Process system interconnection device and carrier transport layer preparation system

Abstract

The embodiment of the utility model provides a process system interconnection device and a carrier transport layer preparation system. The process system interconnection device comprises a chamber, an atmosphere adjusting device and a transmission device, the chamber is used for being connected with more than two process systems in a sealing manner so as to form a closed environment isolated from the outside atmosphere; the more than two process systems are used for processing a to-be-processed workpiece under preset process conditions; the cavity is used for being in sealed connection with a first process system through a first gate valve and being in sealed connection with a second process system through a second gate valve; the atmosphere adjusting device is used for adjusting the atmosphere condition in the cavity so as to protect the to-be-machined part. And the transmission device is used for transferring the workpiece to be processed among more than two process systems in a closed environment. The carrier transport layer preparation system comprises the process system interconnection device, more than two process systems, more than two gate valves and a loading and unloading system. The performance of the prepared workpiece to be machined is improved.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic equipment, and in particular to a process system interconnection device and a carrier transport layer preparation system. Background Art

[0002] Perovskite solar cells have the advantages of high conversion rate, low cost, compatibility with existing crystalline silicon technology, wide application scenarios, and low production line investment. In recent years, they have been generally considered to be the next generation of mainstream photovoltaic technology after amorphous silicon thin-film heterojunction cells (HJT) technology.

[0003] Perovskite solar cells are usually composed of five main parts: a conductive glass substrate hole transport layer, a perovskite light absorption layer, an electron transport layer, and an electrode. As one of the main functional layers, the electron transport layer is in direct contact with the perovskite light absorption layer. Its material and structure play an important role in the conversion efficiency and stability of solar cells. At present, the electron transport layer can adopt a composite electron transport layer. The preparation method is mainly: on a substrate covered with a perovskite layer, first use the first process system to prepare the first electron transport layer, and then use the second process system to prepare the second electron transport layer. The first electron transport layer and the second electron transport layer constitute a composite electron transport layer.

[0004] The perovskite solar cells prepared by the above existing preparation methods have defects, such as low conversion efficiency and poor stability. Summary of the invention

[0005] In view of this, the embodiments of the present application provide a process system interconnection device and a carrier transport layer preparation system to solve at least one problem existing in the background technology.

[0006] In a first aspect, an embodiment of the present application provides a process system interconnection device, including: a chamber, an atmosphere adjustment device, and a transmission device;

[0007] The chamber is used to be sealed and connected with two or more process systems to form a closed environment isolated from the outside atmosphere; the two or more process systems are used to process the workpiece under predetermined process conditions;

[0008] The chamber is used to be sealed and connected to the first process system through a first gate valve, and to be sealed and connected to the second process system through a second gate valve;

[0009] The atmosphere adjustment device is used to adjust the atmosphere conditions in the chamber to protect the workpiece to be processed;

[0010] The transmission device is used to transfer the workpiece to be processed between the two or more process systems in the closed environment.

[0011] In combination with the first aspect of the present application, in an optional embodiment, the process system interconnection device also includes a transmission control device, which is connected to the transmission device and is used to control the order of transferring the workpiece to be processed between the more than two process systems according to the processing process design information of the workpiece to be processed.

[0012] In combination with the first aspect of the present application, in an optional embodiment, the atmosphere regulating device includes at least one of a gas pressure regulating device, a gas flow regulating device, an atmosphere type selecting device and a temperature regulating device.

[0013] In combination with the first aspect of the present application, in an optional implementation, the air pressure regulating device includes a vacuum pump.

[0014] In combination with the first aspect of the present application, in an optional implementation, the temperature regulating device is also used to regulate the temperature of the workpiece to be processed.

[0015] In combination with the first aspect of the present application, in an optional implementation, the transmission control device is also used to control the opening and closing of the first gate valve and the second gate valve.

[0016] In combination with the first aspect of the present application, in an optional implementation, the transmission device is also used to control the position and / or angle of the workpiece to be processed.

[0017] In a second aspect, an embodiment of the present application provides a carrier transport layer preparation system, including the above-mentioned process system interconnection device, more than two process systems, more than two gate valves and a loading and unloading system;

[0018] The two or more process systems are used to prepare at least one carrier transport layer on the workpiece to be processed;

[0019] The process system interconnection device is sealed and connected to the two or more process systems through the two or more gate valves respectively; the process system interconnection device is used to transfer the workpiece to be processed between the two or more process systems in the closed environment;

[0020] The two or more gate valves are used to open and close during the transfer of the workpiece to be processed;

[0021] The loading and unloading system is used to transport the workpiece to be processed to the process system interconnection device.

