Impurity removing mechanism and material conveying device
By designing a purification mechanism that uses magnetic grids and connecting rods to adsorb metallic impurities, the molding problem caused by impurities in agricultural mulch film raw materials was solved, thus improving the quality of the film.
Patent Information
- Application Number
- CN202420359707.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-26
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-02-26
AI Technical Summary
Metallic impurities in agricultural mulch film raw materials can cause problems such as non-melting point during molding, pores, unstable film bubbles, and air leakage, affecting the quality of the finished film.
Design a purification mechanism including a first magnetic grid, a second magnetic grid, and a magnetic connecting rod. It uses magnetic force to adsorb metal impurities in raw materials. The first and second magnetic grids are arranged at intervals along a first direction to form multiple rectangular grids. The magnetic connecting rod connects the two grids to achieve layer-by-layer adsorption of metal impurities.
It improves the yield of thin films, effectively removes metal impurities, and ensures the quality of finished thin films.
Smart Images
Figure CN222325405U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of raw material transportation, and in particular to a cleaning mechanism and a material conveying device. Background Art
[0002] With the development of China's agricultural economy, agricultural mulch films are widely used and the market demand is rising. The conventional thickness of agricultural mulch films is 0.01mm. The blown film molding of mulch films has high requirements for raw materials. The metal impurities in the raw materials make it easy for the mulch films to have problems such as infusibility, holes, unstable bubbles, and air leakage, which seriously affect the quality of the finished film. Utility Model Content
[0003] In response to the above technical problems, the present application provides an impurity removal mechanism, which aims to eliminate metal impurities in raw materials.
[0004] According to the first embodiment of the present application, the impurity removal mechanism provided is detachably installed on the hopper, and includes a first magnetic grid, a second magnetic grid and a magnetic connecting rod. The second magnetic grid and the first magnetic grid are spaced apart along a first direction, and the first direction is perpendicular to the plane where the first magnetic grid and the plane where the second magnetic grid are located. The first magnetic grid and the second magnetic grid are both provided with a plurality of rectangular grids arranged in an array; the magnetic connecting rod connects the first magnetic grid and the second magnetic grid.
[0005] In some embodiments, an orthographic projection area of an outer contour of the first magnetic grid in the first direction is greater than an orthographic projection area of an outer contour of the second magnetic grid in the first direction.
[0006] In some embodiments, a plurality of second magnetic grids are spaced apart along the first direction, the second magnetic grids are all located on the same side of the first magnetic grids, and adjacent second magnetic grids are connected by magnetic connecting rods.
[0007] In some embodiments, the orthographic projection area of the outer contour of the plurality of second magnetic grids in the first direction gradually decreases along a direction away from the first magnetic grid.
[0008] In some embodiments, the first magnetic grid includes first magnetic rods extending along the second direction and second magnetic rods extending along the third direction, a plurality of first magnetic rods are arranged at intervals along the third direction, a plurality of second magnetic rods are arranged at intervals along the second direction, and the first direction, the second direction and the third direction are arranged to intersect in pairs.
[0009] In some embodiments, the diameters of the first magnetic rod, the second magnetic rod, and the magnetic connecting rod are all 0.8 cm.
[0010] In some embodiments, the hopper is provided with an inlet and an outlet spaced apart along the first direction, and when the impurity removal mechanism is installed on the hopper, the distance between the second magnetic grid and the outlet is greater than or equal to 10 cm.
[0011] In some embodiments, the magnetic link extends along a first direction.
[0012] In some embodiments, the length and width of the rectangular grid are both greater than or equal to 2 cm.
[0013] The feeding device provided according to the second embodiment of the present application includes a hopper and any of the above impurity removal mechanisms.
[0014] The impurity removal mechanism provided in the embodiment of the present application is detachably mounted on the hopper, and the impurity removal mechanism includes a first magnetic grid, a second magnetic grid and a magnetic connecting rod, the second magnetic grid and the first magnetic grid are arranged at intervals along the first direction, the first direction is perpendicular to the plane where the first magnetic grid is located and the plane where the second magnetic grid is located, and the first magnetic grid and the second magnetic grid are provided with a plurality of rectangular grids arranged in an array; the magnetic connecting rod connects the first magnetic grid and the second magnetic grid. The present application uses the magnetic force of the first magnetic grid, the second magnetic grid and the magnetic connecting rod to absorb metal impurities in the raw material, thereby improving the yield of the film. The first magnetic grid and the second magnetic grid are arranged at intervals along the first direction, and the first magnetic grid and the second magnetic grid are provided with a plurality of rectangular grids arranged in an array, so that the first magnetic grid and the second magnetic grid can absorb metal impurities layer by layer when the raw material is transported longitudinally, further improving the adsorption effect of metal impurities. The first magnetic grid and the second magnetic grid are connected by a magnetic connecting rod, and a plurality of grids can be formed between the magnetic connecting rod and the first magnetic grid and the second magnetic grid, so as to further improve the adsorption effect on metal impurities. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.
