Pre-passing device and vapor deposition system

Abstract

The utility model relates to the technical field of semiconductor production, in particular to a pre-passing device and a vapor deposition system.The pre-passing device comprises a packaging container, a carrier gas inlet pipe, a mixed flow pipe, a buffer assembly and a tail gas treatment system, and the packaging container is provided with a packaging inlet and a packaging outlet which are communicated with an inner containing cavity; the gas outlet end of the carrier gas inlet pipe is communicated with the packaging inlet; the gas inlet end of the mixed flow pipe is communicated with the packaging outlet, and carrier gas carrying a precursor flows in the mixed flow pipe; the buffer assembly is used for collecting the precursor carried in the carrier gas, the gas inlet end of the buffer assembly is communicated with the gas outlet end of the mixed flow pipe, and the gas outlet end of the buffer assembly is communicated with the tail gas treatment system. On the premise that the flow of the precursor is stable, waste of the precursor in the pre-passing process is reduced, the utilization rate of the precursor is increased, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a pre-pass device and a vapor deposition system. Background Art

[0002] Semiconductor precursor (hereinafter referred to as precursor) refers to the chemical substance required to generate semiconductor materials. It is one of the important raw materials for manufacturing semiconductor materials. Precursors can be used in vapor deposition equipment. They are the core manufacturing materials of thin film deposition processes and can usually be an organic or inorganic compound, such as a metal organic compound.

[0003] In the vapor deposition process, the precursor is usually filled in a closed container, carried by a carrier gas flow and transported to the vapor deposition reaction system. In order to ensure the stability of the delivery amount of the semiconductor precursor, in the existing conventional vapor deposition process, the carrier gas is usually introduced into the container containing the precursor. Before the carrier gas carries the precursor into the vapor deposition reaction system, the carrier gas carrying the precursor is usually pre-circulated through a specific pipeline for a certain period of time to ensure the stability of the carrier gas carrying the precursor flow. Then the carrier gas carrying the precursor is switched to the process pipeline and finally introduced into the vapor deposition reaction system.

[0004] During the precursor pre-passage process, the carrier gas carries the precursor and flows directly into the exhaust system, resulting in the consumption of the precursor and an increase in production costs. Utility Model Content

[0005] The utility model aims to provide a pre-passing device to reduce the consumption of precursors in the pre-passing process and reduce production costs.

[0006] In order to achieve the above-mentioned object, the utility model provides a pre-passing device on one hand, the pre-passing device comprises:

[0007] A packaging container, wherein the packaging container has a packaging inlet and a packaging outlet communicating with the internal cavity;

[0008] A carrier gas inlet pipe, wherein the gas outlet end of the carrier gas inlet pipe is connected to the packaging inlet;

[0009] A mixing flow tube, wherein the gas inlet end of the mixing flow tube is connected to the packaging outlet, and a carrier gas carrying the precursor flows in the mixing flow tube;

[0010] A buffer component is used to collect precursors carried in the carrier gas, the air inlet end of the buffer component is connected to the air outlet end of the mixing flow tube, and the air outlet end of the buffer component is connected to the exhaust gas treatment system.

[0011] As an optional technical solution for a pre-pass device, the buffer assembly includes a buffer component, a buffer inlet pipe and a buffer outlet pipe. The air inlet end of the buffer component and the mixed flow pipe are connected via the buffer inlet pipe, and the air outlet end of the buffer component and the exhaust gas treatment system are connected via the buffer outlet pipe.

[0012] As an optional technical solution for the pre-passing device, the buffer member includes a plurality of interconnected accommodating spaces, and adjacent accommodating spaces are connected through mesh partitions to collect solid precursors.

[0013] As an optional technical solution of the pre-opening device, the buffer assembly includes a buffer inlet valve, which is arranged on the buffer inlet pipe and is used to control the opening and closing of the buffer inlet pipe; and / or,

[0014] The buffer assembly comprises a buffer outlet valve, and the buffer outlet valve is arranged on the buffer outlet pipe and is used to control the on-off of the buffer outlet pipe.

[0015] As an optional technical solution for a pre-passing device, the pre-passing device includes a connecting valve, and the buffer inlet pipe and the gas outlet end of the mixing flow pipe and the buffer outlet pipe and the exhaust gas treatment system are connected through the connecting valve.

