Insulation board

Abstract

The utility model relates to a thermal insulation board, which comprises at least one thermal insulation layer and at least one reinforcing layer, the thermal insulation layer and the reinforcing layer are alternately laminated, the thermal insulation layer is formed by stacking at least one thermal insulation sub-layer, and the reinforcing layer is formed by stacking at least one reinforcing sub-layer; wherein the heat conductivity coefficient of the heat preservation sub-layer is smaller than or equal to 0.2 W / (m.K), the bending strength of the reinforcing sub-layer is larger than or equal to 500 MPa, and the tensile strength of the reinforcing sub-layer is larger than or equal to 300 MPa. The thermal insulation board provided by the utility model has excellent thermal insulation property and mechanical property, and can meet the application requirements of specific scenes.

Description

Technical Field

[0001] The utility model relates to a heat-insulating material, in particular to a heat-insulating board. Background Art

[0002] Insulation boards usually form cavities by foaming, and use the slow heat transfer of air to achieve insulation. However, due to the characteristics of foam materials, their mechanical properties such as bending strength, tensile strength, and impact strength are usually poor and cannot meet the application requirements of specific scenarios. Foam boards usually include inorganic foam boards and organic foam boards. Among them, inorganic foam boards include foamed cement, perlite foam boards, etc., which have good durability and fire resistance, but have higher density and lower mechanical strength than organic foam insulation boards; organic foam boards include polystyrene boards, polyurethane boards, phenolic boards, etc., which have outstanding insulation performance, but poor physical stability, resulting in unstable insulation effect.

[0003] Therefore, it is urgent to develop an insulation board that takes both thermal insulation performance and mechanical properties into consideration. Utility Model Content

[0004] Based on this, it is necessary to provide an insulation board to address the above problems, which has excellent insulation performance and mechanical properties and has broad market prospects.

[0005] A thermal insulation board comprises at least one thermal insulation layer and at least one reinforcement layer, wherein the thermal insulation layer and the reinforcement layer are alternately stacked, the thermal insulation layer is formed by stacking at least one thermal insulation sub-layer, and the reinforcement layer is formed by stacking at least one reinforcement sub-layer;

[0006] The thermal conductivity of the heat-insulating sublayer is less than or equal to 0.2 W / (m·K); the bending strength of the reinforcing sublayer is greater than or equal to 500 MPa, and the tensile strength is greater than or equal to 300 MPa.

[0007] In one of the embodiments, the bending strength of the thermal insulation sublayer is greater than or equal to 100 MPa;

[0008] And / or, the tensile strength of the thermal insulation sublayer is greater than or equal to 80 MPa;

[0009] And / or, the parallel layer impact strength of the thermal insulation sublayer is greater than or equal to 20KJ / m 2 .

[0010] In one embodiment, the thermal conductivity of the reinforcement sublayer is less than or equal to 0.7 W / (m·K);

[0011] And / or, the parallel ply impact strength of the reinforcing sublayer is greater than or equal to 40KJ / m 2 .

[0012] In one embodiment, the flame retardant grade of the reinforcement sublayer is UL94-V0, and the flame retardant grade of the thermal insulation sublayer is UL94-V0.

[0013] In one of the embodiments, the ratio of the total thickness of the thermal insulation layer to the total thickness of the reinforcement layer is 1:1 to 1:4.

[0014] In one embodiment, the total thickness of the insulation layer accounts for 20% to 30% of the thickness of the insulation board;

[0015] Alternatively, the total thickness of the insulation layer accounts for 30% to 40% of the thickness of the insulation board;

[0016] Alternatively, the total thickness of the thermal insulation layer accounts for 40% to 50% of the thickness of the thermal insulation board.

[0017] In one of the embodiments, the thickness of the thermal insulation sublayer is less than or equal to 0.3 mm;

[0018] And / or, the thickness of the reinforcing sublayer is 0.1 mm to 0.25 mm.

