Power module and charging equipment

Abstract

The embodiment of the utility model provides a power module and charging equipment. The power module comprises a circuit board, a power device, a heat conduction piece and a liquid cooling assembly, wherein the power device is located between the circuit board and the liquid cooling assembly. Wherein the power device comprises a power device main body and pins, and the power device main body is fixed on the surface of the circuit board through the pins. Moreover, the power device main body is in heat-conducting connection with the liquid cooling assembly, and the pins are connected with the liquid cooling assembly through heat-conducting members. Therefore, the liquid cooling assembly not only can perform heat exchange with the power device main body, but also can perform heat exchange with the pins through the heat conduction pieces, so that liquid cooling heat dissipation of the power device main body and the pins is realized. Therefore, the overall heat dissipation effect of the power device can be improved, the heat dissipation requirement of the power device during high-power work can be met, and high-power charging of the electric vehicle by the charging equipment is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of power devices, and more specifically, to a power module and a charging device. Background Art

[0002] At present, charging equipment is developing towards high-power super-charging equipment, which can quickly recharge electric vehicles at a speed of one kilometer per second, thus creating a new charging experience of "a cup of coffee, a full cup to go".

[0003] However, when the charging equipment performs high-power supercharging on electric vehicles, the power devices in the charging equipment generate a lot of heat. If this heat cannot be discharged in time, it is easy to affect the normal high-power supercharging of electric vehicles by the charging equipment. At present, air cooling is often used to dissipate the heat of power devices in charging equipment, but this cooling method has poor heat dissipation effect and is difficult to meet the heat dissipation requirements of power devices when working at high power, thereby affecting the reliability and service life of power devices. Utility Model Content

[0004] The present application provides a power module and a charging device, which can improve the heat dissipation effect of the power device in the power module, so as to meet the heat dissipation requirements of the power device when working at high power, and improve the service life and reliability of the power module when working at high power. This is conducive to enabling the charging device to achieve a charging speed of one kilometer per second, that is, to charge an electric vehicle with the energy to travel one kilometer in one second, thereby bringing users a charging experience of "a cup of coffee, full charge and departure".

[0005] In a first aspect, a power module is provided, the power module comprising a circuit board, a power device, a heat conductive member and a liquid cooling assembly, wherein the power device is located between the circuit board and the liquid cooling assembly. The power device comprises a power device body and pins, wherein the power device body is fixed to the surface of the circuit board through the pins. The power device body is thermally connected to the liquid cooling assembly, and the pins are thermally connected to the liquid cooling assembly through the heat conductive member. The liquid cooling assembly is used for heat exchange with the power device body and the heat conductive member.

[0006] In the power module provided in the embodiment of the present application, the cooling medium in the liquid cooling assembly can perform heat exchange with the power device body, and can also perform heat exchange with the pins using a heat conductor, thereby taking away the heat generated by the power device body and the pins, and realizing liquid cooling of the power device body and the pins. Moreover, compared with air cooling, liquid cooling is more efficient. Furthermore, the overall heat dissipation effect of the power device is improved, which is conducive to meeting the heat dissipation requirements of the power device when working at high power, and improving the service life and reliability of the power module when working at high power.

[0007] Therefore, when the power module is applied to the charging equipment, it is conducive to the charging equipment to achieve a charging speed of one kilometer per second, thereby bringing users a charging experience of "a cup of coffee, a full charge". In addition, the use of liquid cooling for the power module is also conducive to the charging equipment meeting the construction requirements of the full liquid cooling super charging station, that is, it is conducive to meeting the requirements of liquid cooling for the power module and charging gun of each charging device in the charging station.

[0008] In addition, the use of liquid cooling components to simultaneously achieve liquid cooling of the power device body and pins can improve the utilization rate of the liquid cooling components, avoid the problems of large power module size and high cost caused by setting up different heat dissipation devices to dissipate heat for the power device body and pins respectively, and is conducive to the miniaturization and cost optimization of the power module.

[0009] In one implementation, the liquid cooling assembly includes a liquid cooling plate and a surrounding plate. The liquid cooling plate is located on the side of the power device body facing away from the circuit board, and the surrounding plate is fixed to the surface of the liquid cooling plate facing the circuit board. The surrounding plate and the liquid cooling plate are combined to form a glue filling groove, which is used to contain thermal conductive glue. The power device body is buried in the thermal conductive glue and is thermally connected to the liquid cooling plate through the thermal conductive glue. One end of the thermal conductive part is thermally connected to the pin, and the other end of the thermal conductive part extends into the thermal conductive glue and is thermally connected to the liquid cooling plate through the thermal conductive glue.

[0010] In the embodiment of the present application, the liquid cooling plate not only forms a heat dissipation path between the thermally conductive glue in the glue filling groove and the power device body, but also forms another heat dissipation path between the thermally conductive glue in the glue filling groove and the heat conductive part and the pin. As a result, the power device body and the pin of the power device can exchange heat with the cooling medium circulating in the liquid cooling plate through different heat dissipation paths. This can not only meet the heat dissipation requirements of the power device body and the pin, but also speed up the heat dissipation process of the cooling medium in the liquid cooling plate to the power device as a whole, thereby improving the overall heat dissipation effect of the power device.

[0011] In addition, while using the thermal conductive glue in the glue potting groove as an intermediate medium for thermal connection between the liquid cooling plate and the power device body and the pins, by burying the power device body in the thermal conductive glue, it is also possible to reduce the accumulation of dust and the like on the power device and alleviate the corrosion of the power device caused by harsh environment, which is beneficial to further improve the service life and reliability of the power module when working at high power.

[0012] In one implementation, the power device further includes a package, which is embedded in the thermally conductive adhesive and covers the power device body. One end of the pin is located in the package and fixedly connected to the power device body, the other end of the pin extends in the direction of the circuit board and exposes the package, and the other end of the pin is fixedly connected to the circuit board. The thermal conductor is located outside the package, one end of the thermal conductor is thermally connected to the other end of the pin, and the other end of the thermal conductor extends along the outer surface of the package in the direction of the thermally conductive adhesive, so that the other end of the thermal conductor extends into the thermally conductive adhesive.

[0013] In the embodiment of the present application, the other end of the pin that is fixedly connected to the circuit board is in direct heat-conducting contact with the heat-conducting member, so that when the power device is working, the heat generated at the other end of the pin can be directly and quickly transferred to the thermally conductive glue contained in the glue potting groove through the heat-conducting member. In addition, the efficiency of transferring the heat from the pin to the liquid cooling plate is improved, and the heat dissipation process of the liquid cooling component to the pin is accelerated, which is conducive to improving the overall heat dissipation effect of the power device.

[0014] In one implementation, the circuit board further includes a through hole, which penetrates the circuit board along the direction in which the circuit board and the power device body are arranged. The other end of the pin and one end of the heat conductor pass through the through hole, and the other end of the pin, one end of the heat conductor and the through hole are fixed by welding.

