BOB device and optical communication equipment

Abstract

The utility model provides a BOB device and optical communication equipment, and belongs to the technical field of optical communication. The BOB device comprises an optical assembly, a circuit board and a flexible board. The optical assembly comprises a shell with an inner cavity, a sending unit, a receiving unit and a protruding structure. The transmitting unit and the receiving unit are accommodated in the inner cavity, and the transmitting unit and the receiving unit are respectively connected to the circuit board through the flexible board so as to realize electric connection between the optical assembly and the circuit board; one end of the protruding structure is connected with the shell, and the other end protrudes relative to the outer wall of the shell and is connected with the circuit board so that the optical assembly can be fixed to the circuit board. According to the BOB device and the optical communication equipment, the optical assembly and the circuit board can be reliably fixed under the scene that the optical assembly is assembled to the circuit board through the flexible board.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technology, and in particular to a BOSA on board (BOB) device and optical communication equipment. Background Art

[0002] In the field of optical communications, optical communication devices such as optical network terminals (ONT) or optical network units (ONU) transmit and receive optical signals through optical components.

[0003] In traditional technology, in high-speed optical communication scenarios, optical components are assembled on circuit boards in optical communication equipment through flexible boards to achieve signal transmission between the circuit boards and the optical components, and to power the optical components through the circuit boards. However, the optical components cannot be reliably fixed to the circuit boards through flexible board connections. Utility Model Content

[0004] The present disclosure provides a method for realizing reliable fixation between an optical component and a circuit board in a scenario where the optical component is assembled to the circuit board through a flexible board.

[0005] In a first aspect, the present disclosure provides an optical component on board (BOB) device, the BOB device comprising an optical component, a circuit board and a flexible board;

[0006] The optical assembly includes a housing having an inner cavity, a transmitting unit, a receiving unit, and a protruding structure;

[0007] The sending unit and the receiving unit are accommodated in the inner cavity, and the sending unit and the receiving unit are respectively connected to the circuit board through the soft board to achieve electrical connection between the optical component and the circuit board;

[0008] One end of the protruding structure is connected to the shell, and the other end protrudes relative to the outer wall of the shell and is connected to the circuit board to fix the optical component on the circuit board.

[0009] The solution shown in the present disclosure, when the electrical connection between the optical component and the circuit board is achieved through a flexible board, a protruding structure protruding relative to the outer wall of the shell is provided on the shell, so that a hard connection between the shell and the circuit board is achieved through the protruding structure, so that the shell can be reliably fixed on the circuit board, thereby achieving reliable fixation between the optical component and the circuit board.

[0010] In a possible implementation, the circuit board includes a soldering pad, and an end of the protruding structure away from the housing is inserted into the soldering pad and soldered to the soldering pad.

[0011] In the solution disclosed in the present invention, the protruding structure is directly soldered to the circuit board through the soldering pad, and the fixing reliability is higher, thereby facilitating the reliable fixing between the optical component and the circuit board.

[0012] In a possible implementation, the protruding structure includes at least one metal boss, one end of the metal boss is connected to the outer surface of the housing, and the other end of the metal boss is connected to the circuit board.

[0013] The solution shown in the present disclosure forms a raised structure (metal boss) for achieving connection between the shell and the circuit board directly on the outer surface of the shell, which can avoid affecting the layout of the sending unit and the receiving unit contained in the shell.

[0014] In a possible implementation, the shell is a metal shell, and the metal boss and the metal shell are integrally formed components.

[0015] The solution shown in the present disclosure, by integrally forming the metal boss with the metal shell, eliminates the need to additionally connect the metal boss to the shell, thereby reducing the difficulty of assembling the protruding structure and the shell.

[0016] In a possible implementation, the protrusion structure includes a plurality of the metal bosses, and the plurality of the metal bosses are arranged at intervals.

[0017] The solution shown in the present disclosure can provide multiple connection points for the housing and the circuit board by arranging multiple metal bosses at intervals to improve the fixing reliability.

[0018] In a possible implementation, the diameter of the metal boss is not less than 0.2 mm; and / or the length of the metal boss is not less than 1.5 mm.

[0019] The solution shown in the present disclosure limits the minimum diameter and the minimum length of the metal boss to ensure that the size of the metal boss can meet the size requirements for welding with the circuit board, and can make the metal boss have a certain strength and not easy to deform, so as to ensure the fixation reliability between the shell and the circuit board.

[0020] In a possible implementation, the diameter of the metal boss is not less than 0.2 mm and not more than 7 mm; and / or the length of the metal boss is not less than 1.5 mm and not more than 20 mm.

[0021] The solution shown in the present disclosure, by limiting the diameter of the metal boss to below 7 mm, avoids the metal boss being too large in size, which would cause it to occupy too much installation space and may be difficult to set on the shell; while a metal boss that is too long may cause the distance between the two connection points of the metal boss on the shell and the circuit board to be too large, thereby causing unstable fixation between the shell and the circuit board.

