Semiconductor glue scraping equipment for etching glue removing machine

Abstract

The utility model discloses semiconductor glue scraping equipment for an etching glue removing machine, relates to the technical field of glue scraping equipment, solves the problem that the position of a scraping blade is inconvenient to adjust, and comprises a working table, a first electric cylinder is fixedly connected to the back surface of an inner cavity of the working table, and a push plate is fixedly connected to the telescopic end of the first electric cylinder; according to the wafer glue scraping device, the storage table is arranged, wafers needing glue scraping can be conveniently stored, glue on the surfaces of the wafers can be scraped through the second electric air cylinder, the mounting plate and the scraper, the first electric air cylinder and the push plate are arranged, the scraper can be driven to move front and back, glue on the surfaces of the wafers can be scraped, and the glue scraping efficiency is improved. And by arranging a servo motor, a threaded rod and a threaded sleeve, a second electric air cylinder, a mounting plate and a scraper can be driven to move left and right, the left-right position of the scraper is adjusted, and the glue scraping device can conduct glue scraping operation on wafers with different sizes.

Description

Technical Field

[0001] The utility model relates to the field of glue scraping equipment, in particular to semiconductor glue scraping equipment for an etching and glue removing machine. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The specific process is to first cut the wafer into chips through a dicing process, then attach the cut chips to the corresponding substrate with glue, and then use ultra-fine metal wires to connect the bonding pads of the chip to the corresponding pins of the substrate to form a circuit. During the packaging process, the chip needs to be fixed to the surface of the substrate with glue. Since the glue will overflow when it is squeezed, it is also necessary to scrape off the glue on the edge of the chip. When scraping off the glue, it is operated by the scraper of the scraper equipment. However, there are differences in the size of the chips. Generally, the position of the substrate is changed to fit the scraper. When the chip and the substrate are clamped and cannot be moved, the scraper equipment needs to be moved to align the scraper with the edge of the chip, which is very inconvenient. Therefore, it is necessary to design a scraper equipment that can be used for chips of different sizes.

[0003] After searching, the China Patent Network discloses a semiconductor scraping device for an etching and degumming machine, and its authorization announcement number is CN218498024U. The semiconductor scraping device for the etching and degumming machine starts the connecting motor of the driving gear when scraping the wafer, and the driving gear meshes with the adjusting tooth plate for transmission, and then moves inside the adjusting cavity. During the movement, the driving gear drives the connecting shaft and the scraper at the bottom of the clamping block to move. The scraper scrapes the glue overflowing from the side of the wafer through the restriction of the limit plate. When the size of the wafer changes, the position of the scraper can be adjusted by the adjustment mechanism to scrape the glue again, without moving the wafer and the substrate, so that when the wafer and the substrate are clamped and fixed, the scraper position can be adjusted to facilitate scraping of wafers of different sizes.

[0004] However, the patent is inconvenient to operate during adjustment, and manual adjustment is required. Manual adjustment is time-consuming, and the operation is cumbersome and has defects in use. Therefore, a semiconductor scraping device for an etching and degumming machine is now proposed. Utility Model Content

[0005] In order to improve the problem that it is inconvenient to adjust the position of a scraper, the utility model provides a semiconductor scraping device for an etching and descaling machine.

[0006] The utility model provides a semiconductor scraping device for an etching and degumming machine, which adopts the following technical scheme:

[0007] A semiconductor glue scraping device for an etching and glue removal machine comprises a workbench, a first electric cylinder is fixedly connected to the back of the inner cavity of the workbench, a push plate is fixedly connected to the telescopic end of the first electric cylinder, columns are fixedly connected to the left and right sides of the top of the push plate, a driving box is fixedly connected to the top of the column, a moving mechanism is arranged in the inner cavity of the driving box, a glue scraping mechanism is arranged at the bottom of the moving mechanism, a storage table is arranged on the top of the workbench, and a fixing mechanism is arranged on the top of the storage table;

[0008] The moving mechanism includes a servo motor, which is fixedly installed on one side of the inner cavity of the drive box. The output end of the servo motor is fixedly connected to a threaded rod. The end of the threaded rod away from the servo motor is rotatably connected to the connection on the one side of the inner cavity of the drive box through a bearing. The outer surface of the threaded rod is threadedly connected to a threaded sleeve.