[0015] In an embodiment of the present application, the other end of the pin and one end of the heat conductor are welded and fixed to the through hole on the circuit board, thereby realizing a thermal connection between the other end of the pin, one end of the heat conductor and the inner wall of the through hole. When the power device is working, on the one hand, the heat generated by the other end of the pin can be quickly transferred to the thermally conductive glue contained in the glue potting groove through the heat conductor in direct thermal contact. Furthermore, the efficiency of the heat transfer from the pin to the liquid cooling plate is improved, and the heat dissipation process of the liquid cooling component to the pin is accelerated, which is beneficial to improving the overall heat dissipation effect of the power device. On the other hand, the heat generated at the through hole where the circuit board is fixedly connected to one end of the heat conductor can also be transferred to the liquid cooling plate through the heat conductor, thereby realizing liquid cooling heat dissipation at the through hole position. Furthermore, the heat dissipation effect of the power module is improved.

[0016] In one implementation, the power device further includes a package, which is embedded in the thermally conductive adhesive and covers the power device body. One end of the pin is located in the package and fixedly connected to the power device body, the other end of the pin extends in the direction of the circuit board and exposes the package, and the other end of the pin is fixedly connected to the circuit board. One end of the thermal conductor is located in the package and is thermally connected to one end of the pin, and the other end of the thermal conductor is in the direction of the liquid cooling plate and exposes the package, so that the other end of the thermal conductor extends into the thermally conductive adhesive.

[0017] In the embodiment of the present application, by disposing part of the heat conductive member in the package, the heat conductive member can be used to realize liquid cooling of the pins by the cooling medium in the liquid cooling assembly while also improving the structural compactness of the power module.

[0018] In one implementation, the power module further includes an auxiliary heat conductive member, which is embedded in the heat conductive adhesive, is heat conductively connected to the other end of the heat conductive member, and extends in a direction parallel to the liquid cooling plate.

[0019] In the embodiment of the present application, by thermally connecting the other end of the heat conductor to the auxiliary heat conductor, the contact area between the heat conductor and the thermally conductive adhesive can be increased. As a result, the heat generated by the other end of the pin exposed from the package can be transferred to the thermally conductive adhesive in the adhesive potting tank through the heat conductor and the auxiliary heat conductor at the same time, thereby improving the heat transfer efficiency at the pin. Furthermore, the cooling process of the pin by the cooling medium in the liquid cooling plate is accelerated, and the overall heat dissipation effect of the power module is improved.

[0020] In one implementation, along the direction in which the circuit board and the power device body are arranged, the height of the end surface of the enclosure facing the circuit board is less than the height of the surface of the package facing the circuit board. In this way, along the direction in which the circuit board and the power device body are arranged, there is a spacing space between the enclosure and the circuit board, and a portion of the package away from the circuit board is buried in the thermal conductive adhesive, and another portion of the package close to the circuit board is exposed to the thermal conductive adhesive.

[0021] In the embodiment of the present application, by providing a spacing space between the enclosure and the circuit board, when other electronic components in the power module are fixed to the surface of the circuit board facing the enclosure, it is possible to avoid the contact between the enclosure and the surface of the circuit board facing the enclosure and thus avoid affecting other electronic components fixed on the circuit board, thereby ensuring the normal operation of the power module and improving the operating reliability of the power module.

[0022] In addition, by setting the height of the package to be greater than the height of the enclosure, part of the package is buried in the thermally conductive adhesive in the adhesive potting tank. Compared with the package being completely buried in the thermally conductive adhesive in the adhesive potting tank, this can ensure that the package and the thermally conductive adhesive have a sufficiently large contact area while reducing the excessive use of the enclosure and the thermally conductive adhesive, which is conducive to reducing the cost of the power module.

[0023] In one implementation, along the direction in which the circuit board and the power device body are arranged, the projection of the enclosure does not overlap with the projection of the package and the projection of the heat conductor, respectively. Along the direction perpendicular to the arrangement of the circuit board and the power device body, the projection of the liquid cooling plate does not overlap with the projection of the package and the projection of the heat conductor, respectively. That is to say, along the direction in which the circuit board and the power device body are arranged, there is a gap between the enclosure and the package and they do not touch, and there is a gap between the enclosure and the heat conductor and they do not touch. Furthermore, along the direction perpendicular to the arrangement of the circuit board and the power device body, there is a gap between the liquid cooling plate and the package and they do not touch, and there is a gap between the liquid cooling plate and the heat conductor and they do not touch.

[0024] In this way, safety problems caused by contact between the enclosure and the packaging and heat-conducting parts can be avoided, and safety problems caused by contact between the liquid cooling plate and the packaging and heat-conducting parts can also be avoided, thereby improving the safety of the power module and helping to meet the safety requirements of the power module.

[0025] In one implementation, the enclosure includes an inner side surface and an outer side surface that are arranged opposite to each other. In the direction perpendicular to the arrangement of the circuit board and the main body of the power device, the inner side surface is close to the thermally conductive glue in the glue potting groove, and the outer side surface is away from the thermally conductive glue in the glue potting groove. In the direction perpendicular to the arrangement of the circuit board and the main body of the power device, the height of the inner side surface facing the circuit board is less than the height of the outer side surface facing the circuit board. In this way, a recessed portion can be formed on the end surface of the enclosure facing the circuit board, and the recessed portion is connected to the open end of the glue potting groove, thereby increasing the caliber of the open end of the glue potting groove. In other words, in the direction perpendicular to the arrangement of the circuit board and the main body of the power device, the distance between the portion of the inner side surface located at the open end of the glue potting groove and the packaging component, and the distance between the inner side surface and the thermal conductive component are longer than other portions of the inner side surface.

[0026] Thus, voltage breakdown caused by too small distance between the enclosure and the heat conducting member at the opening end of the glue potting groove and too small distance between the enclosure and the packaging member can be avoided. Furthermore, the safety of the power module can be improved, which is conducive to meeting the safety requirements of the power module.

[0027] In a second aspect, a charging device is provided, which includes a power module and at least one charging interface, the power module is electrically connected to the at least one charging interface, and the power module is used to output power to the electric vehicle through the at least one charging interface. Among them, the power module includes a circuit board, a power device, a heat conductor and a liquid cooling component, and the power device is located between the circuit board and the liquid cooling component. The power device includes a power device body and pins, the power device body is fixed to the surface of the circuit board through the pins, the power device body is thermally connected to the liquid cooling component, and the pins are thermally connected to the liquid cooling component through the heat conductor. The liquid cooling component is used to perform heat exchange with the power device body and the heat conductor.

[0028] For the beneficial effects of the second aspect that are not detailed, please refer to the beneficial effects of the first aspect mentioned above, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of a charging system provided in an embodiment of the present application.

[0030] Figure 2 yes Figure 1 Schematic diagram of the connection structure of the charging system shown.

[0031] Figure 3 It is a structural schematic diagram of a power module provided in an embodiment of the present application.

[0032] Figure 4 It is a schematic diagram of the structure of another power module provided in an embodiment of the present application.

[0033] Figure 5 It is a schematic diagram of the main structure of another power module provided in an embodiment of the present application.

[0034] Figure 6 yes Figure 5 A side view structural schematic diagram of the power module shown. DETAILED DESCRIPTION

[0035] To facilitate understanding of the embodiments of the present application, the following points are explained before introducing the embodiments of the present application.

