Dispensing device based on semiconductor lighting device processing

Abstract

The utility model relates to the technical field of semiconductor lighting, in particular to a dispensing device based on semiconductor lighting device processing. In order to solve the problems that most of glue outlet heads of existing glue dispensing devices are fixedly installed and are inconvenient to replace, and due to the fact that the aperture of the glue outlet head is fixedly arranged, the glue amount of different glue dispensing parts is difficult to control in the glue outlet process, the following technical scheme is provided: the glue dispensing device comprises a workbench and a transmission device, a storage box used for storing glue is installed on the top wall body of the workbench, a glue pumping pump convenient for pumping the glue out of the storage box is installed at the top of the storage box, and the outlet end of the glue pumping pump is connected with a telescopic hose playing a role in guiding the glue. According to the glue heating device, the aim of controlling the glue outlet amount is achieved while the glue is heated to improve the flowability, and resource waste is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor lighting, in particular to a glue dispensing device based on semiconductor lighting device processing. Background Art

[0002] Semiconductor lighting devices are devices that use semiconductor materials to emit light, mainly including light-emitting diodes (LEDs) and organic light-emitting diodes (OLEDs). They are widely used in the field of lighting, gradually replacing traditional incandescent lamps and fluorescent lamps, and becoming the mainstream products in the lighting industry. Semiconductor chips are important components of semiconductor devices. During the production process, they need to be glued on the surface. Through glue dispensing, a sealed coating is formed on the surface of the semiconductor chip to prevent external environmental factors such as air, water vapor, and dust from invading the chip and reducing the chip's reliability and performance.

[0003] However, the glue heads of existing glue dispensing devices are mostly fixed and inconvenient to replace. In addition, since the aperture of the glue dispensing head is fixed, it is difficult to control the amount of glue at different glue dispensing locations during the glue dispensing process. In view of this, we propose a glue dispensing device based on semiconductor lighting device processing. Utility Model Content

[0004] The purpose of the utility model is to address the problems existing in the background technology and to propose a glue dispensing device based on semiconductor lighting device processing.

[0005] The technical solution of the utility model: a glue dispensing device based on the processing of semiconductor lighting devices, including a workbench and a transmission device, a storage box for storing glue is installed on the top wall of the workbench, a glue pump for extracting glue from the storage box is installed on the top of the storage box, the outlet end of the glue pump is connected to a telescopic hose that guides the glue, the outlet end of the telescopic hose is connected to a glue dispensing component that is convenient for dispensing glue on semiconductor chips, an auxiliary frame is installed on the top wall of the workbench, a limiting slide is installed on the auxiliary frame, a first cylinder is installed on the top wall of the limiting slide, the output end of the first cylinder is connected to a driving component, and a second cylinder is installed on the top wall of the auxiliary frame.

[0006] Preferably, the glue discharging assembly comprises a heating cylinder, a top seat is installed on the top of the heating cylinder, and the top wall of the top seat is connected to the output end of the first cylinder.

[0007] Preferably, a bearing seat is installed on the bottom wall of the heating cylinder, the rotating end of the bearing seat is connected to a first rotating shaft, a first gear is sleeved on the outer ring surface of the first rotating shaft, and a sealing ring is installed on the top wall of the first gear.

[0008] Preferably, internal thread sealing cylinders are arranged in a ring array on the bottom wall of the first gear, external thread sealing cylinders are installed in multiple internal thread sealing cylinders, and the outlet ends of multiple external thread sealing cylinders are connected to glue outlet heads, and the multiple glue outlet heads have different sizes.

[0009] Preferably, the driving assembly includes a bracket, a motor is mounted on the top wall of the bracket, an output end of the motor is connected to a second rotating shaft, a second gear is sleeved on the outer ring surface of the second rotating shaft, and the second gear is meshed with the first gear.

[0010] Preferably, a positioning opening is provided on the top wall of the bracket, and the heating tube is fixedly installed in the positioning opening.

[0011] Preferably, a limiting sliding groove is provided on the top wall of the auxiliary frame, and the limiting sliding seat is arranged in the limiting sliding groove.

