Dustproof computer

Abstract

The utility model discloses a dustproof computer which comprises a box body, an electronic element is arranged in the box body, a dismounting plate is fixedly connected in the electronic element and movably connected with the box body through screws, a refrigeration mechanism is fixedly connected to the top wall of the box body, and the top wall of the box body is fixedly connected with a fan. The refrigerating mechanism comprises a semiconductor refrigerating sheet fixedly connected to the top wall, the cold end of the semiconductor refrigerating sheet extends into the box body, and a connecting plate fixedly connected with the box body is arranged below the semiconductor refrigerating sheet. According to the utility model, the refrigeration mechanism is arranged, the temperature in the box body is observed through the display screen of the temperature sensor, then the cold end of the semiconductor refrigeration sheet is used for refrigeration, so that cold energy is generated in the box body, and then the first fan box is used for blowing the cold energy to the surface of an electronic component through the air inlet pipe, so that the heat dissipation effect is achieved; damage of heat to electronic components is reduced, and use of the electronic components by personnel is not affected.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a dustproof computer. Background Art

[0002] The patent document with publication number CN 210776473 U discloses a dustproof computer. The utility model provides a dustproof computer, comprising: a computer case body and a vent arranged on one side of the computer case body, a dust cover is arranged at the vent, a dust cover is arranged on one side of the dust cover, the dust cover is used to cover the outside of the dust cover, and the dust cover and the outer surface of the computer case body are detachably arranged, by arranging the dust cover at the vent of the computer case body, and arranging a detachable dust cover on the side of the dust cover close to the outer surface of the computer case body, thereby ensuring that the vent is closed by the dust cover when the computer is not in use, thereby reducing the dust accumulation inside the computer case body, thereby reducing the situation that the circuit board inside the computer is short-circuited due to dust, thereby improving the service life of the computer.

[0003] The background technology of the above patent proposes that the ventilation holes of the existing device are open. Although the above patent can prevent dust, the components inside the chassis will generate a certain amount of heat when in use, which will accumulate heat inside the chassis over time. Although the above patent can rely on the ventilation holes for ventilation and heat dissipation, when used in hot weather, the heat dissipation effect is minimal, which will not only affect the service life of the components, but also affect the normal use of the components by personnel. Summary of the invention

[0004] In order to solve the problems raised in the above background technology, the purpose of the utility model is to provide a dustproof computer, which has the advantages of good heat dissipation effect and increased chassis service life, and solves the problem that poor heat dissipation effect affects the chassis service life and affects people's use of the chassis.

[0005] To achieve the above object, the utility model provides the following technical solution: a dustproof computer, comprising a box, wherein electronic components are arranged inside the box, a disassembly plate is fixedly connected inside the electronic components, the disassembly plate is movably connected to the box through screws, and a refrigeration mechanism is fixedly connected to the top wall of the box;

[0006] The refrigeration mechanism includes a semiconductor refrigeration plate fixedly connected to the top wall, the cold end of the semiconductor refrigeration plate extends to the interior of the box, a connecting plate fixedly connected to the box is arranged below the semiconductor refrigeration plate, the bottom of the connecting plate is fixedly connected to a first fan box, an air inlet is opened on the right side wall of the box, a temperature sensor connected to the interior of the box is embedded in the front of the box, the interior of the first fan box is connected to an air intake pipe that runs through the top of the connecting plate, and the surface of the air intake pipe is sleeved with a sealing ring fixedly connected to the connecting plate.

[0007] As a preferred embodiment of the present invention, the hot end of the semiconductor refrigeration plate extends to the outside of the box body, and the hot end of the semiconductor refrigeration plate is sleeved with a second fan box fixedly connected to the box body.

[0008] As a preferred embodiment of the utility model, a third fan box is fixedly connected to both sides of the box body, and a connecting pipe communicating with the interior of the box body is fixedly connected to the interior of the third fan box.

[0009] As a preferred embodiment of the present invention, dustproof nets are provided inside the through opening, the second fan box and the third fan box.

[0010] As a preferred embodiment of the present invention, a fixing plate is fixedly connected to the bottom of the box body, and a universal wheel is fixedly connected to the bottom of the fixing plate.

[0011] As a preferred embodiment of the present invention, a through opening is provided at the back of the box body, and an inspection door is movably connected inside the through opening.

[0012] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0013] 1. The utility model sets a refrigeration mechanism, observes the temperature inside the box through the display screen of the temperature sensor, and then uses the cold end of the semiconductor refrigeration sheet to cool the box to generate cold energy inside the box, and then uses the first fan box to blow the cold energy to the surface of the electronic component through the air intake pipe to achieve the effect of heat dissipation, reduce the damage of heat to the electronic components, will not affect the use of electronic components by personnel, and improve the service life of the electronic components.

[0014] 2. The utility model can dissipate the heat at the hot end of the semiconductor refrigeration plate by setting up a second fan box, thereby improving the refrigeration effect of the semiconductor refrigeration plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 It is a cross-sectional schematic diagram of the utility model;

[0017] Figure 3It is a schematic diagram of the connection between the box body and the inspection door of the utility model;

[0018] Figure 4 For this utility model Figure 2 A is an enlarged schematic diagram.

