Optical receiver, optical receiving module and electronic equipment

Abstract

The utility model discloses an optical receiver, an optical receiving module and an electronic device, comprising a photosensitive chip, a processing chip and a lead frame, the lead frame comprises a support part, a plurality of pin parts, a first shielding part, a second shielding part and at least one of a third shielding part, a fourth shielding part and a fifth shielding part, the photosensitive chip and the processing chip are fixed on the supporting part, the first shielding part, the second shielding part, the third shielding part, the fourth shielding part and the fifth shielding part respectively cover each surface of the photosensitive chip, and the first shielding part is provided with a light hole for transmitting light to the photosensitive chip. The surfaces, facing the photosensitive chip, of the second shielding part, the third shielding part, the fourth shielding part and the fifth shielding part are reflecting surfaces, and the reflecting surfaces are used for reflecting light transmitted by the light transmitting holes to the photosensitive chip, so that the lead frame does not need to be bent for many times to enable the front surface of the photosensitive chip to face the light incidence direction. Therefore, the production cost of the optical receiver can be reduced, and the production efficiency of the optical receiver can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical devices, and in particular to an optical receiver, an optical receiving module and an electronic device. Background Art

[0002] like Figure 1 As shown, Figure 1 The schematic diagram of the cross-sectional structure of a photoreceiver includes a photosensitive chip 10, a processing chip 11 and a lead frame 12. The lead frame 12 is used to support the photosensitive chip 10 and the processing chip 11 and is electrically connected to the processing chip 11. However, in order to make the front side of the photosensitive chip 10, i.e., the photosensitive surface, face the incident direction of light, a specific device is required to bend the lead frame 12 at least three times to form Figure 1 The frame of the shape shown in the figure results in higher production cost and lower production efficiency of the optical receiver. Utility Model Content

[0003] The utility model discloses an optical receiver, an optical receiving module and an electronic device, which can reduce the production cost of the optical receiver and improve the production efficiency of the optical receiver.

[0004] In the first aspect, the utility model discloses a light receiver, comprising a photosensitive chip, a processing chip and a lead frame; the lead frame comprises a supporting part, a first shielding part, a second shielding part and a plurality of pin parts; the photosensitive chip and the processing chip are fixed to the supporting part, the photosensitive chip is electrically connected to the processing chip, and the processing chip is electrically connected to the plurality of pin parts; the first shielding part is connected to the second end of the supporting part, the second end is an opposite end to the first end, and the second shielding part is connected to the first shielding part; the first shielding part covers the first side surface of the photosensitive chip, the first shielding part has a light-transmitting hole, and the light-transmitting hole is used to transmit light to the photosensitive chip; the second shielding part covers the front side of the photosensitive chip, and the surface of the second shielding part facing the photosensitive chip is a reflecting surface, and the reflecting surface is used to reflect the light transmitted by the light-transmitting hole to the photosensitive chip; the front side and the first side surface of the photosensitive chip are both photosensitive surfaces.

[0005] In some optional embodiments, the lead frame also includes at least one of a third shielding part, a fourth shielding part and a fifth shielding part; the third shielding part, the fourth shielding part and the fifth shielding part are all connected to the second shielding part, and the third shielding part, the fourth shielding part and the fifth shielding part respectively cover the second side surface, the third side surface and the fourth side surface of the photosensitive chip; the surfaces of the third shielding part, the fourth shielding part and the fifth shielding part facing the photosensitive chip are all reflective surfaces, and the reflective surfaces of the third shielding part, the fourth shielding part and the fifth shielding part are respectively used to reflect the light transmitted by the light-transmitting hole to the photosensitive chip; the second side surface, the third side surface and the fourth side surface of the photosensitive chip are all photosensitive surfaces.

[0006] In some optional embodiments, the first shielding portion, the second shielding portion, the third shielding portion, the fourth shielding portion and the fifth shielding portion are all optical signal shielding structures and / or electromagnetic signal shielding structures.

[0007] In some optional embodiments, at least one of the second shielding portion, the third shielding portion, the fourth shielding portion, and the fifth shielding portion is a grid-like structure or a non-grid-like structure.