[0022] In combination with the second aspect of the present application, in an optional embodiment, the carrier transport layer preparation system is used to prepare a composite electron transport layer of a perovskite battery; the composite electron transport layer of the perovskite battery includes at least two electron transport layers; the two or more process systems include a first process system and a second process system; the first process system and the second process system are used to prepare at least one electron transport layer on the workpiece to be processed.

[0023] In a third aspect, an embodiment of the present application provides a method for preparing a carrier transport layer, comprising:

[0024] Transport the workpiece to be processed to the process system interconnection device;

[0025] The process system interconnection device is sealedly connected to two or more process systems to form a closed environment isolated from the outside atmosphere;

[0026] Adjusting the atmosphere conditions of the closed environment;

[0027] Transferring the workpiece to be processed from the process system interconnection device to the first process system in the closed environment for first processing;

[0028] After the first processing is completed, the workpiece to be processed is transferred to a second process system in the closed environment for a second processing; the first processing and the second processing are used to form at least one carrier transport layer on the workpiece to be processed;

[0029] After the second processing is completed, the workpiece to be processed is transferred to the process system interconnection device.

[0030] In conjunction with the third aspect of the present application, in an optional implementation manner, the method further includes: obtaining processing technology design information of the workpiece to be processed;

[0031] The transfer sequence of the workpiece to be processed between the two or more process systems is determined according to the processing technology design information.

[0032] The process system interconnection device of the embodiment of the present application is sealed and connected with more than two process systems to form a closed environment isolated from the outside atmosphere, and the atmosphere in the interconnection device is adjusted by the atmosphere adjustment device, so that the workpiece to be processed is always in a closed protective environment during the transfer between more than two process systems, avoiding the exposure of the workpiece to be processed and the electron transport layer, light absorption layer and other film layers thereon to the atmosphere and other harmful atmospheres, preventing them from being damaged and causing defects, and realizing the lossless preparation of the electron transport layer, thereby improving the conversion efficiency and stability of the perovskite battery. The transmission control device of the embodiment of the present application adjusts the transfer order of the workpiece to be processed between more than two process systems according to the processing technology design information, realizes the automatic optimization adjustment of the materials of each film layer and the preparation order of the film layer, and further improves the conversion efficiency, stability and other performances of devices such as perovskite batteries.

[0033] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0035] Figure 1 A schematic diagram of a carrier transport layer preparation system provided in one embodiment of the present application;

[0036] Figure 2 A schematic diagram of a process system interconnection device provided in one embodiment of the present application;

[0037] Figure 3 A schematic diagram of a process system interconnection device provided in another embodiment of the present application;

[0038] Figure 4 A schematic diagram of a carrier transport layer preparation system provided in another embodiment of the present application;

[0039] Figure 5 A method for preparing a carrier transport layer is provided in one embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to make the technical solutions and beneficial effects of the present application more obvious and understandable, the technical solutions in the embodiments of the present application are clearly and completely described below by listing specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0042] It should be noted that the terms "first", "second", etc. used in this application can be used to describe various elements in this article, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element, rather than to describe a specific order or sequence. For example, without departing from the scope of this application, the first resistor can be referred to as the second resistor, and similarly, the second resistor can be referred to as the first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor. When describing "first", it does not mean that there must be a "second"; and when discussing "second", it does not mean that there must be a first element, component, area, layer or part in this application. When used here, the singular form of "one", "one" and "said / the" may also be intended to include plural forms, unless the context clearly indicates another way. The meaning of "multiple" is more than two, unless otherwise clearly and specifically defined. It should also be understood that the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions and do not exclude the presence or addition of one or more other features. The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural.

[0043] The inventors have found through research that the defects of the perovskite solar cells described in the background technology lead to low conversion efficiency and poor stability because: during the preparation of the perovskite solar cell, there is no protection between the first process system and the second process system, and the substrate is exposed to the atmosphere before being sent to the second process system, and the water, oxygen or other sensitive components in the atmosphere cause damage and defects to the film layers such as the perovskite light absorption layer or the electron transport layer. As the main functional layer, the damage and defects of these film layers lead to reduced conversion efficiency and poor stability of the solar cell.