[0019] In the figure: 1. Box body; 2. Electronic components; 3. Disassembly plate; 4. Refrigeration mechanism; 41. Semiconductor refrigeration plate; 42. Connecting plate; 43. First fan box; 44. Air inlet; 45. Temperature sensor; 46. Air inlet pipe; 47. Sealing ring; 5. Second fan box; 6. Third fan box; 7. Connecting pipe; 8. Dust net; 9. Fixing plate; 10. Universal wheel; 11. Inspection door. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] like Figures 1 to 4 As shown, a dustproof computer comprises a box body 1, an electronic component 2 is arranged inside the box body 1, a disassembly plate 3 is fixedly connected inside the electronic component 2, the disassembly plate 3 is movably connected to the box body 1 through screws, and a refrigeration mechanism 4 is fixedly connected to the top wall of the box body 1;

[0022] The refrigeration mechanism 4 includes a semiconductor refrigeration plate 41 fixedly connected to the top wall, the cold end of the semiconductor refrigeration plate 41 extends to the interior of the box body 1, a connecting plate 42 fixedly connected to the box body 1 is arranged below the semiconductor refrigeration plate 41, and a first fan box 43 is fixedly connected to the bottom of the connecting plate 42. An air inlet 44 is provided on the right side wall of the box body 1, and a temperature sensor 45 connected to the interior of the box body 1 is embedded on the front side of the box body 1. The interior of the first fan box 43 is connected to an air intake pipe 46 that passes through the top of the connecting plate 42, and a sealing ring 47 fixedly connected to the connecting plate 42 is provided on the surface of the air intake pipe 46.

[0023] refer to Figure 1 The hot end of the semiconductor refrigeration sheet 41 extends to the outside of the box body 1 , and the hot end of the semiconductor refrigeration sheet 41 is sleeved with a second fan box 5 fixedly connected to the box body 1 .

[0024] As a technical optimization solution of the present invention, by providing a second fan box 5 , the heat at the hot end of the semiconductor refrigeration plate 41 can be dissipated, thereby improving the refrigeration effect of the semiconductor refrigeration plate 41 .

[0025] refer to Figure 2The third fan box 6 is fixedly connected to both sides of the box body 1, and the interior of the third fan box 6 is fixedly connected to a connecting pipe 7 that is connected to the interior of the box body 1.

[0026] As a technical optimization solution of the present invention, by providing the third fan box 6, the box body 1 has a ventilation effect, further improving the heat dissipation effect of the device.

[0027] refer to Figure 3 A dustproof net 8 is provided inside the air inlet 44 , the second air box 5 and the third air box 6 .

[0028] As a technical optimization solution of the utility model, by setting a dustproof net 8, the pollution of external dust to the internal devices of the box body 1, the second fan box 5 and the third fan box 6 is reduced, thereby improving the service life of the internal devices of the box body 1, the second fan box 5 and the third fan box 6.

[0029] refer to Figure 2 A fixing plate 9 is fixedly connected to the bottom of the box body 1, and a universal wheel 10 is fixedly connected to the bottom of the fixing plate 9.

[0030] As a technical optimization solution of the present invention, by providing universal wheels 10, personnel can easily move the box 1, making it convenient for personnel to use.

[0031] refer to Figure 3 A through opening is provided at the back of the box body 1, and an inspection door 11 is movably connected inside the through opening.

[0032] As a technical optimization solution of the present invention, by providing an inspection door 11, it is convenient for personnel to open the box body 1 and also convenient for personnel to inspect and maintain the internal devices of the box body 1 at a later time.

[0033] The working principle and use process of the utility model are as follows: in daily use, the temperature inside the box 1 is observed through the display screen of the temperature sensor 45, and then the cold end of the semiconductor refrigeration sheet 41 is used for cooling to generate cold energy inside the box 1, and then the first fan box 43 is used to blow the cold energy to the surface of the electronic component 2 through the air intake pipe 46 to achieve the effect of heat dissipation, reduce the damage of heat to the electronic component 2, will not affect the use of the electronic component 2 by personnel, and improve the service life of the electronic component 2.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A dustproof computer, comprising a housing (1), characterized in that: An electronic component (2) is arranged inside the box (1), a disassembly plate (3) is fixedly connected inside the electronic component (2), the disassembly plate (3) is movably connected to the box (1) via screws, and a refrigeration mechanism (4) is fixedly connected to the top wall of the box (1); The refrigeration mechanism (4) comprises a semiconductor refrigeration plate (41) fixedly connected to the top wall, the cold end of the semiconductor refrigeration plate (41) extends into the interior of the box body (1), a connecting plate (42) fixedly connected to the box body (1) is arranged below the semiconductor refrigeration plate (41), the bottom of the connecting plate (42) is fixedly connected to a first fan box (43), an air inlet (44) is provided on the right side wall of the box body (1), a temperature sensor (45) connected to the interior of the box body (1) is embedded on the front of the box body (1), the interior of the first fan box (43) is connected to an air intake pipe (46) that runs through the top of the connecting plate (42), and the surface of the air intake pipe (46) is sleeved with a sealing ring (47) fixedly connected to the connecting plate (42).

2. The dustproof computer according to claim 1, characterized in that: The hot end of the semiconductor refrigeration sheet (41) extends to the outside of the box body (1), and the hot end of the semiconductor refrigeration sheet (41) is sleeved with a second fan box (5) fixedly connected to the box body (1).

3. The dustproof computer according to claim 1, characterized in that: A third fan box (6) is fixedly connected to both sides of the box body (1), and a connecting pipe (7) communicating with the interior of the box body (1) is fixedly connected to the interior of the third fan box (6).

4. The dustproof computer according to claim 2, characterized in that: Dust-proof nets (8) are provided inside the air inlet (44), the second fan box (5) and the third fan box (6).

5. The dustproof computer according to claim 1, characterized in that: A fixing plate (9) is fixedly connected to the bottom of the box body (1), and a universal wheel (10) is fixedly connected to the bottom of the fixing plate (9).

6. The dustproof computer according to claim 1, characterized in that: The back of the box body (1) is provided with a through opening, and an inspection door (11) is movably connected inside the through opening.

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