[0019] In one of the embodiments, the thermal insulation sublayer is selected from hollow glass microsphere-resin composite film;

[0020] And / or, the thermal insulation sub-layer is selected from hollow glass microsphere-fiber cloth-resin composite film.

[0021] In one embodiment, the reinforcing sublayer is selected from a fiber cloth-resin composite film.

[0022] In one embodiment, the insulation board includes an upper and lower surface layer and a middle layer, the upper and lower surface layers are both the reinforcement layers, and the middle layer is the insulation layer;

[0023] Alternatively, the insulation board comprises an upper and lower surface layer and a middle layer, the upper and lower surface layers are both the insulation layers, and the middle layer is the reinforcement layer;

[0024] Alternatively, the insulation board comprises an upper and lower surface layer and a middle layer, the upper and lower surface layers are both the reinforcement layer, the middle layer comprises at least two insulation layers and at least one reinforcement layer, and the insulation layers and the reinforcement layers are alternately stacked, and the upper and lower surface layers are in contact with the insulation layer of the middle layer;

[0025] Alternatively, the insulation board comprises an upper and lower surface layer and a middle layer, the upper and lower surface layers are both the insulation layers, the middle layer comprises at least two reinforcing layers and at least one insulation layer, and the reinforcing layers and the insulation layers are alternately stacked, and the upper and lower surface layers are in contact with the reinforcing layers of the middle layer;

[0026] Alternatively, the thermal insulation board is formed by stacking at least one composite layer, and the composite layer is formed by stacking the reinforcement layer and the thermal insulation layer.

[0027] The above-mentioned insulation board is achieved by alternately laminating at least one insulation layer with excellent insulation performance and at least one reinforcement layer with excellent mechanical properties, so that the thermal conductivity of the insulation board is less than or equal to 0.3W / (m·K), the bending strength is greater than or equal to 350MPa, the tensile strength is greater than or equal to 250MPa, and the parallel layer impact strength is greater than or equal to 33KJ / m 2 The insulation board takes into account both thermal insulation performance and mechanical properties, and can meet the application requirements of specific scenarios; in addition, the insulation board can further achieve a lower density, less than or equal to 1.7g / m 3 , which can meet the requirements of lightweight and has good flame retardant properties, and has broad market prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a cross-sectional schematic diagram of a thermal insulation sublayer in one embodiment of the utility model;

[0029] Figure 2 This is a cross-sectional schematic diagram of a thermal insulation sublayer in another embodiment of the present invention;

[0030] Figure 3 This is a cross-sectional schematic diagram of a reinforcing sublayer in one embodiment of the utility model;

[0031] Figure 4 It is a cross-sectional schematic diagram of a thermal insulation board according to a first embodiment of the utility model;

[0032] Figure 5 It is a cross-sectional schematic diagram of a thermal insulation board according to a second embodiment of the present utility model;

[0033] Figure 6 It is a cross-sectional schematic diagram of a heat preservation board according to a third embodiment of the present utility model;

[0034] Figure 7 It is a cross-sectional schematic diagram of a heat preservation board according to a fourth embodiment of the present utility model;

[0035] Figure 8 It is a schematic cross-sectional view of a thermal insulation board according to a fifth embodiment of the present utility model.

[0036] In the figure: 1-insulation layer; 11-insulation sub-layer; 2-reinforcement layer; 22-reinforcement sub-layer; 3-resin layer; 4-hollow glass microspheres; 5-fiber cloth. DETAILED DESCRIPTION

[0037] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below. However, it should be understood that the present invention can be implemented in many different forms and is not limited to the embodiments or examples described herein. On the contrary, the purpose of providing these embodiments or examples is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific implementation methods or embodiments and are not intended to limit the present invention.