[0009] The scraping mechanism comprises a second electric cylinder, which is fixedly mounted on the bottom of the threaded sleeve. The telescopic end of the second electric cylinder is fixedly connected to a mounting plate, and a scraper is fixedly mounted on the bottom of the mounting plate.

[0010] By adopting the above technical solution, the scraping operation of the glue can be realized, and the position of the scraper can be conveniently adjusted so that the scraping operation can be performed on wafers of a certain size.

[0011] Optionally, the fixing mechanism includes two slides, which are respectively opened at front and rear positions of the top of the storage table, and the left and right sides of the inner surface of the slide are slidably connected with sliding rods, one side of the sliding rod is fixedly connected with a cross plate, the top of the cross plate is threadedly connected with a screw, the top of the screw is fixedly connected with a turning handle, and the bottom of the screw is fixedly connected with a pressure plate.

[0012] By adopting the above technical solution, it is possible to fix wafers of different sizes and prevent the wafers from moving during the scraping process.

[0013] Optionally, a concave frame is fixedly connected to the top of the inner cavity of the workbench, a rotating motor is fixedly connected to the bottom of the inner cavity of the concave frame, a rotating shaft is fixedly connected to the output end of the rotating motor, and the top of the rotating shaft is fixedly connected to the connection at the bottom of the storage table.

[0014] By adopting the above technical solution, the storage table and the wafer can be easily driven to rotate, so that the scraper can perform glue scraping operations on different positions of the wafer.

[0015] Optionally, a first slider is fixedly connected to the top of the threaded sleeve, a first slide groove cooperating with the first slider is opened at the top of the inner cavity of the drive box, and the outer surface of the first slider is slidably connected to the inner surface of the first slide groove.

[0016] By adopting the above technical solution, the movement of the threaded sleeve can be guided and limited.

[0017] Optionally, a second slider is fixedly connected to the left and right sides of the bottom of the push plate, a second slide groove is provided on the left and right sides of the bottom of the workbench inner cavity for cooperating with the second slider, and the outer surface of the second slider is slidably connected to the inner surface of the second slide groove.

[0018] By adopting the above technical solution, the movement of the push plate can be guided and limited.

[0019] Optionally, first through grooves are provided on both left and right sides of the top of the workbench, and the outer surface of the column is slidably connected to the inner surface of the first through groove.

[0020] By adopting the above technical solution, the movement of the column can be facilitated.

[0021] Optionally, a second through groove is provided at the bottom of the driving box, and an outer surface of the second electric cylinder is slidably connected to an inner surface of the second through groove.

[0022] By adopting the above technical solution, the second electric cylinder can be easily moved.

[0023] Optionally, a baffle is fixedly connected to the front of the workbench by screws, and a control switch is provided on the front of the baffle.

[0024] By adopting the above technical solution, the workbench can be easily disassembled and repaired.

[0025] In summary, the utility model has the following beneficial effects:

[0026] 1. The utility model can conveniently store wafers that need to be scraped with glue by arranging a storage table, can scrape the glue on the surface of the wafer by arranging a second electric cylinder, a mounting plate and a scraper, can drive the scraper to move back and forth by arranging a first electric cylinder and a push plate, and can facilitate the scraping of glue, and can drive the second electric cylinder, the mounting plate and the scraper to move left and right by arranging a servo motor, a threaded rod and a threaded sleeve, and adjust the left and right position of the scraper so that it can scrape glue on wafers that do not meet the size.