[0044] In addition, at present, in the actual preparation process of the electron transport layer, due to the limitation of the preparation equipment, the material type and preparation order of each electron transport layer are fixed and cannot be adjusted, resulting in the inability to optimize and adjust the preparation process of each electron transport layer, further hindering the improvement of the conversion efficiency and stability of solar cells.

[0045] refer to Figure 1 and Figure 2The embodiment of the present application provides a process system interconnection device 10, comprising: a chamber 11, an atmosphere adjustment device 12 and a transmission device 13. The chamber 11 is used to be sealed and connected with two or more process systems to form a closed environment isolated from the outside atmosphere. The closed environment can protect the workpiece to be processed therein, and prevent it from being damaged by oxygen, water vapor, etc. due to exposure to the atmosphere and causing defects.

[0046] More than two process systems are used to process the workpiece 01 under predetermined process conditions. Figure 1 As shown, optionally, the above two or more process systems include a first process system 20 and a second process system 30, which respectively process the workpiece 01 under different process conditions. For example, the first process system 20 is used to form a first electron transport layer on the workpiece 01; the second process system 30 is used to form a second electron transport layer on the workpiece 01. Figure 1 Only the case of two process systems is shown. It can be understood that the chamber 11 can also be sealed and connected to more process systems, which can be set as needed. The function of the process system is not limited to adding film layers, but also can be used to thin and etch the workpiece or film layer, depending on the application scenario and process design conditions. The above two or more process systems are not only suitable for the preparation of electron transport layers, but also for the preparation of other functional film layers, such as hole transport layers, light absorption layers, etc.

[0047] Optionally, more than two process systems may use technologies such as thermal evaporation TE, electron beam evaporation EBE, vapor transport deposition VTD, close space sublimation CSS, atomic layer deposition ALD, electron beam evaporation EBE, reactive plasma deposition RPD, etc. The two or more process systems may be horizontal process systems or vertical process systems. A horizontal process system refers to a workpiece to be processed, such as a substrate, placed horizontally, with the surface to be processed facing upward and the source facing downward, or with the surface to be processed facing downward and the source facing upward. A vertical process system refers to a workpiece to be processed that is tilted at a certain angle, with the source facing the surface to be processed.

[0048] The chamber 11 is sealed and connected to the first process system 20 through the first gate valve 40. The chamber 11 is sealed and connected to the second process system 30 through the second gate valve 50. The first gate valve 40 and the second gate valve 50 can be controlled to be opened or closed. For example, when the workpiece to be processed is transferred between the first process system 20 and the interconnected device 10, the first gate valve 40 is opened and closed after the transfer is completed; when the workpiece to be processed is transferred between the second process system 30 and the interconnected device 10, the second gate valve 50 is opened and closed after the transfer is completed.

[0049] Optionally, the first gate valve 40 and the second gate valve 50 include a vacuum gate valve, a butterfly valve, a multi-position gate valve or a transfer valve, etc., and are mainly composed of a valve body, a valve plate, a sealing ring, a transmission component and accessories. The valve plate is installed in the valve body, and the sealing ring is installed on the valve plate. The transmission component is used to control the movement of the valve plate, and the accessories include a control system and a sensor. When the valve plate moves toward the valve body until the sealing ring on the valve body is in close contact with the valve body, the gate valve is closed, cutting off the connection between the chambers on both sides of the gate valve. When the valve plate leaves the valve body, the gate valve opens, connecting the chambers on both sides.

[0050] The atmosphere adjustment device 12 is used to adjust the atmosphere conditions in the chamber 11 to protect the workpiece 01 to be processed. The workpiece 01 to be processed is prevented from being damaged by the gas retained in the chamber 11. The atmosphere adjustment device 12 includes at least one of an air pressure adjustment device and an air pressure adjustment device. The air pressure adjustment device includes a vacuum pump. By using a vacuum pump to evacuate the chamber 11, the air retained therein or other harmful components generated during the processing are extracted, thereby preventing the workpiece 01 to be processed, such as the film layer formed thereon, from being damaged and causing defects.