[0036] The directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside" and "outside" in the embodiments of the present application are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present application.

[0037] The "perpendicular" mentioned in this application is not perpendicular in the strict sense, but within the allowable error range. The "parallel" is not parallel in the strict sense, but within the allowable error range.

[0038] In the embodiments of the present application, the same reference numerals represent the same component or the same part. In the embodiments of the present application, for multiple identical parts, only one of the parts may be marked with a reference numeral in the drawings as an example. For other identical parts or components, the reference numerals are also applicable. In addition, the sizes and dimensions of the parts shown in the drawings are only exemplary.

[0039] The embodiment of the present application provides a power module, which includes a circuit board, a power device, a heat conductive member, and a liquid cooling assembly, wherein the power device is located between the circuit board and the liquid cooling assembly. The power device includes a power device body and pins, and the power device body is fixed to the surface of the circuit board through the pins. The power device body is thermally connected to the liquid cooling assembly, and the pins are thermally connected to the liquid cooling assembly through the heat conductive member, and the liquid cooling assembly is used to perform heat exchange with the power device body and the heat conductive member.

[0040] In the power module provided in the embodiment of the present application, the cooling medium in the liquid cooling assembly can perform heat exchange with the power device body connected with heat conduction, and can also perform heat exchange with the pins of the power device using the heat conducting member to take away the heat generated by the power device body and the pins, thereby realizing liquid cooling of the power device body and the pins. Moreover, compared with air cooling, liquid cooling is more efficient. Furthermore, the overall heat dissipation effect of the power device is improved, which is conducive to meeting the heat dissipation requirements of the power device when working at high power, and improving the service life and reliability of the power module when working at high power.

[0041] In addition, the use of liquid cooling components to simultaneously achieve liquid cooling of the power device body and pins can improve the utilization rate of the liquid cooling components, avoid the problems of large power module size and high cost caused by setting up different heat dissipation devices to dissipate heat for the power device body and pins respectively, and is conducive to the miniaturization and cost optimization of the power module.

[0042] The embodiment of the present application also provides a charging device, which includes the power module described above and at least one charging interface. The power module is electrically connected to the at least one charging interface, and the at least one charging interface is used to electrically connect to an electric vehicle. The power module is used to output power to the electric vehicle through at least one charging interface to charge the electric vehicle. As described above, the heat dissipation effect of the power module is good, which can meet the heat dissipation requirements of the power module when working at high power, and is conducive to enabling the charging device to achieve a charging speed of one kilometer per second, that is, to achieve 1 second to charge the electric vehicle to travel 1 kilometer of electricity, thereby bringing users a charging experience of "one kilometer per second, full charge to start". In addition, the use of liquid cooling for the power module is also conducive to enabling the charging equipment to meet the construction requirements of a fully liquid-cooled super-charging charging station, that is, it is conducive to meeting the requirements that the power module and the charging gun of each charging device in the charging station adopt liquid cooling for heat dissipation.

[0043] The charging device provided in the embodiment of the present application can be applied to a charging system including an electric vehicle. In the charging system, the charging device can use the electric energy from the power grid to charge the electric vehicle. Figure 1 and Figure 2 The charging system provided in the embodiment of the present application is first described in detail.

[0044] Figure 1 It is a structural schematic diagram of a charging system 10 provided in an embodiment of the present application. Figure 2 yes Figure 1 The connection structure diagram of the charging system 10 is shown.

[0045] Combine 1 and Figure 2 The charging system 10 includes a charging device 11 and an electric vehicle 12. The charging device 11 includes a charging host 111, at least one charging terminal 112 and at least one charging gun 113, that is, the charging device 11 can be a split-type charging pile.

[0046] Among them, the charging host 111 includes multiple alternating current-direct current (AC-DC) power modules 1111, multiple direct current-direct current (DC-DC) power modules 1112, a DC bus 1113, a power distribution device 1114 and at least one charging interface. Multiple AC-DC power modules 1111 are connected in parallel between the external power grid 20 and the DC bus 1113. The input ends of multiple DC-DC power modules 1112 are electrically connected to the DC bus 1113, and the output ends of multiple DC-DC power modules 1112 are electrically connected to the input end of the power distribution device 1114. The output end of the power distribution device 1114 is electrically connected to at least one charging interface. In a specific implementation, each charging interface can be electrically connected to a charging terminal 112, and each charging terminal 112 is electrically connected to at least one charging gun 113.

[0047] Among them, multiple AC-DC power modules 1111 are used to receive alternating current from the external power grid 20, and convert the alternating current into direct current and output it to the direct current bus 1113. Multiple DC-DC power modules 1112 are used to obtain direct current from the direct current bus 1113, and further convert the obtained direct current into direct current suitable for the electric vehicle 12 and transmit it to the power distribution device 1114. The power distribution device 1114 is used to dynamically distribute the direct current output by the multiple DC-DC power modules 1112 according to the actual charging power required by the electric vehicle 12, and transmit the distributed charging power to the electric vehicle 12 through the charging gun 113 connected to the charging terminal 112, so as to charge the electric vehicle 12.

[0048] The charging terminal 112 outputs the received DC power to the electric vehicle 12 through the electrically connected charging gun 113 to charge the electric vehicle 12. Exemplarily, the charging terminal 112 includes a housing, a human-machine interaction interface, a charging control unit, a metering and billing unit, etc., and is used to perform information exchange, energy transmission, metering and billing, etc. with the electric vehicle 12.

[0049] The electric vehicle 12 is a vehicle that is driven by electric energy. The electric vehicle 12 may be a pure electric vehicle (pure EV / battery EV), a hybrid electric vehicle (HEV), a range extended electric vehicle (REEV), or a plug-in hybrid electric vehicle (PHEV).

[0050] It should be understood that the embodiment of the present application is described by taking the charging device 11 as a split-type charging pile as an example. In some other embodiments, the charging device 11 may also be an integrated charging pile. Specifically, the charging device 11 may directly set the human-computer interaction interface, the charging control unit, and the metering and billing unit in the charging host 111, so that the charging device 11 may not include the charging terminal 112, but include the charging host 111, and at least one charging gun 113 electrically connected to the charging host 111.

[0051] It should also be understood that the present application embodiment is described by taking the charging device 11 as an example including the AC-DC power module 1111 and the DC-DC power module 1112. In some other embodiments, the charging device 11 may only include the AC-DC power module 1111, but not the DC-DC power module 1112.

[0052] Combine the following Figures 3 to 6 The specific structure of the power module provided in the embodiment of the present application is described in detail.

[0053] Figure 3 and Figure 4 They are schematic diagrams of the structure of a power module 300 provided in the embodiment of the present application. It should be understood that in the embodiment of the present application, the power module 300 may be Figure 2 The AC-DC power module 1111 shown, or the power module 300 may also be Figure 2 The DC-DC power module 1112 is shown.

[0054] It should be noted that, for ease of description and understanding, the following embodiments are described by taking the power module 300 as an example of a charging device in a charging system. In some other embodiments, the power module 300 can also be applied to other scenarios such as an energy storage system or a photovoltaic storage system.

