Field effect transistor heat dissipation structure, motor controller and vehicle
By designing a bidirectional heat dissipation path in the motor controller and using oxygen-free copper thermal conductors, the problem of insufficient heat dissipation of field effect transistors is solved, which significantly improves the heat dissipation effect and improves the safety of the entire vehicle.
Patent Information
- Application Number
- CN202323666588.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2033-12-29
AI Technical Summary
The heat dissipation effect of the field effect transistor in the existing motor controller is insufficient, resulting in the inability to export heat in time, which may cause the motor controller or even the entire vehicle to fail.
Design a heat dissipation structure of a field effect transistor, including setting a bearing surface and mounting bracket on the shell, the thermal conductor is composed of stacked heat conductor sheets and thermal conductor parts. The thermal conductor is made of oxygen-free copper and is embedded on the mounting bracket. A liquid-cooled plate is also installed at the bottom of the housing to enhance installation stability and heat dissipation through spring blades and positioning protrusions.
By forming a bidirectional heat dissipation path and high thermal conductivity oxygen-free copper heat conduction parts, the heat dissipation effect of the field effect transistor is significantly improved, heat accumulation is avoided, and the safety of the whole vehicle is improved.
Smart Images
Figure CN222300661U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of motor controllers, and in particular to a field effect transistor heat dissipation structure. At the same time, the utility model also relates to a motor controller equipped with the field effect transistor heat dissipation structure, and a vehicle equipped with the motor controller. Background Art
[0002] At present, with the advancement of new energy vehicles' technologies in wireless transmission and unmanned driving, new energy vehicles are rapidly developing towards long endurance, high power, intelligence, high frequency, and networking and interoperability. This also puts forward more stringent requirements on automotive electronics. Among them, semiconductor field effect transistors (MOSFET) have inevitably become one of the key research directions of various automobile companies.
[0003] Field effect transistors are voltage control elements in motor controllers. Compared with ordinary bipolar transistors, they have the characteristics of high input impedance, low noise, large dynamic range, low power consumption and easy integration. They are one of the most important components of the entire motor controller. During the operation of the car, if the heat generated by the field effect transistor cannot be removed in time, it will cause intermittent or permanent failure of the electrical components, resulting in failure of the motor controller or even the entire vehicle.
[0004] The field effect transistor in the existing motor controller is generally fixed to the heat dissipation main housing by a plastic bracket and connected to the heat dissipation main housing by a high thermal conductivity insulation sheet to achieve the heat dissipation effect. However, for highly integrated motor controllers, such a design is easily limited by the structure and cannot directly water cool the field effect transistor or effectively dissipate the heat of the field effect transistor, which can easily cause the field effect transistor to exceed the junction temperature and even fail. Utility Model Content
[0005] In view of this, the utility model aims to provide a field effect transistor heat dissipation structure, which is beneficial to improving the heat dissipation effect of the field effect transistor.
[0006] In order to achieve the above object, the technical solution of the utility model is implemented as follows:
[0007] A field effect transistor heat dissipation structure comprises a bearing surface formed on a housing of an electronic device where the field effect transistor is located, and a mounting bracket arranged on the housing;
[0008] The mounting bracket is provided with a heat conducting portion, and the field effect transistor is clamped between the heat conducting portion and the carrying surface.
[0009] Furthermore, the heat conducting portion includes a heat conducting sheet and a heat conducting member which are stacked, the heat conducting member is fixedly connected to the mounting bracket, and a side of the heat conducting sheet which is opposite to the heat conducting member abuts against the field effect transistor.
[0010] Furthermore, the heat conducting element is made of oxygen-free copper.
[0011] Furthermore, the heat conducting member is embedded in the mounting bracket.
[0012] Furthermore, the shell is provided with a liquid cooling plate arranged close to the bearing surface.
[0013] Furthermore, a limiting protrusion is provided on the top of the mounting bracket, the limiting protrusion is located on a side of the mounting bracket facing the field effect transistor, and the limiting protrusion is used to limit the movement of the field effect transistor in the height direction of the shell.
[0014] Furthermore, a circuit board connected to the field effect transistor is provided on the top of the shell; a through-going groove is provided on the limiting protrusion, and the groove is used for passing a wiring harness connecting the field effect transistor and the circuit board and positioning the wiring harness.
