High-heat-dissipation LED (light-emitting diode)

Abstract

The utility model provides a high heat dissipation LED (light emitting diode), which comprises a base, a lower light transmission cover is arranged at the top of the base, and a positive electrode conduction piece and a negative electrode conduction piece are arranged in the lower light transmission cover. The heat-conducting silica gel block is arranged on the upper light-transmitting cover, the dissipated heat is radiated out through the lower light-transmitting cover, meanwhile, the heat of the heat-conducting silica gel block is also conducted to the heat-dissipating fins and then is led out and dissipated through the heat-dissipating fins, then, the bottom of the heat-conducting silica gel block is in contact with the dry heat-dissipating fins, the circular heat dissipater composed of the heat-dissipating fins exchanges heat with air for heat dissipation, and after multiple times of heat dissipation, the heat dissipation efficiency is improved. And finally, cold air is generated by utilizing the cold sheet end of the miniature semiconductor cooler to dissipate heat of the light-emitting diode, so that the heat dissipation effect is good, heat emitted by the LED can be continuously and rapidly dissipated into air, and the luminous efficiency and the normal service life of the light-emitting diode light source are ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of diodes, and more specifically, particularly relates to a high heat dissipation LED light emitting diode. Background Art

[0002] LED light-emitting diodes are made of compounds of gallium, arsenic, phosphorus, nitrogen and indium. They can radiate visible light when electrons and holes recombine. They are used as indicator lights in circuits and instruments, or to form text or digital displays. Light-emitting diodes are semiconductor components. As an efficient light source, they have many characteristics such as environmental protection, power saving and long life, and have been widely used in various fields.

[0003] Existing LED light-emitting diodes consume electrical energy to emit light when working, thereby generating a large amount of heat. In order to ensure its normal operation, a heat sink is set at its light-emitting position for heat dissipation. However, only using a heat sink for heat dissipation has a poor heat dissipation effect and is likely to affect the stable operation of the light-emitting diode.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a high heat dissipation LED light emitting diode is provided, in order to achieve the purpose of having more practical value. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a high heat dissipation LED light emitting diode, which is achieved by the following specific technical means:

[0006] A high heat dissipation LED light emitting diode comprises a base, a lower light-transmitting cover is installed on the top of the base, a positive electrode conductive part and a negative electrode conductive part are installed inside the lower light-transmitting cover, an upper light-transmitting cover is threadedly sleeved on the top of the lower light-transmitting cover, a positive electrode pin and a negative electrode pin are connected to the bottom ends of the positive electrode conductive part and the negative electrode conductive part respectively, a heat-conducting silicone block is fitted on one side of the positive electrode conductive part and the negative electrode conductive part, a heat-conducting copper sheet in contact with the heat-conducting silicone block is connected on both sides of the inner wall of the lower light-transmitting cover, a plurality of heat-dissipating fins are equidistantly connected to one side of two heat-conducting silicone blocks, one end of the plurality of heat-dissipating fins passes through the heat-conducting copper sheet and the lower light-transmitting cover and extends to the outside of the lower light-transmitting cover, a plurality of heat-dissipating fins are connected to the bottom of the two heat-conducting silicone blocks, and a miniature semiconductor refrigerator is embedded in the base.

[0007] Furthermore, the positive electrode pin and the negative electrode pin are both arranged below the base, the plurality of heat sink fins are all extended to below the base, and the bottom ends of the plurality of heat sink fins are all wavy.

[0008] Furthermore, the cold plate end of the micro semiconductor refrigerator is arranged inside the lower light-transmitting cover, and the hot plate end is arranged below the base.

[0009] Furthermore, an annular groove is provided at the top edge of the lower light-transmitting cover, and an annular block matching the annular groove is fixedly connected to the bottom end of the upper light-transmitting cover.

[0010] Furthermore, an inner wall of the annular groove is provided with an internal thread, and an outer wall of the annular block is provided with an external thread matching the external thread.

