Base material cutting device for flexible circuit board
By using parts such as support plates, sliding columns and flattening rollers in the substrate cutting device, combined with the drive motor and return spring, the effective flattening and fixing of the flexible circuit board substrate is achieved, and the low cutting accuracy in the prior art is solved The problem of cutting quality has been improved.
Patent Information
- Application Number
- CN202420477887.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-13
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-03-13
AI Technical Summary
The existing substrate cutting devices cannot effectively flatten and fix the flexible circuit board substrate, resulting in low cutting accuracy and poor quality, affecting production.
A device including a workbench, a cutting mechanism and a driving mechanism is designed. Through supporting plates, sliding columns, down plates and flattening rollers, the driving motor and return springs are used to achieve the leveling and fixing of the substrate to ensure the substrate. Stability during cutting.
It effectively avoids the base material positioning deviation, improves the cutting accuracy and quality, and promotes the production of flexible circuit boards.
Smart Images

Figure CN222307695U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board production devices, in particular to a substrate cutting device for flexible circuit boards. Background Art
[0002] Flexible circuit board, also known as FPC, is a kind of printed circuit board with high reliability and excellent flexibility made of polyimide or polyester film as the substrate. It has the characteristics of high wiring density, light weight, thin thickness and good bending property. Due to its soft characteristics, it is also called soft board. Compared with rigid printed circuit board, flexible circuit board is more flexible to use, can be bent and folded freely, and can realize three-dimensional assembly. In the production process of flexible circuit board, cutting device is needed to cut the substrate so that it has a certain scale for easy production.
[0003] Since the flexible circuit board substrate can be bent and wound, most of the existing substrate cutting devices directly fix the substrate by pressing down. Since the substrate cannot be flattened before fixing, the positioning of the substrate is deviated, and the substrate cannot be effectively fixed, resulting in low cutting accuracy and poor cutting quality, which affects the subsequent production of flexible circuit boards. Utility Model Content
[0004] The technical problem to be solved by the utility model is to provide a flexible circuit board substrate cutting device which can fix the flexible circuit board substrate after flattening it.
[0005] In order to solve the above technical problems, the technical solution provided by the utility model is: a substrate cutting device for flexible circuit boards, including a workbench, a cutting mechanism is provided on the workbench, a driving mechanism is provided on the workbench, the workbench is connected to a supporting plate through the driving mechanism, a sliding column is slidably provided on the supporting plate, the sliding column is symmetrically arranged, a lower pressure plate is provided at the lower end of the sliding column, a sliding spring is sleeved on the sliding column, one end of the sliding spring is connected to the supporting plate, a positioning block is symmetrically provided on the supporting plate, the positioning block is arranged on the outside of the sliding column, a rotating arm is rotatably provided on the positioning block, a mounting sleeve is provided on the rotating arm, a reset spring is provided on the mounting sleeve, a flattening roller is rotatably provided at one end of the rotating arm away from the positioning block, and the flattening roller is arranged below the lower pressure plate.
[0006] As an improvement, the cross section of the sliding column is a T-shaped structure.
[0007] As an improvement, a flexible pad is provided at the lower end of the lower pressure plate, and the circumference of the flexible pad is a rounded structure.
[0008] As an improvement, the supporting plate is a U-shaped structure.
[0009] As an improvement, a placing table is provided on the workbench, and the placing table is arranged corresponding to the supporting plate, and the four corners of the placing table are all rounded structures.
[0010] As an improvement, the driving mechanism includes a driving block arranged on the workbench, the driving block is symmetrically provided with limiting slide grooves, a limiting slider is slidably provided in the limiting slide groove, a support plate is provided on the limiting slider, the support plate is connected to the supporting plate, a driving screw is rotatably provided on the workbench, the driving screw is connected to the support plate by a thread, the driving block is provided with a motor frame, the motor frame is provided with a driving motor, and the output end of the driving motor is connected to the driving screw.
[0011] As an improvement, the cutting mechanism comprises a connecting plate arranged on the driving block, and a laser cutting head is arranged on the connecting plate.