[0015] Furthermore, it also includes a spring sheet arranged on the shell, the spring sheet is located on a side of the mounting bracket away from the field effect transistor, and one end of the spring sheet is detachably connected to the shell, and the other end of the spring sheet is elastically pressed against the mounting bracket; and / or, a positioning protrusion is provided on the mounting bracket, and positioning holes are provided on the field effect transistor and the heat conductive sheet corresponding to the mounting bracket, and the positioning protrusion is inserted into the positioning holes on the field effect transistor and the heat conductive sheet corresponding to the mounting bracket in sequence.
[0016] Compared with the prior art, the utility model has the following advantages:
[0017] The field effect transistor heat dissipation structure described in the utility model can form a heat dissipation path of field effect transistor-heat conduction portion-mounting bracket-housing by arranging a heat conduction portion on the mounting bracket, so as to improve the heat dissipation effect of the field effect transistor, avoid the risk of failure of the motor controller or even the whole vehicle due to the failure to dissipate the heat of the field effect transistor in time, thereby improving the safety of the whole vehicle.
[0018] Secondly, by coordinating the heat conducting sheet and the heat conducting component, the efficiency of heat transfer from the field effect transistor to the mounting bracket can be improved, thereby improving the heat dissipation effect of the field effect transistor. The heat conducting component is made of oxygen-free copper, which can utilize the high thermal conductivity and good processing performance of oxygen-free copper, which is not only conducive to improving the heat dissipation effect of the field effect transistor, but also conducive to the manufacture of heat conducting components and meeting the design requirements of different shapes. The heat conducting component is embedded in the mounting bracket, which is conducive to improving the thermal conductivity, while reducing space occupancy and improving the connection reliability between the two.
[0019] In addition, a liquid cooling plate is provided at the bottom of the shell to facilitate cooling of the shell, thereby effectively absorbing the heat dissipated by the field effect transistor. The setting of the limiting protrusion can limit the movement of the field effect transistor in the height direction of the shell, so as to improve its installation stability. At the same time, the provision of a groove is conducive to avoiding and positioning the wiring harness, while also protecting the wiring harness. The mounting bracket is installed by means of a spring sheet, which is not only simple to operate, but also conducive to improving the installation stability of the mounting bracket, the field effect transistor and the two heat conducting sheets without damaging the mounting bracket.
[0020] In addition, another object of the present invention is to provide a motor controller, in which the above-mentioned field effect transistor heat dissipation structure is configured.
[0021] In addition, another object of the present invention is to provide a vehicle, in which the above-mentioned motor controller is provided.
[0022] The motor controller and vehicle described in the utility model can timely conduct away the heat emitted by the field effect transistor by configuring the above-mentioned field effect transistor heat dissipation structure, avoiding the failure of the motor controller or even the whole vehicle, thereby helping to improve the safety of the whole vehicle. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the accompanying drawings:
[0024] Figure 1 It is a structural schematic diagram of the existing field effect transistor heat dissipation structure according to an embodiment of the utility model;
[0025] Figure 2 It is a structural schematic diagram of the heat dissipation structure of the field effect transistor according to an embodiment of the utility model;
[0026] Figure 3 It is a partial exploded view of the heat dissipation structure of the field effect transistor according to the embodiment of the utility model;
[0027] Figure 4 This is a schematic diagram of the structure of the mounting bracket according to an embodiment of the utility model;
[0028] Description of reference numerals:
[0029] 1. housing; 11. raised portion;
[0030] 2. Mounting bracket; 21. Limiting protrusion; 211. Groove; 22. Positioning protrusion;
[0031] 3. Field effect transistor; 4. Heat conducting sheet; 5. Heat conducting part; 6. Liquid cooling plate; 7. Circuit board; 8. Wiring harness; 9. Spring sheet; 10. Screw. DETAILED DESCRIPTION
[0032] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.
[0033] In the description of the present invention, it should be noted that if there are terms such as "upper", "lower", "inner", "outer" and the like indicating orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, if there are terms such as "first" and "second", they are also used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0034] In addition, in the description of the present invention, unless otherwise clearly defined, the terms "installation", "connection", "connection" and "connector" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood in combination with specific circumstances.
[0035] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.
[0036] Embodiment 1
[0037] The present embodiment relates to a field effect transistor heat dissipation structure, which improves the heat dissipation effect of the field effect transistor 3 by forming a bidirectional heat dissipation path structural design, can avoid the risk of failure of the motor controller or even the entire vehicle, and is conducive to improving the safety performance of the entire vehicle.