[0022] In a possible implementation, the protrusion structure includes a fixing plate and a metal pin;

[0023] The fixing plate is fixedly connected to the shell, one end of the metal pin is connected to the fixing plate, and the other end protrudes to the outside of the shell and is connected to the circuit board.

[0024] In the solution shown in the present disclosure, the fixing plate provides a mounting carrier for the metal pin, thereby increasing the connection area between the metal pin and the shell, helping to improve the fixing reliability between the metal pin and the shell, and preventing the metal pin from shaking relative to the shell.

[0025] In a possible implementation, the shell is provided with a through hole communicating with the inner cavity, and the fixing plate closes the through hole;

[0026] The metal pin passes through the fixing plate, and one end of the metal pin is accommodated in the shell, and the other end protrudes to the outside of the shell.

[0027] The solution shown in the present disclosure is to pass the metal pins through the fixing disk from both sides of the fixing disk, which makes it easier to weld the metal pins to the holes on the fixing disk through which they pass, thereby reducing the difficulty of assembly; and by covering and closing the through holes opened on the shell with the fixing disk, the sending unit and receiving unit contained in the shell can be protected.

[0028] In a possible implementation, the fixing plate and the metal pin are packaged as a TO base, and the TO base is any one of a TO46 base and a TO56 base.

[0029] The solution shown in the present disclosure directly adopts a TO base for the raised structure of the fixing plate and the metal socket, and the raised structure can be easily obtained without additional processing. By selecting a TO base of a specific specification such as a TO46 base or a TO56 base to achieve the connection between the housing and the circuit board, the size of the through hole on the housing can be easily designed, reducing the difficulty of processing and assembly.

[0030] In a possible implementation, the shell is in a square shape;

[0031] The protruding structure is in the shape of a straight column, and the protruding structure is located on the side of the housing facing the circuit board; or,

[0032] The protruding structure has at least one bend, and the protruding structure is located on a side of the housing adjacent to the circuit board or on a side of the housing away from the circuit board.

[0033] The solution shown in the present disclosure sets the raised structure as a straight column and directly sets it on the side of the shell facing the circuit board, which reduces the difficulty of forming the raised structure itself; and sets the raised structure as a bent shape, so as to be set on the side of the shell adjacent to or away from the circuit board, which can reduce the difficulty of welding between the raised structure and the circuit board.

[0034] In a possible implementation, the first pin of the sending unit is exposed at a first side surface of the housing, and the second pin of the receiving unit is exposed at a second side surface of the housing;

[0035] The optical assembly further includes an optical fiber fixing unit, the optical fiber fixing unit is exposed on a third side surface of the housing, the first side surface is opposite to the third side surface, and the second side surface is adjacent to the first side surface and the third side surface respectively;

[0036] The protruding structure is located on a fourth side surface of the shell, and the fourth side surface is different from the first side surface, the second side surface and the third side surface.

[0037] The solution shown in the present disclosure is to arrange the protruding structure on one of the remaining side surfaces of the cube except the side surfaces where the sending unit, the receiving unit and the optical fiber fixing unit are respectively located, so as to avoid interference between the protruding structure and the sending unit, the receiving unit and the optical fiber fixing unit, and to arrange the protruding structure separately on one side surface of the cube-shaped shell, so as to facilitate the processing of the protruding structure.

[0038] In a possible implementation, the second side surface is a surface of the housing that is away from the circuit board, the soft board connected to the second pin covers the fifth side surface of the housing and is connected to the circuit board, the fifth side surface is located between the second side surface and the circuit board, and the fifth side surface is different from the first side surface and the third side surface;

[0039] The fourth side surface is adjacent to the fifth side surface, or the fourth side surface is opposite to the fifth side surface.

[0040] In the solution shown in the present disclosure, when the receiving unit is arranged on the side of the shell away from the circuit board, the soft board connected to the receiving unit can be attached to and extended on the outer surface of the shell to avoid the soft board being easily deformed due to being suspended in the air; when the protruding structure is arranged, by avoiding the protruding structure from the side covered by the soft board, it helps to reduce the difficulty of assembling the soft board.

[0041] In a possible implementation, the BOB device further includes a metal cover, the metal cover is disposed on the circuit board, and the optical component is located in a space enclosed by the metal cover and the circuit board.

[0042] In the solution shown in the present disclosure, the metal cover can be used as a shielding cover to shield and dissipate heat for the optical components.

[0043] In a possible implementation manner, the BOB device further includes at least one heat conductive member, and the heat conductive member is located between a top portion of the optical component facing away from the circuit board and an inner wall of the metal cover.

[0044] In the solution shown in the present disclosure, the heat conducting member provides a heat transfer path between the optical component and the metal cover, thereby helping to improve the heat dissipation effect.

