Universal heating block for chip mounters of different brands

Abstract

The utility model relates to the technical field of chip mounter accessories, in particular to a universal heating block for chip mounters of different brands, which comprises a heat insulation layer, a heating layer is mounted at the top end of the heat insulation layer, a heat conduction layer is mounted at the top end of the heating layer, through holes I are formed in four corners in the heat insulation layer, and through holes II are formed in the heat conduction layer. Second through holes are formed in the four corners of the interior of the heating layer, placing grooves are formed in the four corners of the interior of the heat conduction layer, bolts are slidably connected to the interiors of the placing grooves, and the exteriors of the bolts penetrate through the second through holes and the first through holes. The heating block has the beneficial effects that the heating block is divided into three layers, the thicknesses of the three layers are respectively adjusted into different sizes, the overall thickness is not changed, the lengths and the widths of the three layers are kept in universal sizes, and the uppermost side can be disassembled and replaced, so that when different brands of chip mounters are used, only the uppermost layer needs to be adjusted, and the production cost is reduced. And therefore, the heating block is relatively high in use flexibility, and the use cost is further reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip mounter accessories, in particular to a universal heating block used for chip mounters of different brands. Background Art

[0002] The tablet loading machine is a kind of equipment used in the pharmaceutical industry, which is used to press powdered or granular drug raw materials into tablets or block objects. The heating block plays an important role in the tablet loading machine, mainly processing the drug raw materials into the required shape and density by heating. The tablet loading machine heating block refers to the heating element or component used in the tablet loading machine.

[0003] The heating block in the prior art is generally designed with two layers or three layers. The dimensions of the heating block with a two-layer design are: the overall thickness is maintained at 10.5mm, the overall width is maintained at 50mm, the overall length is maintained at 73mm, the thickness of the insulation layer is 1.7mm, and the thickness of the heating layer is 8.8mm. The dimensions of the heating block with a three-layer design are: the overall thickness is maintained at 11mm, the overall width is maintained at 80mm, the overall length is maintained at 73mm, the thickness of the insulation layer is 2.5mm, the thickness of the heating layer is 2mm, and the thickness of the thermal conductive layer is 3.5mm.

[0004] In actual use, the heating blocks of different brands of wafer loading equipment are not interchangeable. Under the same frame, each wafer loading machine of different brands needs to purchase the corresponding heating block, and then when producing other models of products, it is necessary to install matching heating blocks, which makes the cost of heating blocks increase sharply. Utility Model Content

[0005] The purpose of the utility model is to provide a universal heating block for wafer loading machines of different brands, so as to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a universal heating block for different brands of wafer loading machines, comprising a thermal insulation layer, a heating layer is installed on the top of the thermal insulation layer, a heat conducting layer is installed on the top of the heating layer, through hole one is opened at the four corners inside the thermal insulation layer, through hole two is opened at the four corners inside the heating layer, placement grooves are opened at the four corners inside the heat conducting layer, a latch is slidably connected inside the placement groove, and the outside of the latch passes through through hole two and through hole one.

[0007] Preferably, four arc-shaped grooves are formed on the upper side of the placement groove, and four connection grooves are formed inside the latch.

[0008] Preferably, the heat insulating layer, the heating layer and the heat conducting layer are the same in length and width.

[0009] Preferably, the thickness of the heating layer is greater than that of the heat-conducting layer, and the thickness of the heat-conducting layer is greater than that of the heat-insulating layer.

[0010] Preferably, the latch is of "T"-shaped design, and the latch as a whole is a rectangular block.

[0011] Preferably, the arc-shaped groove matches the connecting groove, the inner side of the connecting groove is designed as an arc, and the outer side of the connecting groove is designed as a "T" shape.

[0012] Compared with the prior art, the utility model proposes a universal heating block for different brands of wafer loading machines, which has the following beneficial effects: by dividing the heating block into three layers, adjusting the thickness of the three layers to different sizes respectively, and keeping the overall thickness unchanged, the length and width of the three layers are maintained at a universal size, and the middle layer and the bottom layer are fixedly installed so that the top side can be disassembled and replaced, so that when using wafer loading machines of different brands, only the top layer needs to be adjusted, which makes the heating block more flexible to use and reduces the cost of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional diagram of the utility model;

[0014] Figure 2 This is a schematic diagram of the heat insulation layer structure of the utility model;

[0015] Figure 3 This is a schematic diagram of the heating layer structure of the utility model;

[0016] Figure 4 For this utility model Figure 1 Structural cross-section at AA in the middle;

[0017] Figure 5 For this utility model Figure 4 Enlarged view of point A in the middle;

[0018] Figure 6 This is a schematic diagram of the latch structure of the utility model.

[0019] In the figure: 1, thermal insulation layer; 2, heating layer; 3, thermal conductive layer; 4, through hole 1; 5, through hole 2; 6, placement groove; 7, arc groove; 8, latch; 9, connection groove. DETAILED DESCRIPTION

[0020] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Embodiment 1

[0022] See also Figure 1-Figure 6 The utility model provides a technical solution: a universal heating block for different brands of wafer loading machines, including a heat insulating layer 1, a heating layer 2 is installed on the top of the heat insulating layer 1, a heat conducting layer 3 is installed on the top of the heating layer 2, the heat insulating layer 1, the heating layer 2 and the heat conducting layer 3 are the same in length and width, the thickness of the heating layer 2 is larger than that of the heat conducting layer 3, and the thickness of the heat conducting layer 3 is larger than that of the heat insulating layer 1.