[0038] It is worth mentioning here that see Figure 1 As shown, this embodiment shows the existing field effect transistor heat dissipation structure, which is only on the left side of the field effect transistor 3 ( Figure 1 The left side in the shown state is provided with a heat conducting sheet 4, and the heat dissipation path is: field effect transistor 3 - heat conducting sheet 4 - housing 1 (the temperature of housing 1 is adjusted by liquid cooling plate 6). Since the heat is only conducted through the mounting bracket 2 on the right side, the heat dissipation is poor, that is, only one-side heat dissipation can be achieved, and the heat dissipation effect is poor.
[0039] As a result, the existing field effect transistor heat dissipation structure has the risk of poor heat dissipation, which may cause the motor controller or even the entire vehicle to fail due to the failure to dissipate the heat of the field effect transistor 3 in time.
[0040] To this end, this embodiment proposes an improved field effect transistor heat dissipation structure. In terms of overall structure, Figures 2 to 4 As shown, the field effect transistor heat dissipation structure includes a bearing surface formed on a housing 1 of an electronic device where the field effect transistor is located, and a mounting bracket 2 provided on the housing 1. In addition, a heat conducting portion is disposed on the mounting bracket 2, and the field effect transistor 3 is clamped between the heat conducting portion and the bearing surface.
[0041] Here, it can be understood that the field effect transistor heat dissipation structure of this embodiment is based on the traditional design (only in Figure 1 and 2 In the shown state, a heat-conducting sheet 4 is provided on the left side of the field effect transistor 3, that is, a heat-conducting sheet 4 abutting the field effect transistor 3 is provided on the bearing surface. At the same time, a heat dissipation path of field effect transistor 3 - heat-conducting part - mounting bracket 2 - housing 1 is also formed on the side of the mounting bracket, thereby forming a two-way heat dissipation channel and effectively improving the heat dissipation effect.
[0042] Based on the above overall introduction, in this embodiment, if Figure 2 and Figure 3 As shown, as an exemplary structure, the heat conducting portion includes a stacked heat conducting sheet 4 and a heat conducting member 5 , the heat conducting member 5 is fixedly connected to the mounting bracket 2 , and the side of the heat conducting sheet 4 facing away from the heat conducting member 5 abuts against the field effect transistor 3 .
[0043] Such a configuration can improve the efficiency of heat transfer from the field effect transistor 3 to the mounting bracket 2 , effectively conduct away the heat generated by the field effect transistor 3 when it is working, and thus improve the heat dissipation effect of the field effect transistor 3 .
[0044] In specific implementation, as a preferred implementation form, the heat conducting member 5 of this embodiment is made of oxygen-free copper. Thus, the high thermal conductivity and good processing performance of oxygen-free copper can be utilized, which is not only beneficial to improving the heat dissipation effect of the field effect transistor 3, but also beneficial to the manufacture of the heat conducting member 5 and meeting the requirements of different shape designs.
[0045] At the same time, in this embodiment, as a preferred implementation form, see Figure 4 As shown, the heat conducting member 5 is embedded in the mounting bracket 2. The advantage of such a configuration is that it can help improve the heat conduction effect, reduce space occupation, and improve the connection reliability between the two.
[0046] It is also worth mentioning that the heat conductor 5 of this embodiment adopts oxygen-free copper. With the support of the good processing performance of oxygen-free copper, it is convenient to realize the embedded design between the heat conductor 5 and the mounting bracket 2, and the embedded form can be achieved by the existing injection molding process, and the heat conductor 5 is injection molded on the mounting bracket 2.
[0047] In addition, in this embodiment, as a preferred implementation form, still refer to Figure 2 As shown, a liquid cooling plate 6 arranged close to the bearing surface is provided at the bottom of the housing 1. Thus, the housing 1 can be cooled, thereby effectively absorbing the heat dissipated by the field effect transistor 3.
[0048] In addition, in this embodiment, as a preferred implementation form, continue to refer to Figure 4 As shown, a limiting protrusion 21 is provided on the top of the mounting bracket 2. The limiting protrusion 21 is located on the side of the mounting bracket 2 facing the field effect transistor 3, and the limiting protrusion 21 is used to limit the movement of the field effect transistor 3 in the height direction of the shell 1, thereby facilitating improving the installation stability of the field effect transistor 3.
[0049] It is worth mentioning that the height direction of the housing 1 of this embodiment refers to Figures 1 to 3 Up and down directions in the shown state.
