Stably-assembled liquid crystal display module

Abstract

The utility model discloses a liquid crystal display module stable in assembly, and belongs to the field of liquid crystal display modules. Comprising a main body frame, a PCBA board, a backlight source and an FOG module, the bottom face of the main body frame is provided with a first installation groove with an opening in the side face, the PCBA board is clamped into the first installation groove, a second installation groove is formed in the main body frame, the backlight source is clamped and fixed into the second installation groove, and the bottom face of the backlight source is pressed and held on the top face of the PCBA board; a third mounting groove is formed in the main body frame, the bottom of the third mounting groove is communicated with the second mounting groove, the FOG module is fixed in the third mounting groove, the FOG module is electrically connected with the PCBA board, and the backlight source is attached to one side of the PCBA board. According to the liquid crystal display module, the driving chip is packaged based on a COG mode to form an integral FOG module, the size of a PCBA board can be reduced, the size of the module can be reduced, the PCBA board is clamped into the main body frame in a front-back, left-right and up-down positioning mode, and therefore the whole liquid crystal display module is more stable and reliable to assemble.

Description

Technical Field

[0001] The utility model belongs to the field of liquid crystal display modules, and in particular relates to a liquid crystal display module with stable assembly. Background Art

[0002] The existing LCD display module adopts the COB method to package the driver chip. For example, a black and white 128X64 LCD display module is usually driven by one AIP31107 and two AIP31108 driver chips. The driver chip is packaged on the gold-immersed PCBA in the COB method, and then the backlight source and electronic components are welded to the COB board to form a whole. Finally, the COB board and LCD (liquid crystal glass) are placed in the iron frame, and the COB gold finger and LCD conductive electrode are connected by conductive adhesive strips. The COB board is assembled into a finished product with 6 to 8 metal twist feet set on the iron frame.

[0003] This type of LCD module usually has a high cost because it uses more chips. The COB packaging process itself has more assembly steps, complex processes, low production efficiency, and low yield rate. In addition, COB packaging must use a gold-plated board, which requires a large PCB board area. The COB board and the LCD are connected with a conductive rubber strip, which makes the thickness of the entire LCD module larger. At the same time, when the metal twist pin is used to buckle the COB board, the strength of the metal twist pin manually twisted by the assembler is different, resulting in inconsistent compression ratios of the conductive rubber strips. The metal twist pin is very easy to loosen and hang in the air under transportation and vibration conditions. The compression ratio of the conductive rubber strip changes due to aging after long-term use, which can easily cause poor contact between the COB board and the LCD, resulting in quality failures such as light and dark display and missing pixels. In general, the existing LCD modules based on COB packaging generally have the problem of poor assembly stability.

[0004] As a mature chip packaging process, COG chip packaging technology can effectively solve the above problems, but how to apply this technology to design a stable assembly liquid crystal display module is a problem that the prior art urgently needs to solve. Based on this, the prior art urgently needs a liquid crystal display module that can realize stable assembly based on COG packaging. Utility Model Content

[0005] In order to solve the above problems, the purpose of the utility model is to provide a liquid crystal display module with stable assembly, which is more stable and reliable.

[0006] To achieve the above purpose, the technical solution of the utility model is as follows:

[0007] The utility model provides a liquid crystal display module with stable assembly, comprising a main frame, a PCBA board, a backlight source, and a FOG module. The bottom surface of the main frame is provided with a first mounting groove with a side opening, the side wall of the first mounting groove extends a support step into the first mounting groove, the PCBA board is inserted into the first mounting groove, and the edge of the PCBA board is abutted against the support step; the side wall of the support step also extends a first undercut into the first mounting groove, the front end of the first undercut penetrates the PCBA board upward, a second mounting groove is provided in the main frame, the second mounting groove is located above the first mounting groove, the backlight source is fixed in the second mounting groove by snapping, and the bottom surface of the backlight source is pressed against the top surface of the PCBA board; a third mounting groove is provided in the main frame, the third mounting groove is provided above the second mounting groove, and the bottom of the third mounting groove is communicated with the second mounting groove, the FOG module is fixed in the third mounting groove, the FOG module is electrically connected to the PCBA board, and the backlight source is attached to one side of the PCBA board.

[0008] In the present application, during assembly, the PCBA board is inserted into the first mounting groove from the side opening, and the PCBA board is supported by the support step and fixed by pulling the first undercut, so that the PCBA board can be fixed in the front-to-back and left-to-right directions; the backlight source is fixed in the second mounting groove and pressed on the top of the PCBA board, so that the PCBA board can be fixed in the up-and-down directions, thereby realizing the front-to-back, left-to-right, and up-and-down locking and fixing of the PCBA board, making the assembly of the liquid crystal display module more stable.