[0055] Combination Figure 3 and Figure 4The power module 300 includes a circuit board 310 , a power device 320 , a heat conductor 330 and a liquid cooling assembly 340 .

[0056] The power device 320, the heat conductor 330 and the liquid cooling assembly 340 are located on the same side of the circuit board 310, and the power device 320 is located between the circuit board 310 and the liquid cooling assembly 340. The circuit board 310 is used to fix the power device 320 and is electrically connected to the power device 320. The heat conductor 330 is used to connect the power device 320 and the liquid cooling assembly 340 by thermal conduction, so as to transfer the heat generated by the power device 320 to the liquid cooling assembly 340. The liquid cooling assembly 340 is used to connect the power device 320 and the heat conductor 330 by thermal conduction.

[0057] In this way, the cooling medium circulating in the liquid cooling assembly 340 can directly exchange heat with the power device 320, and can also exchange heat with the power device 320 through the heat conductor 330, thereby taking away the heat generated by the power device 320, and realizing liquid cooling of the power device 320. Compared with the commonly used air cooling method, the liquid cooling method is more efficient, thereby improving the heat dissipation effect of the power device 320, which is conducive to meeting the heat dissipation requirements of the power device 320 when working at high power.

[0058] The following is a detailed introduction to each component in the power module 300 mentioned above.

[0059] Combination Figure 3 and Figure 4 In some embodiments, the circuit board 310 includes a first circuit board surface 311 and a second circuit board surface 312 that are arranged opposite to each other. The power device 320 is fixed on the circuit board 310, and the first circuit board surface 311 can be fixed to the enclosure 342 in the liquid cooling assembly 340 described below by, for example, fasteners (not shown in the figure).

[0060] In the embodiment of the present application, the circuit board 310 may refer to a printed circuit board (PCB), a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a circuit board, an aluminum substrate, a high-frequency board, an impedance board, etc. For ease of description and understanding, the embodiment of the present application is described by taking the circuit board 310 as a printed circuit board as an example.

[0061] It should be understood that in the embodiment of the present application, the number of the power devices 320 in the power module 300 may be one or more. For ease of description and understanding, the embodiment of the present application is described by taking one power device 320 in the power module 300 as an example.

[0062] For example, the power device 320 may refer to a high-power device such as a relay, a fuse or a transformer that generates heat during operation.

[0063] Continue to combine Figure 3 and Figure 4 In some embodiments, the power device 320 includes a power device body 321 and pins 322 . The power device body 321 is located between the circuit board 310 and the liquid cooling assembly 340 , and the power device body 321 is fixed to one side of the circuit board 310 through the pins 322 .

[0064] It should be understood that in the embodiment of the present application, the power device body 321 may refer to the part of the power device 320 used for working, and the pin 322 may refer to the part of the power device 320 used for connecting other circuit elements, such as for connecting the circuit board 310. Among them, the pin 322 can play the role of transmitting current.

[0065] It should also be understood that in the embodiment of the present application, the power device body 321 can be fixed to one side of the circuit board 310 through one or more pins 322. For ease of description and understanding, the embodiment of the present application is described by taking the example that the power device body 321 is fixed to one side of the circuit board 310 through two pins 322.

[0066] Furthermore, in some embodiments, the power device 320 further includes a package 323, and the package 323 is used to package the power device body 321. Specifically, the package 323 covers the power device body 321, one end 3221 of the pin 322 is located in the package 323 and fixedly connected to the power device body 321, and the other end 3222 of the pin 322 extends toward the circuit board 310 and exposes the package 323, so as to be fixedly connected to the circuit board 310.

[0067] It should be understood that in the embodiment of the present application, the packaging member 323 encapsulating the power device body 321 means that the power device body 321 is completely encapsulated by the packaging member 323 .

[0068] In a specific implementation, in some embodiments, the other end 3222 of the pin 322 may be fixed to the circuit board 310 by welding, or may be fixed to the circuit board 310 by a fastener 350 .

[0069] For an example, see Figure 3 The circuit board 310 further includes a soldering through hole 313, which penetrates the circuit board 310 along the direction in which the circuit board 310 and the power device body 321 are arranged. That is, the soldering through hole 313 penetrates the circuit board 310 along the direction in which the first circuit board surface 311 and the second circuit board surface 312 of the circuit board 310 are arranged. The other end 3222 of the pin 322 exposed from the package 323 extends toward the circuit board 310 and passes through the soldering through hole 313, and the other end 3222 of the pin 322 and the soldering through hole 313 are fixedly connected by welding.

[0070] For another example, see Figure 4 The power module 300 further includes a fastener 350, and the circuit board 310 further includes a mounting through hole 314. The mounting through hole 314 penetrates the circuit board 310 along the direction in which the circuit board 310 and the power device body 321 are arranged. That is, the mounting through hole 314 penetrates the circuit board 310 along the direction in which the first circuit board surface 311 and the second circuit board surface 312 of the circuit board 310 are arranged.

[0071] The other end 3222 of the pin 322 exposed from the package 323 extends toward the circuit board 310 and passes through the mounting through hole 314. The fastener 350 is located on the side of the circuit board 310 away from the power device body 321, and the fastener 350 is used to assemble with the mounting through hole 314 to fix the pin 322 to the circuit board 310. The fastener 350 can be, for example, a rivet nut or a rivet screw. In other words, the other end 3222 of the pin 322 can be fixedly connected to the circuit board 310 by riveting.

[0072] Continue to combine Figure 3 and Figure 4 In some embodiments, the power device body 321 is thermally connected to the liquid cooling assembly 340, and the pin 322 is thermally connected to the liquid cooling assembly 340 through the heat conductive member 330. The heat conductive member 330 is a connector capable of transferring heat, such as a metal copper bar or a metal aluminum bar.

[0073] It should be understood that when the power device 320 is working, in addition to the power device body 321 generating a lot of heat, the pins 322 of the power device 320 also generate a certain amount of heat. If this heat cannot be discharged in time, it will also affect the service life of the power device 320 and the reliability of the soldering position of the pins 322 and the circuit board 310.

[0074] In the embodiment of the present application, by arranging the power device 320 between the circuit board 310 and the liquid cooling assembly 340, and thermally connecting the power device body 321 to the liquid cooling assembly 340, the heat generated by the power device body 321 can be transferred to the cooling medium in the liquid cooling assembly 340 through thermal contact, thereby achieving liquid cooling of the power device body 321. In addition, by thermally connecting the pin 322 to the liquid cooling assembly 340 through the heat conductive member 330, the heat generated by the pin 322 can be transferred to the liquid cooling assembly 340 at a distance through the heat conductive member 330, thereby achieving liquid cooling of the pin 322.

[0075] That is to say, in the embodiment of the present application, there is a heat dissipation path between the power device body 321 and the liquid cooling assembly 340, and there is another heat dissipation path between the pin 322, the heat conductor 330 and the liquid cooling assembly 340, that is, the power device body 321 and the pin 322 perform heat exchange with the liquid cooling assembly 340 through different heat dissipation paths. This can speed up the heat dissipation process of the liquid cooling assembly 340 for the power device 320 as a whole while meeting the heat dissipation requirements of the power device body 321 and the pin 322. In addition, the overall heat dissipation effect of the power device 320 is improved, which is conducive to meeting the heat dissipation requirements of the power device 320 when working at high power, and improving the service life and reliability of the power module 300 when working at high power.