[0016] As an optional technical solution of the pre-pass device, the buffer comprises a temperature regulating member and a collecting member, the temperature regulating member is used to regulate the temperature of the buffer, and the collecting member is used to collect the liquid precursor; and / or,

[0017] The buffer member includes a pressure regulating member and a collecting member. The pressure regulating member is used to regulate the pressure of the buffer member, and the collecting member is used to collect liquid precursors.

[0018] As an optional technical solution for the pre-pass device, a plurality of buffer components are provided, and the plurality of buffer components are arranged in parallel or in series between the gas outlet end of the mixing flow pipe and the exhaust gas treatment system.

[0019] As an optional technical solution for a pre-passing device, the packaging inlet and the packaging outlet of the packaging container are correspondingly provided with a packaging inlet valve and a packaging outlet valve; the pre-passing device includes a purge pipeline and a purge valve, the purge valve is arranged on the purge pipeline, and is used to control the on-off of the purge pipeline; the purge pipeline is connected between the carrier gas inlet pipe and the mixing flow pipe.

[0020] As an optional technical solution for a pre-passing device, the pre-passing device includes a bypass pipe and at least one bypass valve, and the bypass pipe and the buffer assembly are arranged in parallel between the gas outlet end of the mixing flow pipe and the exhaust gas treatment system; the bypass valve is arranged at least at one end of the bypass pipe close to the gas outlet end of the mixing flow pipe, for controlling the opening and closing of the bypass pipe.

[0021] On the other hand, the utility model provides a vapor deposition system, which includes a deposition component and a pre-pass device as described in any of the above-mentioned technical solutions, wherein the deposition component and the buffer component are arranged in parallel between the gas outlet end of the mixing flow pipe and the exhaust gas treatment system, and the gas inlet end and the gas outlet end of the deposition component are both provided with deposition valves to control the on and off of the gas.

[0022] The beneficial effects of the utility model are:

[0023] The utility model provides a pre-passing device, in which a buffer component is arranged, and the buffer component is connected between a mixing flow tube and an exhaust gas treatment system, the buffer component can collect the precursor carried by the carrier gas flowing out of the mixing flow tube, to prevent the precursor from directly entering the exhaust gas treatment system, and the collected precursor can be reused later, under the premise of ensuring the stability of the precursor flow rate, the waste of the precursor in the pre-passing process is reduced, the utilization rate of the precursor is improved, and the production cost is reduced.

[0024] The utility model provides a vapor deposition system, which includes a pre-pass device and a deposition component. Before executing a deposition process, a carrier gas carrying a precursor is first passed through a buffer component to collect the precursor. After the precursor carried in the carrier gas is stabilized, it is directly switched to the deposition component, thereby reducing the waste of the precursor and thus reducing the cost required for the deposition process. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic structural diagram of a vapor deposition system in an embodiment of the utility model;

[0026] Figure 2 It is a schematic diagram of the structure of the buffer member in the embodiment of the utility model.

[0027] In the figure:

[0028] 110, packaging container; 111, packaging inlet; 1111, packaging inlet valve; 112, packaging outlet; 1121, packaging outlet valve;

[0029] 120, buffer assembly; 121, buffer member; 1211, accommodating space; 1212, mesh partition; 122, buffer inlet pipe; 1221, buffer inlet valve; 123, buffer outlet pipe; 1231, buffer outlet valve;

[0030] 130. Exhaust gas treatment system;

[0031] 140, deposition assembly; 141, deposition member; 142, deposition inlet pipe; 1421, deposition inlet valve; 143, deposition outlet pipe; 1431, deposition outlet valve;

[0032] 210, carrier gas inlet pipe; 211, carrier gas inlet valve; 220, mixing flow pipe; 221, mixing valve;

[0033] 230, purge pipeline; 231, purge valve;

[0034] 240, bypass pipe; 241, first bypass valve; 242, second bypass valve;

[0035] 250, connecting valve;

[0036] 260. Transfer pipe; 261. Transfer valve. DETAILED DESCRIPTION

[0037] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0041] In the semiconductor manufacturing process, precursors are decomposed into the required elements through chemical reactions and then deposited on the substrate to form a thin film. Different types of precursors can be used to manufacture a variety of semiconductor materials and form different types of semiconductor device structures. In addition to the purity and stability of the precursors, which will directly affect the quality and performance of the semiconductor materials, in the process of semiconductor material preparation, the cost of the precursor is also a key consideration for the industry's R&D and production units.

