Light source structure and backlight equipment

Abstract

The utility model is applicable to the technical field of backlight equipment, and provides a light source structure and backlight equipment, and the light source structure comprises at least one light-emitting chip, a light-transmitting layer and a shielding layer. The light-emitting chip has a front surface, a back surface opposite to the front surface, a peripheral side surface connecting the front surface and the back surface, and an electrode contact on the back surface. The light-transmitting layer covers the front face and the peripheral side face and exposes the back face. The light-transmitting layer is provided with a first face back to the front face, a second face opposite to the first face and a peripheral face connecting the first face and the second face. The shielding layer contacts and covers the first surface and exposes the peripheral surface, and the shielding layer is used for blocking light penetration. The stacking direction of the light-transmitting layer and the shielding layer is a first direction, and the thickness of the shielding layer in the first direction ranges from 0.05 mm to 0.15 mm. By arranging the light-transmitting layer and the shielding layer, light can be effectively prevented from penetrating through the shielding layer to be emitted out, more light can be emitted out through the peripheral face of the light-transmitting layer, the light-emitting uniformity of the side face of the light source structure is effectively improved, and the display effect is better.

Description

Technical Field

[0001] The present application relates to the technical field of backlight devices, and more specifically, to a light source structure and a backlight device. Background Art

[0002] In recent years, as the LED (Light-Emitting Diode) backlight display market has grown, most backlight devices currently use five-sided light sources 1 for light emission. Figure 1 to Figure 2 As shown, the conventional five-sided light source 1 usually has the top surface and four side surfaces surrounding the top surface as the light-emitting surface 3, and in the five-sided light source 1, most of the light is emitted from the top surface. When the five-sided light source 1 is used in a side-emitting backlight device, a side-mounting method is usually adopted to achieve the purpose of side-emitting light, and one side of the five-sided light source 1 is mounted on the PCB2 (Printed Circuit Board) so that the light emitted from the top surface of the five-sided light source 1 can be emitted laterally (the lateral direction specifically includes the direction parallel to the PCB and the direction set at an acute angle to the PCB), thereby realizing side-emitting light.

[0003] However, the five-side light source 1 of the side mounting method not only increases the thickness of the backlight device, but also some light is not emitted only from the side, resulting in uneven light emission of the backlight device and poor display effect. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a light source structure and a backlight device, aiming to solve the technical problems in the prior art that the five-sided light source has uneven light emission, thick thickness and poor display effect.

[0005] To achieve the above-mentioned purpose, the technical solution adopted in the present application is: to provide a light source structure, including at least one light-emitting chip, a light-transmitting layer and a shielding layer, the light-emitting chip having a front side, a back side opposite to the front side, a peripheral side surface connecting the front side and the back side, and an electrode contact, the electrode contact is located on the back side, the light-transmitting layer covers the front side and the peripheral side surface and exposes the back side, the light-transmitting layer has a first surface facing away from the front side, a second surface opposite to the first surface, and a peripheral surface connecting the first surface and the second surface, the shielding layer contacts and covers the first surface and exposes the peripheral surface, the shielding layer is used to block light from penetrating, the stacking direction of the light-transmitting layer and the shielding layer is a first direction, and the thickness range of the shielding layer in the first direction is 0.05mm~0.15mm.

[0006] In a possible design, the shielding layer is a white glue solidified layer, the thickness of the white glue solidified layer in the first direction is 0.1 mm, and the distance between the front surface and the first surface in the first direction ranges from 0.05 mm to 0.1 mm.

[0007] In a possible design, the shielding layer is a black glue solidified layer, the thickness of the black glue solidified layer in the first direction is 0.1 mm, and the distance between the front surface and the first surface in the first direction ranges from 0.05 mm to 0.1 mm.

[0008] In a possible design, the shielding layer includes an inner shielding layer and an outer shielding layer stacked along the first direction, the inner shielding layer is closer to the light-emitting chip than the outer shielding layer, wherein the transmittance of the outer shielding layer is lower than the transmittance of the inner shielding layer.

[0009] In a possible design, the inner shielding layer is a white glue solidified layer, the outer shielding layer is a black glue solidified layer, and the distance between the front surface and the first surface in the first direction ranges from 0.05 mm to 0.1 mm.