[0076] In addition, by using the liquid cooling component 340 to simultaneously achieve liquid cooling of the power device body 321 and the pins 322, the utilization rate of the liquid cooling component 340 can be improved, and the problem of a larger size and higher cost of the power module 300 caused by separately dissipating heat for the power device body 321 and the pins 322 through different heat dissipation devices is avoided, which is beneficial to the miniaturization and cost optimization of the power module 300.

[0077] Exemplarily, when the power device 320 includes a plurality of pins 322, the number of heat conductive members 330 in the power module 300 may be multiple, and the plurality of heat conductive members 330 correspond to the plurality of power devices 320 one by one, and the pin 322 of each power device 320 is thermally connected to the liquid cooling assembly 340 through the corresponding heat conductive member 330. In other words, the heat generated by the plurality of pins 322 of the power device 320 is transferred to the liquid cooling assembly 340 through different heat conductive members 330, which is conducive to accelerating the heat dissipation process of the liquid cooling assembly 340 for the plurality of pins 322, thereby improving the overall heat dissipation effect of the power module 300.

[0078] The following continues to combine Figure 3 and Figure 4 The liquid cooling assembly 340 in the power module 300 is introduced in detail.

[0079] Continue to combine Figure 3 and Figure 4 In some embodiments, the liquid cooling assembly 340 includes a liquid cooling plate 341 and a surrounding plate 342. The liquid cooling plate 341 is located on the side of the power device body 321 away from the circuit board 310, and the surrounding plate 342 is fixed to the surface 3411 of the liquid cooling plate 341 facing the circuit board 310. The surrounding plate 342 and the surface 3411 of the liquid cooling plate 341 facing the circuit board 310 are enclosed to form a glue filling groove 343, and the opening of the glue filling groove 343 faces the circuit board 310.

[0080] Specifically, one end of the enclosure 342 is fixedly connected to the surface 3411 of the liquid cooling plate 341 facing the circuit board 310, and the other end of the enclosure 342 extends in the direction of the circuit board 310. The enclosure 342 serves as the side wall of the glue pouring groove 343, and the surface 3411 of the liquid cooling plate 341 facing the circuit board 310 serves as the bottom surface of the glue pouring groove 343. The glue pouring groove 343 is used to accommodate thermally conductive glue. The thermally conductive glue is thermally conductively connected to the bottom surface of the glue pouring groove 343, that is, to the surface 3411 of the liquid cooling plate 341 facing the circuit board 310, and further to the cooling medium in the liquid cooling plate 341.

[0081] In some embodiments, in combination Figure 3 and Figure 4 The liquid cooling plate 341 is provided with a liquid cooling channel 3412, and the liquid cooling channel 3412 includes a liquid inlet 3412a and a liquid outlet 3412b. The liquid inlet 3412a and the liquid outlet 3412b are arranged opposite to each other in a direction parallel to the liquid cooling plate 341, and the liquid inlet 3412a is used to connect to the input end of the external cooling system, and the liquid outlet 3412b is used to connect to the output end of the external cooling system.

[0082] In this way, the cooling medium in the external cooling system can flow into the liquid cooling channel 3412 through the liquid inlet 3412a, and flow out of the liquid cooling channel 3412 through the liquid outlet 3412b. The cooling medium in the liquid cooling channel 3412 can be thermally connected to the thermally conductive glue in the glue potting groove 343 through the surface 3411 of the liquid cooling plate 341 facing the circuit board 310.

[0083] It should be understood that in the embodiment of the present application, the external cooling system may refer to a cooling system located outside the power module 300 that can provide cooling medium for the liquid cooling channel 3412 and can reduce the temperature of the cooling medium delivered to the liquid cooling channel 3412.

[0084] Further, in some embodiments, the power device body 321 is embedded in the thermally conductive adhesive and is thermally connected to the thermally conductive adhesive. Specifically, the package 323 is embedded in the thermally conductive adhesive and covers the power device body 321. That is, the power device body 321 is thermally connected to the thermally conductive adhesive through the package 323. In addition, one end 331 of the thermal conductive member 330 is thermally connected to the pin 322, and the other end 332 of the thermal conductive member 330 extends into the thermally conductive adhesive and is thermally connected to the thermally conductive adhesive.

[0085] Thus, the power device body 321 can be thermally connected to the cooling medium in the liquid cooling plate 341 through the thermally conductive glue in the glue potting groove 343. The pin 322 can be thermally connected to the cooling medium in the liquid cooling plate 341 through the heat conductive member 330 and the thermally conductive glue in the glue potting groove 343.

[0086] It should be understood that in the embodiment of the present application, the packaging component 323 being buried in the thermal conductive adhesive means that at least a portion of the packaging component 323 is covered by the thermal conductive adhesive.

[0087] In a specific implementation, the cooling medium of the external cooling system flows into the liquid cooling channel 3412 through the liquid inlet 3412a of the liquid cooling channel 3412. On the one hand, the cooling medium in the liquid cooling channel 3412 exchanges heat with the power device body 321 through the liquid cooling plate 341 and the thermally conductive adhesive to remove the heat generated by the power device body 321, thereby achieving liquid cooling and heat dissipation of the power device body 321. On the other hand, the cooling medium in the liquid cooling channel 3412 exchanges heat with the pin 322 through the liquid cooling plate 341, the thermally conductive adhesive and the thermally conductive member 330 to remove the heat generated by the pin 322, thereby achieving liquid cooling and heat dissipation of the pin 322.

[0088] Afterwards, the cooling medium carrying heat flows back to the external cooling system through the liquid outlet 3412b of the liquid cooling channel 3412. The external cooling system is used to cool the cooling medium carrying heat, and the cooled cooling medium flows into the liquid cooling channel 3412 through the liquid inlet 3412a of the liquid cooling channel 3412 to realize the recycling of the cooling medium in the liquid cooling plate 341, thereby realizing the circulating heat dissipation of the power device body 321 and the pins 322 by the liquid cooling plate 341.

[0089] It should be understood that the specific manner in which the heat-conducting member 330 connects the pins 322 and the thermally conductive adhesive will be described below. To avoid redundancy, the above is only a brief description.

[0090] In the embodiment of the present application, the liquid cooling plate 341 forms a heat dissipation path between the thermally conductive glue in the glue filling groove 343 and the power device body 321, and the liquid cooling plate 341 forms a heat dissipation path between the thermally conductive glue in the glue filling groove 343 and the heat conductive member 330 and the pin 322 of the power device 320. As a result, the power device body 321 and the pin 322 exchange heat with the cooling medium circulating in the liquid cooling channel 3412 of the liquid cooling plate 341 through different heat dissipation paths. This is conducive to meeting the heat dissipation requirements of the power device body 321 and the pin 322 of the power device 320, and is also conducive to accelerating the heat dissipation process of the cooling medium in the liquid cooling channel 3412 to the power device 320 as a whole, thereby improving the heat dissipation effect on the power device 320 as a whole.