[0027] 2. The utility model can fix the wafers on the top of the storage table by arranging a slide, a slide bar, a cross plate, a rotating handle, a screw and a pressure plate, and can also fix wafers of different sizes. By arranging a rotating motor and a rotating shaft, it can drive the storage table to rotate, and then drive the wafer to rotate, so that the scraper can scrape glue at different positions of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the structure of the utility model;

[0029] Figure 2 It is a three-dimensional cross-sectional view of the structure of the utility model;

[0030] Figure 3 It is a planar cross-sectional view of the structure of the utility model;

[0031] Figure 4 It is a schematic diagram of the first electric cylinder and push plate structure of the utility model;

[0032] Figure 5 The utility model structure Figure 1 A partial enlarged view of point A in the middle.

[0033] In the figure: 1. workbench; 2. first electric cylinder; 3. push plate; 4. column; 5. drive box; 6. moving mechanism; 601. servo motor; 602. threaded rod; 603. threaded sleeve; 7. scraper mechanism; 701. second electric cylinder; 702. mounting plate; 703. scraper; 8. storage table; 9. fixing mechanism; 901. slideway; 902. slide rod; 903. cross plate; 904. screw; 905. handle; 906. pressure plate; 10. concave frame; 11. rotating motor; 12. rotating shaft. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] Embodiment 1:

[0036] Please refer to Figure 1-5 A semiconductor scraping device for an etching and degumming machine comprises a workbench 1, a first electric cylinder 2 is fixedly connected to the back of the inner cavity of the workbench 1, a push plate 3 is fixedly connected to the telescopic end of the first electric cylinder 2, a column 4 is fixedly connected to the left and right sides of the top of the push plate 3, a driving box 5 is fixedly connected to the top of the column 4, a moving mechanism 6 is arranged in the inner cavity of the driving box 5, a scraping mechanism 7 is arranged at the bottom of the moving mechanism 6, a storage table 8 is arranged on the top of the workbench 1, and a fixing mechanism 9 is arranged on the top of the storage table 8;

[0037] The moving mechanism 6 includes a servo motor 601, which is fixedly mounted on one side of the inner cavity of the driving box 5. The output end of the servo motor 601 is fixedly connected to a threaded rod 602. The end of the threaded rod 602 away from the servo motor 601 is rotatably connected to the connection point of the inner cavity of the driving box 5 through a bearing. The outer surface of the threaded rod 602 is threadedly connected to a threaded sleeve 603.

[0038] The scraper mechanism 7 includes a second electric cylinder 701 , which is fixedly mounted on the bottom of the threaded sleeve 603 . The telescopic end of the second electric cylinder 701 is fixedly connected to a mounting plate 702 , and a scraper 703 is fixedly mounted on the bottom of the mounting plate 702 .

[0039] As a technical optimization solution of the utility model, further, a concave frame 10 is fixedly connected to the top of the inner cavity of the workbench 1, a rotating motor 11 is fixedly connected to the bottom of the inner cavity of the concave frame 10, a rotating shaft 12 is fixedly connected to the output end of the rotating motor 11, and the top of the rotating shaft 12 is fixedly connected to the connection at the bottom of the storage table 8.

[0040] As a technical optimization solution of the utility model, further, the top of the threaded sleeve 603 is fixedly connected with a first slider, the top of the inner cavity of the driving box 5 is provided with a first slide groove used in conjunction with the first slider, and the outer surface of the first slider is slidably connected to the inner surface of the first slide groove.

[0041] As a technical optimization solution of the utility model, further, the left and right sides of the bottom of the push plate 3 are fixedly connected with a second slider, and the left and right sides of the bottom of the inner cavity of the workbench 1 are provided with a second slide groove for cooperating with the second slider, and the outer surface of the second slider is slidably connected to the inner surface of the second slide groove.

[0042] As a technical optimization solution of the utility model, further, first through grooves are opened on both left and right sides of the top of the workbench 1, and the outer surface of the column 4 is slidably connected to the inner surface of the first through groove.