[0009] Furthermore, the first undercut is an "L"-shaped structure, and a card hole adapted to the first undercut is provided on the PCBA board, and a front end of the first undercut passes through the card hole and is exposed above the PCBA board.

[0010] Furthermore, the support step is an "L"-shaped structure. During assembly, the PCBA board is horizontally inserted into the first mounting groove, and the front side, the left side, and the rear side of the PCBA board are all against the support step.

[0011] Furthermore, an opening is provided on the bottom wall of the second mounting groove, and the first mounting groove is connected with the second mounting groove through the opening.

[0012] Further, the bottom wall of the second mounting groove extends upward to form a second reverse buckle, the front end of the second reverse buckle is buckled to the top surface of the backlight, a clamping groove is provided on the inner wall of the side of the second mounting groove away from the second reverse buckle, and the side of the backlight away from the second reverse buckle is snapped into the clamping groove. During installation, one side of the backlight is first snapped into the clamping groove, and then the other side is pressed downward to squeeze the entire backlight into the second mounting groove and fix it through the second reverse buckle.

[0013] Further, the second reverse buckle is of an "L" - shaped structure, and the "L" - shaped surface of the second reverse buckle is buckled to the top surface of the backlight.

[0014] Further, the bottom wall of the third mounting groove extends upward to form a third reverse buckle, and the front end of the third reverse buckle is buckled to the top surface of the FOG module.

[0015] Further, the third reverse buckle is of an "L" - shaped structure, and the "L" - shaped surface of the third reverse buckle is buckled to the top surface of the FOG module.

[0016] Further, the liquid crystal display module further includes a side "U" - shaped fastening member. The fastening member is arranged on the side of the FOG module away from the third reverse buckle. A fastening hole is provided on the PCBA board. The fastening member penetrates through the fastening hole up and down, and the two side edges of the fastening member are respectively attached to the bottom surface of the PCBA board and the top surface of the FOG module. In this application, in order to facilitate the assembly of the FOG module, the third reverse buckle can only be arranged on one side of the third mounting groove, and only one - side fixation of the FOG module can be achieved. The fastening member can achieve the fixation of the other side of the FOG module, improving the assembly stability.

[0017] Further, the FOG module includes an LCD panel, a COG driving IC, and an FPC flexible cable. The COG driving IC is encapsulated on the LCD panel through conductive adhesive. One end of the FPC flexible cable is crimped to the LCD panel and connected to the COG driving IC, and the other end is connected to the PCBA board. The LCD panel is fixed in the third mounting groove, and the front end of the third reverse buckle is buckled to the top surface of the LCD panel.

[0018] Further, the model of the COG driving IC includes one of ST7567, AIP31567, ST7567A, and AIP31567A. The driving IC is encapsulated on the LCD panel by the COG method.

[0019] Further, the LCD panel is a glass substrate.

[0020] Furthermore, the ST7567 chip drives and controls the LCD through COG packaging. The chip is bonded to the step of the LCD glass substrate. One end of the FPC is crimped on the step of the LCD glass substrate. The other end of the FPC can be connected to the PCBA socket by a plug, or the FPC can be connected to the PCBA by welding. All components are mounted on the PCB by an SMT machine. The PCB can use a cheap tin-spraying plate. In this way, the PCB usage area is also greatly reduced, greatly reducing the material procurement cost.

[0021] Furthermore, the main frame is a plastic frame. Compared with the COB process, the module can use plastic materials to make the main frame, which can greatly improve the assembly efficiency and greatly reduce the assembly cost.

[0022] Compared with the prior art, the beneficial effects of the utility model are as follows: the liquid crystal display module encapsulates the driving chip based on the COG method to form an integral FOG module, which can reduce the size of the PCBA board and the volume of the module. The PCBA is inserted into the main frame by front-to-back, left-to-right, and up-and-down positioning, thereby making the assembly of the entire liquid crystal display module more stable and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is an axonometric view of a liquid crystal display module from a first-person perspective.

[0024] Figure 2 It is an axonometric view of the liquid crystal display module from a second perspective.

[0025] Figure 3 This is an exploded view of the LCD display module.

[0026] Figure 4 It is a structural diagram of the main frame.

[0027] Figure 5 It is a top view of the liquid crystal display module.

[0028] Figure 6 yes Figure 5 Cross-section view at AA in the middle.