[0091] In addition, while utilizing the thermally conductive adhesive in the adhesive potting groove 343 as an intermediate medium for thermally conductively connecting the liquid cooling plate 341 with the power device body 321 and the pins 322, by burying the power device body 321 in the thermally conductive adhesive, it is also possible to reduce the accumulation of dust and the like on the power device 320, and alleviate problems such as corrosion of the power device 320 caused by the harsh environment, thereby facilitating further improving the service life and reliability of the power device 320 when operating at high power.

[0092] Further, in some embodiments, continue to combine Figure 3 and Figure 4 , along the direction in which the circuit board 310 and the power device body 321 are arranged, the height of the end surface 3421 of the enclosure 342 facing the circuit board 310 is less than the height of the outer surface 3231 of the package 323 facing the circuit board 310. That is, along the direction in which the circuit board 310 and the power device body 321 are arranged, the height of the circuit board 310>the height of the package 323>the height of the enclosure 342.

[0093] Thus, along the arrangement direction of the circuit board 310 and the power device body 321, there is a spacing space between the end surface 3421 of the enclosure 342 facing the circuit board 310 and the first circuit board surface 311 of the circuit board 310 facing the power device body 321, and a portion of the package 323 facing away from the circuit board 310 is buried in the thermal conductive adhesive, and another portion of the package 323 close to the circuit board 310 is exposed to the thermal conductive adhesive.

[0094] In the embodiment of the present application, by providing a spacing space between the enclosure 342 and the circuit board 310, it is possible to avoid the contact between the enclosure 342 and the first circuit board surface 311 of the circuit board 310 and thus avoid affecting other electronic components in the power module 300 fixed on the first circuit board surface 311, thereby facilitating the normal operation of the power module 300 and improving the operational reliability of the power module 300.

[0095] In addition, by setting the height of the package 323 to be greater than the height of the enclosure 342, a portion of the package 323 is buried in the thermally conductive adhesive in the adhesive potting groove 343. Compared with the package 323 being completely buried in the thermally conductive adhesive in the adhesive potting groove 343, this can reduce the excessive use of the enclosure 342 and the thermally conductive adhesive while ensuring that the package 323 has a sufficient contact area with the thermally conductive adhesive, thereby reducing the cost of the power module 300.

[0096] The specific manner in which the heat-conducting connection pins 322 and the heat-conducting adhesive of the heat-conducting member 330 mentioned above are thermally connected is exemplarily introduced below in conjunction with the accompanying drawings.

[0097] Continue to combine Figure 3 and Figure 4 In some embodiments, when one end 3221 of the pin 322 of the power device 320 is located in the package 323 and fixedly connected to the power device body 321, the other end 3222 of the pin 322 extends toward the circuit board 310 and exposes the package 323 for fixed connection to the circuit board 310, and the thermal conductor 330 is located outside the package 323.

[0098] Among them, one end 331 of the heat conductive member 330 is heat conductively connected to the other end 3222 of the pin 322. That is, one end 331 of the heat conductive member 330 is heat conductively connected to the portion of the pin 322 exposed from the package 323. The other end 332 of the heat conductive member 330 extends along the outer surface of the package 323 in the direction of the glue potting groove 343, and extends into the heat conductive glue contained in the glue potting groove 343. In other words, the heat conductive member 330 is attached to the outer surface of the package 323, and extends along the portion of the pin 322 exposed from the package 323 in the direction pointing to the glue potting groove 343.

[0099] In the embodiment of the present application, the other end 3222 of the pin 322, which is used for fixed connection with the circuit board 310, is in direct heat-conducting contact with the heat-conducting member 330, so that when the power device 320 is working, the heat generated by the other end 3222 of the pin 322 can be directly and quickly transferred to the thermally conductive glue contained in the glue-filling groove 343 through the heat-conducting member 330, and further transferred to the cooling medium in the liquid cooling plate 341 through the thermally conductive glue. In addition, the efficiency of transferring the heat from the pin 322 to the cooling medium is improved, and the heat dissipation process of the liquid cooling component 340 to the pin 322 is accelerated, which is conducive to improving the overall heat dissipation effect of the power device 320.

[0100] For example, Figure 3 and Figure 4 As shown, the other end 332 of the heat conductive member 330 can be bent and extended toward the glue potting groove 343, so that the heat conductive member 330 can be better attached to the outer surface of the package 323. In this way, while improving the overall heat dissipation effect of the power device 320, the compactness of the structure of the power module 300 is also improved.

[0101] It should be understood that the above embodiment is described by taking the example that the power device 320 includes the package 323 and the heat conductive member 330 is attached to the outer surface of the package 323. In some other embodiments, the power device 320 may not be provided with the package 323. In this case, the heat conductive member 330 may be directly attached to the outer surface of the power device body 321.

[0102] For example, in one example, the power device 320 further includes an insulating layer (not shown in the figure), and the heat conductor 330 is attached to the outer surface of the power device body 321 through the insulating layer. In this way, the insulating layer can electrically insulate the heat conductor 330 from the power device body 321, thereby improving the safety of the power module 300 and helping to meet the safety requirements of the power module 300.

[0103] Further, in some embodiments, refer to Figure 3When the pin 322 of the power device 320 is welded to the circuit board 310, the other end 3222 of the pin 322 exposed from the package 323 and the one end 331 of the heat conductor 330 pass through the welding through hole 313, and the other end 3222 of the pin 322, the one end 331 of the heat conductor 330 and the welding through hole 313 are fixed by welding.

[0104] In the embodiment of the present application, the other end 3222 of the pin 322 and the one end 331 of the heat conductive member 330 are welded together with the welding through hole 313 on the circuit board 310 to achieve a thermal connection between the other end 3222 of the pin 322, the one end 331 of the heat conductive member 330 and the inner wall of the welding through hole 313. When the power device 320 is working, on the one hand, the heat generated by the other end 3222 of the pin 322 can be transferred to the thermal conductive glue contained in the glue filling groove 343 more quickly through the heat conductive member 330, thereby accelerating the heat dissipation process of the liquid cooling component 340 for the pin 322. On the other hand, the heat generated at the position on the circuit board 310 where the pin 322 is welded can also be transferred to the thermal conductive glue contained in the glue filling groove 343 through the heat conductive member 330. In addition, the overall heat dissipation effect of the power module 300 is improved.

[0105] In some embodiments, the combination Figure 3 and Figure 4 , along the direction in which the circuit board 310 and the power device body 321 are arranged, the projection of the enclosure 342 does not overlap with the projection of the package 323 and the projection of the heat conductor 330. That is to say, along the direction in which the circuit board 310 and the power device body 321 are arranged, there is a gap between the enclosure 342 and the package 323, and there is a gap between the enclosure 342 and the heat conductor 330 attached to the outer surface of the package 323. This helps to avoid safety problems caused by the contact between the enclosure 342 and the heat conductor 330, and the contact between the enclosure 342 and the package 323, thereby improving the safety of the power module 300 and helping to meet the safety requirements of the power module 300.