[0016] Figure 1 A schematic diagram of the structure of the impurity removal mechanism provided in the embodiment of the present application after the magnetic connecting rod is hidden;
[0017] Figure 2 A cross-sectional view of the impurity removal mechanism and hopper provided in an embodiment of the present application;
[0018] Figure 3A schematic diagram of the structure of the first magnetic grid provided in an embodiment of the present application.
[0019] Description of reference numerals:
[0020] 10. impurity removal mechanism; 20. hopper; 21. hopper wall; 22. inlet; 23. outlet;
[0021] 100, first magnetic grid; 110, first magnetic rod; 120, second magnetic rod;
[0022] 200, second magnetic grid;
[0023] 300, magnetic connecting rod;
[0024] x, first direction; y, second direction; z, third direction.
[0025] The realization of the purpose, functional features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. The above-mentioned drawings have shown clear embodiments of this application, which will be described in more detail later. These drawings and textual descriptions are not intended to limit the scope of the concept of this application in any way, but to illustrate the concept of this application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION
[0026] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.
[0027] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.
[0028] It should be understood that, although the terms first, second, third, etc. may be used to describe various information in this article, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this article, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein can be interpreted as "at the time of..." or "when..." or "in response to determination". Furthermore, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising", "including" indicate that there are described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations are inherently mutually exclusive in some way. When describing the structure of a component, when a layer or a region is referred to as being "above" or "over" another layer or another region, it may mean being directly above the other layer or another region, or containing other layers or regions between it and the other layer or another region. Moreover, if the component is turned over, the layer or region will be "below" or "below" the other layer or another region. In the embodiments of the present application, "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B only based on A, but B can also be determined based on A and / or other information.
[0029] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0030] In the subsequent description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present application, and have no specific meanings. Therefore, "module", "component" or "unit" can be used in a mixed manner.
[0031] In the relevant technology, the conventional thickness of agricultural mulch film is 0.01mm. The blown film molding of mulch film has high requirements on raw materials. The metal impurities in the raw materials make it easy for the mulch film to have problems such as inmelting point, holes, unstable film bubbles, and air leakage during molding, which seriously affects the quality of the finished film.
[0032] In view of this, in order to better understand the present application, the impurity removal mechanism of the embodiment of the present application is described in detail below in conjunction with the accompanying drawings. In the accompanying drawings, for the convenience of drawing, the dimensions in the drawings are not necessarily proportional to the actual dimensions. For the clarity of the drawing, some structures in the drawings may be hidden or partially displayed.
[0033] Please refer to Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of the impurity removal mechanism provided in the embodiment of the present application after the magnetic connecting rod is hidden; Figure 2 A cross-sectional view of the impurity removal mechanism and hopper provided in an embodiment of the present application.
[0034] like Figure 1 and Figure 2 As shown, the embodiment of the present application provides a cleaning mechanism 10, which is detachably mounted on the hopper 20. The cleaning mechanism 10 includes a first magnetic grid 100, a second magnetic grid 200 and a magnetic connecting rod 300. The second magnetic grid 200 and the first magnetic grid 100 are arranged at intervals along a first direction (the x direction in the figure), and the first direction x is perpendicular to the plane where the first magnetic grid 100 and the plane where the second magnetic grid 200 are located. A plurality of rectangular grids arranged in an array are provided on the first magnetic grid 100 and the second magnetic grid 200; the magnetic connecting rod 300 connects the first magnetic grid 100 and the second magnetic grid 200.
[0035] Optionally, the hopper 20 includes a hopper wall 21, and the hopper 20 is provided with an inlet 22 and an outlet 23 arranged at intervals along the first direction x. The raw material flows into the hopper 20 from the inlet 22, and then flows out of the hopper 20 from the outlet 23. The hopper 20 is funnel-shaped, and the cross-sectional area of the hopper 20 in the first direction x gradually decreases from the inlet 22 to the outlet 23. When the impurity removal mechanism 10 is installed on the hopper 20, at least part of the impurity removal mechanism 10 is located in the hopper 20, and the raw material will rub against the impurity removal mechanism 10 when flowing through the hopper 20, and the metal impurities in the raw material will be adsorbed by the impurity removal mechanism 10, thereby reducing the metal impurities flowing out of the outlet 23.