[0042] With the development of the semiconductor industry, the market scale of the semiconductor industry has further expanded, and market competition has become increasingly fierce. Cost competitiveness is the basis of corporate competition. Only by improving cost competitiveness can enterprises have the basis for participating in competition. However, in the current market, the production costs of semiconductor companies are still very high, mainly due to the need to use expensive precursors and equipment in their manufacturing process, and the need for complex process flows. Therefore, in large-scale production, if related companies can reduce the use of precursors and reduce production costs, then they can improve the price competitiveness of their products, which is of great significance to the sustainable development of enterprises.

[0043] In the vapor deposition process, the precursor is usually filled in a closed container, and the precursor is transported to the vapor deposition reaction system by a carrier gas flow. In the preparation process of specific semiconductor materials, the transportation stability of the precursor is strictly required. In order to ensure the stability of the precursor delivery amount, in the existing conventional vapor deposition process, the carrier gas is usually passed into the precursor filling container. Before the carrier gas carries the precursor into the vapor deposition reaction system, the carrier gas carrying the precursor is usually pre-circulated through a specific pipeline for a certain period of time to ensure the stability of the carrier gas carrying the precursor flow, which can be called pre-flow; after pre-flow, the stability of the precursor flow can be ensured to ensure the stability of the gas phase reaction process, which can improve the performance stability of semiconductor products. After pre-flow, the carrier gas carrying the precursor is switched to the process pipeline for semiconductor production.

[0044] During the precursor pre-passing process, the carrier gas carrying the precursor directly flows into the exhaust system, which consumes the precursor and increases the production cost. Based on this, the utility model provides a pre-passing device and a vapor deposition system to reduce the consumption of the precursor in the pre-passing process and reduce the cost.

[0045] Combination Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the vapor deposition system in the embodiment of the utility model. Figure 2 This is a schematic diagram of the structure of the buffer component in an embodiment of the utility model. In this embodiment, a pre-passing device is provided, which is used to collect precursors carried by the carrier gas during the pre-passing process. The pre-passing device includes a packaging container 110, a carrier gas inlet pipe 210, a mixing flow pipe 220, a buffer assembly 120 and an exhaust gas treatment system 130.

[0046] The packaging container 110 has a packaging inlet 111 and a packaging outlet 112 connected to the internal cavity; the outlet end of the carrier gas inlet tube 210 is connected to the packaging inlet 111; the inlet end of the mixing flow tube 220 is connected to the packaging outlet 112, and the carrier gas carrying the precursor flows in the mixing flow tube 220; the buffer component 120 is used to collect the precursor carried in the carrier gas, the inlet end of the buffer component 120 is connected to the outlet end of the mixing flow tube 220, and the outlet end of the buffer component 120 is connected to the exhaust gas treatment system 130.

[0047] The buffer component 120 in the above-mentioned setting can collect the precursor carried by the carrier gas flowing out of the mixing flow tube 220, thereby preventing the precursor from directly entering the exhaust gas treatment system 130. The collected precursor can be reused later, thereby improving the utilization rate of the precursor. Under the premise of ensuring the stability of the precursor flow, the waste of the precursor in the pre-pass process is reduced, thereby reducing the production cost.

[0048] Regarding the specific structure of the buffer assembly 120, in some embodiments, the buffer assembly 120 includes a buffer member 121, a buffer inlet pipe 122, and a buffer outlet pipe 123. The air inlet end of the buffer member 121 and the mixed flow pipe 220 are connected through the buffer inlet pipe 122, and the air outlet end of the buffer member 121 and the exhaust gas treatment system 130 are connected through the buffer outlet pipe 123. The above arrangement enables the buffer member 121 to adapt to different position requirements through the buffer inlet pipe 122 and the buffer outlet pipe 123, expanding the application scenarios of the pre-pass device.

[0049] Regarding the structure of the buffer 121, in some embodiments, the buffer 121 includes a plurality of interconnected accommodating spaces 1211, and adjacent accommodating spaces 1211 are connected through mesh partitions 1212 to collect solid precursors. The arrangement of the plurality of accommodating spaces 1211 generates multiple vortices during the flow of the carrier gas, and the precursors carried in the carrier gas will fall to the bottom of the accommodating spaces 1211 and gradually accumulate, and can be taken out and reused later; in addition, the process of the carrier gas passing through the mesh partition 1212 will also block part of the precursor while passing through the carrier gas, thereby improving the collection effect of the precursor.

[0050] Furthermore, the buffer member 121 has an accommodating cavity inside, a plurality of accommodating partitions are arranged in the accommodating cavity at intervals to form a plurality of accommodating spaces 1211 , the accommodating partitions are provided with communicating holes, and the mesh partitions 1212 are arranged in the communicating holes.