[0008] In some optional embodiments, the first shielding part is connected to the supporting part through a first connecting part, the second shielding part is connected to the first shielding part through a second connecting part, and the third shielding part, the fourth shielding part and the fifth shielding part are connected to the second shielding part through a third connecting part, a fourth connecting part and a fifth connecting part respectively; the supporting part, the first shielding part, the second shielding part, the third shielding part, the fourth shielding part and the fifth shielding part are all flat-plate structures, and the first connecting part, the second connecting part, the third connecting part, the fourth connecting part and the fifth connecting part are all strip structures, and the thickness of the strip structure is less than the thickness of the flat-plate structure.

[0009] In some optional embodiments, the optical receiver further includes a packaging body; the photosensitive chip, the processing chip and the lead frame are packaged inside the packaging body, and the plurality of pin portions partially extend to the outside of the packaging body.

[0010] In some optional embodiments, the encapsulation colloid includes a lens portion, and the lens portion covers the first shielding portion; the lens portion is used to converge the light and make the converged light incident on the light-transmitting hole of the first shielding portion.

[0011] In some optional embodiments, the packaging body includes at least two positioning parts, and the at least two positioning parts are respectively arranged on two opposite sides of the packaging body, and the at least two positioning parts are used to locate the fixed position of the optical receiver and the PCB board.

[0012] In a second aspect, the utility model discloses an optical receiving module, comprising a PCB board and an optical receiver as described in any one of the above items, wherein a pin of the optical receiver is electrically connected to the PCB board.

[0013] In a third aspect, the utility model discloses an electronic device, comprising the light receiving module as described above.

[0014] The optical receiver, optical receiving module and electronic device disclosed in the utility model can allow light to at least be incident on the first side and front side of the photosensitive chip through a first shielding part having a light-transmitting hole and a second shielding part having a reflective surface. Because the first side and front side of the photosensitive chip are both photosensitive surfaces, it is no longer necessary to bend the lead frame multiple times to make the front side of the photosensitive chip face the incident direction of light, thereby simplifying the manufacturing process of the lead frame, thereby reducing the production cost of the optical receiver and improving the production efficiency of the optical receiver. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background technology, the drawings required for use in the embodiments of the present invention or the background technology will be described below.

[0016] Figure 1 A schematic diagram of the cross-sectional structure of an optical receiver.

[0017] Figure 2 The present invention is a schematic diagram of the structure of an optical receiver disclosed in an embodiment of the present utility model.

[0018] Figure 3 for Figure 2 The expanded structural schematic diagram of the optical receiver is shown.

[0019] Figure 4 for Figure 2 An optical path diagram of an optical receiver is shown.

[0020] Figure 5 This is a schematic diagram of the structure of another optical receiver disclosed in an embodiment of the utility model.

[0021] Figure 6 for Figure 5 The expanded structural schematic diagram of the optical receiver is shown.

[0022] Figure 7 for Figure 5 A partially expanded structural schematic diagram of an optical receiver is shown.

[0023] Figure 8 for Figure 5 An optical path diagram of an optical receiver is shown.

[0024] Fig. 9 This is a schematic diagram of the structure of another optical receiver disclosed in an embodiment of the utility model.

[0025] Fig.10 This is a schematic diagram of the structure of another optical receiver disclosed in an embodiment of the utility model.

[0026] Fig.11 It is a schematic diagram of the three-dimensional structure of another optical receiver disclosed in an embodiment of the utility model.

[0027] Fig.12 The present invention is a schematic structural diagram of an optical receiver and a PCB board disclosed in an embodiment of the present utility model. DETAILED DESCRIPTION

[0028] The technical scheme in the embodiment of the utility model will be described below in conjunction with the drawings in the embodiment of the utility model. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] As an optional implementation of the disclosure of the present utility model, the present utility model embodiment discloses an optical receiver, such as Figure 2 and Figure 3 As shown, Figure 2 This is a schematic diagram of the structure of an optical receiver disclosed in an embodiment of the utility model. Figure 3 for Figure 2 The schematic diagram of the expanded structure of the optical receiver shown in the figure includes a photosensitive chip 10, a processing chip 11 and a lead frame 12.