[0039] The thermal insulation board provided by the utility model comprises at least one thermal insulation layer 1 and at least one reinforcement layer 2, and the thermal insulation layer 1 and the reinforcement layer 2 are alternately stacked, the thermal insulation layer 1 is formed by stacking at least one thermal insulation sublayer 11, and the reinforcement layer 2 is formed by stacking at least one reinforcement sublayer 22;

[0040] The thermal conductivity of the heat-insulating sublayer 11 is less than or equal to 0.2 W / (m·K); the bending strength of the reinforcing sublayer 22 is greater than or equal to 500 MPa, and the tensile strength is greater than or equal to 300 MPa.

[0041] The above-mentioned insulation board is achieved by alternately laminating at least one insulation layer with excellent insulation performance and at least one reinforcement layer with excellent mechanical properties, so that the thermal conductivity of the insulation board is less than or equal to 0.3W / (m·K), the bending strength is greater than or equal to 350MPa, the tensile strength is greater than or equal to 250MPa, and the parallel layer impact strength is greater than or equal to 33KJ / m 2 The insulation board takes into account both thermal insulation performance and mechanical properties, and can meet the application requirements of specific scenarios.

[0042] To further ensure the mechanical strength of the insulation board, the bending strength of the insulation sublayer 11 is preferably greater than or equal to 100 MPa, including but not limited to any point value of 150 MPa, 180 MPa, 200 MPa, 300 MPa, 400 MPa, 500 MPa or a range value between any two of them.

[0043] In one embodiment, the tensile strength of the thermal insulation sublayer 11 is preferably greater than or equal to 80 MPa, including but not limited to any point value of 90 MPa, 100 MPa, 1500 MPa, 200 MPa, 300 MPa, 400 MPa or a range value between any two of them.

[0044] In one embodiment, the parallel layer impact strength of the thermal insulation sub-layer 11 is preferably greater than or equal to 20 KJ / m2 , including but not limited to 25KJ / m 2 、30KJ / m 2 、35KJ / m 2 、40KJ / m 2 、50KJ / m 2 、60KJ / m 2 Any point value in or any range of values ​​between them.

[0045] In order to further reduce the thermal conductivity of the insulation board and ensure the thermal insulation performance of the insulation board, the thermal conductivity of the reinforcing sublayer 22 is preferably less than or equal to 0.7W / (m·K), including but not limited to any point value of 0.69W / (m·K), 0.65W / (m·K), 0.6W / (m·K), 0.55W / (m·K), 0.5W / (m·K), 0.4W / (m·K) or the range value between any two of them.

[0046] In order to further improve the mechanical strength of the insulation board, the parallel layer impact strength of the reinforcing sublayer 22 is preferably greater than or equal to 40KJ / m 2 , including but not limited to 40KJ / m 2 、42KJ / m 2 、45KJ / m 2 、50KJ / m 2 、60KJ / m 2 、70KJ / m 2 Any point value in or any range between them.

[0047] In one embodiment, the flame retardant grade of the reinforcing sublayer 22 is UL94-V0, and the flame retardant grade of the thermal insulation sublayer 11 is UL94-V0, thereby effectively improving the flame retardancy of the thermal insulation board, and the flame retardant grade reaches UL94-V0, which has broad application prospects.

[0048] In one embodiment, the ratio of the total thickness of the insulation layer 1 to the total thickness of the reinforcement layer 2 is 1:1 to 1:4, which is beneficial for reducing the thermal conductivity of the insulation board while improving the bending strength, tensile strength and parallel layer impact strength of the insulation board, thereby effectively improving the thermal insulation performance and mechanical properties of the insulation board.

[0049] In one embodiment, the total thickness of the thermal insulation layer 1 accounts for 20% to 30% of the thickness of the thermal insulation board, thereby further improving the mechanical properties of the thermal insulation board while ensuring the thermal insulation performance of the thermal insulation board.

[0050] In one embodiment, the total thickness of the thermal insulation layer 1 accounts for 30% to 40% of the thickness of the thermal insulation board, which is beneficial for taking into account both the thermal insulation performance and the mechanical properties of the thermal insulation board.