[0036] Optionally, the material of the impurity removing mechanism 10 includes permanent magnets.
[0037] Optionally, the length and width of the rectangular grids on the first magnetic grid 100 and the second magnetic grid 200 are both greater than or equal to 2 cm, and the diameter of the plastic particles in the raw material is 2-3 mm. By limiting the side length of the rectangular grid to be greater than or equal to 2 cm, it will not cause the raw material to get stuck, and the raw material can be fully contacted with the magnetic grid, thereby improving the adsorption effect of metal impurities.
[0038] The impurity removal mechanism 10 provided in the embodiment of the present application, through the magnetic force of the first magnetic grid 100, the second magnetic grid 200 and the magnetic connecting rod 300, absorbs the metal impurities in the raw material, thereby improving the yield of the film. The first magnetic grid 100 and the second magnetic grid 200 are arranged at intervals along the first direction x, and the first magnetic grid 100 and the second magnetic grid 200 are provided with a plurality of rectangular grids arranged in an array, so that the first magnetic grid 100 and the second magnetic grid 200 can absorb metal impurities layer by layer when the raw material is transported longitudinally, further improving the adsorption effect on metal impurities. The first magnetic grid 100 and the second magnetic grid 200 are connected by the magnetic connecting rod 300, and a grid parallel to the first direction x can also be formed between the adjacent magnetic connecting rods 300, the first magnetic grid 100 and the second magnetic grid 200, further improving the adsorption effect on metal impurities.
[0039] In some optional embodiments, the orthographic projection area of the outer contour of the first magnetic grid 100 in the first direction x is greater than the orthographic projection area of the second magnetic grid 200 in the first direction x.
[0040] Optionally, in order to make the first magnetic grid 100 and the second magnetic grid 200 fully fill the hopper 20 and prevent metal impurities from leaking through the gap between the impurity removal mechanism 10 and the hopper wall 21, the outer contour of the first magnetic grid 100 and the outer contour of the second magnetic grid 200 are matched with the cross-sectional shape of the hopper 20 in the first direction x. For example, when the cross-sectional shape of the hopper 20 in the first direction x is rectangular, the outer contour of the first magnetic grid 100 and the outer contour of the second magnetic grid 200 are also rectangular, and when the cross-sectional shape of the hopper 20 in the first direction x is circular, the outer contour of the first magnetic grid 100 and the outer contour of the second magnetic grid 200 are also circular. When the impurity removal mechanism 10 is installed on the hopper 20, the distance between the second magnetic grid 200 and the discharge port 23 is less than the distance between the first magnetic grid 100 and the discharge port 23. Among them, the second magnetic grid 200 is against the hopper wall 21 but not fixedly connected.
[0041] The impurity removal mechanism 10 provided in the embodiment of the present application makes the orthographic projection area of the outer contour of the first magnetic grid 100 in the first direction x larger than the orthographic projection area of the second magnetic grid 200 in the first direction x. This allows the first magnetic grid 100 and the second magnetic grid 200 to fully fill the hopper 20 while allowing the impurity removal mechanism 10 to adapt to the shape of the hopper 20 to avoid interference between the second magnetic grid 200 and the hopper wall 21.
[0042] In some optional embodiments, a plurality of second magnetic grids 200 are spaced apart along the first direction x, the second magnetic grids 200 are all located on the same side of the first magnetic grid 100 , and adjacent second magnetic grids 200 are connected by magnetic connecting rods 300 .
[0043] Optionally, the outer contour of the plurality of second magnetic grids 200 is gradually reduced in the direction away from the first magnetic grid 100. The orthographic projection area of the second magnetic grid 200 in the first direction x is gradually reduced. This allows the first magnetic grid 100 and the second magnetic grid 200 to fully fill the hopper 20, while allowing the impurity removal mechanism 10 to adapt to the shape of the hopper 20, thereby avoiding interference between the second magnetic grid 200 and the hopper wall 21.
[0044] Optionally, the impurity removal mechanism 10 includes two second magnetic grids 200, that is, the impurity removal mechanism 10 has a total of three layers of magnetic grids arranged at intervals, the spacing between the two second magnetic grids 200 in the first direction x is 7.5 cm, and the spacing between the first magnetic grid 100 and the second magnetic grid 200 closest to it in the first direction x is also 7.5 cm. Without considering the thickness of the first magnetic grid 100 and the second magnetic grid 200, the total height of the impurity removal mechanism 10 in the first direction x is 15 cm.