[0030] The lead frame 12 includes a support portion 120, a first shielding portion 121, a second shielding portion 122 and a plurality of pin portions 123. The photosensitive chip 10 and the processing chip 11 are fixed to the support portion 120, the photosensitive chip 10 is electrically connected to the processing chip 11, and the processing chip 11 is electrically connected to the plurality of pin portions 123.

[0031] The photosensitive chip 10 is used to sense the light signal and convert the light signal into an electrical signal. The processing chip 11 is used to amplify the electrical signal output by the photosensitive chip 10, and output the processed electrical signal to the PCB board through a plurality of pins 123, and transmit the electrical signal to the main controller of the electronic device where the light receiver is located through the PCB board, so that the main controller can perform corresponding control operations such as turning on and off the screen based on the electrical signal.

[0032] The first shielding part 121 is connected to the second end of the supporting part 120, the second end is opposite to the first end, and the second shielding part 122 is connected to the first shielding part 121. The first shielding part 121 covers the first side surface of the photosensitive chip 10, and the first shielding part 121 has a light-transmitting hole 1210, which is used to transmit light to the photosensitive chip 10.

[0033] The second shielding part 122 covers the front of the photosensitive chip 10, and the surface of the second shielding part 122 facing the photosensitive chip 10 is a reflective surface, which is used to reflect the light transmitted by the light-transmitting hole 1210 to the photosensitive chip 10. The front and first side surfaces of the photosensitive chip 10 are both photosensitive surfaces.

[0034] like Figure 4 As shown, Figure 4 for Figure 2 An optical path diagram of the optical receiver shown in the figure shows that after the light signal is incident from the light-transmitting hole 1210, part of it is incident on the first side surface S1 of the photosensitive chip 10, and part of it is incident on the reflecting surface of the second shielding part 122, which reflects the light incident thereon to the front side D of the photosensitive chip 10.

[0035] In the embodiment of the utility model, through the first shielding part 121 having a light-transmitting hole 1210 and the second shielding part 122 having a reflective surface, light can be incident on at least the first side surface S1 and the front surface D of the photosensitive chip 10. Because the first side surface S1 and the front surface D of the photosensitive chip 10 are both photosensitive surfaces, it is no longer necessary to bend the lead frame multiple times to make the front surface of the photosensitive chip 10 face the incident direction of light, thereby simplifying the manufacturing process of the lead frame, thereby reducing the production cost of the optical receiver and improving the production efficiency of the optical receiver.

[0036] In some optional embodiments, some of the pins in the plurality of pin portions 123 are connected to the first end of the support portion 120, such as Figure 2 As shown, two pins 123 are connected to the first end of the support portion 120, and two pins 123 are not connected to the support portion 120. Of course, the present invention is not limited thereto, and in other optional embodiments, multiple pins 123 may not be connected to the support portion 120.

[0037] In some optional embodiments, the optical receiver includes at least two photosensitive chips 10 and a processing chip 11, and the at least two photosensitive chips 10 are arranged around the processing chip 11. Compared with the optical receiver with only one photosensitive chip, the optical receiver with at least two photosensitive chips 10 has higher sensitivity. Figure 3 As shown, the optical receiver includes two photosensitive chips 10 and a processing chip 11 , and the two photosensitive chips 10 are respectively arranged on both sides of the processing chip 11 .

[0038] In some optional embodiments, the lead frame 12 further includes at least one of a third shielding portion, a fourth shielding portion, and a fifth shielding portion. Figure 5 As shown, Figure 5 This is a schematic diagram of the structure of another optical receiver disclosed in an embodiment of the utility model. Figure 6 for Figure 5 The schematic diagram of the unfolded structure of the optical receiver shown in the figure takes the lead frame 12 also including the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 as an example for explanation. The third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 are all connected to the second shielding part 122, and the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 respectively cover the second side S2, the third side S3 and the fourth side S4 of the photosensitive chip 10.

[0039] The third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 are all reflective surfaces facing the photosensitive chip 10, and the reflective surfaces of the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 are respectively used to reflect the light transmitted by the light-transmitting hole 1210 to the photosensitive chip 10. Among them, the second side surface S2, the third side surface S3 and the fourth side surface S4 of the photosensitive chip 10 are all photosensitive surfaces.