[0106] Similarly, in some other embodiments, continue to combine Figure 3 and Figure 4 , along the direction perpendicular to the arrangement of the circuit board 310 and the power device body 321, the projection of the liquid cooling plate 341 does not overlap with the projection of the package 323 and the projection of the heat conductor 330. That is to say, along the direction perpendicular to the arrangement of the circuit board 310 and the power device body 321, there is a gap between the liquid cooling plate 341 and the package 323, and there is a gap between the liquid cooling plate 341 and the heat conductor 330. This helps to avoid safety problems caused by the contact between the liquid cooling plate 341 and the heat conductor 330, and the contact between the liquid cooling plate 341 and the package 323, thereby improving the safety of the power module 300 and meeting the safety requirements of the power module 300.

[0107] In some embodiments, the combination Figure 3 and Figure 4 The enclosure 342 includes an inner side surface 3422 and an outer side surface 3423 that are arranged opposite to each other. Along the direction perpendicular to the arrangement of the circuit board 310 and the power device body 321, the inner side surface 3422 is close to the thermal conductive glue in the glue potting groove 343, and the outer side surface 3423 is away from the thermal conductive glue in the glue potting groove 343. Among them, along the arrangement direction of the circuit board 310 and the power device body 321, the height d1 of the inner side surface 3422 facing the circuit board 310 is less than the height d2 of the outer side surface 3423 facing the circuit board 310, that is, d1<d2. As a result, a recessed portion can be formed on the end surface 3421 of the enclosure 342 facing the circuit board 310, and the recessed portion is connected to the open end of the glue potting groove 343.

[0108] In practical application, the recessed portion can be used as a part of the open end of the glue filling groove 343, thereby increasing the caliber of the open end of the glue filling groove 343. That is to say, along the direction perpendicular to the arrangement of the circuit board 310 and the power device body 321, the distance between the part of the inner side surface 3422 located at the open end of the glue filling groove 343 and the package 323, and the distance between the inner side surface 3422 and the heat conducting member 330 attached to the outer surface of the package 323 are longer than other parts of the inner side surface 3422. This is conducive to avoiding voltage breakdown caused by too small a distance between the enclosure 342 at the open end of the glue filling groove 343 and the heat conducting member 330, and too small a distance between the enclosure 342 and the package 323. Furthermore, the safety of the power module 300 can be improved, which is conducive to meeting the safety requirements of the power module 300.

[0109] In an example, Figure 3 and Figure 4 As shown, along the direction perpendicular to the arrangement of the circuit board 310 and the power device body 321, the distance d3 between the portion of the inner side surface 3422 located at the open end of the glue potting groove 343 and the heat conductive member 330 attached to the outer surface of the package 323 is greater than or equal to 5mm, and the distance d4 between the other portion of the inner side surface 3422 located outside the open end of the glue potting groove 343 and the heat conductive member 330 attached to the outer surface of the package 323 is less than 5mm. That is, d3≥5mm and d4<5mm, so that the caliber of the open end of the glue potting groove 343 is larger, which is conducive to improving the safety of the power module 300 and meeting the safety requirements of the power module 300.

[0110] Figure 5 It is a schematic diagram of the main structure of another power module 300 provided in an embodiment of the present application. Figure 6 yes Figure 5 The side view of the power module 300 is shown. It should be understood that Figure 5 and Figure 6The power module 300 shown includes Figure 3 and Figure 4 To avoid redundancy in most of the technical features of the illustrated embodiment, the following mainly describes the differences between the two.

[0111] and Figure 3 and Figure 4 The embodiment shown is different in that Figure 5 and Figure 6 In the illustrated embodiment, when one end 3221 of the pin 322 of the power device 320 is located in the package 323 and fixedly connected to the power device body 321, and the other end 3222 of the pin 322 extends toward the circuit board 310 and exposes the package 323 for fixed connection to the circuit board 310, part of the heat conductive member 330 is located inside the package 323. Specifically, one end 331 of the heat conductive member 330 is located inside the package 323, and one end 331 of the heat conductive member 330 is thermally connected to one end 3221 of the pin 322 located inside the package 323. The other end 332 of the heat conductive member 330 extends toward the liquid cooling plate 341, exposes the package 323 and extends into the thermal conductive glue contained in the glue potting groove 343.

[0112] In this way, when the power device 320 is working, the heat generated by the other end 3222 of the pin 322 exposed from the package 323 is first transferred to the one end 3221 of the pin 322 located in the package 323, and then transferred to the thermal conductive adhesive contained in the glue potting groove 343 through the thermal conductive member 330 thermally connected to the one end 3221 of the pin 322, and then transferred to the cooling medium in the liquid cooling plate 341 through the thermal conductive adhesive, thereby realizing liquid cooling of the pin 322.

[0113] It should be understood that, in a specific implementation, the power device 320 generally further includes a copper bar, and one end 3221 of the pin 322 is welded to the copper bar. The copper bar can extend toward the liquid cooling plate 341, and a portion of the copper bar is exposed from the package 323 for thermal connection with the thermal conductive glue in the glue potting groove 343. In other words, the heat conducting member 330 can be a copper bar provided in the power device 320.

[0114] In the embodiment of the present application, by partially disposing the heat conductor 330 in the package 323 , the heat conductor 330 can be used to realize liquid cooling of the pins 322 by the cooling medium in the liquid cooling plate 341 while improving the structural compactness of the power module 300 .

[0115] Further, in some embodiments, refer to Figure 6The power module 300 further includes an auxiliary heat conductive member 360. The auxiliary heat conductive member 360 is embedded in the heat conductive glue of the glue potting groove 343 and is heat conductively connected to the heat conductive glue. The auxiliary heat conductive member 360 is connected to the other end 332 of the heat conductive member 330 exposed from the packaging member 323, and the auxiliary heat conductive member 360 extends in a direction parallel to the liquid cooling plate 341.

[0116] In this way, when the power device 320 is working, the heat generated by the other end 3222 of the pin 322 exposed from the package 323 is first transferred to the one end 3221 of the pin 322 located in the package 323, and then simultaneously transferred to the thermally conductive glue contained in the glue potting groove 343 through the thermally conductive member 330 thermally connected to the one end 3221 of the pin 322 and the auxiliary thermally conductive member 360 thermally connected to the thermally conductive member 330, thereby increasing the area of ​​thermal contact with the thermally conductive glue. In addition, the cooling process of the pin 322 by the cooling medium in the liquid cooling plate 341 is accelerated, and the overall heat dissipation effect of the power module 300 is improved.

[0117] In some embodiments, continue to refer to Figure 6 , along the direction in which the circuit board 310 and the power device body 321 are arranged, the projection of the enclosure 342 does not overlap with the projection of the package 323, the projection of the heat conductor 330, and the projection of the auxiliary heat conductor 360. That is, along the direction in which the circuit board 310 and the power device body 321 are arranged, the enclosure 342 and the package 323 are spaced apart and do not contact each other, the enclosure 342 and the heat conductor 330 are spaced apart and do not contact each other, and the enclosure 342 and the auxiliary heat conductor 360 are spaced apart and do not contact each other.

[0118] This helps avoid safety issues caused by contact between the enclosure 342 and the heat conductor 330 , the enclosure 342 and the auxiliary heat conductor 360 , and the enclosure 342 and the packaging component 323 , thereby improving the safety of the power module 300 and helping to meet the safety requirements of the power module 300 .