[0051] In one embodiment, the total thickness of the insulation layer 1 accounts for 40% to 50% of the thickness of the insulation board, which is beneficial to reduce the density of the insulation board to 1.6 g / m 3 The following, as well as further improving its thermal insulation performance.

[0052] In order to improve the thermal insulation performance of the thermal insulation board and ensure its mechanical properties, the thickness of the thermal insulation sublayer 11 is preferably less than or equal to 0.3 mm.

[0053] In order to further improve the mechanical properties of the thermal insulation board, the thickness of the reinforcing sublayer 22 is preferably 0.1 mm to 0.25 mm.

[0054] It should be noted that the total thickness of the thermal insulation layer 1 is expressed as the sum of the thicknesses of each thermal insulation layer 1, and the thickness of the thermal insulation layer 1 is the sum of the thicknesses of its thermal insulation sub-layers 11; the total thickness of the reinforcing layer 2 is expressed as the sum of the thicknesses of each reinforcing layer 2, and the thickness of the reinforcing layer 2 is the sum of the thicknesses of its reinforcing sub-layers 22; when the thermal insulation layer 1 is formed by stacking multiple layers of thermal insulation sub-layers 11, the thicknesses of each thermal insulation sub-layer 11 may be the same or different; when the reinforcing layer 2 is formed by stacking multiple layers of reinforcing sub-layers 22, the thicknesses of each reinforcing sub-layer 22 may be the same or different.

[0055] In one embodiment, the thermal insulation sub-layer 11 is selected from hollow glass microsphere-resin composite film.

[0056] Specifically, Figure 1 As shown, the thermal insulation sublayer 11 includes a resin layer 3 and hollow glass microspheres 4 dispersed in the resin layer 3, wherein the resin is selected from at least one of thermosetting resins or thermoplastic resins, including but not limited to epoxy resins, phenolic resins, unsaturated resins, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyformaldehyde, polycarbonate, polyphenylene ether, polytetrafluoroethylene, etc.

[0057] In another embodiment, the thermal insulation sub-layer 11 is selected from hollow glass microsphere-fiber cloth-resin composite film.

[0058] Specifically, Figure 2 As shown, the thermal insulation sublayer includes a resin layer 3 and hollow glass microspheres 4 and fiber cloth 5 dispersed in the resin layer 3. The fiber cloth 5 is selected from at least one of inorganic fiber cloth or organic fiber cloth, including but not limited to glass fiber woven cloth, carbon fiber woven cloth, nylon fiber cloth, polyester fiber cloth, acrylic fiber cloth, aramid fiber cloth, polyimide fiber cloth, etc.

[0059] It should be noted that when the thermal insulation layer 1 is formed by stacking multiple thermal insulation sub-layers 11 , each thermal insulation sub-layer 11 may be the same or different.

[0060] In one embodiment, the reinforcing sublayer 22 is selected from a fiber cloth-resin composite film.

[0061] Specifically, Figure 3 As shown, the reinforcing sublayer 22 includes a resin layer 3 and a fiber cloth 5 dispersed in the resin layer 3, wherein the resin is selected from at least one of a thermosetting resin or a thermoplastic resin, including but not limited to epoxy resin, phenolic resin, unsaturated resin, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyformaldehyde, polycarbonate, polyphenylene ether, polytetrafluoroethylene, etc.; the fiber cloth 5 is selected from at least one of an inorganic fiber cloth or an organic fiber cloth, including but not limited to a glass fiber woven cloth, a carbon fiber woven cloth, a nylon fiber cloth, a polyester fiber cloth, an acrylic fiber cloth, an aramid fiber cloth, a polyimide fiber cloth, etc.

[0062] Preferably, the reinforcing sublayer 22 further includes an inorganic filler, and the inorganic filler is selected from at least one of aluminum hydroxide, silicon dioxide, titanium dioxide, calcium carbonate, talcum powder, aluminum oxide, magnesium oxide and aluminum nitride, thereby further improving the mechanical properties of the insulation board.