[0029] Explanation of reference numbers: 1. Main frame; 2. PCBA board; 3. Backlight source; 4. FOG module; 5. First mounting slot; 6. Support step; 7. First undercut; 8. Second mounting slot; 9. Third mounting slot; 10. Card hole; 11. Opening; 12. Second undercut; 13. Card slot; 14. Third undercut; 15. Fastener; 16. Button hole. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0031] To achieve the above purpose, the technical solution of the utility model is as follows:

[0032] See also Figure 1-6 As shown, the present embodiment provides a liquid crystal display module with stable assembly, including a main frame 1, a PCBA board 2, a backlight source 3, and a FOG module 4. The bottom surface of the main frame 1 is provided with a first mounting groove 5 with a side opening, and the side wall of the first mounting groove 5 extends a support step 6 into the first mounting groove 5. The PCBA board 2 is inserted into the first mounting groove 5, and the edge of the PCBA board 2 is abutted against the support step 6; the side wall of the support step 6 also extends a first undercut 7 into the first mounting groove 5, and the front end of the first undercut 7 penetrates the PCBA board upward. 2, a second mounting groove 8 is provided in the main frame 1, the second mounting groove 8 is located above the first mounting groove 5, the backlight source 3 is fixed in the second mounting groove 8, and the bottom surface of the backlight source 3 is pressed against the top surface of the PCBA board 2; a third mounting groove 9 is provided in the main frame 1, the third mounting groove 9 is provided above the second mounting groove 8, and the bottom of the third mounting groove 9 is connected with the second mounting groove 8, the FOG module 4 is fixed in the third mounting groove 9, the FOG module 4 is electrically connected with the PCBA board 2, and the backlight source 3 is provided on one side of the PCBA board 2.

[0033] In the present application, during assembly, the PCBA board 2 is inserted into the first mounting groove 5 from the side opening. The PCBA board 2 is supported by the support step 6 and fixed by pulling the first undercut 7, so that the PCBA board 2 can be fixed in the front-to-back and left-to-right directions. The backlight source 3 is fixed in the second mounting groove 8 and pressed on the top of the PCBA board 2, so that the PCBA board 2 can be fixed in the up-and-down directions, thereby realizing the locking and fixing of the PCBA board 2 in the front-to-back, left-to-right, and up-and-down directions, making the assembly of the liquid crystal display module more stable.

[0034] Furthermore, the FOG module 4 includes an LCD panel, a COG driver IC, and an FPC cable. The COG driver IC is encapsulated on the LCD panel through conductive glue. One end of the FPC cable is crimped on the LCD panel and connected to the COG driver IC, and the other end is connected to the PCBA board 2. The LCD panel is fixed in the third mounting groove 9, and the front end of the third inverted buckle 14 is buckled on the top surface of the LCD panel.

[0035] Furthermore, the model of the COG driver IC is one of ST7567, AIP31567, ST7567A, and AIP31567A, and the driver IC is packaged on the LCD panel using a COG method.

[0036] Furthermore, the LCD panel is a glass substrate.

[0037] It should be noted that the FOG module 4 in this application belongs to the prior art. Its ST7567 chip is packaged through the existing COG process to drive and control the LCD. The chip is bonded to the step of the LCD glass substrate, one end of the FPC is crimped on the step of the LCD glass substrate, and the other end of the FPC can be connected to the PCBA socket as a plug, or the FPC can be connected to the PCBA by welding. All components are mounted on the PCB by an SMT machine, and the PCB can use a cheap tin-spraying plate. In this way, compared with the existing COB packaging process, the PCB usage area is also greatly reduced, which greatly reduces the material procurement cost.

[0038] Furthermore, the first undercut 7 is an “L”-shaped structure, and a clamping hole 10 adapted to the first undercut 7 is provided on the PCBA board 2 , and a front end of the first undercut 7 passes through the clamping hole 10 and is exposed above the PCBA board 2 .

[0039] Furthermore, the support step 6 is an "L"-shaped structure. During assembly, the PCBA board 2 is horizontally inserted into the first mounting groove 5, and the front side, left side, and rear side of the PCBA board 2 are all against the support step 6.

[0040] Furthermore, an opening 11 is provided on the bottom wall of the second mounting groove 8 , and the first mounting groove 5 is connected to the second mounting groove 8 through the opening 11 .

[0041] Furthermore, a second undercut 12 extends upward from the bottom wall of the second mounting groove 8, and the front end of the second undercut 12 is buckled to the top surface of the backlight source 3. A clamping groove 13 is provided on the inner wall of the second mounting groove 8 on the side away from the second undercut 12, and the side of the backlight source 3 away from the second undercut 12 is clamped into the clamping groove 13. During installation, the backlight source 3 is first clamped into the clamping groove 13 on one side, and then the other side is pressed downward to squeeze the entire backlight source 3 into the second mounting groove 8 and fixed by the second undercut 12.

[0042] Furthermore, the second inverted portion 12 is an “L”-shaped structure, and the “L”-shaped surface of the second inverted portion 12 is buckled to the top surface of the backlight source 3 .