[0051] Optionally, the atmosphere regulating device 12 includes an atmosphere type selection device for filling the chamber 11 with protective gas, such as nitrogen, inert gas, etc., so as to protect the workpiece 01 to be processed. The atmosphere type selection device includes a gas storage bottle and a gas valve. Optionally, the atmosphere regulating device 12 includes a gas flow regulating device for adjusting the speed of inflation or exhaust to control the rate of change of the air pressure in the chamber 11. The atmosphere in the chamber 11 can be quickly changed by the gas flow regulating device, so as to achieve rapid protection of the workpiece to be processed. The gas flow regulating device includes a gas concentration detector and a gas flow controller. The gas flow controller is, for example, a flow valve.

[0052] Optionally, the atmosphere regulating device 12 includes a temperature regulating device for regulating the temperature of the workpiece to be processed and the temperature in the chamber 11. Too high or too low a temperature will generate stress between the film layer and the substrate of the workpiece to be processed and between the film layers, causing processing defects, and will also accelerate the damage to the film layer by the environment in which the workpiece to be processed is located. By using a temperature regulating device, the workpiece to be processed 01 is kept at a suitable temperature, thereby achieving a protective effect. Optionally, the temperature regulating device includes a heating plate, a heating jacket, a cooling plate, a water cooler, etc.

[0053] The transmission device 13 is used to transfer the workpiece 01 to be processed between the two or more process systems in the closed environment. In this way, the workpiece 01 to be processed can be transferred between the process systems in an isolated atmosphere, so as to avoid the workpiece 01 to be processed and the film layer formed thereon being exposed to the atmosphere and damaged. Optionally, the transmission device 13 includes a conveyor belt, a transmission manipulator, a flip manipulator, a roller, etc. The transmission device 13 is also used to control the position and / or angle of the workpiece 01 to be processed, so as to achieve precise adjustment of the workpiece 01 in the process system for convenient processing.

[0054] The following takes the preparation of the composite electron transport layer of the perovskite solar cell as an example to illustrate the working process of the interconnection device 10. When in use, the chamber 11 of the interconnection device 10 is sealed and connected to two or more process systems to form a closed environment isolated from the outside atmosphere. The workpiece 01 to be processed is placed in the chamber 11. The workpiece 01 to be processed can also be placed in the chamber 11 first, and then the above-mentioned sealing connection is performed. According to the processing technology design information, the workpiece 01 to be processed is transported to more than two process systems for processing in sequence. After processing, the workpiece 01 to be processed is transported to the subsequent process. For example, the composite electron transport layer includes two electron transport layers, and the above-mentioned two electron transport layers are processed by the first process system 20 and the second process system 30 respectively.

[0055] First, the workpiece 01 to be processed is placed in the chamber 11. The chamber 11 is sealed and connected to the first process system 20 through the first gate valve 40, and is sealed and connected to the second process system 30 through the second gate valve 50, so as to form a closed environment isolated from the outside atmosphere. Next, the first gate valve 40 is opened, and the workpiece 01 to be processed is transported to the first process system 20 through the transmission device 13, and the first gate valve 40 is closed. The first electron transport layer of the workpiece 01 to be processed is processed through the first process system 20. The atmosphere conditions in the chamber 11 are adjusted by the atmosphere adjustment device 12, for example, the chamber 11 is evacuated by a vacuum pump to remove the air retained therein to avoid damage to the first electron transport layer. As described above, the atmosphere adjustment device 12 such as a gas flow adjustment device, an atmosphere type selection device and a temperature adjustment device can also be used to adjust the atmosphere of the chamber 11.

[0056] After the first electron transport layer is processed, the first gate valve 40 is opened, the workpiece 01 is transported to the chamber 11 through the transport device 13, and the first gate valve 40 is closed. The second gate valve 50 is opened, the workpiece 01 is transported to the second process system 30, and the second gate valve 50 is closed. The second electron transport layer is processed on the workpiece 01 through the second process system 30.

[0057] After the second electron transport layer is processed, the second gate valve 50 is opened, the workpiece 01 is transported to the chamber 11, and the second gate valve 50 is closed. Optionally, before the workpiece 01 is transported from the second process system 30 to the chamber 11, the atmosphere in the chamber 11 is adjusted again by the atmosphere adjustment device 12 to prevent the gas composition, temperature and other environments in the chamber 11 from damaging the composite electron transport layer.

[0058] Finally, the workpiece 01 to be processed is taken out from the chamber 11 and transported to the next process.