[0023] By designing the original two-layer structure of the heating block into a three-layer structure, and keeping the overall thickness at

[0024] 10.5mm or 11mm, the overall width is maintained at 80mm, and the overall length is maintained at 73mm, so that the improved heating block can be used in different types of wafer loading machines, and the thickness of the thermal insulation layer 1 is 1.7mm or

[0025] The thickness of the heating layer 2 is 5.3 mm or 5 mm, and the thickness of the heat-conducting layer 3 is 3.5 mm, so that after the heat-insulating layer 1, the heating layer 2 and the heat-conducting layer 3 are stacked and combined, the overall thickness is still maintained at

[0026] 10.5mm, so that the length, width and thickness of the improved heating plate can be adapted to different models, and when in use, by installing the insulation layer 1 and the heating layer 2 on the track, only the heat-conducting layer 3 needs to be replaced. Since the length, width and thickness of the heat-conducting layer 3 are the same, the heat-conducting layer 3 can be installed on different models of chip loaders, which increases the versatility of the heating block and reduces the cost of use, making the heating block more economical to use.

[0027] Embodiment 2

[0028] On the basis of embodiment one, through holes 1 4 are provided at the four inner corners of the heat insulation layer 1, through holes 2 5 are provided at the four inner corners of the heating layer 2, placement grooves 6 are provided at the four inner corners of the heat conducting layer 3, and a latch 8 is slidably connected inside the placement groove 6. The latch 8 is a "T"-shaped design, and the latch 8 is a rectangular block as a whole, and the outside of the latch 8 passes through through hole 2 5 and through hole 1 4.

[0029] The through hole 1 4, the through hole 2 5 and the placement groove 6 match each other, so that the pin 8 can directly slide into the interior of the insulation layer 1, the heating layer 2 and the heat-conducting layer 3, and because the outer portion of the pin 8 is rectangular, the pin 8 can be placed inside the insulation layer 1, the heating layer 2 and the heat-conducting layer 3 only when they are kept on the same horizontal line, thereby ensuring the installation flatness of the insulation layer 1, the heating layer 2 and the heat-conducting layer 3, so that the use quality of the heating block is relatively high, and the head of the pin 8 fits with the lower side of the inner wall of the placement groove 6, so that the pin 8 can be stably placed inside the through hole 1 4, the through hole 2 5 and the placement groove 6, and due to the limitation of the pin 8, the insulation layer 1, the heating layer 2 and the heat-conducting layer 3 will not shift during use, thereby making the quality of the processed product relatively high, thereby improving the economic use of the heating block, and the top and bottom ends of the pin 8 are respectively kept flat with the heat-conducting layer 3 and the insulation layer 1, so that the pin 8 will not affect the normal use of the heating block.

[0030] Embodiment 3

[0031] On the basis of the second embodiment, four arc grooves 7 are opened on the upper side of the placement groove 6, and four connecting grooves 9 are opened inside the latch 8. The arc groove 7 matches the connecting groove 9. The inner side of the connecting groove 9 is designed as an arc, and the outer side of the connecting groove 9 is designed as a "T" shape.

[0032] When the plug 8 needs to be disassembled, it can be done by using fingers or tweezers and other tools. By putting it into the connecting groove 9, the plug 8 can be pulled upwards to conveniently pull the plug 8 out from the through hole 1 4, the through hole 2 5 and the placement groove 6, so that the thermal conductive layer 3 can be conveniently replaced. The design of the arc groove 7 reserves a disassembly space for the disassembly of the plug 8, so that tools such as fingers or tweezers can easily enter the connecting groove 9, making the disassembly of the plug 8 more convenient.

[0033] In actual use, the thermal insulation layer 1 is first installed on the wafer loading machine, and then the heating layer 2 is installed on the thermal insulation layer 1. Finally, according to the specifications of the wafer loading machine, the corresponding type of thermal conductive layer 3 is placed on the surface of the heating layer 2, and the whole is connected, so that the heating block can use wafer loading machines of different models and specifications, making the use of the heating block more flexible and thus making the use of the heating block more economical.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A universal heating block for wafer mounters of different brands, comprising a heat insulating layer (1), a heating layer (2) being mounted on the top of the heat insulating layer (1), characterized in that: A heat-conducting layer (3) is installed on the top of the heating layer (2), through holes (1) (4) are provided at the four corners inside the heat-insulating layer (1), through holes (2) (5) are provided at the four corners inside the heating layer (2), placement grooves (6) are provided at the four corners inside the heat-conducting layer (3), a latch (8) is slidably connected inside the placement groove (6), and the outside of the latch (8) passes through the through hole (5) and the through hole (4).

2. A universal heating block for wafer loading machines of different brands according to claim 1, characterized in that: Four arc-shaped grooves (7) are provided on the upper side of the placement groove (6), and four connection grooves (9) are provided inside the latch (8).

3. A universal heating block for wafer loading machines of different brands according to claim 1, characterized in that: The heat insulating layer (1), the heating layer (2) and the heat conducting layer (3) are the same in length and width.

4. The universal heating block for wafer loading machines of different brands according to claim 1, characterized in that: The thickness of the heating layer (2) is greater than the thickness of the heat-conducting layer (3), and the thickness of the heat-conducting layer (3) is greater than the thickness of the heat-insulating layer (1).

5. The universal heating block for wafer loading machines of different brands according to claim 1, characterized in that: The latch (8) is of T-shaped design, and the latch (8) is a rectangular block as a whole.

6. A universal heating block for wafer loading machines of different brands according to claim 2, characterized in that: The arc groove (7) matches the connecting groove (9), the inner side of the connecting groove (9) is designed as an arc, and the outer side of the connecting groove (9) is designed as a "T" shape.

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