[0011] Furthermore, the lower light-transmitting cover and the upper light-transmitting cover are both made of epoxy resin.

[0012] Furthermore, a plurality of through slots are formed on the base, and the bottom ends of the plurality of heat dissipation fins are all inserted into the corresponding through slots.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] 1. In the utility model, the heat generated by the light-emitting diode when in use is quickly conducted to the heat-conducting copper sheet by using the heat-conducting silica gel block, and the dissipated heat is radiated out through the lower light-transmitting cover. At the same time, the heat of the heat-conducting silica gel block is also conducted to the heat dissipation fins, and then is conducted out through the heat dissipation fins. Secondly, the bottom of the heat-conducting silica gel block is in contact with the dry sheet heat dissipation fins, and the circular heat sink composed of a plurality of heat dissipation fins exchanges heat with the air to dissipate heat. After multiple heat dissipations, the cold sheet end of the micro semiconductor refrigerator is finally used to generate cold air to dissipate the light-emitting diode. The heat dissipation effect is good, and the heat emitted by the LED can be continuously and rapidly dissipated in the air, thereby ensuring the luminous efficiency and normal life of the light-emitting diode light source;

[0015] 2. The traditional integrated light cover is changed into a detachable lower light cover and upper light cover. After the chip of the LED light-emitting diode is burned, the staff only needs to rotate the upper light cover and remove it from the lower light cover, and the chip of the LED light-emitting diode will be exposed. Replacement is quick and convenient, and there is no need to discard the entire light cover, avoiding waste of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional structure diagram of the utility model. Figure 1 .

[0017] Figure 2 This is a three-dimensional structure diagram of the utility model. Figure 2 .

[0018] Figure 3 It is a three-dimensional structural schematic diagram of the positive electrode conductive component and the negative electrode conductive component of the utility model.

[0019] Figure 4 It is a three-dimensional structural schematic diagram of the upper light-transmitting cover of the utility model.

[0020] In the figure, the corresponding relationship between the component names and the figure numbers is as follows:

[0021] 1. Base; 2. Lower light-transmitting cover; 3. Upper light-transmitting cover; 4. Positive pin; 5. Negative pin; 6. Positive conductive member; 7. Negative conductive member; 8. Thermally conductive silicone block; 9. Thermally conductive copper sheet; 10. Heat sink fins; 11. Heat sink fins; 12. Micro semiconductor refrigerator; 13. Annular groove; 14. Annular block; 15. External thread; 16. Through groove; 17. Internal thread. DETAILED DESCRIPTION

[0022] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0023] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] As attached Figure 1 To Attachment Figure 4 As shown:

[0026] The utility model provides a high heat dissipation LED light emitting diode, including a base 1, a lower light-transmitting cover 2 is installed on the top of the base 1, a positive electrode conductive part 6 and a negative electrode conductive part 7 are installed inside the lower light-transmitting cover 2, an upper light-transmitting cover 3 is threadedly sleeved on the top of the lower light-transmitting cover 2, a positive electrode conductive part 4 and a negative electrode conductive part 5 are connected to the bottom ends of the positive electrode conductive part 6 and the negative electrode conductive part 7, a heat-conducting silicone block 8 is fitted on one side of the positive electrode conductive part 6 and the negative electrode conductive part 7, and both sides of the inner wall of the lower light-transmitting cover 2 are connected to the heat-conducting silicone block 8. The heat-conducting copper sheet 9 is provided, and a plurality of heat-dissipating fins 10 are equidistantly connected to one side of the two heat-conducting silicone blocks 8. The heat-dissipating fins 10 on both sides are irregularly arranged, which can make the heat dissipation uneven, cause the convection of the surrounding air, speed up the speed at which the air takes away the heat, and make the heat dissipation effect more obvious; one end of the plurality of heat-dissipating fins 10 passes through the heat-conducting copper sheet 9 and the lower light-transmitting cover 2 and extends to the outside of the lower light-transmitting cover 2, the bottom of the two heat-conducting silicone blocks 8 are connected to a plurality of heat-dissipating fins 11, and a miniature semiconductor refrigerator 12 is embedded in the base 1.