[0045] In a second aspect, the present disclosure provides an optical communication device, comprising the optical component-on-board (BOB) device of the first aspect.

[0046] In the solution shown in the present disclosure, in the optical communication device, a fixed connection between the optical component and the circuit board is achieved by a protruding structure arranged on the housing of the optical component, the structure is relatively simple, and the assembly difficulty is low. In addition, the optical component is shielded and heat-dissipated by the metal cover, and the heat-conducting member arranged between the optical component and the metal cover further improves the heat dissipation effect of the optical component. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 is a schematic diagram of a bidirectional optical sub-assembly (BOSA) provided by an exemplary embodiment of the present disclosure;

[0048] Figure 2 is a side structural schematic diagram of a BOB device provided by an exemplary embodiment of the present disclosure;

[0049] Figure 3 yes Figure 2 Schematic diagram of the structure of the Zhongguang component;

[0050] Figure 4 is another side view structural schematic diagram of a BOB device provided by an exemplary embodiment of the present disclosure;

[0051] Figure 5 yes Figure 4 Schematic diagram of the structure of the Zhongguang component;

[0052] Figure 6 yes Figure 5 Exploded diagram of

[0053] Figure 7 is a structural schematic diagram of a BOB device provided by an exemplary embodiment of the present disclosure;

[0054] Figure 8 is a structural schematic diagram of another BOB device provided by an exemplary embodiment of the present disclosure;

[0055] Fig. 9 is a structural schematic diagram of another BOB device provided by an exemplary embodiment of the present disclosure;

[0056] Fig.10 It is another side view structural schematic diagram of a BOB device provided by an exemplary embodiment of the present disclosure.

[0057] Description of reference numerals:

[0058] 1. Optical components; 2. Circuit boards; 3. Flexible boards; 4. Metal housings; 5. Heat conducting parts; 6. Optical fibers;

[0059] 11. Transmission module; 12. Housing; 13. Protruding structure; 21. Pad; 31. First soft board; 32. Second soft board;

[0060] 111, transmitting unit; 112, receiving unit; 113, optical fiber fixing unit; 121, inner cavity; 122, through hole; 123, first side surface; 124, second side surface; 125, third side surface; 126, fourth side surface; 127, fifth side surface; 131, metal boss; 132, TO base;

[0061] 1111, first pin; 1121, second pin; 1321, fixing plate; 1322, metal pin. DETAILED DESCRIPTION

[0062] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0063] Some terminology concepts involved in the embodiments of the present disclosure are explained below.

[0064] BOSA is a component that can transmit and receive optical signals. BOSA is connected to the optical fiber. BOSA includes a transmitting unit, a splitting unit, and a receiving unit. Figure 1 The optical path diagram is shown in Figure 1. Figure 1 In the embodiment, the sending unit sends a signal through light of wavelength λ1, and the receiving unit receives a signal through light of wavelength λ2.

[0065] In the field of optical communication, optical communication equipment is an important device. Generally, optical components are directly mounted on the circuit board in the optical communication equipment. The circuit board is connected to the optical component to realize signal transmission and power the optical component. For example, the optical communication equipment is an optical network terminal or an optical network unit. In the high-speed optical communication scenario, the optical component is mounted on the circuit board in the optical communication equipment through a flexible board.

[0066] Here, the circuit board in the optical communication equipment can also be called a printed circuit board (PCB), or a circuit board, which uses a rigid or semi-rigid substrate as a carrier and has a relatively fixed shape. The soft board can also be called a flexible printed circuit (FPC), which uses a flexible substrate as a carrier and is easy to bend and deform.

[0067] In an embodiment of the present disclosure, a BOB device is provided, in which an optical component is connected to a circuit board in a communication device through a flexible board, and a protruding structure connected to a housing in the optical component is used to achieve reliable fixation between the optical component and the circuit board, so that the BOB device can be applied to high-speed optical communication scenarios. For example, high-speed optical communication scenarios include but are not limited to 10-Gigabit-capable symmetric passive optical network (XGS PON), 50G passive optical network (PON) or scenarios greater than 50G.

[0068] Figure 2 A side view of a BOB device is provided, such as Figure 2 As shown, the BOB device includes an optical component 1, a circuit board 2 and a soft board 3. The optical component 1 includes a housing 12 having an inner cavity 121, a sending unit 111, a receiving unit 112, and a protruding structure 13. The sending unit 111 and the receiving unit 112 are accommodated in the inner cavity 121, and the sending unit 111 and the receiving unit 112 are respectively connected to the circuit board 2 through the soft board 3 to achieve electrical connection between the optical component 1 and the circuit board 2. One end of the protruding structure 13 is connected to the housing 12, and the other end protrudes relative to the outer wall of the housing 12 and is connected to the circuit board 2 to fix the optical component 1 on the circuit board 2.