[0051] In order to further improve the collection effect of the precursor, the connecting holes on the adjacent accommodating partitions are staggered. In other words, the projections of the connecting holes on the adjacent accommodating partitions in the direction from the air inlet end to the air outlet end of the buffer 121 do not overlap. The above arrangement increases the flow path of the carrier gas in the process of passing through the mesh partition 1212, so that the solid precursor collides with the side wall of the accommodating space 1211 and falls to the bottom of the accommodating space 1211 during the carrier gas turning process.

[0052] Furthermore, one of the connecting holes on the adjacent accommodating partitions is located at the upper end of the accommodating partition, and the other is located at the lower end of the accommodating partition. The above arrangement maximizes the path of the carrier gas flow, thereby improving the effect of precursor collection as much as possible.

[0053] In some embodiments, the buffer assembly 120 includes a buffer inlet valve 1221, which is disposed on the buffer inlet pipe 122 and is used to control the on-off of the buffer inlet pipe 122. The buffer assembly 120 includes a buffer outlet valve 1231, which is disposed on the buffer outlet pipe 123 and is used to control the on-off of the buffer outlet pipe 123. The above arrangement allows the inlet and outlet of the buffer 121 to be closed by the buffer inlet valve 1221 and the buffer outlet valve 1231, thereby preventing the internal precursor from flowing out when the buffer 121 is replaced, thereby improving the smoothness and safety of the replacement of the buffer assembly 120.

[0054] To improve the maintenance efficiency of the buffer assembly 120, in some embodiments, the pre-pass device includes a connecting valve 250, the buffer inlet pipe 122 is connected to the outlet end of the mixed flow pipe 220 via the connecting valve 250, and the buffer outlet pipe 123 is connected to the exhaust gas treatment system 130 via another connecting valve 250. The provision of the connecting valve 250 makes the installation or disassembly of the buffer assembly 120 more convenient, and improves the efficiency of subsequent maintenance.

[0055] In some embodiments, the buffer 121 includes a temperature regulating member and a collecting member, wherein the temperature regulating member is used to adjust the temperature of the buffer 121, and the collecting member is used to collect liquid precursors. Specifically, the temperature regulating member can be a heating belt, which is wrapped around the periphery of the collecting member to adjust the internal temperature of the collecting member and can keep the temperature constant, so that when the carrier gas carrying the precursor flows through the collecting member, the precursor is converted into a liquid state and collected by the collecting member after being subjected to temperature changes. The temperature regulating member is communicatively connected to the controller, and the method of controlling the temperature regulating member by the controller is well known to those skilled in the art and will not be repeated here. Of course, in other embodiments, the temperature regulation in the collecting member can be achieved by other existing technologies, and is not limited to the above content.

[0056] The buffer 121 includes a pressure regulating member and a collecting member, wherein the pressure regulating member is used to adjust the pressure of the buffer 121, and the collecting member is used to collect liquid precursors. Specifically, the pressure regulating member can be a vacuum pump, and the vacuum port of the vacuum pump is connected to the outlet of the collecting member to control the internal pressure of the collecting member, so that when the carrier gas carrying the precursor flows through the collecting member, the precursor is converted into a liquid state and collected by the collecting member after the pressure change. The pressure regulating member is communicatively connected to the controller, and the method of controlling the pressure regulating member by the controller is well known to those skilled in the art and will not be repeated here. Of course, in other embodiments, the pressure regulation in the collecting member can be achieved by other existing technologies, and is not limited to the above content.

[0057] The above arrangement allows the precursor carried by the carrier gas to be collected in the buffer 121 due to supersaturation caused by lowering the temperature. The temperature in the buffer 121 is preferably lower than the melting point of the precursor. In practice, the operation of the buffer assembly 120 can be controlled by both temperature and pressure, so that the precursor can be liquefied after entering the buffer 121. It should be noted that the specific values ​​of temperature and pressure can be set according to actual conditions, and in this embodiment, no specific limitation is made.

[0058] In some embodiments, a plurality of buffer components 120 are provided, and the plurality of buffer components 120 are arranged in series between the gas outlet end of the mixing flow tube 220 and the exhaust gas treatment system 130, so that the carrier gas enters the exhaust gas treatment system 130 after passing through the plurality of buffer components 120 in sequence. Each time the carrier gas passes through a buffer component 120, the precursor carried by the carrier gas can be collected, thereby greatly reducing the precursor content in the carrier gas that finally enters the exhaust gas treatment system 130, thereby improving the collection effect of the precursor.