[0010] In a possible design, the thickness of the black glue solidified layer in the first direction is 0.05 mm, and the thickness of the white glue solidified layer in the first direction is 0.05 mm.

[0011] In a possible design, the second surface is flush with the back surface.

[0012] In a possible design, the light source structure also includes a substrate, the electrode contacts are mounted on the substrate, the substrate is used to connect to an external circuit board, and the peripheral surface of the substrate, the peripheral surface of the light-transmitting layer and the peripheral surface of the shielding layer are flush.

[0013] In a possible design, the at least one light-emitting chip includes a red light-emitting chip, a blue light-emitting chip, and a green light-emitting chip.

[0014] The present application also provides a backlight device, comprising a circuit board and a light source structure provided by any of the above technical solutions, wherein the circuit board is electrically connected to the electrode contacts.

[0015] The beneficial effect of the light source structure provided by the present application is that: compared with the prior art, in the light source structure provided by the embodiment of the present application, the light emitting chip mainly emits light through its front and surrounding side surfaces. Since the light-transmitting layer covers the front and surrounding side surfaces of the light-emitting chip, the light emitted by the light-emitting chip will enter the light-transmitting layer. Since the first surface of the light-transmitting layer is covered with a shielding layer in the thickness range of 0.05mm to 0.15mm, the use of the shielding layer in this thickness range can reduce the thickness of the shielding layer as much as possible, and can also make the shielding layer have a better shielding effect on the light emitted to the surface of the shielding layer. Therefore, the light emitted to the first surface can be blocked by the shielding effect of the shielding layer, so that the light emitted by the light-emitting chip is finally emitted through the surrounding surface of the light-transmitting layer. It can be seen from the above that by setting the light-transmitting layer and the shielding layer, the light can be effectively prevented from penetrating the shielding layer and emitting, so that the light is emitted through the surrounding surface of the light-transmitting layer, which effectively improves the uniformity of the light emission on the side of the light source structure and has a better display effect.

[0016] The beneficial effect of the backlight device provided in the present application is that, compared with the prior art, since the backlight device provided in the present application includes the light source structure provided by any of the above-mentioned technical solutions, the backlight device provided in the present application at least includes all the beneficial effects of the above-mentioned light source structure, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 It is a schematic diagram of the structure of a five-side light source in the prior art;

[0019] Figure 2 It is a schematic diagram of the assembly of a five-sided light source and a PCB in the prior art;

[0020] Figure 3 is a structural schematic diagram of a light source structure provided by an embodiment of the present application;

[0021] Figure 4 This is a simulation experiment diagram of the effect of the thickness of the white glue solidified layer on the reflectivity of the white glue solidified layer;

[0022] Figure 5 is a structural schematic diagram of a light source structure provided by another embodiment of the present application;

[0023] Figure 6 is a structural schematic diagram of a light source structure provided by yet another embodiment of the present application;

[0024] Figure 7 is a structural schematic diagram of a light source structure provided in yet another embodiment of the present application;

[0025] Figure 8 is a structural schematic diagram of a light source structure provided in yet another embodiment of the present application;

[0026] Fig. 9 is a structural schematic diagram of a light source structure provided in yet another embodiment of the present application;

[0027] Fig.10 This is a schematic diagram of an exploded view of parts of a light source structure provided in another embodiment of the present application.

[0028] The reference numerals in the above drawings are as follows:

[0029] 1. Five-sided light source; 2. PCBA; 3. Light-emitting surface;

[0030] 10. Light source structure; 11. Light-emitting chip; 12. Light-transmitting layer; 13. Shielding layer; 131. Inner shielding layer; 132. Outer shielding layer; 14. Substrate. DETAILED DESCRIPTION

[0031] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0032] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component.

[0033] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the structure or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] Finally, it should be noted that in the drawings provided in this application, the leads with solid arrows point to the structure itself, and the leads with hollow arrows point to the surface of the structure.

[0036] In order to solve the above problems, the present application provides a light source structure 10. In order to illustrate the technical solution described in the present application, it is described in detail below in conjunction with specific drawings and embodiments.