[0069] In an example, the sending unit 111 and the receiving unit 112 may each be packaged in a transistor outline (TO) form, so the sending unit 111 may also be referred to as a sending TO, and the receiving unit 112 may also be referred to as a receiving TO.

[0070] In a specific implementation, two through holes (respectively referred to as a first through hole and a second through hole) may be provided on the shell wall of the shell 12, and the two through holes are respectively connected to the inner cavity 121 of the shell 12. The first pin 1111 of the sending unit 111 may extend to the outside of the shell 12 through the first through hole, and then be welded to the flexible board 3; the second pin 1121 of the receiving unit 112 may extend to the outside of the shell 12 through the second through hole, and then be welded to the flexible board 3.

[0071] The first pin 1111 in the sending unit 111 may be a signal pin, which is used to send a signal; the second pin 1121 in the receiving unit 112 may also be a signal pin, which is used to receive a signal. In an example, there may be two pins for sending a signal, which are used to send a pair of differential signals, and there may be two pins for receiving a signal, which are used to receive a pair of differential signals.

[0072] like Figure 2 and Figure 3 As shown, the optical component 1 may further include an optical fiber fixing unit 113, which is accommodated in the inner cavity 121 of the housing 12. The optical component 1 may be connected to the optical fiber 6 through the interface of the optical fiber fixing unit 113 exposed to the housing 12. Similar to the above-mentioned sending unit 111 and receiving unit 112, the interface of the optical fiber fixing unit 113 may be exposed to the housing 12 through a third through hole provided on the housing 12, and then connected to the optical fiber 6.

[0073] The above-mentioned sending unit 111, receiving unit 112 and optical fiber fixing unit 113 can be used as the transmission module 11 in the optical component 1. That is, the optical component 1 may include the transmission module 11, the housing 12 and the protruding structure 13, wherein the transmission module 11 is accommodated in the inner cavity 121 of the housing 12, and the protruding structure 13 is fixed on the housing 12.

[0074] In one example, since the sending unit 111 and the receiving unit 112 are arranged perpendicular to each other, in order to facilitate the connection between the sending unit 111 and the receiving unit 112 and the flexible board 3, as shown in FIG. Figure 2 As shown, the soft board 3 may include a first soft board 31 and a second soft board 32, and the first soft board 31 and the second soft board 32 are separated from each other, wherein the first pin 1111 of the sending unit 111 may be connected to the first soft board 31, and the second pin 1121 of the receiving unit 112 may be connected to the second soft board 32. In another example, the first pin 1111 of the sending unit 111 and the second pin 1121 of the receiving unit 112 may be connected to the same soft board 3.

[0075] Similar to the first pin 1111 and the second pin 1121, the protruding structure 13 connected to the housing 12 and protruding relative to the housing 12 can be welded to the circuit board 2, so that the protruding structure 13 and the circuit board 2 are rigidly connected to reliably fix the position of the housing 12 on the circuit board 2. For example, Figure 2 As shown, the circuit board 2 includes a pad 21, and one end of the protruding structure 13 away from the housing 12 can be inserted into the pad 21 and welded to the pad 21. The pad 21 can be, for example, a through-hole pad, and one end of the protruding structure 13 is directly inserted into the through hole of the through-hole pad and welded to the hole wall of the through hole to achieve a direct plug connection between the protruding structure 13 and the circuit board 2.

[0076] In one example, if Figure 2 and Figure 3 As shown, the protruding structure 13 includes at least one metal boss 131, one end of the metal boss 131 is connected to the outer surface of the housing 12, and the other end is connected to the circuit board 2. In other words, the metal boss 131 can be directly formed on the outer surface of the housing 12, so that the arrangement of the metal boss 131 will not affect the layout of the sending unit 111 and the receiving unit 112 accommodated in the housing 12.

[0077] The metal boss 131 can be in any shape as long as it can achieve stable fixation between the housing 12 and the circuit board 2. Figure 3 As shown, the metal boss 131 can be formed into a cylindrical shape. In other examples, the metal boss can also be formed into a truncated cone shape, or a prism shape, etc.

[0078] like Figure 2 and Figure 3 As shown, a part of the soft board 3 can be attached to the shell 12, so that the shell 12 provides a certain support for the soft board 3, and at the same time facilitates the connection of the soft board 3 with the first pin 1111 and the second pin 1121. In order to prevent the shell 12 from being affected by the welding process between the first pin 1111 and the second pin 1121 and the soft board 3, the shell 12 can be a high-temperature resistant metal shell. In this case, the metal boss 131 can be a part of the shell 12 and integrally formed with the shell 12. In other words, the shell 12 is a metal shell, and the metal boss 131 and the metal shell are integrally formed components.

[0079] In other examples, the metal boss 131 can be formed independently of the housing 12 and then fixed to the housing 12 by welding or other processes.