[0059] In other embodiments, a plurality of buffer components 120 are arranged in parallel between the outlet end of the mixing flow tube 220 and the exhaust gas treatment system 130, so that different buffer components 120 do not affect each other, and the buffer components 120 can be replaced at any time without shutting down, thereby improving the pre-pass efficiency and the equipment utilization rate.

[0060] In order to facilitate purging of each pipeline and improve the cleanliness of each pipeline, in some embodiments, the packaging inlet 111 and the packaging outlet 112 of the packaging container 110 are respectively provided with a packaging inlet valve 1111 and a packaging outlet valve 1121; the pre-pass device includes a purge pipeline 230 and a purge valve 231, the purge valve 231 is provided in the purge pipeline 230, and the purge valve 231 is used to control the on-off of the purge pipeline 230; the purge pipeline 230 is connected between the carrier gas inlet pipe 210 and the mixed flow pipe 220. When the purge valve 231 is opened, and the packaging inlet valve 1111 and the packaging outlet valve 1121 are both closed, the carrier gas can enter the buffer 121 after passing through the purge pipeline 230 and the mixed flow pipe 220 in sequence, and purge the internal structure of the buffer 121.

[0061] In some embodiments, the pre-pass device includes a bypass pipe 240 and at least one bypass valve. The bypass pipe 240 and the buffer assembly 120 are arranged in parallel between the gas outlet end of the mixing flow pipe 220 and the tail gas treatment system 130. The bypass valve is arranged at least at one end of the bypass pipe 240 close to the gas outlet end of the mixing flow pipe 220, and is used to control the on-off of the bypass pipe 240. With the above arrangement, when the bypass valve is opened, the carrier gas can enter the tail gas treatment system 130 after passing through the purge pipeline 230, the mixing flow pipe 220 and the bypass pipe 240 in sequence, bypassing the buffer assembly 120, and purging the mixing flow pipe 220, so that the content of the precursor entering the deposition assembly 140 later is more accurate.

[0062] Specifically, the buffer outlet pipe 123 and the bypass pipe 240 are connected to one end of the transfer pipe 260 through a three-way valve, and the other end of the transfer pipe 260 is connected to the exhaust gas treatment system 130. A transfer valve 261 is provided on the transfer pipe 260. Among them, the bypass valve includes a first bypass valve 241 and a second bypass valve 242. The first bypass valve 241 is provided at one end of the bypass pipe 240 close to the gas outlet end of the mixed flow pipe 220, and the second bypass valve 242 is provided at one end of the bypass pipe 240 close to the exhaust gas treatment system 130. A carrier gas inlet valve 211 is provided on the carrier gas inlet pipe 210, and the carrier gas inlet valve 211 controls the on-off of the carrier gas inlet pipe 210.

[0063] The present embodiment also provides a vapor deposition system, which includes a deposition component 140 and a pre-pass device of any of the above embodiments. The deposition component 140 and the buffer component 120 are arranged in parallel between the gas outlet end of the mixing flow tube 220 and the exhaust gas treatment system 130. The gas inlet end and the gas outlet end of the deposition component 140 are both provided with deposition valves to control the on and off of the gas.

[0064] With the aid of the above arrangement, the carrier gas carrying the precursor is first passed through the buffer component 120 to collect the precursor. After the content of the precursor carried in the carrier gas is stabilized, it is directly switched to the deposition component 140, thereby reducing the waste of the precursor and thus reducing the cost required for the deposition process.

[0065] In this embodiment, when the purge valve 231 is opened and the package inlet valve 1111 and the package outlet valve 1121 are both closed, the carrier gas can also enter the deposition assembly 140 through the purge line 230 to purge various pipelines of the deposition assembly 140.

[0066] Specifically, a mixing valve 221 is provided on the mixing flow pipe 220 to control the on and off of the mixing flow pipe 220. The deposition assembly 140 includes a deposition member 141, a deposition inlet pipe 142 and a deposition outlet pipe 143. One end of the deposition inlet pipe 142 is connected to the inlet of the deposition member 141, and the other end of the deposition inlet pipe 142 is connected to the mixing flow pipe 220 through a three-way valve. The position where the deposition inlet pipe 142 and the mixing flow pipe 220 are connected is located between the mixing valve 221 and the package outlet valve 1121; one end of the deposition outlet pipe 143 is connected to the outlet of the deposition member 141, and the other end of the deposition outlet pipe 143 is connected to the exhaust gas treatment system 130.