[0037] like Figures 3 to 10 As shown, an embodiment of the present application provides a light source structure 10, including at least one light-emitting chip 11, a light-transmitting layer 12 and a shielding layer 13. The light-emitting chip 11 has a front side, a back side opposite to the front side, a peripheral side surface connecting the front side and the back side, and an electrode contact, and the electrode contact is located on the back side. The light-transmitting layer 12 covers the front side and the peripheral side surface and exposes the back side. The light-transmitting layer 12 has a first surface facing away from the front side, a second surface opposite to the first surface, and a peripheral surface connecting the first surface and the second surface. The shielding layer 13 contacts and covers the first surface and the exposed peripheral surface, and the shielding layer 13 is used to block light from penetrating. The stacking direction of the light-transmitting layer 12 and the shielding layer 13 is the first direction, and the thickness of the shielding layer 13 in the first direction ranges from 0.05 mm to 0.15 mm. For example, the thickness of the shielding layer 13 can be 0.05 mm, 0.1 mm, 0.13 mm or 0.15 mm, etc.

[0038] In the embodiment of the present application, the light source structure 10 has a vertical direction and a lateral direction, the first direction is the vertical direction of the light source structure 10, and any direction perpendicular to the first direction is the lateral direction of the light source structure 10. In each figure of the embodiment of the present application, the first direction is indicated by the arrow AA.

[0039] In the embodiment of the present application, the first surface and the second surface of the light-transmitting layer 12 are spaced apart along the first direction, the first surface is in contact with the blocking layer 13, the second surface is located on the side of the light-transmitting layer 12 away from the blocking layer 13, the peripheral surface of the light-transmitting layer 12 is located between the first surface and the second surface, and the first surface and the second surface are connected through the peripheral surface.

[0040] Compared with the related art, in the light source structure 10 provided in the embodiment of the present application, the light emitting chip 11 mainly emits light through its front and surrounding sides. Since the light-transmitting layer 12 covers the front and surrounding sides of the light-emitting chip 11, the light emitted by the light-emitting chip 11 will enter the light-transmitting layer 12. Since the first surface of the light-transmitting layer 12 is covered with a shielding layer 13 with a thickness in the range of 0.05mm to 0.15mm, the shielding layer 13 within this thickness range can be used to reduce the thickness of the shielding layer 13 as much as possible, and can also enable the shielding layer 13 to have a better shielding effect on the light emitted to the surface of the shielding layer 13. Therefore, the light emitted to the first surface can be blocked by the shielding effect of the shielding layer 13, so that the light emitted by the light-emitting chip 11 is finally emitted through the surrounding surface of the light-transmitting layer 12. As can be seen from the above, by providing the light-transmitting layer 12 and the shielding layer 13, the light can be effectively prevented from penetrating the shielding layer 13 and emitting, so that the light is emitted through the surrounding surface of the light-transmitting layer 12, which effectively improves the luminous uniformity of the side of the light source structure 10, and the display effect is better. In addition, since the thickness of the shielding layer 13 is in the range of 0.05mm to 0.15mm, the light source structure 10 provided in the embodiment of the present application improves the luminous uniformity of its side and also reduces the thickness of the light source structure 10 to a certain extent, so that the light source structure 10 can be applied to some ultra-thin backlight devices.

[0041] In some embodiments, the light-transmitting layer 12 is a square plate-shaped structure, and the thickness direction of the light-transmitting layer 12 is parallel to the first direction. The light-transmitting layer 12 has four side surfaces parallel to the first direction, and the four side surfaces are light-emitting surfaces of the light source structure 10. Two adjacent side surfaces are connected, and the four side surfaces are surrounded to form a peripheral surface of the light-transmitting layer 12. For ease of description, the following description is based on the light-transmitting layer 12 being a square plate-shaped structure as an example.