[0059] The interconnection device 10 of the embodiment of the present application is sealed and connected with more than two process systems to form a closed environment isolated from the outside atmosphere, and the atmosphere in the interconnection device 10 is adjusted by the atmosphere adjustment device 12, so that the workpiece 01 to be processed is always in a closed protective environment during the transfer between the two or more process systems, thereby avoiding exposure of the workpiece 01 to be processed and the electron transport layer, light absorption layer and other film layers thereon to the atmosphere and other harmful atmospheres, preventing them from being damaged and causing defects, and realizing lossless preparation of the electron transport layer, thereby improving the conversion efficiency and stability of the perovskite battery.

[0060] It can be understood that the technical field applicable to the interconnection device of the embodiment of the present application is not limited to the preparation of perovskite cells, but can also be applied to the preparation of organic light-emitting devices OLED, organic solar cells OPV, etc. that also include carrier transport layers, which can greatly reduce the defects of the prepared devices and improve their performance.

[0061] refer to Figure 3 In a possible embodiment of the present application, the interconnection device 10 also includes a transmission control device 14, which is connected to the transmission device 13 and is used to control the order of transfer of the workpiece 01 to be processed between the above-mentioned two or more process systems according to the processing technology of the workpiece 01 to be processed. In the prior art, the preparation order of the carrier transport layer, such as the composite electron transport layer, is fixed and cannot be dynamically and automatically adjusted, which is not conducive to the optimization and adjustment of the materials and preparation order of the film layers such as the carrier transport layer. The film layer materials and preparation order will have a significant impact on the conversion efficiency, stability and other performance of devices such as perovskite batteries. In the present application, the two or more process systems sealed and connected to the interconnection device 10 may have different processing materials, process conditions, etc. according to the process design, and can form different carrier film layers, and perform different processing on the workpiece 01 and its carrier film layers. The transmission control device 14 is used to control the transmission device 13, thereby controlling the order in which the workpiece 01 to be processed is transferred between the above-mentioned two or more process systems under a predetermined processing technology, thereby achieving optimized adjustment of the material of the carrier transport layer and the film layer preparation sequence, and further improving the conversion efficiency, stability and other performance of devices such as perovskite batteries.

[0062] Optionally, the transmission control device 14 includes a single chip microcomputer (MCU) or a programmable logic controller (PLC). The transmission, position adjustment and angle adjustment of the workpiece 01 to be processed are achieved by controlling the actuating mechanism in the transmission device 13 .

[0063] The following takes the preparation of the composite electron transport layer of the perovskite solar cell as an example to illustrate the working process of the transport control device 14. The composite electron transport layer is the main electron transport layer commonly used in perovskite cells, including a first electron transport layer and a second electron transport layer. The first electron transport layer includes low melting point electron transport layer materials such as fullerene (C60) and phenyl-C61-butyric acid methyl ester (PCBM); the second electron transport layer includes n-type inorganic semiconductor materials such as SnO2 and TiO2.

[0064] First, the transmission control device 14 obtains the processing technology design information of the workpiece 01 to be processed. The processing technology design information includes the number of process systems, the processing order of each process system, the processing time and process parameters, etc. According to the processing technology design information, the transmission device 13 is controlled to transport the workpiece 01 to be processed to the first process system 20 for processing. The processing of the workpiece 01 to be processed by the first process system may be to form a first electron transport layer thereon. After the processing of the first process system is completed, the transmission control device 14 controls the transmission device 13 to transport the workpiece 01 to be processed to the second process system 30. The processing of the workpiece 01 to be processed by the second process system 30 may be to form a second electron transport layer thereon. The number of process systems can also be three or more, and the workpiece 01 to be processed is transported to the subsequent process system in sequence according to the processing technology design information.

[0065] In the case of changes in the processing technology design, the transmission control device 14 automatically controls the transmission device to transport the workpiece 01 to each process system for processing according to the new processing sequence, so as to adjust the preparation sequence of each film layer in the composite electron transport layer. In this way, the material of each film layer and the preparation sequence of the film layer are automatically optimized and adjusted, further improving the conversion efficiency, stability and other performance of devices such as perovskite batteries.

[0066] It can be understood that the transport control device 14 of the embodiment of the present application is not only suitable for adjusting the preparation order of each film layer in the composite electron transport layer, but also suitable for adjusting the preparation order of functional film layers such as the hole transport layer and the light absorption layer.