[0027] In other embodiments, the positive pin 4 and the negative pin 5 are both arranged below the base 1, and the plurality of heat sink fins 11 extend to the bottom of the base 1. The bottom ends of the plurality of heat sink fins 11 are wavy. The wavy heat sink fins 11 can further improve a certain thermal effect, and the heat sink fins 11 extend into the lower light-transmitting cover 2 and contact with the thermally conductive silicone block 8, which can achieve a better thermal conductivity and further improve the heat dissipation effect.

[0028] In other embodiments, the cold fin end of the micro semiconductor refrigerator 12 is arranged inside the lower light-transmitting cover 2, and the hot fin end is arranged below the base 1. When the micro semiconductor refrigerator 12 is started to work, the cold fin end of the micro semiconductor refrigerator 12 can cool the air in the lower light-transmitting cover 2, thereby cooling the positive conductive component 6 and the negative conductive component 7, while the hot fin end is arranged below the base 1, and the external natural wind can be used to dissipate heat.

[0029] In other embodiments, an annular groove 13 is provided at the top edge of the lower light cover 2, and an annular block 14 matching the annular groove 13 is fixedly connected to the bottom end of the upper light cover 3. By using the annular groove 13 and the annular block 14 in combination, the connection area between the lower light cover 2 and the upper light cover 3 is increased, so that the connection between the lower light cover 2 and the upper light cover 3 is stable.

[0030] In other embodiments, an internal thread 17 is provided on the inner wall of the annular groove 13, and an external thread 15 matching the external thread 15 is provided on the outer wall of the annular block 14. By arranging the internal thread 17 and the external thread 15 for use together, a threaded connection is adopted between the lower light cover 2 and the upper light cover 3. When the upper light cover 3 needs to be removed later, it only needs to be rotated.

[0031] In other embodiments, the lower light-transmitting cover 2 and the upper light-transmitting cover 3 are both made of epoxy resin material. The lower light-transmitting cover 2 and the upper light-transmitting cover 3 made of epoxy resin material have good processability, high heat resistance, high tensile strength, good electrical properties, good UV resistance and weather resistance, and are more suitable for the packaging of LED light-emitting diodes.

[0032] In other embodiments, a plurality of through slots 16 are provided on the base 1, and the bottom ends of the plurality of heat sink fins 11 are all passed through the corresponding through slots 16. The plurality of through slots 16 are provided to facilitate the plurality of heat sink fins 11 to extend out of the lower light-transmitting cover 2 to dissipate heat.

[0033] The specific usage and function of this embodiment are as follows:

[0034] In the utility model, the positive conductive member 6 and the negative conductive member 7 work, and the heat generated by the light-emitting diode when in use is quickly conducted to the heat-conductive copper sheet 9 by the heat-conductive silica gel block 8, and the dissipated heat is radiated out through the lower light-transmitting cover 2. At the same time, the heat of the heat-conductive silica gel block 8 is also conducted to the heat dissipation fins 10, and then conducted out and dissipated through the heat dissipation fins 10. Secondly, the bottom of the heat-conductive silica gel block 8 is in contact with the dry sheet heat dissipation fins 11, and a circular heat sink composed of a plurality of heat dissipation fins 11 exchanges heat with the air to dissipate heat. After multiple heat dissipations, the micro semiconductor refrigerator 12 is started to work, and the cold sheet end of the micro semiconductor refrigerator 12 can cool the air in the lower light-transmitting cover 2, thereby cooling the positive conductive member 6 and the negative conductive member 7 again, and the hot sheet end is arranged below the base 1, and can use the external natural wind for heat dissipation, with good heat dissipation effect, and can continuously and rapidly dissipate the heat emitted by the LED into the air, thereby ensuring the luminous efficiency and normal life of the light-emitting diode light source.