[0040] In some optional embodiments, such as Figure 6 As shown, the first shielding portion 121 is connected to the supporting portion 120 via the first connecting portion 131, the second shielding portion 122 is connected to the first shielding portion 121 via the second connecting portion 132, and the third shielding portion 124, the fourth shielding portion 125 and the fifth shielding portion 126 are connected to the second shielding portion 122 via the third connecting portion 133, the fourth connecting portion 134 and the fifth connecting portion 135 respectively.

[0041] In some optional embodiments, the supporting portion 120, the first shielding portion 121, the second shielding portion 122, the third shielding portion 124, the fourth shielding portion 125 and the fifth shielding portion 126 are all flat plate structures, the first connecting portion 131, the second connecting portion 132, the third connecting portion 133, the fourth connecting portion 134 and the fifth connecting portion 135 are all strip structures, and the thickness of the strip structure is less than the thickness of the flat plate structure.

[0042] like Figure 7 As shown, Figure 7 for Figure 5In the partially unfolded structure diagram of the optical receiver shown in the figure, the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 can be bent toward the second shielding part 122 through the third connecting part 133, the fourth connecting part 134 and the fifth connecting part 135, and after bending, the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 are approximately perpendicular to the second shielding part 122. In addition, the second shielding part 122 can also be bent toward the first shielding part 121 through the second connecting part 132, and the first shielding part 121 can also be bent toward the supporting part 120 through the first connecting part 131. After bending, the first shielding part 121 is approximately perpendicular to the supporting part 120, and the second shielding part 122 is approximately perpendicular to the first shielding part 121 and approximately parallel to the supporting part 120. Based on this, the supporting portion 120 , the first shielding portion 121 , the second shielding portion 122 , the third shielding portion 124 , the fourth shielding portion 125 and the fifth shielding portion 126 can be bent into a box-type structure for accommodating the photosensitive chip 10 and the processing chip 11 .

[0043] like Figure 8 As shown, Figure 8 for Figure 5 In the optical path diagram of the optical receiver shown in the figure, after the optical signal is incident from the light-transmitting hole 1210, part of the optical signal is incident on the first side surface S1 of the photosensitive chip 10, and part of the optical signal is incident on the reflection surface of the second shielding part 122. The reflection surface of the second shielding part 122 reflects part of the light incident thereon to the front surface D of the photosensitive chip 10, and part of the light incident thereon to the reflection surface of the third shielding part 124. The reflection surface of the third shielding part 124 then reflects the light to the photosensitive chip 10. Of course, the reflection surface of the second shielding part 122 can also reflect part of the light to the reflection surfaces of the fourth shielding part 125 and the fifth shielding part 126, which will not be repeated here.

[0044] Based on this, through the first shielding part 121 with a light-transmitting hole 1210 and the second shielding part 122, the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 with a reflective surface, light can be incident on each side and the front of the photosensitive chip 10. Because each side and the front of the photosensitive chip 10 are photosensitive surfaces, it is no longer necessary to bend the lead frame multiple times to make the front of the photosensitive chip 10 face the incident direction of light, thereby simplifying the manufacturing process of the lead frame, thereby reducing the production cost of the optical receiver and improving the production efficiency of the optical receiver. In addition, Figure 2 Compared to the structure shown, Figure 5 In the structure shown, more light is incident on the photosensitive chip 10, and the sensitivity of the light receiver is higher.

[0045] In some optional embodiments, the first shielding portion 121 , the second shielding portion 122 , the third shielding portion 124 , the fourth shielding portion 125 , and the fifth shielding portion 126 are all optical signal shielding structures and / or electromagnetic signal shielding structures.

[0046] In some optional embodiments, the materials of the first shielding part 121, the second shielding part 122, the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 are all opaque materials, so that the first shielding part 121, the second shielding part 122, the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 are all optical signal shielding structures to shield the interference of external optical signals on the photosensitive chip 10.

[0047] In other optional embodiments, the materials of the first shielding part 121, the second shielding part 122, the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 are all metal materials, so that the first shielding part 121, the second shielding part 122, the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 are all electromagnetic signal shielding structures to shield the interference of external electromagnetic signals on the photosensitive chip 10 and the processing chip 11.

