Semiconductor wafer cleaning equipment

Abstract

The utility model discloses semiconductor wafer cleaning equipment which comprises a cleaning box, the top of one end of the cleaning box is fixedly connected with a supporting block, the top of the supporting block is fixedly connected with a telescopic air cylinder, the output end of the telescopic air cylinder is fixedly connected with a mounting frame, and the end, away from the telescopic air cylinder, of the mounting frame is fixedly connected with a cover plate. The top of the cover plate is fixedly connected with a water supply module, the bottom of the cover plate is fixedly connected with a plurality of cleaning pipes, the water supply module is communicated with the plurality of cleaning pipes through guide pipes, the bottom of the cover plate is fixedly connected with a motor, the output end of the motor is fixedly connected with a rotating rod, and the bottom of the rotating rod is fixedly connected with a rotating disc. According to the utility model, through the arrangement of the lifting cleaning mechanism, the wafer cleaning equipment can be conveniently maintained, so that the maintenance efficiency of the wafer cleaning equipment is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor cleaning, in particular to a semiconductor wafer cleaning device. Background Art

[0002] The semiconductor industry is the core of the modern electronics industry, and the foundation of the semiconductor industry is the silicon material industry. The original material of the wafer is silicon. Contaminants on the surface of the wafer will seriously affect the performance, reliability, and yield of the device. With the rapid development of microelectronics technology and the improvement of people's requirements, the impact of pollutants on devices has become more and more prominent.

[0003] During the wafer manufacturing process, it is inevitable to be contaminated by dust, metal, organic and inorganic substances. These pollutants can easily cause surface defects and dirt in the holes, resulting in emission points, black spots, dark spots, etc., which will lead to a decrease in the yield of the wafer and make the quality of the wafer unstable and even fail. Therefore, it is very important to remove contaminants on the wafer surface during the wafer manufacturing process.

[0004] However, the existing semiconductor wafer cleaning equipment has a relatively simple structure, and the cleaning equipment is not convenient to maintain and clean, which affects the maintenance efficiency of the cleaning equipment. Utility Model Content

[0005] The utility model aims to solve the problem that the semiconductor wafer cleaning equipment in the prior art has a relatively simple structure and is inconvenient to maintain and clean, and proposes a semiconductor wafer cleaning equipment.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A semiconductor wafer cleaning device comprises a cleaning box, wherein a support block is fixedly connected to the top of one end of the cleaning box, a telescopic cylinder is fixedly connected to the top of the support block, a mounting bracket is fixedly connected to the output end of the telescopic cylinder, a cover plate is fixedly connected to the end of the mounting bracket away from the telescopic cylinder, a water supply module is fixedly connected to the top of the cover plate, a plurality of cleaning pipes are fixedly connected to the bottom of the cover plate, the water supply module is connected to the plurality of cleaning pipes through a conduit, a motor is fixedly connected to the bottom of the cover plate, a rotating rod is fixedly connected to the output end of the motor, a rotating disk is fixedly connected to the bottom of the rotating rod, a plurality of placement slots are provided on the top of the rotating disk, a grid plate is fixedly inserted into the inner bottom of the placement slot, a water outlet pipe is fixedly inserted into the inner bottom of the cleaning box, and a water outlet valve is threadedly connected to the water outlet pipe.

[0008] Preferably, a plurality of supporting feet are fixedly connected to the bottom of the cleaning box, and a plurality of fastening openings are provided on the supporting feet.

[0009] Preferably, a sliding rod is fixedly inserted at the bottom of the cover plate near one end of the support block, a sliding cavity corresponding to the sliding rod is provided on the cleaning box, and one end of the sliding rod located in the sliding cavity is fixedly connected to a limiting block.

[0010] Preferably, a spray head is fixedly sleeved on the bottom of the cleaning pipe.

[0011] Preferably, a damping shock absorber is fixedly embedded on the top of one end of the cleaning box close to the water supply module, and the top of the damping shock absorber is against the bottom of the cover plate.

[0012] Preferably, a plurality of guide blocks are fixedly connected to the bottom of the turntable, and an annular guide rail corresponding to the guide blocks is provided at the inner bottom of the cleaning box.

[0013] Beneficial effects:

[0014] 1. The utility model provides a lifting and cleaning mechanism, so that the wafer cleaning equipment can be easily maintained, thereby effectively improving the maintenance efficiency of the wafer cleaning equipment;

[0015] 2. Place the wafer into the mounting slot on the turntable, then cover it with the cover, start the motor to drive the turntable to rotate, and start the water supply module to clean the wafer through the cleaning pipe. When the equipment needs to be cleaned and maintained, start the telescopic cylinder to drive the cover to move upward, thereby taking the turntable out of the cleaning box, and then clean the cleaning box and the turntable. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural schematic diagram of a semiconductor wafer cleaning device proposed by the utility model;

[0017] Figure 2 The utility model is a schematic diagram of a top view of the structure of a turntable of a semiconductor wafer cleaning device.