[0035] It should be noted that the specific model specifications of the positive pin 4, the negative pin 5, the positive conductive component 6, the negative conductive component 7 and the miniature semiconductor refrigerator 12 need to be selected and determined according to the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail. The positive pin 4, the negative pin 5, the positive conductive component 6, the negative conductive component 7 and the miniature semiconductor refrigerator 12 are devices or equipment that exist in the prior art, or are devices or equipment that can be realized by the prior art. Its power supply, specific composition and principle are clear to those skilled in the art and are common knowledge in this field, so it will not be described in detail.

[0036] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A high heat dissipation LED light emitting diode, characterized in that: The invention comprises a base (1), a lower light-transmitting cover (2) is installed on the top of the base (1), a positive electrode conductive part (6) and a negative electrode conductive part (7) are installed inside the lower light-transmitting cover (2), an upper light-transmitting cover (3) is threadedly sleeved on the top of the lower light-transmitting cover (2), a positive electrode conductive part (4) and a negative electrode conductive part (5) are connected to the bottom ends of the positive electrode conductive part (6) and the negative electrode conductive part (7) respectively, a heat-conducting silica gel block (8) is attached to one side of the positive electrode conductive part (6) and the negative electrode conductive part (7), and the lower light-transmitting cover (2) is threadedly sleeved with an upper light-transmitting cover (3), the bottom ends of the positive electrode conductive part (6) and the negative electrode conductive part (7) are connected to the positive electrode conductive part (4) and the negative electrode conductive part (5) respectively, and a heat-conducting silica gel block (8) is attached to one side of the positive electrode conductive part (6) and the negative electrode conductive part (7), and the lower light-transmitting cover (2) is threadedly sleeved with an upper light-transmitting cover (3) Both sides of the inner wall of the light cover (2) are connected to heat-conducting copper sheets (9) in contact with the heat-conducting silicone blocks (8); one side of the two heat-conducting silicone blocks (8) is equidistantly connected to a plurality of heat-dissipating fins (10); one end of the plurality of heat-dissipating fins (10) passes through the heat-conducting copper sheets (9) and the lower light-transmitting cover (2) and extends to the outside of the lower light-transmitting cover (2); the bottoms of the two heat-conducting silicone blocks (8) are connected to a plurality of heat-dissipating fins (11); and a miniature semiconductor refrigerator (12) is embedded in the base (1).

2. The high heat dissipation LED light emitting diode as claimed in claim 1, characterized in that: The positive electrode pin (4) and the negative electrode pin (5) are both arranged below the base (1), the plurality of heat dissipation fins (11) extend below the base (1), and the bottom ends of the plurality of heat dissipation fins (11) are all wavy.

3. The high heat dissipation LED light emitting diode as claimed in claim 1, characterized in that: The cold plate end of the micro semiconductor refrigerator (12) is arranged inside the lower light-transmitting cover (2), and the hot plate end is arranged below the base (1).

4. The high heat dissipation LED light emitting diode as claimed in claim 1, characterized in that: An annular groove (13) is provided at the top edge of the lower light-transmitting cover (2), and an annular block (14) matching the annular groove (13) is fixedly connected to the bottom end of the upper light-transmitting cover (3).

5. The high heat dissipation LED light emitting diode as claimed in claim 4, characterized in that: An internal thread (17) is provided on the inner wall of the annular groove (13), and an external thread (15) matching the external thread (15) is provided on the outer wall of the annular block (14).

6. The high heat dissipation LED light emitting diode as claimed in claim 1, characterized in that: The lower light-transmitting cover (2) and the upper light-transmitting cover (3) are both made of epoxy resin material.

7. The high heat dissipation LED light emitting diode as claimed in claim 1, characterized in that: The base (1) is provided with a plurality of through slots (16), and the bottom ends of the plurality of heat dissipation fins (11) are all inserted into the corresponding through slots (16).

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