[0048] In other optional embodiments, the materials of the first shielding part 121, the second shielding part 122, the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 are all opaque metal materials, so that the first shielding part 121, the second shielding part 122, the third shielding part 124, the fourth shielding part 125 and the fifth shielding part 126 are both electromagnetic signal shielding structures and optical signal shielding structures.

[0049] On this basis, in some optional embodiments, at least one of the second shielding portion 122, the third shielding portion 124, the fourth shielding portion 125 and the fifth shielding portion 126 is a grid structure. Fig. 9 As shown, Fig. 9 This is a schematic diagram of the structure of another optical receiver disclosed in an embodiment of the utility model. The second shielding portion 122 is a grid structure, that is, the second shielding portion 122 has a plurality of mesh holes 1220. The mesh holes 1220 can be arranged in an array or randomly. The shape of the mesh holes 1220 can be square, circular, triangular, etc.

[0050] It is understandable that the grid-shaped shielding portion can also achieve the shielding effect of electromagnetic signals, and the grid-shaped shielding portion can reduce the weight of the optical receiver, reduce the cost of the optical receiver, and make the optical receiver more suitable for light-weight and low-cost equipment. Of course, the utility model is not limited to this. In other optional embodiments, at least one of the second shielding portion 122, the third shielding portion 124, the fourth shielding portion 125 and the fifth shielding portion 126 may not be a grid-shaped structure, which will not be repeated here.

[0051] In some optional embodiments, such as Fig.10 As shown, Fig.10This is a schematic diagram of the structure of another optical receiver disclosed in an embodiment of the utility model. The optical receiver also includes a packaging colloid 14, a photosensitive chip 10, and a processing chip ( Fig.10 The lead frame 12 is encapsulated in the encapsulation body 14, and the plurality of pin portions 123 partially extend to the outside of the encapsulation body 14.

[0052] In some optional embodiments, such as Fig.10 and Fig.11 As shown, Fig.11 It is a schematic diagram of the three-dimensional structure of another optical receiver disclosed in an embodiment of the utility model. The encapsulation colloid 14 includes a lens portion 140. The lens portion 140 covers the first shielding portion 121, or in other words, the lens portion 140 covers the first side surface of the photosensitive chip 10. The lens portion 140 is used to converge light and make the converged light incident on the light-transmitting hole 1210 of the first shielding portion 121, so that the light is incident on the photosensitive chip 10 from the light-transmitting hole 1210.

[0053] In some optional embodiments, the number of lens parts 140 may be the same as the number of photosensitive chips 10, so that each lens part 140 is provided corresponding to a photosensitive chip 10. Of course, the present invention is not limited to this, and in other optional embodiments, the number of lens parts 140 may also be different from the number of photosensitive chips 10, which will not be repeated here.

[0054] In some optional embodiments, such as Fig.11 As shown, the encapsulation colloid 14 includes at least two positioning portions 141, and the at least two positioning portions 141 are respectively arranged on two opposite sides of the encapsulation colloid 14. Fig.12 As shown, Fig.12 The schematic diagram of the structure of an optical receiver and a PCB board disclosed in an embodiment of the utility model, at least two positioning parts 141 are used to position the optical receiver and the PCB board 15. The optical receiver can be partially embedded inside the PCB board 15 along a direction parallel to the PCB board 15.

[0055] As an optional implementation of the contents disclosed in the present utility model, an embodiment of the present utility model discloses an optical receiving module, which includes a PCB board and an optical receiver disclosed in any of the above embodiments, and a pin portion of the optical receiver is electrically connected to the PCB board.

[0056] In some optional embodiments, such as Fig.12 As shown, the optical receiver can be partially embedded inside the PCB board 15 along a direction parallel to the PCB board 15 to reduce the overall thickness of the optical receiving module. Of course, the utility model is not limited to this. In other optional embodiments, the optical receiver can be installed above the PCB board 15, which will not be repeated here.

[0057] As an optional implementation of the disclosure of the utility model, the embodiment of the utility model discloses an electronic device, which includes the light receiving module disclosed in the above embodiment. The electronic device can be applied in smart home fields such as smart phones, tablet computers and smart TVs.