[0012] The advantages of the utility model compared with the prior art are:
[0013] The support plate moves downward with the cooperation of the driving mechanism, and the flattening roller moves downward to contact the substrate. After the substrate is flattened, the lower pressure plate contacts the substrate to fix the substrate, avoiding positioning deviation of the substrate, achieving effective fixation of the substrate, improving cutting accuracy and cutting quality, and facilitating the subsequent production of flexible circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the structure of a substrate cutting device for a flexible circuit board of the utility model. Figure 1 .
[0015] Figure 2 This is a schematic diagram of the structure of a substrate cutting device for a flexible circuit board of the utility model. Figure 2 .
[0016] Figure 3 It is an enlarged view of part A of a substrate cutting device for a flexible circuit board of the utility model.
[0017] Figure 4 It is an enlarged view of part B of a substrate cutting device for a flexible circuit board of the utility model.
[0018] As shown in the figure: 1. Workbench; 2. Support plate; 3. Positioning block; 4. Rotating arm; 5. Flattening roller; 6. Mounting sleeve; 7. Reset spring; 8. Sliding column; 9. Sliding spring; 10. Lower pressure plate; 11. Flexible pad; 12. Placement table; 13. Drive block; 14. Limit slide groove; 15. Limit slider; 16. Support plate; 17. Drive screw; 18. Motor frame; 19. Drive motor; 20. Connecting plate; 21. Laser cutting head. DETAILED DESCRIPTION
[0019] The utility model is further described in detail below in conjunction with the accompanying drawings.
[0020] Combined with Figure 1 To Attachment Figure 4 , a substrate cutting device for a flexible circuit board, comprising a workbench 1, a cutting mechanism is provided on the workbench 1, the cutting mechanism comprises a connecting plate 20 arranged on a driving block 13, a laser cutting head 21 is provided on the connecting plate 20, the laser cutting head 21 can move in three axes of X, Y, and Z, which can be achieved by two sets of electric slide rails arranged perpendicular to each other and electric sliders slidably matched therewith plus an electric push rod, which is the current prior art and will not be described in detail here, the workbench 1 is provided with a driving mechanism, the workbench 1 is connected to a supporting plate 2 through the driving mechanism, the supporting plate 2 is a U-shaped structure, a sliding column 8 is slidably provided on the supporting plate 2, the cross-section of the sliding column 8 is a T-shaped structure, the sliding column 8 is symmetrically arranged, and a lower pressing plate 10 is provided at the lower end of the sliding column 8, the lower pressing plate A flexible pad 11 is provided at the lower end of 10, and the circumference of the flexible pad 11 is a rounded structure. A sliding spring 9 is sleeved on the sliding column 8, and one end of the sliding spring 9 is connected to the supporting plate 2. A positioning block 3 is symmetrically provided on the supporting plate 2, and the positioning block 3 is arranged on the outer side of the sliding column 8. A rotating arm 4 is rotatably provided on the positioning block 3, and a mounting sleeve 6 is provided on the rotating arm 4, and a reset spring 7 is provided on the mounting sleeve. A flattening roller 5 is rotatably provided at one end of the rotating arm 4 away from the positioning block 3, and the flattening roller 5 is arranged lower than the lower pressing plate 10. When the supporting plate 2 moves downward, the flattening roller 5 first contacts with the substrate to flatten the substrate, and then the lower pressing plate 10 contacts with the substrate to fix the substrate. A placing table 12 is provided on the workbench 1, and the placing table 12 is arranged corresponding to the supporting plate 2, and the four corners of the placing table 12 are all rounded structures.
[0021] Combined with Figure 1 , Attachment Figure 2 And attached Figure 4 The driving mechanism includes a driving block 13 arranged on the workbench 1, and a limiting slide groove 14 is symmetrically provided on the driving block 13. A limiting slider 15 is slidably provided in the limiting slide groove 14. The limiting slider 15 and the limiting slide groove 14 are both T-shaped structures. A support plate 16 is provided on the limiting slider 15 to prevent the support plate 16 from rotating in the horizontal direction and improve the stability of the movement of the support plate 16. The support plate 16 is connected to the supporting plate 2. A driving screw 17 is rotatably provided on the workbench 1, and the driving screw 17 is connected to the support plate 16 by a thread. A motor frame 18 is provided on the driving block 13, and a driving motor 19 is provided on the motor frame 18. The output end of the driving motor 19 is connected to the driving screw 17.