[0043] As a technical optimization solution of the utility model, further, a second through groove is opened at the bottom of the driving box 5, and the outer surface of the second electric cylinder 701 is slidably connected to the inner surface of the second through groove.

[0044] As a technical optimization solution of the utility model, further, a baffle is fixedly connected to the front side of the workbench 1 by screws, and a control switch is arranged on the front side of the baffle.

[0045] In this embodiment: by setting up a storage table 8, it is convenient to store wafers that need to be scraped with glue; by setting up a second electric cylinder 701, a mounting plate 702 and a scraper 703, the glue on the surface of the wafer can be scraped off; by setting up a first electric cylinder 2 and a push plate 3, the scraper 703 can be driven to move forward and backward to facilitate scraping off the glue; by setting up a servo motor 601, a threaded rod 602 and a threaded sleeve 603, the second electric cylinder 701, the mounting plate 702 and the scraper 703 can be driven to move left and right, and the left and right position of the scraper 703 can be adjusted so that it can be correct. The scraping operation can be performed on wafers of different sizes. By setting a rotating motor 11 and a rotating shaft 12, the storage table 8 and the wafer can be driven to rotate, so that the scraper 703 can scrape the glue on different positions of the wafer. By setting a first slider and a first slide groove, the movement of the threaded sleeve 603 can be guided, and the movement of the threaded sleeve 603 can also be limited. By setting a second slider and a second slide groove, the movement of the push plate 3 can be guided. By setting a first through groove, the movement of the column 4 can be facilitated. By setting a second through groove, the movement of the second electric cylinder 701 can be facilitated.

[0046] Embodiment 2:

[0047] Reference Figure 1 , Figure 3 and Figure 4 The fixing mechanism 9 includes two slides 901, which are respectively opened at the front and rear positions of the top of the storage platform 8. The left and right sides of the inner surface of the slide 901 are slidably connected with slide rods 902. One side of the slide rod 902 is fixedly connected with a cross plate 903. The top of the cross plate 903 is threadedly connected with a screw rod 904. The top of the screw rod 904 is fixedly connected with a handle 905. The bottom of the screw rod 904 is fixedly connected with a pressure plate 906.

[0048] In this embodiment: by setting the horizontal plate 903, the rotating handle 905, the screw 904 and the pressure plate 906, the wafer on the top of the storage table 8 can be fixed, and by setting the slide 901 and the slide bar 902, the position of the pressure plate 906 can be adjusted so that it can fix wafers of different sizes.

[0049] The implementation principle of the utility model is as follows: when in use, the bonded wafer is placed on the top of the storage table 8, the rotating handle 905 is rotated, the rotating handle 905 drives the screw rod 904 to rotate, the screw rod 904 drives the pressing plate 906 to move downward to fix the wafer, and then the control switch of the second electric cylinder 701 is started, the second electric cylinder 701 drives the mounting plate 702 to move downward, the mounting plate 702 drives the scraper 703 to move downward, so that the scraper 703 contacts the wafer, and then the control switch of the first electric cylinder 2 is started, the first electric cylinder 2 drives the push plate 3 to move, the push plate 3 drives the column 4 to move, the column 4 drives the drive box 5 to move, the drive box 5 drives the second electric cylinder 701, the mounting plate 702 and the scraper 703 to move forward and backward, and the glue on the surface of the wafer is scraped off by the scraper 703;

[0050] When the position of the scraper 703 needs to be adjusted, the control switch of the servo motor 601 is started, the servo motor 601 drives the threaded rod 602 to rotate, the threaded rod 602 drives the threaded sleeve 603 to move left and right, the threaded sleeve 603 drives the second electric cylinder 701 to move left and right, the second electric cylinder 701 moves left and right through the mounting plate 702 and the scraper 703, and adjusts the left and right position of the scraper 703 so that it can perform glue scraping operations on wafers that do not exceed the size. This method is simple to operate and easy to adjust.