[0067] Optionally, the transmission control device 14 is also used to control the opening and closing of the first gate valve 40 and the second gate valve 50, so as to achieve synchronous control with the transmission device 13, and improve the coordination and work efficiency of the system as a whole. For example, when the transmission device 13 is controlled to transfer the workpiece 01 to be processed from the chamber 11 to the first process system 20, the first gate valve 40 is synchronously controlled to be opened, and after the transfer is completed, the first gate valve 40 is controlled to be closed. When the transmission device 13 is controlled to transfer the workpiece 01 to be processed from the chamber 11 to the second process system 30, the second gate valve 50 is synchronously controlled to be opened, and after the transfer is completed, the second gate valve 50 is controlled to be closed.

[0068] The present application also provides a carrier transport layer preparation system, referring to Figure 4 , including: a process system interconnection device 10, more than two process systems, more than two gate valves and a loading and unloading system 60.

[0069] More than two process systems are used to prepare at least one carrier transport layer on the workpiece 01 to be processed. The functions of the more than two process systems are not limited to adding film layers, but can also perform thinning, etching and other treatments on the workpiece or film layer to be processed. For example, the more than two process systems include a first process system 20 and a second process system 30. The first process system 20 and the second process system 30 are respectively used to prepare two layers of carrier transport layers on the workpiece 01 to be processed, or are respectively used to prepare sub-film layers in the carrier transport layer; or, one of the more than two process systems is used to prepare a carrier transport layer on the workpiece 01 to be processed, and the other process systems are used to perform other treatments such as thinning and etching on the workpiece 01 to be processed.

[0070] The process system interconnection device 10 is sealed and connected to the above two or more process systems through two or more gate valves to form a closed environment isolated from the outside atmosphere. The process system interconnection device 10 is used to transfer the workpiece 01 to be processed between the above two or more process systems in a closed environment.

[0071] The two or more gate valves are used to open and close during the transfer of the workpiece 01 to be processed, so as to realize the transfer of the workpiece 01 to be processed and the sealing of the process system interconnection device 10.

[0072] The loading and unloading system 60 is used to transport the workpiece 01 to be processed to the process system interconnection device 10. The loading and unloading system 60 is connected to the process system interconnection device 10, and can transfer the workpiece 01 to be processed from the previous process to the process system interconnection device 10, and transfer the workpiece 01 to the subsequent process after the above two or more process systems complete the processing.

[0073] Optionally, the carrier transport layer preparation system is used to prepare a composite electron transport layer of a perovskite battery. The composite electron transport layer of the perovskite battery includes at least two electron transport layers; the above-mentioned two or more process systems include a first process system 20 and a second process system 30; the first process system 20 and the second process system 30 are used to prepare at least one electron transport layer on the workpiece 01 to be processed. That is, the first process system 20 is used to prepare a first electron transport layer on the workpiece 01 to be processed, and the second process system 30 is used to prepare a second electron transport layer on the workpiece 01 to be processed; or, the first process system 20 or the second process system 30 is used to prepare at least one electron transport layer on the workpiece 01 to be processed, and the other process system is used to perform other processes such as etching and thinning.

[0074] The present application also provides a method for preparing a carrier transport layer, comprising:

[0075] Step S11, the workpiece 01 is transported to the process system interconnection device 10, and the process system interconnection device 10 is sealed and connected with two or more process systems to form a closed environment isolated from the outside atmosphere. In this way, the workpiece 01 and its film layer are prevented from being damaged due to exposure to the atmosphere during subsequent processing. Optionally, the workpiece 01 is transported from the previous process to the process system interconnection device 10 through the loading and unloading system 60.

[0076] Step S21, adjust the atmosphere conditions of the closed environment to prevent harmful components from damaging the workpiece 01. The atmosphere conditions of the closed environment are adjusted by the atmosphere adjustment device 12 to prevent harmful components such as air retained in the closed environment from damaging the workpiece 01. The adjustment methods of the atmosphere adjustment device 12 include vacuuming, filling with protective gas, selecting the type of atmosphere, adjusting the airflow and / or adjusting the temperature of the environment. Optionally, the atmosphere conditions of the closed environment are pre-adjusted to be the same or similar to the atmosphere conditions of the first processing system, so as to facilitate the atmosphere fusion during the transfer process of the workpiece 01.

[0077] Step S31 , transferring the workpiece 01 to be processed from the process system interconnection device 10 to the first process system in the closed environment for the first processing.