[0080] The protruding structure 13 for connecting the housing 12 and the circuit board 2 may include a plurality of metal bosses 131 , and the plurality of metal bosses 131 are arranged at intervals from each other, thereby providing a plurality of connection points for the housing 12 and the circuit board 2 to improve connection reliability.

[0081] For example, Figure 3 As shown, the protruding structure 13 may include four metal bosses 131 , and the four metal bosses 131 may be arranged at intervals at four corners on the side of the housing 12 facing the circuit board 2 .

[0082] It is understandable that the strength of the protruding structure 13 can be greater than a certain value so that the protruding structure 13 is not easily deformed, thereby ensuring the reliability of the fixation between the housing 12 and the circuit board 2. Based on this, when the hard connection between the housing 12 and the circuit board 2 is achieved through the metal boss 131, the diameter of the metal boss 131 should be no less than 0.2 mm; and / or the length of the metal boss 131 should be no less than 1.5 mm. In one example, the diameter of the metal boss 131 is no less than 0.2 mm and no more than 7 mm; and / or the length of the metal boss 131 is no less than 1.5 mm and no more than 20 mm. For example, the diameter of the metal boss 131 can be 0.2mm, 0.3mm, 0.4mm, 0.5mm, 07mm, 08mm, 09mm, 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, etc.; the length of the metal boss 131 can be 1.5mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, etc.

[0083] In another example, Figure 4 and Figure 5 As shown, the protrusion structure 13 includes a fixing plate 1321 and a metal pin 1322. The fixing plate 1321 is connected to the housing 12, one end of the metal pin 1322 is connected to the fixing plate 1321, and the other end protrudes to the outside of the housing 12 and is connected to the circuit board 2. In other words, one end of the metal pin 1322 is connected to the housing 12 through the fixing plate 1321, and the other end protrudes relative to the outer wall of the housing 12 and is fixed to the circuit board 2.

[0084] like Figure 5 and Figure 6 As shown, the housing 12 may be provided with a through hole 122 communicating with the inner cavity 121, and the fixing plate 1321 closes the through hole 122. The metal pin 1322 passes through the fixing plate 1321, and one end is accommodated in the housing 12, and the other end protrudes to the outside of the housing 12.

[0085] In one example, a hole may be provided on the fixing disk 1321, and the metal pin 1322 may be inserted into the hole, so that the metal pin 1322 may pass through the fixing disk 1321, and both ends of the metal pin 1322 may pass through opposite sides of the fixing disk 1321. The metal pin 1322 may be welded to the hole wall through which it passes. When the TO base 132 is assembled to the housing 12, one end of the metal pin 1322 is accommodated in the housing 12, and the other end protrudes to the outside of the housing 12. In other words, for the metal pin 1322, the housing 12 is provided with a through hole 122 (which may be referred to as a fourth through hole) that is connected to the inner cavity 121, and the metal pin 1322 passes through the through hole 122 and protrudes to the outside of the housing 12.

[0086] The end of the metal pin 1322 extending into the housing 12 can be shorter to avoid affecting the layout of the sending unit 111 and the receiving unit 112 contained in the inner cavity 121; and the end of the metal pin 1322 extending outside the housing 12 can be longer to facilitate welding with the circuit board 2. The protruding structure 13 can have multiple metal pins 1322, thereby providing multiple connection points for the housing 12 and the circuit board 2, and the multiple metal pins 1322 are fixed to the same fixing plate 1321. The multiple metal pins 1322 can be arranged at intervals and pass through the fixing plate 1321 through different holes respectively; and different metal pins 1322 can pass through the same through hole 122 and extend outside the housing 12.

[0087] In a specific implementation, in order to facilitate the adaptation with the fixing disk 1321, the through hole 122 can be set as a circular hole, and the diameter of the fixing disk 1321 can be slightly larger than the outer diameter of the through hole 122, so that the fixing disk 1321 can completely cover the through hole 122 from the outside of the shell 12, and adhere to the outer surface of the shell 12 around the through hole 122, so as to close the through hole 122. On this basis, the side edge of the fixing disk 1321 and the outer wall of the shell 12 around the through hole 122 can be coated with black glue, so as to bond the fixing disk 1321 to the shell 12. In other examples, the diameter of the fixing disk 1321 can be slightly smaller than the outer diameter of the through hole 122, so that the fixing disk 1321 can at least partially extend into the through hole 122, and be fixed to the inner wall of the through hole by bonding, welding or clamping, so as to close the through hole 122.

[0088] In one example, the fixing plate 1321 and the metal pin 1322 are packaged as a TO base, and the TO base can be any one of a TO46 base and a TO56 base.