[0045] Optionally, the magnetic connecting rod 300 extends along the first direction x, and the same magnetic connecting rod 300 can connect the first magnetic grid 100 and all the second magnetic grids 200. In order to improve the connection stability, adjacent magnetic grids can be connected by multiple magnetic connecting rods 300.
[0046] The impurity removal mechanism 10 provided in the embodiment of the present application further improves the adsorption effect on metal impurities by providing a plurality of second magnetic grids 200 .
[0047] Please refer to Figures 1 to 3 , Figure 3 A schematic diagram of the structure of the first magnetic grid provided in an embodiment of the present application.
[0048] like Figures 1 to 3 As shown, in some optional embodiments, the first magnetic grid 100 includes first magnetic rods 110 extending along the second direction (y direction in the figure) and second magnetic rods 120 extending along the third direction (z direction in the figure), a plurality of first magnetic rods 110 are arranged at intervals along the third direction z, and a plurality of second magnetic rods 120 are arranged at intervals along the second direction y. The first direction x, the second direction y and the third direction z are arranged to intersect each other.
[0049] Optionally, the first direction x is the up-down direction, the second direction y is the left-right direction, and the third direction z is the front-back direction. When the raw material is in the hopper 20 , it moves from the feed port 22 to the discharge port 23 under the action of gravity.
[0050] Optionally, the first magnetic rod 110 and the second magnetic rod 120 are connected by welding, bolts, cable ties, etc., and the magnetic connecting rod 300 is also connected to the first magnetic rod 110 and / or the second magnetic rod 120 by welding, bolts, cable ties, etc. Among them, the magnetic connecting rod 300 can be connected to the intersection of the first magnetic rod 110 and the second magnetic rod 120, that is, the first magnetic rod 110, the second magnetic rod 120 and the magnetic connecting rod 300 are fixed by welding, cable ties, etc.; the magnetic connecting rod 300 can also be connected only to the first magnetic rod 110 or the second magnetic rod 120, that is, the magnetic connecting rod 300 is connected to the non-intersecting position of the first magnetic rod 110 and the second magnetic rod 120.
[0051] Optionally, the first magnetic rod 110 and the second magnetic rod 120 are connected by their own magnetic adsorption, and the magnetic connecting rod 300 is also connected to the first magnetic rod 110 and / or the second magnetic rod 120 by their own magnetic adsorption. Among them, when the first magnetic rod 110 and the second magnetic rod 120 are connected, at least one of the magnetic rods is provided with a limiting groove for accommodating another magnetic rod, so that the first magnetic rod 110 and the second magnetic rod 120 are structurally stable after being adsorbed to each other, and are not easily disintegrated by external forces. The connection between the magnetic connecting rod 300 and the first magnetic rod 110 and the second magnetic rod 120 is similar. The magnetic connecting rod 300 can be connected to the intersection of the first magnetic rod 110 and the second magnetic rod 120, or it can be connected only to the first magnetic rod 110 or the second magnetic rod 120.
[0052] Optionally, the second magnetic grid 200 is also composed of a plurality of magnetic rods extending in the second direction y and the third direction z, respectively. The structure can refer to the first magnetic grid 100 and will not be described in detail here. Since the rectangular grids on the first magnetic grid 100 and the second magnetic grid 200 are the same in size, but the outer contour projection areas of the first magnetic grid 100 and the second magnetic grid 200 are not equal, the number of magnetic rods on the first magnetic grid 100 and the second magnetic grid 200 are different. For example, the first magnetic grid 100 includes 6 first magnetic rods and 6 second magnetic rods 120, the second magnetic grid 200 closest to the first magnetic grid 100 includes 4 magnetic rods extending in the second direction y and 4 magnetic rods extending in the third direction z, and the second magnetic grid 200 far away from the first magnetic grid 100 includes 2 magnetic rods extending in the second direction y and 2 magnetic rods extending in the third direction z.
[0053] Optionally, the cross-sectional shapes of the first magnetic rod 110, the second magnetic rod 120 and the magnetic connecting rod 300 are all circular, and the diameters of the first magnetic rod 110, the second magnetic rod 120 and the magnetic connecting rod 300 are all 0.8 cm. By making the cross-sectional shapes of the first magnetic rod 110, the second magnetic rod 120 and the magnetic connecting rod 300 all circular, the friction between the impurity removal mechanism 10 and the raw material is reduced, thereby reducing the probability of material jamming.