[0042] In one possible design, Figure 3 As shown, the shielding layer 13 is a white glue solidified layer, the thickness of the white glue solidified layer in the first direction is 0.1mm, and the distance between the front surface and the first surface in the first direction ranges from 0.05mm to 0.1mm, that is, the distance between the shielding layer 13 and the light emitting chip 11 is 0.05mm to 0.1mm. Since the white glue solidified layer has a high reflectivity, in this arrangement, by using the white glue solidified layer as the shielding layer 13, the light directed to the white glue solidified layer can be reflected back to the light-transmitting layer 12, and finally emitted from the surrounding surface of the light-transmitting layer 12, so as to improve the light brightness of the light source structure 10.

[0043] Generally, when the shielding layer 13 is a white glue solidified layer, Figure 4 As shown, Figure 4The figure shows the reflectance of the white glue cured layer with the thickness of 58um, 90um and 150um respectively for the light with the wavelength range of 350nm to 850nm during the experiment. Figure 4 It can be seen that the thicker the colloid thickness of the white glue solidified layer, the higher the reflectivity of the white glue solidified layer. Therefore, according to the above technical solution, using a white glue solidified layer with a thickness of 0.1 mm in the first direction as the shielding layer 13 can improve the reflectivity of the shielding layer 13 while, to a certain extent, making the thickness of the light source structure 10 in the first direction thinner. After many experimental measurements, it is known that using a white glue solidified layer with a thickness of 0.1 mm in the first direction as the shielding layer 13 can make the reflectivity of the shielding layer 13 as low as 90%, or even higher.

[0044] In one possible design, Figure 5 As shown, the shielding layer 13 is a black glue solidified layer, the thickness of the black glue solidified layer in the first direction is 0.1mm, and the distance between the front surface and the first surface in the first direction ranges from 0.05mm to 0.1mm. The black glue solidified layer has a low light transmittance, which can effectively block the light from passing through the black glue solidified layer. Therefore, in this setting, by using the black glue solidified layer as the shielding layer 13, the halo degree of the shielding layer 13 can be effectively reduced, and the light uniformity of the light source structure 10 can be improved to improve the display effect. For the black glue solidified layer, using a black glue solidified layer with a thickness of 0.1mm in the first direction as the shielding layer 13 can effectively reduce the halo phenomenon of the light source structure 10, and to a certain extent, it can also make the thickness of the light source structure 10 in the first direction thinner.

[0045] In one possible design, Figure 6 As shown, the shielding layer 13 includes an inner shielding layer 131 and an outer shielding layer 132 stacked in a first direction, the inner shielding layer 131 is closer to the light emitting chip 11 than the outer shielding layer 132, wherein the light transmittance of the outer shielding layer 132 is lower than the light transmittance of the inner shielding layer 131. In this arrangement, by arranging the outer shielding layer 132 with lower light transmittance on the outside, it is possible to effectively prevent light from passing through the outer shielding layer 132 and emitting, and can effectively absorb the light passing through the inner shielding layer 131 to avoid light leakage, and make the light emitted from the surrounding surface of the light-transmitting layer 12 under the reflection effect of the inner shielding layer 131, effectively increasing the amount of light emitted from the surrounding surface of the light-transmitting layer 12, thereby increasing the luminous brightness of the light source structure 10.

[0046] In one possible design, Figure 6As shown, the inner shielding layer 131 is a white glue solidifying layer, and the outer shielding layer 132 is a black glue solidifying layer. The light transmittance of the black glue solidifying layer is lower than that of the white glue solidifying layer, but the light reflectance of the white glue solidifying layer is higher than that of the black glue solidifying layer. The distance between the front surface and the first surface in the first direction ranges from 0.05mm to 0.1mm, which specifically means that the distance between the white glue solidifying layer and the light emitting chip 11 in the first direction ranges from 0.05mm to 0.1mm. In this embodiment, among the light emitted by the light emitting chip 11, a part of the light is emitted directly through the surrounding surface of the light-transmitting layer 12, another part of the light passes through the light-transmitting layer 12 to reach the surface of the white glue solidifying layer, and another part of the light passes through the light-transmitting layer 12 and the white glue solidifying layer in turn to reach the surface of the black glue solidifying layer. Since the light reflectance of the white glue solidifying layer is relatively high, and the light transmittance of the black glue solidifying layer is relatively low. In this way, most of the light reaching the surface of the white glue solidifying layer can be reflected back to the light-transmitting layer 12 through the white glue solidifying layer, and the reflected light is finally emitted from the surrounding surface of the light-transmitting layer 12. The remaining small part of the light that passes through the white glue solidifying layer reaches the surface of the black glue solidifying layer, and can be shielded by the absorption of the black glue solidifying layer. This not only improves the luminous brightness of the light source structure 10, but also effectively reduces the amount of light emitted through the outer shielding layer 132, thereby effectively reducing the halo phenomenon and improving the luminous effect of the light source structure 10.