[0022] During the specific implementation of the present invention, the flexible circuit board substrate is laid flat on the placement table 12, and the driving motor 19 is started. The driving motor 19 drives the driving screw 17 to rotate, and the support plate 16 drives the supporting plate 2 to move downward. The limiting slider 15 slides along the limiting slide groove 14, and the supporting plate 2 drives the sliding column 8 and the rotating arm 4 to move downward synchronously. The rotating arm 4 drives the flattening roller 5 to contact the substrate first, and then continue to move the supporting plate 2 downward. While the rotating arm 4 rotates, the reset spring 7 is squeezed, and the reset spring 7 is contracted under the force, and the flattening roller 5 moves toward both ends of the substrate to flatten the substrate. At the same time, the lower pressure plate 10 drives the flexible pad 11 to abut against the substrate to fix the substrate. The lower pressure plate 10 squeezes the sliding spring 9, and the sliding spring 9 is contracted under the force to avoid damage to the substrate caused by excessive fixing force. The laser cutting head 21 can be operated to cut the fixed substrate.
[0023] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.
Claims
1. A substrate cutting device for a flexible circuit board, comprising a workbench (1), wherein a cutting mechanism is provided on the workbench (1), characterized in that: The workbench (1) is provided with a driving mechanism, and the workbench (1) is connected to a supporting plate (2) through the driving mechanism. A sliding column (8) is slidably provided on the supporting plate (2), and the sliding column (8) is symmetrically arranged. A lower pressure plate (10) is provided at the lower end of the sliding column (8). A sliding spring (9) is sleeved on the sliding column (8), and one end of the sliding spring (9) is connected to the supporting plate (2). A positioning block (3) is symmetrically provided on the supporting plate (2), and the positioning block (3) is arranged on the outer side of the sliding column (8). A rotating arm (4) is rotatably provided on the positioning block (3), and a mounting sleeve (6) is provided on the rotating arm (4). A reset spring (7) is provided on the mounting sleeve. A flattening roller (5) is rotatably provided at one end of the rotating arm (4) away from the positioning block (3), and the flattening roller (5) is arranged below the lower pressure plate (10).
2. A flexible circuit board substrate cutting device according to claim 1, characterized in that: The cross section of the sliding column (8) is a T-shaped structure.
3. The flexible circuit board substrate cutting device according to claim 1, characterized in that: A flexible pad (11) is provided at the lower end of the lower pressure plate (10), and the circumference of the flexible pad (11) is a rounded structure.
4. The flexible circuit board substrate cutting device according to claim 1, characterized in that: The supporting plate (2) is a U-shaped structure.
5. The flexible circuit board substrate cutting device according to claim 1, characterized in that: The workbench (1) is provided with a placement platform (12), the placement platform (12) is arranged corresponding to the supporting plate (2), and the four corners of the placement platform (12) are all rounded structures.
6. The flexible circuit board substrate cutting device according to claim 1, characterized in that: The driving mechanism comprises a driving block (13) arranged on a workbench (1), a limiting slide groove (14) is symmetrically arranged on the driving block (13), a limiting slide block (15) is slidably arranged in the limiting slide groove (14), a supporting plate (16) is arranged on the limiting slide block (15), the supporting plate (16) is connected to the supporting plate (2), a driving screw rod (17) is rotatably arranged on the workbench (1), the driving screw rod (17) is connected to the supporting plate (16) by a thread, the driving block (13) is provided with a motor frame (18), the motor frame (18) is provided with a driving motor (19), and the output end of the driving motor (19) is connected to the driving screw rod (17).
7. A flexible circuit board substrate cutting device according to claim 6, characterized in that: The cutting mechanism comprises a connecting plate (20) arranged on a driving block (13), and a laser cutting head (21) is arranged on the connecting plate (20).