[0089] The TO base is the base part of the TO package, which is usually provided with a metal pin 1322 as a pin for accessing the circuit board 2. The fixing plate 1321 can be used as a mounting carrier for the metal pin 1322 and functional devices such as chips. The metal pin 1322 can be welded to the circuit board 2 to achieve a hard connection between the metal pin 1322 and the circuit board 2, so that the position of the optical component (housing 12) on the circuit board 2 can be fixed by the metal pin 1322.

[0090] In one example, in addition to the TO base, the TO package may also include a TO cap, which may be connected to the fixing plate 1321 and cover one end of the metal pin 1322 that passes through the fixing plate 1321 and is accommodated in the inner cavity 121 of the housing 12. The TO cap cooperates with the fixing plate 1321 to achieve a sealed package for the short-end metal pin 1322 and other possible functional elements. In the disclosed embodiment, the protruding structure 13 may include only the TO base 132, or may include a complete TO package.

[0091] It is understandable that the protruding structure 13 formed as the metal boss 131 or the TO base 132 does not have a signal transmission function itself, but is only used to provide a fixed connection between the housing 12 and the circuit board 2 .

[0092] Combination Figure 1 and Figure 7 It can be seen that the sending unit 111 and the optical fiber 6 are relatively coaxially arranged, and the sending unit 111 is arranged perpendicularly to the receiving unit 112. In order to facilitate the arrangement of the sending unit 111, the receiving unit 112 and the optical fiber fixing unit 113 in the housing 12 and conveniently connect to the flexible board 3 and the optical fiber 6, the housing 12 can be set to a square shape, and the sending unit 111, the receiving unit 112 and the optical fiber fixing unit 113 can be respectively arranged on three adjacent sides of the square shape.

[0093] In one example, when the shell 12 is placed on the circuit board 2, one of the side surfaces can be parallel to the circuit board 2, so that the side surface of the shell 12 facing the circuit board 2 and the side surface away from the circuit board 2 are respectively parallel to the circuit board 2; and the remaining four side surfaces adjacent to the circuit board 2 can be perpendicular to the circuit board 2.

[0094] The protruding structure 13 may be disposed on one of the sides of the tetrahedron. Figures 2 to 7 As shown, when the protruding structure 13 is located on the side of the housing 12 facing the circuit board 2, the protruding structure 13 can be a straight column. In this case, the protruding structure 13 can serve as a support point for fixing the housing 12 on the circuit board 2. Figure 8 and Fig. 9As shown, when the protruding structure 13 is located on the side of the housing 12 adjacent to the circuit board 2 or on the side of the housing 12 away from the circuit board 2, the protruding structure 13 has at least one bend. Exemplarily, the protruding structure 13 may include at least a first portion parallel to the circuit board 2 and a second portion perpendicular to the circuit board 2.

[0095] In a specific implementation, the protruding structure 13 can be arranged on one of the remaining side surfaces of the cube except the side surfaces where the sending unit 111, the receiving unit 112 and the optical fiber fixing unit 113 are respectively located, so as to avoid interference between the protruding structure 13 and the sending unit 111, the receiving unit 112 and the optical fiber fixing unit 113.

[0096] In one example, if Figure 5 and Figure 7 As shown, the first pin 1111 of the sending unit 111 is exposed on the first side 123 of the housing 12, and the second pin 1121 of the receiving unit 112 is exposed on the second side 124 of the housing 12; the optical fiber fixing unit 113 is exposed on the third side 125 of the housing 12, the first side 123 is opposite to the third side 125, and the second side 124 is adjacent to the first side 123 and the third side 125 respectively. The protruding structure 13 is located on the fourth side 126 of the housing 12, and the fourth side 126 is different from the first side 123, the second side 124 and the third side 125.

[0097] like Figure 7 and Figure 8 As shown, the sides where the transmitting unit 111 and the optical fiber fixing unit 113 are located can be perpendicular to the circuit board 2, and the side where the receiving unit 112 is located can be parallel to the circuit board 2. In this case, the second side 124 can be the surface of the housing 12 facing away from the circuit board 2, so that the first pin 1111 exposed on the second side 124 can be away from the circuit board 2 and extend upward, so that the circuit board 2 will not hinder the connection between the first pin 1111 and the flexible board 3.

[0098] One end of the soft board 3 (for example, the second soft board 32) connected to the second pin 1121 can be attached to the second side surface 124 to facilitate connection with the first pin 1111, and the other end can be connected to the circuit board 2; the main body between the two ends of the soft board 3 can be attached to the surface of the housing 12 to extend to avoid the soft board 3 being suspended in the air and easily deformed. For example, Figure 7 and Figure 8 As shown, the flexible board 3 connected to the second pin 1121 covers the fifth side 127 of the shell 12 and is connected to the circuit board 2, the fifth side 127 is located between the second side 124 and the circuit board 2, and the fifth side 127 is different from the first side 123 and the third side 125.