[0050] In this embodiment, as a preferred implementation form, a circuit board 7 (specifically, a printed circuit board assembly) for connecting to the field effect transistor 3 is provided on the top of the housing 1. At the same time, a through-arranged groove 211 is provided on the limiting protrusion 21, and the groove 211 is used for passing the wire harness 8 connecting the field effect transistor 3 and the circuit board 7 and positioning the wire harness 8.
[0051] It can be understood that the provision of the groove 211 here facilitates avoiding and positioning the wire harness 8 , while also protecting the wire harness 8 .
[0052] In addition, in this embodiment, as a preferred implementation form, refer again to Figure 2 and Figure 3 As shown, it also includes a spring sheet 9 arranged on the housing 1. The spring sheet 9 is located on the side of the mounting bracket 2 away from the field effect transistor 3, and one end of the spring sheet 9 is detachably connected to the housing 1, and the other end of the spring sheet 9 is elastically pressed against the mounting bracket 2.
[0053] Here, the mounting bracket 2 is installed by means of a detachable spring sheet 9 , which is not only easy to operate, but also helps to improve the installation stability of the mounting bracket 2 , the field effect transistor 3 and the two heat conducting sheets 4 without damaging the mounting bracket 2 .
[0054] Furthermore, the spring sheet 9 and the housing 1 of this embodiment can be connected via a fastener to achieve a detachable connection of the spring sheet 9 , and the fastener can specifically be a screw 10 .
[0055] In addition, in this embodiment, as a preferred implementation form, the mounting bracket 2 is provided with a positioning protrusion 22 (such as Figure 4 As shown), the field effect transistor 3 and the heat conductive sheet 4 of the corresponding mounting bracket 2 are provided with positioning holes, and the positioning protrusions 22 are inserted into the positioning holes on the field effect transistor 3 and the heat conductive sheet 4 of the corresponding mounting bracket 2 in sequence, thereby improving the installation convenience and stability of the field effect transistor 3 and the heat conductive sheet 4.
[0056] The field effect transistor heat dissipation structure of this embodiment has Figure 2 In the state shown, the assembly sequence is as follows: the liquid cooling plate 6 and the shell 1 are welded by stir friction welding, the left heat conductive sheet 4 is attached to the outer surface of the shell 1 by its own adsorption, and then the field effect transistor 3, the right heat conductive sheet 4, the heat conductive part 5 and the mounting bracket 2 are assembled into a component and assembled to the shell 1. During assembly, one end of the spring sheet 9 is locked by the screw 10, and the component is pressed onto the left heat conductive sheet 4 by the other end of the spring sheet 9. Finally, the wiring harness 8 of the field effect transistor 3 is passed through the groove 211 and welded to the circuit board 7.
[0057] In this embodiment, the electronic device of this embodiment is preferably a motor controller, and it should be mentioned that the housing 1 of this embodiment, such as Figure 2 and Figure 3 As shown, two protruding portions 11 protruding upward are provided on the top wall, and an installation space for installing the field effect transistor 3 is formed between the two protruding portions 11 and the top wall, that is, in Figure 2 In the state shown, installation spaces are provided on both the left and right sides of the housing 1, and the field effect transistors 3 on both sides are respectively installed on the bearing surfaces (ie, the outer side walls) of the protrusions 11 on the corresponding sides.
[0058] In specific implementation, each installation space is provided with related components such as field effect transistor 3, two heat conductive sheets 4, heat conductive member 5, mounting bracket 2, spring sheet 9 and screw 10. Based on the field effect transistor 3 on each side being installed on the bearing surface of the protrusion 11 on the corresponding side, one end of the spring sheet 9 is screwed to the top wall of the housing 1 by screw 10, and the other end of the spring sheet 9 is elastically pressed against the mounting bracket 2 (the mounting bracket 2 presses the right heat conductive sheet 4, field effect transistor 3, and right heat conductive sheet 4 on the protrusion 11 in sequence). In addition, the related structural parts not mentioned in the field effect transistor heat dissipation structure of this embodiment can refer to the various parts in the existing motor controller. For example, multiple field effect transistors 3 can be arranged on the outer wall of the protrusion 11 on each side, and one mounting bracket 2 can press two or four field effect transistors 3 (including the heat conductive sheets 4 on both sides) at the same time.