[0051] The above are all preferred embodiments of the present utility model, and are not intended to limit the protection scope of the present utility model. Therefore, any equivalent changes made based on the structure, shape, and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A semiconductor scraping device for an etching and degumming machine, comprising a workbench (1), characterized in that: A first electric cylinder (2) is fixedly connected to the back of the inner cavity of the workbench (1), a push plate (3) is fixedly connected to the telescopic end of the first electric cylinder (2), columns (4) are fixedly connected to the left and right sides of the top of the push plate (3), a driving box (5) is fixedly connected to the top of the column (4), a moving mechanism (6) is provided in the inner cavity of the driving box (5), a scraping mechanism (7) is provided at the bottom of the moving mechanism (6), a storage table (8) is provided at the top of the workbench (1), and a fixing mechanism (9) is provided at the top of the storage table (8); The moving mechanism (6) comprises a servo motor (601), the servo motor (601) is fixedly mounted on one side of the inner cavity of the drive box (5), an output end of the servo motor (601) is fixedly connected to a threaded rod (602), an end of the threaded rod (602) away from the servo motor (601) is rotatably connected to a connection point on one side of the inner cavity of the drive box (5) via a bearing, and a threaded sleeve (603) is threadedly connected to an outer surface of the threaded rod (602); The scraping mechanism (7) comprises a second electric cylinder (701), the second electric cylinder (701) is fixedly mounted on the bottom of the threaded sleeve (603), the telescopic end of the second electric cylinder (701) is fixedly connected to a mounting plate (702), and a scraper (703) is fixedly mounted on the bottom of the mounting plate (702).

2. A semiconductor scraping device for an etching and degumming machine according to claim 1, characterized in that: The fixing mechanism (9) comprises two slideways (901), the two slideways (901) are respectively arranged at the front and rear positions of the top of the storage platform (8), the left and right sides of the inner surface of the slideway (901) are slidably connected with slide rods (902), one side of the slide rod (902) is fixedly connected with a cross plate (903), the top of the cross plate (903) is threadedly connected with a screw rod (904), the top of the screw rod (904) is fixedly connected with a rotating handle (905), and the bottom of the screw rod (904) is fixedly connected with a pressing plate (906).

3. A semiconductor scraping device for an etching and degumming machine according to claim 1, characterized in that: The top of the inner cavity of the workbench (1) is fixedly connected to a concave frame (10), the bottom of the inner cavity of the concave frame (10) is fixedly connected to a rotating motor (11), the output end of the rotating motor (11) is fixedly connected to a rotating shaft (12), and the top of the rotating shaft (12) is fixedly connected to the connection point of the bottom of the storage table (8).

4. The semiconductor scraping device for an etching and degumming machine according to claim 1, characterized in that: A first sliding block is fixedly connected to the top of the threaded sleeve (603), a first sliding groove for cooperating with the first sliding block is provided at the top of the inner cavity of the drive box (5), and the outer surface of the first sliding block is slidably connected to the inner surface of the first sliding groove.

5. The semiconductor scraping device for an etching and degumming machine according to claim 1, characterized in that: The left and right sides of the bottom of the push plate (3) are fixedly connected with a second sliding block, and the left and right sides of the bottom of the inner cavity of the workbench (1) are provided with a second sliding groove for matching with the second sliding block, and the outer surface of the second sliding block is slidably connected with the inner surface of the second sliding groove.

6. The semiconductor scraping device for an etching and degumming machine according to claim 1, characterized in that: The left and right sides of the top of the workbench (1) are both provided with first through grooves, and the outer surface of the column (4) is slidably connected to the inner surface of the first through groove.

7. The semiconductor scraping device for an etching and desmearing machine according to claim 1, characterized in that: A second through groove is provided at the bottom of the driving box (5), and the outer surface of the second electric cylinder (701) is slidably connected to the inner surface of the second through groove.

8. The semiconductor scraping device for an etching and desmearing machine according to claim 1, characterized in that: The front side of the workbench (1) is fixedly connected with a baffle via screws, and a control switch is arranged on the front side of the baffle.

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