[0012] Compared with the prior art, the utility model has the following beneficial technical effects:

[0013] The utility model injects glue in the storage box into the heating cylinder for use through a glue pump, and discharges it through an external threaded sealing cylinder and a glue outlet head, thereby completing the glue dispensing processing of the semiconductor chip. In addition, under the preheating of the heating cylinder, it is beneficial to heat the glue and improve the fluidity of the glue. Then, the second shaft is driven by a starting motor to drive the second gear to rotate, and the second gear in the rotating state drives (665) to rotate, so that the first shaft adjusts the glue outlet head of a suitable size to the outlet of the heating cylinder, thereby realizing the control of the glue outlet amount, and facilitating the adjustment of the glue outlet amount of different parts according to the processing requirements of the semiconductor chip, thereby avoiding waste of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the front cross-sectional structure of a dispensing device based on semiconductor lighting device processing;

[0015] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of the middle drive assembly as viewed from the right;

[0016] Figure 3 yes Figure 1 Schematic diagram of the front cross-sectional structure of the center glue outlet component.

[0017] Figure numerals: 1. workbench; 2. transmission device; 3. storage box; 4. glue pump; 5. telescopic hose; 6. glue discharging assembly; 61. heating cylinder; 62. top seat; 63. bearing seat; 64. first rotating shaft; 65. first gear; 66. internal thread sealing cylinder; 67. external thread sealing cylinder; 68. glue discharging head; 7. driving assembly; 71. bracket; 72. motor; 73. second rotating shaft; 74. second gear; 8. auxiliary frame; 9. limiting slide; 10. first cylinder; 11. second cylinder. DETAILED DESCRIPTION

[0018] The technical solution of the utility model is further described below in conjunction with the accompanying drawings and specific embodiments.

[0019] Example

[0020] like Figure 1-3 As shown, the glue dispensing device based on semiconductor lighting device processing proposed by the utility model includes a workbench 1 and a transmission device 2. The transmission device 2 is arranged at the opening of the top wall of the workbench 1, which is convenient for conveying semiconductor chips and facilitating the subsequent glue dispensing work; the storage box 3 is fixedly installed on the top wall of the workbench 1, and is used to store glue, so as to provide glue for glue dispensing; the glue pump 4 is fixedly installed on the top wall of the storage box 3, and the inlet end of the glue pump 4 is connected with the inside of the storage box 3, so as to facilitate the extraction of glue in the storage box 3; the inlet end of the telescopic hose 5 is connected with the outlet end of the glue pump 4, so as to facilitate the guidance of the extracted glue; the auxiliary frame 8 is fixedly installed on the workbench 1 is on the top wall of the auxiliary frame 8, the second cylinder 11 is fixedly installed on the top wall of the auxiliary frame 8, the output end of the second cylinder 11 is fixedly connected to the side wall of the limit slide 9, so as to facilitate the lateral adjustment of the position of the limit slide 9, and the limit slide 9 is arranged in the limit slide groove provided on the top wall of the auxiliary frame 8, and the limit slide 9 is assisted to move by the limit slide groove to avoid the position deviation of the limit slide 9 during the movement, which affects the subsequent dispensing; the first cylinder 10 is fixedly installed on the top wall of the limit slide 9, and the limit slide 9 can drive the first cylinder 10 to move, and the limit slide 9 is provided with a first through hole, and the output end of the first cylinder 10 passes through the first through hole and is located below the limit slide 9.

[0021] Furthermore, the outlet end of the telescopic hose 5 is connected with a glue dispensing component 6 for dispensing glue to the semiconductor chip. The glue dispensing component 6 includes a heating cylinder 61. The top of the heating cylinder 61 is fixedly connected to the bottom wall of the top seat 62. The heating cylinder 61 is connected to the mains. The interface valve on the back of the heating cylinder 61 is connected to the outlet end of the telescopic hose 5, which is convenient for transferring the glue. The glue passing through the heating cylinder 61 can be heated by the heating cylinder 61, thereby improving the fluidity of the glue and avoiding the solidification of the glue during the shutdown process, causing blockage and affecting the next dispensing work. The bearing seat 63 is fixedly installed on the bottom wall of the heating cylinder 61. The top end of the first rotating shaft 64 is connected to the rotating end of the bearing seat 63. The first rotating shaft 64 is assisted in rotating by the bearing seat 63. The first gear 65 is fixedly sleeved on the first On the outer ring surface of a rotating shaft 64, a sealing ring is fixedly installed on the top of the first gear 65, and a sealing groove is provided on the bottom wall of the heating tube 61, and the sealing ring is arranged in the sealing groove. The cooperation between the sealing groove and the sealing ring is conducive to preventing glue leakage when the heating tube 61 discharges glue; a plurality of second through holes are provided on the first gear 65, and a plurality of internally threaded sealing cylinders 66 are distributed in a ring array at the bottom of the first gear 65, and the second through holes corresponding to the positions are placed inside the internally threaded sealing cylinder 66; the top ends of the plurality of glue discharge heads 68 are connected to the bottom ends of the plurality of externally threaded sealing cylinders 67, and the plurality of glue discharge heads 68 have different sizes. The plurality of externally threaded sealing cylinders 67 are arranged in the plurality of internally threaded sealing cylinders 66, and the two are connected by threads, which is convenient for the staff to replace the glue discharge heads 68 according to the glue discharge requirements.