[0043] Furthermore, a third undercut 14 extends upward from the bottom wall of the third mounting slot 9 , and a front end of the third undercut 14 is buckled to the top surface of the FOG module 4 .

[0044] Further, the third reverse buckle 14 is in an "L" shape, and the "L" surface of the third reverse buckle 14 is buckled to the top surface of the FOG module 4.

[0045] Further, the liquid crystal display module further includes a side "U"-shaped fastening member 15. The fastening member 15 is disposed on a side of the FOG module 4 away from the third reverse buckle 14. A fastening hole 16 is provided on the PCBA board 2. The fastening member 15 penetrates through the fastening hole 16 vertically, and two side edges of the fastening member 15 are respectively in contact with the bottom surface of the PCBA board 2 and the top surface of the FOG module 4. In this application, in order to facilitate the assembly of the FOG module 4, the third reverse buckle 14 can only be provided on one side of the third installation groove 9, and only the fixation of one side of the FOG module 4 can be achieved. The fastening member 15 can achieve the fixation of the other side of the FOG module 4, improving the stability of the assembly.

[0046] Further, the main body frame 1 is a plastic rubber frame. Compared with the COB process, this module can use plastic materials to make the main body frame, greatly improving the assembly efficiency and significantly reducing the assembly cost.

[0047] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A liquid crystal display module with stable assembly, characterized in that: It includes a main body frame, a PCBA board, a backlight, and a FOG module. A first installation groove with a side opening is provided on the bottom surface of the main body frame. A support step extends from the side wall of the first installation groove into the first installation groove. The PCBA board is snapped into the first installation groove, and the edge of the PCBA board abuts against the support step. A first倒扣 extends from the side wall of the support step into the first installation groove, and the front end of the first倒扣 penetrates upward through the PCBA board. A second installation groove is provided in the main body frame, and the second installation groove is located above the first installation groove. The backlight is snap-fitted and fixed in the second installation groove, and the bottom surface of the backlight presses against the top surface of the PCBA board. A third installation groove is provided in the main body frame, and the third installation groove is provided above the second installation groove, and the bottom of the third installation groove communicates with the second installation groove. The FOG module is fixed in the third installation groove, the FOG module is electrically connected to the PCBA board, and the backlight is attached to one side of the PCBA board.

2. A stably assembled liquid crystal display module as claimed in claim 1, characterized in that: The first倒扣 is an "L"-shaped structure, and a card hole adapted to the first倒扣 is provided on the PCBA board. The front end of the first倒扣 penetrates through the card hole and is exposed above the PCBA board.

3. The stably assembled liquid crystal display module according to claim 1, characterized in that: The support step is an "L"-shaped structure.

4. The stably assembled liquid crystal display module according to claim 1, characterized in that: An opening is provided on the bottom wall of the second installation groove, and the first installation groove communicates with the second installation groove through the opening.

5. The stably assembled liquid crystal display module according to claim 1, characterized in that: A second倒扣 extends upward from the bottom wall of the second installation groove, and the front end of the second倒扣 is buckled to the top surface of the backlight. A card slot is provided on the inner wall of the side of the second installation groove away from the second倒扣, and the side of the backlight away from the second倒扣 is snapped into the card slot.

6. A stably assembled liquid crystal display module as claimed in claim 5, characterized in that: The second倒扣 is an "L"-shaped structure, and the "L"-shaped surface of the second倒扣 is buckled to the top surface of the backlight.

7. The stably assembled liquid crystal display module according to claim 1, characterized in that: A third倒扣 extends upward from the bottom wall of the third installation groove, and the front end of the third倒扣 is buckled to the top surface of the FOG module.

8. The stably assembled liquid crystal display module according to claim 7, characterized in that: The third倒扣 is an "L"-shaped structure, and the "L"-shaped surface of the third倒扣 is buckled to the top surface of the FOG module.

9. The stably assembled liquid crystal display module according to claim 7, characterized in that: The liquid crystal display module further includes a side "凵"-shaped fastening member. The fastening member is provided on the side of the FOG module away from the third倒扣. A fastening hole is provided on the PCBA board. The fastening member penetrates through the fastening hole up and down, and the two side edges of the fastening member are respectively attached to the bottom surface of the PCBA board and the top surface of the FOG module.

10. The stably assembled liquid crystal display module according to claim 8, characterized in that: The FOG module includes an LCD panel, a COG driving IC, and an FPC cable. The COG driving IC is encapsulated on the LCD panel through conductive adhesive. One end of the FPC cable is pressed and connected to the LCD panel to be connected to the COG driving IC, and the other end is connected to the PCBA board. The LCD panel is fixed in the third installation groove, and the front end of the third倒扣 is buckled to the top surface of the LCD panel.

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