[0099] In one example, as Figure 7 shown, the fourth side surface 126 is adjacent to the fifth side surface 127. In this case, the convex structure 13 is located on the side surface of the housing 12 facing the circuit board 2, so that the convex structure 13 can adopt a linear columnar structure as shown in Figure 3 and Figure 4 .

[0100] In another example, as Figure 8 shown, the fourth side surface 126 is opposite to the fifth side surface 127. In this case, the convex structure 13 is located on the side surface of the housing 12 adjacent to the circuit board 2, so that the convex structure 13 can adopt a bent structure. Exemplarily, the convex structure 13 can be an "L" - shaped structure, where a first part corresponding to one side of the "L" is parallel to the circuit board 2, and a second part corresponding to the other side is perpendicular to the circuit board 2.

[0101] As Fig. 9 shown, the side surfaces where the transmitting unit 111, the receiving unit 112, and the optical fiber fixing unit 113 are located can be respectively adjacent to and perpendicular to the circuit board 2. In this case, the convex structure 13 can be provided on a side surface of the housing 12 adjacent to the circuit board 2 so that the convex structure 13 is formed into an "L" - shaped structure. Or, the convex structure 13 can be provided on the side surface of the housing 12 facing away from the circuit board 2 so that the convex structure 13 can be formed into a "匚" - shaped structure, which includes two second parts perpendicular to the circuit board.

[0102] Figure 7 , Figure 8 and and Fig. 9 , the optical fiber fixing unit 113 is not shown because it is shielded by the optical fiber 6, and the position of the optical fiber fixing unit 113 can be indicated by the optical fiber 6; the position of the transmitting unit 111 can be indicated by the first pin 1111, and the position of the receiving unit 112 can be indicated by the second pin 1121.

[0103] In one example, as Fig.10 shown, the BOB device may further include a metal cover 4, the metal cover 4 covers the circuit board 2, and the optical component 1 is located in the space surrounded by the metal cover 4 and the circuit board 2.

[0104] In one example, the metal cover 4 may include a hem, and the hem can be attached to the circuit board 2 and fixed to the circuit board 2 through connectors such as screws.

[0105] The metal cover 4 can be used as a shielding cover to achieve the function of shielding external signals and thus protecting the optical component. In addition, due to the good thermal conductivity of the metal material, the metal cover 4 is equivalent to increasing the heat dissipation area of the housing 12, so that the metal cover 4 can also play a heat dissipation function.

[0106] To further improve the heat dissipation effect, in one example, Fig.10 As shown, the BOB device further includes at least one heat conducting member 5, which is located between the top of the optical component 1 facing away from the circuit board 2 and the inner wall of the metal cover 4. Exemplarily, the heat conducting member 5 may be, for example, thermal conductive silicone grease and a heat sink.

[0107] In a specific implementation, the heat conducting member 5 can be disposed between the housing 12 and the metal cover 4. Figure 7 and Figure 8 As shown, the soft board 3 covers the top of the housing 12 away from the circuit board 2. In this case, the heat conductor 5 can be arranged between the soft board 3 (for example, the second soft board 32) and the metal cover 4. In other examples, the heat conductor 5 can also be arranged between the head of the sending unit 111 exposed from the housing 12 and the inner wall of the metal cover 4.

[0108] The BOB device provided by the embodiment of the present disclosure realizes a fixed connection between the optical component 1 and the circuit board 2 by means of the protruding structure 13 arranged on the housing 12, and has a relatively simple structure and low assembly difficulty. The optical component 1 is shielded and heat-dissipated by the metal cover 4; the heat-conducting member 5 arranged between the optical component 1 and the metal cover 4 further improves the heat dissipation effect of the optical component 1.

[0109] In an embodiment of the present disclosure, an optical communication device is further provided. The optical communication device includes the BOB device described above. The optical communication device is an ONT or an ONU, etc.

[0110] In the description of the present disclosure, the terms (if any) "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more features. It should also be understood that the terms "first" and "second" are used to distinguish between identical or similar items with substantially the same effects and functions. It should be understood that there is no logical or temporal dependency between "first" and "second", and these terms are only used to distinguish one element from another. For example, without departing from the scope of various examples, the first pin may be referred to as the second pin, and similarly, the second pin may be referred to as the first pin. Both the first pin and the second pin may be pins, and in some cases, may be separate and different pins.

[0111] In the description of the present application, unless otherwise clearly and specifically defined, “plurality” means two or more.

[0112] In addition, it should be understood that the terms (if any) "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0113] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0114] Unless otherwise clearly specified and limited, the terms (if any) "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0115] In the description of this specification, the reference terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application.