[0078] Optionally, step S31 further includes step S30: adjusting the position and / or angle of the workpiece 01 to be processed, so as to facilitate the first processing of the workpiece 01 by the first process system 20. The position and / or angle adjustment of the workpiece 01 to be processed may be performed before or after the workpiece 01 to be processed is transferred from the process system interconnection device 10 to the first process system 20.

[0079] The transfer, position and angle adjustment of the workpiece 01 to be processed are achieved through the transmission device 13 .

[0080] Step S41, after the first processing is completed, the workpiece 01 to be processed is transferred to the second process system 30 in a closed environment for a second processing; the first processing and the second processing are used to form at least one carrier transport layer on the workpiece 01 to be processed. The carrier transport layer can be a functional carrier transport layer, such as a hole transport layer or a composite electron transport layer, or a sub-transport layer of a functional carrier transport layer, such as the first electron transport layer or the second electron transport layer of the composite electron transport layer. The description of forming at least one layer is as described above and will not be repeated here.

[0081] Optionally, step S41 also includes step S42: after the first processing is completed, in a closed environment, first transfer the workpiece 01 to be processed from the first process system 20 to the process system interconnection device 10. When the atmosphere conditions during the processing of the first process system 20 and the second process system 30 are the same, the workpiece 01 to be processed can be directly transferred to the second process system 30 for a second processing. When the atmosphere conditions during the processing of the first process system 20 and the second process system 30 are different, first transfer the workpiece 01 to be processed from the first process system 20 to the process system interconnection device 10. Optionally, step S42 also includes: adjusting the atmosphere conditions of the closed environment to protect the workpiece 01 to be processed and its film layer. The adjustment of the atmosphere conditions of the closed environment can be a pre-adjustment, and its atmosphere conditions are adjusted to be the same or similar to the atmosphere conditions of the second process system 30, so as to facilitate the atmosphere fusion during the transfer of the workpiece 01 to be processed.

[0082] After step S42, step S43 is also included, transferring the workpiece 01 to be processed from the process system interconnection device 10 to the second process system 30. Optionally, step S43 also includes: adjusting the position and / or angle of the workpiece 01 to be processed, so as to facilitate the second processing of the workpiece 01 by the second process system 30. The position and / or angle of the workpiece 01 to be processed may be adjusted before or after the workpiece 01 to be processed is transferred from the process system interconnection device 10 to the second process system 30.

[0083] Step S51, after the second processing is completed, the workpiece 01 to be processed is transferred to the process system interconnection device 10. Optionally, step S51 also includes: adjusting the atmosphere conditions of the process system interconnection device 10 to facilitate taking out the workpiece 01 to be processed.

[0084] Optionally, the carrier transport layer preparation method further comprises step S61: taking out the workpiece 01 from the process system interconnection device 10. The workpiece 01 is taken out from the process system interconnection device 10 by the loading and unloading system 60 so as to be transported to a subsequent process for processing.

[0085] In a possible embodiment of the present application, the above-mentioned carrier transport layer preparation system and preparation method are used to prepare a composite electron transport layer of a perovskite battery. The composite electron transport layer of the perovskite battery includes at least two electron transport layers; the above-mentioned two or more process systems include a first process system 20 and a second process system 30; the first process system 20 and the second process system 30 are used to prepare at least one electron transport layer on the workpiece 01 to be processed. That is, the first process system 20 is used to prepare a first electron transport layer on the workpiece 01 to be processed, and the second process system 30 is used to prepare a second electron transport layer on the workpiece 01 to be processed; or, the first process system 20 or the second process system 30 is used to prepare at least one electron transport layer on the workpiece 01 to be processed, and the remaining process systems are used to perform other processes such as etching and thinning.

[0086] In a possible embodiment of the present application, the following steps are further included before step S31:

[0087] S01, obtaining processing technology design information of the workpiece 01 to be processed; the processing technology design information includes the number of process systems, the processing sequence of each process system, the processing time and process parameters, etc.;

[0088] S02, determining the transfer order of the workpiece 01 to be processed between the two or more process systems according to the processing technology design information. Determining the transfer order means determining which of the two or more process systems the first processing technology system is, which of the two or more process systems the second processing technology is, and so on. The processing technology design information of the workpiece 01 to be processed is obtained through the transmission control device 14.