[0058] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The above embodiments only express several implementation methods of this specification, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of this specification, which all belong to the protection scope of this specification. Therefore, the protection scope of the patent of this specification shall be based on the attached claims.

Claims

1. An optical receiver, characterized in that: Including photosensitive chip, processing chip and lead frame; The lead frame includes a supporting portion, a first shielding portion, a second shielding portion and a plurality of pin portions; The photosensitive chip and the processing chip are fixed to the supporting portion, the photosensitive chip is electrically connected to the processing chip, and the processing chip is electrically connected to the plurality of pin portions; The first shielding part is connected to the supporting part, and the second shielding part is connected to the first shielding part; the first shielding part covers the first side surface of the photosensitive chip, and the first shielding part has a light-transmitting hole, and the light-transmitting hole is used to transmit light to the photosensitive chip; The second shielding part covers the front side of the photosensitive chip, and the surface of the second shielding part facing the photosensitive chip is a reflective surface, and the reflective surface is used to reflect the light transmitted by the light-transmitting hole to the photosensitive chip; the front side and the first side surface of the photosensitive chip are both photosensitive surfaces.

2. The optical receiver according to claim 1, characterized in that The lead frame further includes at least one of a third shielding portion, a fourth shielding portion, and a fifth shielding portion; The third shielding part, the fourth shielding part and the fifth shielding part are all connected to the second shielding part, and the third shielding part, the fourth shielding part and the fifth shielding part respectively cover the second side surface, the third side surface and the fourth side surface of the photosensitive chip; The surfaces of the third shielding part, the fourth shielding part and the fifth shielding part facing the photosensitive chip are all reflective surfaces, and the reflective surfaces of the third shielding part, the fourth shielding part and the fifth shielding part are respectively used to reflect the light transmitted through the light-transmitting hole to the photosensitive chip; the second side surface, the third side surface and the fourth side surface of the photosensitive chip are all photosensitive surfaces.

3. The optical receiver according to claim 2, characterized in that The first shielding portion, the second shielding portion, the third shielding portion, the fourth shielding portion and the fifth shielding portion are all optical signal shielding structures and / or electromagnetic signal shielding structures.

4. The optical receiver according to claim 3, characterized in that At least one of the second shielding portion, the third shielding portion, the fourth shielding portion, and the fifth shielding portion is a grid-like structure or a non-grid-like structure.

5. The optical receiver according to claim 2, characterized in that The first shielding portion is connected to the supporting portion through a first connecting portion, the second shielding portion is connected to the first shielding portion through a second connecting portion, and the third shielding portion, the fourth shielding portion and the fifth shielding portion are connected to the second shielding portion through a third connecting portion, a fourth connecting portion and a fifth connecting portion respectively; The supporting part, the first shielding part, the second shielding part, the third shielding part, the fourth shielding part and the fifth shielding part are all flat plate structures, and the first connecting part, the second connecting part, the third connecting part, the fourth connecting part and the fifth connecting part are all strip structures, and the thickness of the strip structure is less than the thickness of the flat plate structure.

6. The optical receiver according to claim 1, characterized in that The optical receiver further comprises a packaging body; the photosensitive chip, the processing chip and the lead frame are packaged inside the packaging body, and the plurality of pin portions partially extend to the outside of the packaging body.

7. The optical receiver according to claim 6, characterized in that The encapsulation colloid comprises a lens portion, and the lens portion covers the first shielding portion; the lens portion is used to converge light and make the converged light incident on the light-transmitting hole of the first shielding portion.

8. The optical receiver according to claim 6, characterized in that The packaging colloid comprises at least two positioning parts, and the at least two positioning parts are respectively arranged on two opposite sides of the packaging colloid, and the at least two positioning parts are used to locate the fixed position of the optical receiver and the PCB board.

9. A light receiving module, characterized in that: It comprises a PCB board and the optical receiver according to any one of claims 1 to 8, wherein the pins of the optical receiver are electrically connected to the PCB board.

10. An electronic device, characterized in that: Includes the light receiving module as described in claim 9.

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