[0059] Furthermore, the heat conducting sheet 4, the mounting bracket 2 and the shell 1 of the present embodiment can be made of materials commonly used by those skilled in the art. For example, the heat conducting sheet 4 is made of silicone or boron nitride composite materials to have good thermal conductivity and insulation properties, so that it can conduct heat to the field effect transistor 3 while providing insulation protection. Furthermore, the mounting bracket 2 is made of engineering plastics made of PBT (polybutylene terephthalate) with 30% glass fiber added.
[0060] The heat dissipation structure of the field effect transistor of this embodiment is achieved by Figure 2 In the state shown, a heat conducting sheet 4 and a heat conducting part are respectively provided, which can form a two-way heat dissipation path of field effect transistor 3 - heat conducting sheet 4 - housing 1, and field effect transistor 3 - heat conducting part - mounting bracket 2 - housing 1 (or field effect transistor 3 - heat conducting part - mounting bracket 2 - spring sheet 9 - housing 1), so as to improve the heat dissipation effect of field effect transistor 3, avoid the risk of failure of motor controller or even whole vehicle due to failure to dissipate heat of field effect transistor 3 in time, thereby improving the safety of whole vehicle.
[0061] Embodiment 2
[0062] This embodiment relates to a motor controller, in which the field effect transistor heat dissipation structure in Embodiment 1 is configured. At the same time, this embodiment also relates to a vehicle, in which the above motor controller is provided.
[0063] The motor controller and vehicle of this embodiment, by setting the field effect transistor heat dissipation structure in Example 1, can avoid the risk of failure of the motor controller or even the entire vehicle due to the failure to dissipate the heat of the field effect transistor 3 in time, thereby improving the heat dissipation effect of the field effect transistor 3, thereby helping to improve the safety of the entire vehicle.
[0064] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A field effect transistor heat dissipation structure, characterized in that: It comprises a bearing surface formed on a housing (1) of an electronic device in which a field effect transistor (3) is located, and a mounting bracket (2) arranged on the housing (1); The mounting bracket (2) is provided with a heat-conducting portion, and the field effect transistor (3) is clamped between the heat-conducting portion and the bearing surface.
2. The field effect transistor heat dissipation structure according to claim 1, characterized in that: The heat-conducting portion comprises a stacked heat-conducting sheet (4) and a heat-conducting member (5), wherein the heat-conducting member (5) is fixedly connected to the mounting bracket (2), and a side of the heat-conducting sheet (4) facing away from the heat-conducting member (5) abuts against the field effect transistor (3).
3. The field effect transistor heat dissipation structure according to claim 2, characterized in that: The heat conducting member (5) is made of oxygen-free copper.
4. The field effect transistor heat dissipation structure according to claim 2, characterized in that: The heat conducting member (5) is embedded in the mounting bracket (2).
5. The field effect transistor heat dissipation structure according to claim 2, characterized in that: The shell (1) is provided with a liquid cooling plate (6) arranged close to the bearing surface.
6. The field effect transistor heat dissipation structure according to claim 2, characterized in that: A limiting protrusion (21) is provided on the top of the mounting bracket (2), the limiting protrusion (21) is located on the side of the mounting bracket (2) facing the field effect transistor (3), and the limiting protrusion (21) is used to limit the movement of the field effect transistor (3) in the height direction of the housing (1).
7. The field effect transistor heat dissipation structure according to claim 6, characterized in that: A circuit board (7) for connecting to the field effect transistor (3) is provided on the top of the housing (1); The limiting protrusion (21) is provided with a through-going groove (211), and the groove (211) is used for allowing a wire harness (8) connecting the field effect transistor (3) and the circuit board (7) to pass through and for positioning the wire harness (8).
8. The field effect transistor heat dissipation structure according to any one of claims 2 to 7, characterized in that: It also comprises a spring sheet (9) arranged on the housing (1), the spring sheet (9) being located on a side of the mounting bracket (2) away from the field effect transistor (3), and one end of the spring sheet (9) being detachably connected to the housing (1), and the other end of the spring sheet (9) being elastically pressed against the mounting bracket (2); and / or, The mounting bracket (2) is provided with a positioning protrusion (22), and the field effect transistor (3) and the heat conducting plate (4) corresponding to the mounting bracket (2) are both provided with positioning holes, and the positioning protrusion (22) is sequentially inserted into the positioning holes on the field effect transistor (3) and the heat conducting plate (4) corresponding to the mounting bracket (2).
9. A motor controller, characterized in that: The motor controller is provided with a field effect transistor heat dissipation structure according to any one of claims 1 to 8.
10. A vehicle, characterized in that: The vehicle is provided with the motor controller according to claim 9.