[0089] In the prior art, the preparation order of the composite electron transport layer of the perovskite battery is fixed and cannot be adjusted dynamically and automatically, which is not conducive to the optimization and adjustment of the materials and preparation order of the film layers such as the composite electron transport layer, thereby affecting the improvement of the conversion efficiency, stability and other performance of devices such as perovskite batteries. The embodiment of the present application obtains the processing technology design information of the workpiece 01 to be processed, and then determines the transfer order of the workpiece 01 to be processed between the above-mentioned two or more process systems based on the information, thereby realizing the dynamic and free adjustment of the processing technology of the composite electron transport layer. By changing the transmission order of the workpiece 01 to be processed between the process systems, the order in which the workpiece 01 to be processed enters two or more process systems, such as the first process system 20 and the process system 30, is changed, thereby changing the preparation order of the first electron transport layer and the second electron transport layer in the composite electron transport layer, realizing the optimization and adjustment of the materials and preparation order of each film layer in the composite electron transport layer, thereby improving the conversion efficiency, stability and other performance of devices such as perovskite batteries.

[0090] It is understandable that the technical field to which the carrier transport layer preparation system and preparation method of the embodiment of the present application is applicable is not limited to the preparation of perovskite cells, but can also be applied to the preparation of devices that also contain carrier transport layers, such as organic light-emitting devices OLED, organic solar cells OPV and other devices, which can greatly reduce the defects of the prepared devices and improve their performance. The carrier transport layer is not limited to the composite electron transport layer, but can also be applied to adjust the functional film layers such as the hole transport layer and the light absorption layer.

[0091] For the relevant contents of each component / unit in this embodiment, reference may be made to the relevant contents of the unit with the same figure mark in any of the aforementioned embodiments, and no further details will be given here.

[0092] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned steps does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0093] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0094] The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, each functional unit in each embodiment of the present application may be integrated into a processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0095] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0096] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A process system interconnection device, characterized in that: include: chambers, atmosphere conditioning devices, and transfer devices; The chamber is used to be sealed and connected with two or more process systems to form a closed environment isolated from the outside atmosphere; the two or more process systems are used to process the workpiece under predetermined process conditions; The chamber is used to be sealed and connected to the first process system through a first gate valve, and to be sealed and connected to the second process system through a second gate valve; The atmosphere adjustment device is used to adjust the atmosphere conditions in the chamber to protect the workpiece to be processed; The transmission device is used to transfer the workpiece to be processed between the two or more process systems in the closed environment.

2. The process system interconnection device according to claim 1, characterized in that: It also includes a transmission control device connected to the transmission device, which is used to control the order of transferring the workpiece to be processed between the more than two process systems according to the processing technology design information of the workpiece to be processed.

3. The process system interconnection device according to claim 1 or 2, characterized in that: The atmosphere regulating device comprises at least one of a gas pressure regulating device, a gas flow regulating device, an atmosphere type selecting device and a temperature regulating device.

4. The process system interconnection device according to claim 3, characterized in that: The gas pressure regulating device comprises a vacuum pump.

5. The process system interconnection device according to claim 3, characterized in that: The temperature regulating device is also used to regulate the temperature of the workpiece to be processed.

6. The process system interconnection device according to claim 2, characterized in that: The transmission control device is also used to control the opening and closing of the first gate valve and the second gate valve.

7. The process system interconnection device according to claim 1 or 2, characterized in that: The transmission device is also used to control the position and / or angle of the workpiece to be processed.

8. A carrier transport layer preparation system, characterized in that: include: The process system interconnection device according to any one of claims 1 to 6, two or more process systems, two or more gate valves and a loading and unloading system; The two or more process systems are used to prepare at least one carrier transport layer on the workpiece to be processed; The process system interconnection device is sealed and connected to the two or more process systems through the two or more gate valves respectively; the process system interconnection device is used to transfer the workpiece to be processed between the two or more process systems in the closed environment; The two or more gate valves are used to open and close during the transfer of the workpiece to be processed; The loading and unloading system is used to transport the workpiece to be processed to the process system interconnection device.

9. The carrier transport layer preparation system according to claim 8, characterized in that: The carrier transport layer preparation system is used to prepare a composite electron transport layer for a perovskite battery; the composite electron transport layer for a perovskite battery includes at least two electron transport layers; the more than two process systems include a first process system and a second process system; the first process system and the second process system are used to prepare at least one electron transport layer on the workpiece to be processed.

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