[0022] Further, the output end of the first cylinder 10 is connected to a driving assembly 7, which includes a bracket 71. The top wall of the bracket 71 is connected to the output end of the first cylinder 10, so that the height of the bracket 71 can be adjusted by the first cylinder 10; the motor 72 is fixedly mounted on the top wall of the bracket 71, and an auxiliary hole is provided on the top wall of the bracket 71. The output end of the motor 72 is arranged in the auxiliary hole. The top end of the second rotating shaft 73 is arranged in the auxiliary hole and connected to the output end of the motor 72. The second gear 74 is sleeved on the outer ring surface of the second rotating shaft 73. The heating tube 61 is fixedly mounted in the positioning hole provided on the top wall of the bracket 71. The first gear 65 is meshed with the second gear 74. By starting the motor 72 to drive the second rotating shaft 73 to drive the second gear 74 to rotate, the second gear 74 can drive the first gear 65 to rotate, thereby completing the adjustment of the position of the glue head 68, which is conducive to adjusting the glue head 68 with a suitable caliber to the corresponding position at the outlet of the heating tube 61 according to the processing requirements, so as to facilitate the control of the glue output amount and avoid waste of resources.

[0023] The above-mentioned specific embodiments are only several preferred embodiments of the present invention. Based on the technical solution of the present invention and the relevant inspiration of the above-mentioned embodiments, those skilled in the art can make various alternative improvements and combinations to the above-mentioned specific embodiments.

Claims

1. A dispensing device for processing semiconductor lighting devices, comprising a workbench (1) and a transmission device (2), characterized in that: A storage box (3) for storing glue is installed on the top wall of the workbench (1), a glue pump (4) for extracting glue from the storage box (3) is installed on the top of the storage box (3), the outlet end of the glue pump (4) is connected to a telescopic hose (5) for guiding the glue, the outlet end of the telescopic hose (5) is connected to a glue dispensing component (6) for dispensing glue on semiconductor chips, an auxiliary frame (8) is installed on the top wall of the workbench (1), a limit slide (9) is installed on the auxiliary frame (8), a first cylinder (10) is installed on the top wall of the limit slide (9), the output end of the first cylinder (10) is connected to a drive component (7), and a second cylinder (11) is installed on the top wall of the auxiliary frame (8).

2. The glue dispensing device based on semiconductor lighting device processing according to claim 1 is characterized in that: The glue discharging assembly (6) comprises a heating cylinder (61), a top seat (62) is installed on the top of the heating cylinder (61), and the top wall of the top seat (62) is connected to the output end of the first cylinder (10).

3. The glue dispensing device based on semiconductor lighting device processing according to claim 2 is characterized in that: A bearing seat (63) is installed on the bottom wall of the heating cylinder (61), and the rotating end of the bearing seat (63) is connected to a first rotating shaft (64). A first gear (65) is sleeved on the outer ring surface of the first rotating shaft (64), and a sealing ring is installed on the top wall of the first gear (65).

4. The glue dispensing device based on semiconductor lighting device processing according to claim 3 is characterized in that: Internally threaded sealing cylinders (66) are arranged in a ring array on the bottom wall of the first gear (65), and externally threaded sealing cylinders (67) are installed in multiple internally threaded sealing cylinders (66). The outlet ends of the multiple externally threaded sealing cylinders (67) are connected to glue outlet heads (68), and the multiple glue outlet heads (68) have different sizes.

5. The glue dispensing device based on semiconductor lighting device processing according to claim 4 is characterized in that: The driving assembly (7) comprises a bracket (71), a motor (72) is mounted on the top wall of the bracket (71), an output end of the motor (72) is connected to a second rotating shaft (73), a second gear (74) is sleeved on the outer ring surface of the second rotating shaft (73), and the second gear (74) is meshed with the first gear (65).

6. The glue dispensing device based on semiconductor lighting device processing according to claim 5 is characterized in that: A positioning opening is provided on the top wall of the bracket (71), and the heating tube (61) is fixedly installed in the positioning opening.

7. The glue dispensing device based on semiconductor lighting device processing according to claim 1 is characterized in that: A limiting sliding groove is provided on the top wall of the auxiliary frame (8), and the limiting sliding seat (9) is arranged in the limiting sliding groove.

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