[0054] Optionally, when the impurity removal mechanism 10 is installed on the hopper 20, at least part of the first magnetic rod 110 and / or the second magnetic rod 120 is located on the side of the hopper wall 21 away from the discharge port 23 and overlaps with the surface of the hopper wall 21 away from the discharge port 23. That is, when the impurity removal mechanism 10 is installed on the hopper 20, the first magnetic grid 100 is erected on the hopper 20, and due to the support of the hopper wall 21, the impurity removal mechanism 10 can be stably connected to the hopper 20. When cleaning the impurity removal mechanism 10, the operator can also lift the impurity removal mechanism 10 along the first direction x to separate the impurity removal mechanism 10 from the hopper 20.
[0055] In some optional embodiments, when the impurity removal mechanism 10 is installed on the hopper 20, the distance between the second magnetic grid 200 and the discharge port 23 is greater than or equal to 10 cm.
[0056] The impurity removal mechanism 10 provided in the embodiment of the present application has a certain distance between the second magnetic grid 200 and the discharge port 23 by making the distance between the second magnetic grid 200 and the discharge port 23 greater than or equal to 10 cm. When the operator lifts up and cleans the impurity removal mechanism 10, there is still some raw material in the lower part of the hopper 20 that has not flowed out of the discharge port 23. Until the impurity removal mechanism 10 is cleaned and reset, the raw material continues to be poured into the feed port 22, and the flow of raw material from the discharge port 23 is uninterrupted.
[0057] The embodiment of the second aspect of the present application provides a feeding device, including a hopper 20 and a dust removal mechanism 10 as described in any of the above embodiments. Since the feeding device provided by the embodiment of the second aspect of the present application includes the dust removal mechanism 10 of any of the above embodiments of the first aspect, the feeding device provided by the embodiment of the second aspect of the present application has the beneficial effects of the dust removal mechanism 10 of any of the above embodiments of the first aspect, which will not be described in detail here.
[0058] Optionally, the feeding device further includes a feeding pipe (not shown) connected to the hopper 20 . The feeding pipe may be connected to the feed inlet 22 or the feed outlet 23 . The feeding pipe is used to feed the raw materials into the hopper 20 or to discharge the raw materials out of the hopper 20 .
[0059] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A debris removal mechanism, detachably mounted on a hopper, characterized in that: include: The first magnetic grid; A second magnetic grid is spaced apart from the first magnetic grid along a first direction, the first direction is perpendicular to a plane where the first magnetic grid and a plane where the second magnetic grid are located, and a plurality of rectangular grids arranged in an array are provided on the first magnetic grid and the second magnetic grid; A magnetic connecting rod connects the first magnetic grid and the second magnetic grid.
2. The impurity removal mechanism according to claim 1, characterized in that: An orthographic projection area of an outer contour of the first magnetic grid in the first direction is greater than an orthographic projection area of an outer contour of the second magnetic grid in the first direction.
3. The impurity removal mechanism according to claim 2, characterized in that: A plurality of the second magnetic grids are arranged at intervals along the first direction, the second magnetic grids are all located on the same side of the first magnetic grid, and adjacent second magnetic grids are connected by the magnetic connecting rod.
4. The impurity removal mechanism according to claim 3, characterized in that: The orthographic projection area of the outer contour of the plurality of second magnetic grids in the first direction gradually decreases along the direction away from the first magnetic grid.
5. The impurity removal mechanism according to claim 1, characterized in that: The first magnetic grid includes first magnetic rods extending along the second direction and second magnetic rods extending along the third direction, a plurality of the first magnetic rods are arranged at intervals along the third direction, a plurality of the second magnetic rods are arranged at intervals along the second direction, and the first direction, the second direction and the third direction are arranged to intersect in pairs.
6. The impurity removal mechanism according to claim 5, characterized in that: The diameters of the first magnetic rod, the second magnetic rod and the magnetic connecting rod are all 0.8 cm.
7. The impurity removal mechanism according to claim 1, wherein the hopper is provided with an inlet and an outlet spaced apart along the first direction, characterized in that: When the impurity removal mechanism is installed on the hopper, the distance between the second magnetic grid and the discharge port is greater than or equal to 10 cm.
8. The impurity removal mechanism according to claim 1, characterized in that: The magnetic connecting rod extends along the first direction.
9. The impurity removal mechanism according to claim 1, characterized in that: The length and width of the rectangular grid are both greater than or equal to 2 cm.
10. A feeding device, characterized in that: The utility model comprises a hopper and a debris removal mechanism as described in any one of claims 1 to 9.