[0063] It should be noted that the resin layer 3 and the fiber cloth 5 in the thermal insulation sublayer 11 and the reinforcement sublayer 22 may be the same or different.

[0064] In one embodiment, the insulation board is a sandwich structure, including an upper and lower surface layer and a middle layer, and the upper and lower surface layers can be the insulation layer 1 or the reinforcement layer 2. Specifically, Figure 4 As shown, when the upper and lower surface layers are both reinforcement layers 2, the middle layer is the thermal insulation layer 1, wherein the number of reinforcement sublayers 22 in the reinforcement layer 2 includes but is not limited to 4 layers, and the number of thermal insulation sublayers 11 in the thermal insulation layer 1 includes but is not limited to 3 layers; Figure 5 As shown, when the upper and lower surface layers are both the insulation layer 1, the middle layer is the reinforcement layer 2, the number of insulation sublayers 11 in the insulation layer 1 includes but is not limited to 2 layers, and the number of reinforcement sublayers 22 in the reinforcement layer 2 includes but is not limited to 6 layers.

[0065] It can be understood that the present invention does not limit the number of layers of the thermal insulation sublayer 11 and the reinforcing sublayer 22, and the number of layers of the thermal insulation sublayer 11 in any two thermal insulation layers 1 can be the same or different, and the number of layers of the reinforcing sublayer 22 in any two reinforcing layers 2 can be the same or different.

[0066] In another embodiment, the insulation board is another sandwich structure, including upper and lower surface layers and a middle layer, and the upper and lower surface layers can be the insulation layer 1 or the reinforcement layer 2. Specifically, Figure 6As shown, when the upper and lower surface layers are both reinforcement layers 2 having multiple reinforcement sublayers 22, the middle layer includes 4 layers of single-layer insulation layers 1 and 3 layers of single-layer reinforcement layers 2, and the single-layer insulation layers 1 and the single-layer reinforcement layers 2 are alternately stacked, and the upper and lower surface layers are in contact with the single-layer insulation layer 1 of the middle layer; Figure 7 As shown, when the upper and lower surface layers are both single-layer insulation layers 1, the middle layer is 3-layer reinforcement layers 2 with multiple reinforcement sublayers 22 and 2-layer single-layer insulation layers 1, and the reinforcement layers 2 with multiple reinforcement sublayers 22 and the single-layer insulation layers 1 are alternately stacked, and the upper and lower surface layers are in contact with the reinforcement layer 2 of the middle layer.

[0067] It can be understood that the present invention does not limit the number of layers of the thermal insulation layer 1 and the reinforcement layer 2 .

[0068] Combination Figure 8 As shown, it is another embodiment of the utility model, the insulation board is formed by stacking multiple composite layers, and the composite layer is formed by stacking an insulation layer 1 with multiple insulation sublayers 11 and a reinforcement layer 2 with multiple reinforcement sublayers 22.

[0069] It can be understood that the present invention does not limit the number of composite layers, the number of insulation sublayers 11 in any insulation layer 1, and the number of insulation sublayers 22 in any reinforcement sublayer 2, and technicians in this field can make choices based on actual needs.

[0070] In one embodiment, the thermal conductivity of the thermal insulation board is less than or equal to 0.3 W / (m·K), so that the thermal insulation board has excellent thermal insulation performance.

[0071] In one embodiment, the bending strength of the thermal insulation board is greater than or equal to 350 MPa, preferably greater than or equal to 400 MPa, so that the thermal insulation board has excellent mechanical properties.

[0072] In one embodiment, the tensile strength of the thermal insulation board is greater than or equal to 250 MPa, preferably greater than or equal to 300 MPa, so that the thermal insulation board has excellent mechanical properties.

[0073] In one embodiment, the parallel layer impact strength of the insulation board is greater than or equal to 33KJ / m 2 , so that the insulation board has excellent mechanical properties.

[0074] In one embodiment, the density of the insulation board is less than or equal to 1.7 g / m 3 , thus meeting the lightweight requirements of the insulation board.