[0047] In a possible design, the thickness of the black glue solidifying layer in the first direction is 0.05 mm, and the thickness of the white glue solidifying layer in the first direction is 0.05 mm. In this setting, the use of a white glue solidifying layer with a thickness of 0.05 mm can make the white glue solidifying layer thinner and have a higher light reflectivity. Similarly, the use of a black glue solidifying layer with a thickness of 0.05 mm can make the black glue solidifying layer thinner and have a lower light transmittance.

[0048] In one possible design, Figure 6 As shown, the second surface is flush with the back surface. This arrangement enables the light-transmitting layer 12 to completely cover the front surface and the surrounding side surfaces of the light-emitting chip 11. On the one hand, it can provide better protection for the light-emitting chip 11; on the other hand, the second surface is flush with the back surface and the electrode contacts are exposed, which is convenient for the subsequent installation and use of the light source structure 10.

[0049] In one possible design, Figures 7 to 10As shown, the light source structure 10 also includes a substrate 14, and the electrode contacts are installed on the substrate 14. The substrate 14 is used to connect to an external circuit board. The peripheral surface of the substrate 14, the peripheral surface of the light-transmitting layer 12, and the peripheral surface of the shielding layer 13 are flush, so that the overall volume of the light source structure 10 is smaller. It is worth noting that the peripheral surface of the substrate 14 refers to the outer contour surface of the substrate 14 parallel to the first direction. Exemplarily, the substrate 14 has a third surface facing the light-emitting chip 11, a fourth surface away from the third surface, and a peripheral surface connecting the third surface and the fourth surface. In this arrangement, by arranging the substrate 14, the structural strength of the light source structure 10 can be improved. In addition, since the area of ​​the substrate 14 is larger than the area of ​​the light-emitting chip 11, the light source structure 10 will be easier to install and use later through the substrate 14.

[0050] In some optional embodiments, when the light source structure 10 further includes a substrate 14, during the production process of the light source structure 10, the light emitting chip 11 may be first welded to the substrate 14, the back of the light emitting chip 11 may be in contact with the substrate 14, and then a light-transmitting layer 12 may be disposed on the substrate by dispensing, the light-transmitting layer 12 may wrap the light-emitting chip 11, and the thickness of the light-transmitting layer 12 in the first direction may exceed the thickness of the light-emitting chip 11 in the first direction, for example, by 0.05 mm to 0.01 mm, and then baked to shape the light-transmitting layer 12. Then, the shielding layer 13 may be covered on the light-transmitting layer 12 by a molding process, and then baked to obtain the light source structure 10 provided in the embodiment of the present application.

[0051] In some other optional embodiments, when the light source structure 10 does not include the substrate 14, the light-emitting chip 11 can be placed on a sticky substrate (such as a plastic film, a glass carrier or a metal carrier), and the back of the light-emitting chip 11 is attached to the substrate, and the light-emitting chip 11 is temporarily fixed by the stickiness of the substrate itself to facilitate subsequent operations. Then, a light-transmitting layer 12 is arranged on the substrate by dispensing, and the light-transmitting layer 12 wraps the light-emitting chip 11, and the thickness of the light-transmitting layer 12 in the first direction exceeds the thickness of the light-emitting chip 11 in the first direction, for example, exceeding 0.05mm to 0.01mm, and then baked to shape the light-transmitting layer 12. Then, the shielding layer 13 is covered on the light-transmitting layer 12 by a molding process, and baked again to form the light source structure 10 on the substrate, and finally the substrate and the light source structure 10 are separated by cutting.