[0018] In the figure: 1 cleaning box, 2 support block, 3 telescopic cylinder, 4 mounting frame, 5 cover plate, 6 water supply module, 7 cleaning pipe, 8 motor, 9 rotating rod, 10 rotating disk, 11 grid plate, 12 water outlet pipe, 13 water outlet valve, 14 supporting foot, 15 sliding rod, 16 limit block, 17 spray head, 18 damping shock absorber, 19 guide block, 20 conduit. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0020] Reference Figure 1-2A semiconductor wafer cleaning device comprises a cleaning box 1, a plurality of supporting legs 14 are fixedly connected to the bottom of the cleaning box 1, a plurality of fastening holes are arranged on the supporting legs 14, and the cleaning box 1 is conveniently fixed. A supporting block 2 is fixedly connected to the top of one end of the cleaning box 1, a telescopic cylinder 3 is fixedly connected to the top of the supporting block 2, and is used to drive a mounting frame 4 to move up and down, an output end of the telescopic cylinder 3 is fixedly connected to the mounting frame 4, and an end of the mounting frame 4 away from the telescopic cylinder 3 is fixedly connected to a cover plate 5 to prevent debris from falling into the cleaning box 1;

[0021] In this embodiment, a slide bar 15 is fixedly inserted at the bottom of the cover plate 5 near one end of the support block 2, and a slide cavity corresponding to the slide bar 15 is provided on the cleaning box 1. One end of the slide bar 15 located in the slide cavity is fixedly connected to a limit block 16 to prevent the slide bar 15 from falling off the slide cavity. A damping shock absorber 18 is fixedly embedded at the top of the cleaning box 1 near one end of the water supply module 6. The top of the damping shock absorber 18 is against the bottom of the cover plate 5, which plays a certain shock-absorbing and buffering role on the cover plate 5.

[0022] In this embodiment, a water supply module 6 is fixedly connected to the top of the cover plate 5 for storing cleaning liquid, a plurality of cleaning pipes 7 are fixedly connected to the bottom of the cover plate 5 for spraying cleaning liquid to clean the wafers, the water supply module 6 is connected to the plurality of cleaning pipes 7 through a conduit 20, a spray head 17 is fixedly sleeved at the bottom of the cleaning pipe 7, a motor 8 is fixedly connected to the bottom of the cover plate 5 for driving the rotating rod 9 to rotate, the output end of the motor 8 is fixedly connected to the rotating rod 9, and the bottom of the rotating rod 9 is fixedly connected to a turntable 10 for placing wafers;

[0023] In this embodiment, a plurality of placement grooves are provided on the top of the turntable 10, a plurality of guide blocks 19 are fixedly connected to the bottom of the turntable 10, and an annular guide rail corresponding to the guide block 19 is provided on the inner bottom of the cleaning box, which plays a certain guiding and supporting role for the turntable 10, a grid plate 11 is fixedly inserted into the inner bottom of the placement groove, and an outlet pipe 12 is fixedly inserted into the inner bottom of the cleaning box 1, and an outlet valve 13 is threadedly connected to the outlet pipe 12 to facilitate the discharge of cleaning waste liquid.

[0024] In this embodiment, the wafer is placed in the installation groove on the turntable 10, and then the cover plate 5 is covered, the motor 8 is started to drive the turntable 10 to rotate, and the water supply module 6 is started to clean the wafer through the cleaning pipe 7. When the equipment needs to be cleaned and maintained, the telescopic cylinder 3 is started to drive the cover plate 5 to move upward, thereby taking the turntable 10 out of the cleaning box 1, and then the cleaning box 1 and the turntable 10 can be cleaned.

[0025] In this embodiment, the wafer cleaning equipment can be conveniently maintained by providing a lifting and cleaning mechanism, thereby effectively improving the maintenance efficiency of the wafer cleaning equipment.

[0026] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor wafer cleaning device, comprising a cleaning box (1), characterized in that: The top of one end of the cleaning box (1) is fixedly connected to a support block (2), the top of the support block (2) is fixedly connected to a telescopic cylinder (3), the output end of the telescopic cylinder (3) is fixedly connected to a mounting frame (4), the end of the mounting frame (4) away from the telescopic cylinder (3) is fixedly connected to a cover plate (5), the top of the cover plate (5) is fixedly connected to a water supply module (6), the bottom of the cover plate (5) is fixedly connected to a plurality of cleaning pipes (7), and the water supply module (6) is connected to the water supply module (6) through a conduit (20 ) is connected to a plurality of cleaning pipes (7), the bottom of the cover plate (5) is fixedly connected to a motor (8), the output end of the motor (8) is fixedly connected to a rotating rod (9), the bottom of the rotating rod (9) is fixedly connected to a rotating disk (10), the top of the rotating disk (10) is provided with a plurality of placement grooves, the inner bottom of the placement grooves is fixedly inserted with a grid plate (11), the inner bottom of the cleaning box (1) is fixedly inserted with a water outlet pipe (12), and the water outlet pipe (12) is threadedly connected with a water outlet valve (13).

2. A semiconductor wafer cleaning device according to claim 1, characterized in that: A plurality of supporting legs (14) are fixedly connected to the bottom of the cleaning box (1), and a plurality of fastening openings are provided on the supporting legs (14).

3. The semiconductor wafer cleaning device according to claim 1, characterized in that: A sliding rod (15) is fixedly inserted at the bottom of the cover plate (5) near one end of the support block (2); a sliding cavity corresponding to the sliding rod (15) is provided on the cleaning box (1); and one end of the sliding rod (15) located in the sliding cavity is fixedly connected to a limiting block (16).

4. The semiconductor wafer cleaning device according to claim 1, characterized in that: The bottom of the cleaning pipe (7) is fixedly sleeved with a spray head (17).

5. The semiconductor wafer cleaning device according to claim 1, characterized in that: A damping shock absorber (18) is fixedly embedded on the top of one end of the cleaning box (1) close to the water supply module (6), and the top of the damping shock absorber (18) abuts against the bottom of the cover plate (5).

6. The semiconductor wafer cleaning device according to claim 1, characterized in that: A plurality of guide blocks (19) are fixedly connected to the bottom of the rotating disk (10), and an annular guide rail corresponding to the guide blocks (19) is provided at the inner bottom of the cleaning box.

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