[0075] In one embodiment, the flame retardant grade of the thermal insulation board is UL94-V0, thereby meeting the flame retardant performance requirements of the thermal insulation board and having broad application prospects.

[0076] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A thermal insulation board, characterized in that: The thermal insulation board comprises at least one thermal insulation layer and at least one reinforcement layer, and the thermal insulation layer and the reinforcement layer are alternately stacked, the thermal insulation layer is formed by stacking at least one thermal insulation sub-layer, and the reinforcement layer is formed by stacking at least one reinforcement sub-layer; The thermal conductivity of the heat-insulating sublayer is less than or equal to 0.2 W / (m·K); the bending strength of the reinforcing sublayer is greater than or equal to 500 MPa, and the tensile strength is greater than or equal to 300 MPa.

2. The thermal insulation board according to claim 1, characterized in that: The bending strength of the thermal insulation sublayer is greater than or equal to 100 MPa; And / or, the tensile strength of the thermal insulation sublayer is greater than or equal to 80 MPa; And / or, the parallel layer impact strength of the thermal insulation sublayer is greater than or equal to 20KJ / m 2 .

3. The thermal insulation board according to claim 1, characterized in that: The thermal conductivity of the reinforcement sublayer is less than or equal to 0.7 W / (m·K); And / or, the parallel ply impact strength of the reinforcing sublayer is greater than or equal to 40KJ / m 2 .

4. The thermal insulation board according to claim 1, characterized in that: The flame retardant grade of the reinforcing sublayer is UL94-V0, and the flame retardant grade of the thermal insulation sublayer is UL94-V0.

5. The thermal insulation board according to claim 1, characterized in that: The ratio of the total thickness of the thermal insulation layer to the total thickness of the reinforcement layer is 1:1 to 1:

4.

6. The thermal insulation board according to claim 1, characterized in that: The total thickness of the insulation layer accounts for 20% to 30% of the thickness of the insulation board; Alternatively, the total thickness of the insulation layer accounts for 30% to 40% of the thickness of the insulation board; Alternatively, the total thickness of the thermal insulation layer accounts for 40% to 50% of the thickness of the thermal insulation board.

7. The thermal insulation board according to claim 1, characterized in that: The thickness of the thermal insulation sublayer is less than or equal to 0.3 mm; And / or, the thickness of the reinforcing sublayer is 0.1 mm to 0.25 mm.

8. The thermal insulation board according to claim 1, characterized in that: The thermal insulation sublayer is selected from hollow glass microsphere-resin composite film; And / or, the thermal insulation sub-layer is selected from hollow glass microsphere-fiber cloth-resin composite film.

9. The thermal insulation board according to claim 1, characterized in that: The reinforcing sublayer is selected from a fiber cloth-resin composite film.

10. The thermal insulation board according to claim 1, characterized in that: The insulation board comprises an upper and lower surface layer and a middle layer, the upper and lower surface layers are both the reinforcement layers, and the middle layer is the insulation layer; Alternatively, the insulation board comprises an upper and lower surface layer and a middle layer, the upper and lower surface layers are both the insulation layers, and the middle layer is the reinforcement layer; Alternatively, the insulation board comprises an upper and lower surface layer and a middle layer, the upper and lower surface layers are both the reinforcement layer, the middle layer comprises at least two insulation layers and at least one reinforcement layer, and the insulation layers and the reinforcement layers are alternately stacked, and the upper and lower surface layers are in contact with the insulation layer of the middle layer; Alternatively, the insulation board comprises an upper and lower surface layer and a middle layer, the upper and lower surface layers are both the insulation layers, the middle layer comprises at least two reinforcing layers and at least one insulation layer, and the reinforcing layers and the insulation layers are alternately stacked, and the upper and lower surface layers are in contact with the reinforcing layers of the middle layer; Alternatively, the thermal insulation board is formed by stacking at least one composite layer, and the composite layer is formed by stacking the reinforcement layer and the thermal insulation layer.

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