[0116] The above description is only an embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. An optical component on board BOB device, characterized in that: The BOB device comprises an optical component (1), a circuit board (2) and a flexible board (3); The optical component (1) comprises a housing (12) having an inner cavity (121), a sending unit (111), a receiving unit (112), and a protruding structure (13); The sending unit (111) and the receiving unit (112) are accommodated in the inner cavity (121), and the sending unit (111) and the receiving unit (112) are respectively connected to the circuit board (2) via the soft board (3) to achieve electrical connection between the optical component (1) and the circuit board (2); One end of the protruding structure (13) is connected to the housing (12), and the other end protrudes relative to the outer wall of the housing (12) and is connected to the circuit board (2) to fix the optical component (1) on the circuit board (2).

2. The BOB device according to claim 1, characterized in that: The circuit board (2) comprises a soldering pad (21), and one end of the protruding structure (13) away from the housing (12) is inserted into the soldering pad (21) and is soldered to the soldering pad (21).

3. The BOB device according to claim 1, characterized in that: The protruding structure (13) comprises at least one metal boss (131), one end of the metal boss (131) being connected to the outer surface of the housing (12) and the other end being connected to the circuit board (2).

4. The BOB device according to claim 3, characterized in that: The protruding structure (13) comprises a plurality of metal bosses (131), and the plurality of metal bosses (131) are arranged at intervals.

5. The BOB device according to claim 3, characterized in that: The shell (12) is a metal shell, and the metal boss (131) and the metal shell are integrally formed components.

6. The BOB device according to claim 3, characterized in that: The diameter of the metal boss (131) is not less than 0.2 mm; and / or the length of the metal boss (131) is not less than 1.5 mm.

7. The BOB device according to claim 3, characterized in that: The diameter of the metal boss (131) is not less than 0.2 mm and not more than 7 mm; and / or the length of the metal boss (131) is not less than 1.5 mm and not more than 20 mm.

8. The BOB device according to claim 1, characterized in that: The protruding structure (13) comprises a fixing plate (1321) and a metal pin (1322); The fixing disk (1321) is fixedly connected to the housing (12); one end of the metal pin (1322) is connected to the fixing disk (1321), and the other end protrudes to the outside of the housing (12) and is connected to the circuit board (2).

9. The BOB device according to claim 8, characterized in that: The shell (12) is provided with a through hole (122) communicating with the inner cavity (121), and the fixed plate (1321) closes the through hole (122); The metal pin (1322) passes through the fixing plate (1321), and one end of the metal pin is accommodated in the housing (12), while the other end protrudes to the outside of the housing (12).

10. The BOB device according to claim 8, characterized in that: The fixing plate (1321) and the metal pin (1322) are packaged as a TO base, and the TO base is any one of a TO46 base and a TO56 base.

11. The BOB device according to any one of claims 1 to 10, characterized in that: The shell (12) is in a square shape; The protruding structure (13) is in the shape of a straight column, and the protruding structure (13) is located on the side of the housing (12) facing the circuit board (2); or, The protruding structure (13) has at least one bend, and the protruding structure (13) is located on a side of the housing (12) adjacent to the circuit board (2) or on a side of the housing (12) facing away from the circuit board (2).

12. The BOB device according to claim 11, characterized in that: The first pin (1111) of the sending unit (111) is exposed at a first side surface (123) of the housing (12), and the second pin (1121) of the receiving unit (112) is exposed at a second side surface (124) of the housing (12); The optical component (1) further comprises an optical fiber fixing unit (113), the optical fiber fixing unit (113) being exposed on a third side surface (125) of the housing (12), the first side surface (123) being opposite to the third side surface (125), and the second side surface (124) being adjacent to the first side surface (123) and the third side surface (125) respectively; The protruding structure (13) is located on a fourth side surface (126) of the shell (12), and the fourth side surface (126) is different from the first side surface (123), the second side surface (124) and the third side surface (125).

13. The BOB device according to claim 12, characterized in that: The second side surface (124) is a surface of the housing (12) facing away from the circuit board (2); the soft board (3) connected to the second pin (1121) covers the fifth side surface (127) of the housing (12) and is connected to the circuit board (2); the fifth side surface (127) is located between the second side surface (124) and the circuit board (2); and the fifth side surface (127) is different from the first side surface (123) and the third side surface (125); The fourth side surface (126) is adjacent to the fifth side surface (127), or the fourth side surface (126) is opposite to the fifth side surface (127).

14. The BOB device according to any one of claims 1 to 10, characterized in that: The BOB device further comprises a metal cover (4), wherein the metal cover (4) is covered on the circuit board (2), and the optical component (1) is located in a space enclosed by the metal cover (4) and the circuit board (2).

15. The BOB device according to claim 14, characterized in that: The BOB device further comprises at least one heat conducting member (5), wherein the heat conducting member (5) is located between the top of the optical component (1) facing away from the circuit board (2) and the inner wall of the metal cover (4).

16. An optical communication device, characterized in that: The optical communication equipment comprises the optical component-on-board (BOB) device according to any one of claims 1 to 15.

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