[0119] Similarly, in some other embodiments, continue to refer to Figure 6 , along the direction perpendicular to the arrangement of the circuit board 310 and the power device body 321, the projection of the liquid cooling plate 341 does not overlap with the projection of the package 323, the projection of the heat conducting member 330, and the projection of the auxiliary heat conducting member 360. That is, along the direction perpendicular to the arrangement of the circuit board 310 and the power device body 321, there is a gap between the liquid cooling plate 341 and the package 323, there is a gap between the liquid cooling plate 341 and the heat conducting member 330, and there is a gap between the liquid cooling plate 341 and the auxiliary heat conducting member 360.

[0120] This helps to avoid safety problems caused by contact between the liquid cooling plate 341 and the heat conductive member 330 , contact between the liquid cooling plate 341 and the packaging member 323 , and contact between the liquid cooling plate 341 and the auxiliary heat conductive member 360 , thereby improving the safety of the power module 300 and helping to meet the safety requirements of the power module 300 .

[0121] In some embodiments, Figure 5 As shown, along the arrangement direction of the circuit board 310 and the power device body 321, the height d1 of the inner side 3422 of the enclosure 342 facing the circuit board 310 is less than the height d2 of the outer side 3423 of the enclosure 342 facing the circuit board 310, that is, d1<d2. Thus, a recessed portion can be formed on the end surface 3421 of the enclosure 342 facing the circuit board 310, and the recessed portion is connected to the open end of the glue potting groove 343. For a detailed description, please refer to Figure 3 and Figure 4 The embodiments shown will not be described in detail here.

[0122] In an example, Figure 5 As shown, along the direction perpendicular to the arrangement of the circuit board 310 and the power device body 321, the distance d5 between the portion of the inner side surface 3422 located at the open end of the glue potting groove 343 and the outer surface of the package 323 is greater than or equal to 5 mm, and the distance d6 between the other portion of the inner side surface 3422 located outside the open end of the glue potting groove 343 and the outer surface of the package 323 is less than 5 mm. That is, d5 ≥ 5 mm and d6 < 5 mm, so that the diameter of the open end of the glue potting groove 343 is larger.

[0123] This helps to avoid voltage breakdown caused by too small a distance between the enclosure 342 and the packaging component 323 at the open end of the glue potting groove 343. Further, the safety of the power module 300 can be improved, which helps to meet the safety requirements of the power module 300.

[0124] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A power module, characterized in that: The power module includes a circuit board, a power device, a heat conductor and a liquid cooling component, and the power device is located between the circuit board and the liquid cooling component; wherein, The power device comprises a power device body and pins, the power device body is fixed to the surface of the circuit board through the pins, the power device body is thermally connected to the liquid cooling assembly, and the pins are thermally connected to the liquid cooling assembly through the heat conductive member; The liquid cooling component is used for heat exchange with the power device body and the heat conducting member.

2. The power module according to claim 1, characterized in that: The liquid cooling assembly includes a liquid cooling plate and a surrounding plate; The liquid cooling plate is located on a side of the power device body away from the circuit board, the enclosure is fixed to the surface of the liquid cooling plate facing the circuit board, the enclosure and the liquid cooling plate are combined to form a glue pouring groove, the glue pouring groove is used to contain thermally conductive glue, the power device body is buried in the thermally conductive glue and is thermally connected to the liquid cooling plate through the thermally conductive glue; One end of the heat conductive member is thermally connected to the pin, and the other end of the heat conductive member extends into the thermal conductive adhesive and is thermally connected to the liquid cooling plate through the heat conductive member.

3. The power module according to claim 2, characterized in that: The power device further comprises a packaging component, wherein the packaging component is embedded in the thermal conductive adhesive and covers the power device body; One end of the pin is located in the package and fixedly connected to the power device body, the other end of the pin extends toward the circuit board and is exposed from the package, and the other end of the pin is fixedly connected to the circuit board; The heat conductive member is located outside the package, one end of the heat conductive member is thermally connected to the other end of the pin, and the other end of the heat conductive member extends along the outer surface of the package toward the direction of the heat conductive adhesive.

4. The power module according to claim 3, characterized in that: The circuit board further comprises a through hole, wherein the through hole penetrates the circuit board along the direction in which the circuit board and the power device body are arranged; The other end of the pin and one end of the heat conductive member pass through the through hole, and the other end of the pin, one end of the heat conductive member and the through hole are fixed by welding.

5. The power module according to claim 2, characterized in that: The power device further comprises a packaging component, wherein the packaging component is embedded in the thermal conductive adhesive and covers the power device body; One end of the pin is located in the package and fixedly connected to the power device body, the other end of the pin extends toward the circuit board and is exposed from the package, and the other end of the pin is fixedly connected to the circuit board; One end of the heat conductive member is located in the packaging member and is thermally connected to one end of the pin, and the other end of the heat conductive member extends toward the liquid cooling plate and is exposed from the packaging member.

6. The power module according to claim 5, characterized in that: The power module further comprises an auxiliary heat-conducting component, and the auxiliary heat-conducting component is embedded in the heat-conducting glue; The auxiliary heat-conducting member is thermally connected to the other end of the heat-conducting member, and the auxiliary heat-conducting member extends in a direction parallel to the liquid cooling plate.

7. The power module according to any one of claims 3 to 6, characterized in that: Along the direction in which the circuit board and the power device body are arranged, a height of an end surface of the enclosure facing the circuit board is smaller than a height of a surface of the package facing the circuit board.

8. The power module according to any one of claims 3 to 6, characterized in that: Along the direction in which the circuit board and the power device body are arranged, the projection of the enclosure does not overlap with the projection of the packaging component and the projection of the heat conducting component; Along a direction perpendicular to the arrangement of the circuit board and the power device body, the projection of the liquid cooling plate does not overlap with the projection of the packaging component and the projection of the heat conducting component.

9. The power module according to any one of claims 2 to 6, characterized in that: The enclosure plate comprises an inner side surface and an outer side surface which are arranged opposite to each other. In a direction perpendicular to the arrangement of the circuit board and the power device body, the inner side surface is close to the thermal conductive glue in the glue potting groove, and the outer side surface is far away from the thermal conductive glue in the glue potting groove. Along the arrangement direction of the circuit board and the power device body, the height of the inner side wall facing the circuit board is smaller than the height of the outer side wall facing the circuit board.

10. A charging device, characterized in that: The charging device includes a power module and at least one charging interface; The power module is electrically connected to the at least one charging interface, the at least one charging interface is used to electrically connect to an electric vehicle, and the power module is used to output power to the electric vehicle through the at least one charging interface; wherein, The power module comprises a circuit board, a power device, a heat conductor and a liquid cooling assembly, wherein the power device is located between the circuit board and the liquid cooling assembly; The power device comprises a power device body and pins, the power device body is fixed to the surface of the circuit board through the pins, the power device body is thermally connected to the liquid cooling assembly, and the pins are thermally connected to the liquid cooling assembly through the heat conducting member; The liquid cooling component is used for heat exchange with the power device body and the heat conducting member.

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