[0052] In one possible design, at least one light-emitting chip 11 includes a red light-emitting chip, a blue light-emitting chip, and a green light-emitting chip. In this arrangement, at least one light-emitting chip 11 can emit full-color white light of three primary colors (red, green, and blue). In some optional embodiments, the light-emitting chip 11 can be a blue light-emitting chip, and the light-transmitting layer 12 has a fluorescent material, so that the light source structure 10 can emit white light. In the embodiment of the present application, the light-emitting chip 11 can be installed in a forward or reverse manner, which is not limited here.

[0053] Another embodiment of the present application further provides a backlight device, including a circuit board and a light source structure 10 as provided in any of the above embodiments, wherein the circuit board is electrically connected to the electrode contacts. Compared with the related art, since the backlight device provided in the embodiment of the present application includes the light source structure 10 provided in any of the above embodiments, the backlight device provided in the embodiment of the present application at least includes all the beneficial effects of the above light source structure 10, which will not be described in detail here.

[0054] In some embodiments of the present application, the light source structure 10 may include a substrate 14 or may not include the substrate 14. The purpose of providing the substrate 14 is, on the one hand, to enhance the structural strength of the light source structure 10, and on the other hand, when the light source structure 10 is applied to a backlight device, it is convenient to connect the light emitting chip 11 to the circuit board. The purpose of not providing the substrate 14 is to thin the light source structure 10 to reduce production costs, and at the same time, it is conducive to thinning the backlight device.

[0055] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A light source structure, characterized in that: The invention comprises at least one light-emitting chip, a light-transmitting layer and a shielding layer, wherein the light-emitting chip has a front side, a back side opposite to the front side, a peripheral side surface connecting the front side and the back side, and an electrode contact, wherein the electrode contact is located on the back side, the light-transmitting layer covers the front side and the peripheral side surface and exposes the back side, the light-transmitting layer has a first surface facing away from the front side, a second surface opposite to the first surface, and a peripheral surface connecting the first surface and the second surface, the shielding layer contacts and covers the first surface and exposes the peripheral surface, and the shielding layer is used to block light from penetrating, and the stacking direction of the light-transmitting layer and the shielding layer is a first direction, and the thickness range of the shielding layer in the first direction is 0.05 mm to 0.15 mm.

2. The light source structure according to claim 1, characterized in that: The shielding layer is a white glue solidified layer, the thickness of the white glue solidified layer in the first direction is 0.1 mm, and the distance between the front surface and the first surface in the first direction ranges from 0.05 mm to 0.1 mm.

3. The light source structure according to claim 1, characterized in that: The shielding layer is a black glue solidified layer, the thickness of the black glue solidified layer in the first direction is 0.1 mm, and the distance between the front surface and the first surface in the first direction ranges from 0.05 mm to 0.1 mm.

4. The light source structure according to claim 1, characterized in that: The shielding layer includes an inner shielding layer and an outer shielding layer stacked along the first direction, the inner shielding layer is closer to the light emitting chip than the outer shielding layer, wherein the transmittance of the outer shielding layer is lower than the transmittance of the inner shielding layer.

5. The light source structure according to claim 4, characterized in that: The inner shielding layer is a white glue solidified layer, the outer shielding layer is a black glue solidified layer, and the distance between the front surface and the first surface in the first direction ranges from 0.05 mm to 0.1 mm.

6. The light source structure according to claim 5, characterized in that: The thickness of the black glue solidified layer in the first direction is 0.05 mm, and the thickness of the white glue solidified layer in the first direction is 0.05 mm.

7. The light source structure according to claim 1, characterized in that: The second surface is flush with the back surface.

8. The light source structure according to claim 1, characterized in that: The light source structure further includes a substrate, the electrode contacts are mounted on the substrate, the substrate is used to connect to an external circuit board, and the peripheral surface of the substrate, the peripheral surface of the light-transmitting layer and the peripheral surface of the shielding layer are flush.

9. The light source structure according to any one of claims 1 to 8, characterized in that: The at least one light emitting chip includes a red light emitting chip, a blue light emitting chip and a green light emitting chip.

10. A backlight device, characterized in that: It comprises a circuit board and the light source structure according to any one of claims 1 to 9, wherein the circuit board is electrically connected to the electrode contact.

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