[0067] Furthermore, a deposition inlet valve 1421 is provided on the deposition inlet pipe 142 to control the on-off of the deposition inlet pipe 142 , and a deposition outlet valve 1431 is provided on the deposition outlet pipe 143 to control the on-off of the deposition outlet pipe 143 .

[0068] The tail gas treatment system 130 can treat the tail gas after pre-passage or gas phase reaction deposition. The specific treatment method is not an important content of this application, so it will not be described in detail.

[0069] During the semiconductor process preparation, when the deposition component 140 needs a precursor to participate in the reaction to form a specific semiconductor thin film material, the carrier gas inlet valve 211, the package inlet valve 1111, the package outlet valve 1121 and the mixing valve 221 are opened, and the deposition inlet valve 1421 is closed. The carrier gas carries the precursor from the mixing flow pipe 220 to the buffer inlet pipe 122 and enters the buffer 121. Because the temperature inside the buffer 121 is lower, the solubility of the precursor in the carrier gas is reduced, so that the precursor is in a liquid or solid state and is collected by the buffer 121. The remaining carrier gas goes from the buffer outlet pipe 123 to the exhaust gas treatment system 130. After a specific pre-pass time, the mixing valve 221 and the transfer valve 261 are closed, the deposition inlet valve 1421 and the deposition outlet valve 1431 are opened, and the carrier gas carries the precursor from the deposition inlet pipe 142 to the deposition part 141 for production.

[0070] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A pre-pass device, characterized in that: include: A packaging container (110), wherein the packaging container (110) has a packaging inlet (111) and a packaging outlet (112) communicating with the internal cavity; A carrier gas inlet pipe (210), wherein a gas outlet end of the carrier gas inlet pipe (210) is in communication with the packaging inlet (111); A mixing flow tube (220), wherein the gas inlet end of the mixing flow tube (220) is in communication with the packaging outlet (112), and a carrier gas carrying the precursor flows in the mixing flow tube (220); A buffer component (120), the buffer component (120) is used to collect precursors carried in the carrier gas, the air inlet end of the buffer component (120) is connected to the air outlet end of the mixing flow tube (220), and the air outlet end of the buffer component (120) is connected to the exhaust gas treatment system (130).

2. The pre-pass device according to claim 1, characterized in that: The buffer assembly (120) comprises a buffer component (121), a buffer inlet pipe (122) and a buffer outlet pipe (123); an air inlet end of the buffer component (121) and the mixed flow pipe (220) are connected via the buffer inlet pipe (122), and an air outlet end of the buffer component (121) and the exhaust gas treatment system (130) are connected via the buffer outlet pipe (123).

3. The pre-pass device according to claim 2, characterized in that: The buffer (121) comprises a plurality of interconnected accommodating spaces (1211), and adjacent accommodating spaces (1211) are connected via mesh partitions (1212) to collect solid precursors.

4. The pre-pass device according to claim 2, characterized in that: The buffer assembly (120) comprises a buffer inlet valve (1221), wherein the buffer inlet valve (1221) is arranged on the buffer inlet pipe (122) and is used to control the on-off of the buffer inlet pipe (122); and / or, The buffer assembly (120) comprises a buffer outlet valve (1231), and the buffer outlet valve (1231) is arranged on the buffer outlet pipe (123) and is used to control the on-off of the buffer outlet pipe (123).

5. The pre-pass device according to claim 2, characterized in that: The pre-pass device comprises a connecting valve (250), and the buffer inlet pipe (122) and the gas outlet end of the mixing flow pipe (220) as well as the buffer outlet pipe (123) and the exhaust gas treatment system (130) are connected via the connecting valve (250).

6. The pre-pass device according to claim 2, characterized in that: The buffer (121) comprises a temperature regulating member and a collecting member, wherein the temperature regulating member is used to regulate the temperature of the buffer (121), and the collecting member is used to collect liquid precursors; and / or, The buffer (121) comprises a pressure regulating member and a collecting member, wherein the pressure regulating member is used to regulate the pressure of the buffer (121), and the collecting member is used to collect liquid precursors.

7. The pre-pass device according to claim 1, characterized in that: A plurality of the buffer components (120) are provided, and the plurality of the buffer components (120) are arranged in parallel or in series between the gas outlet end of the mixing flow pipe (220) and the exhaust gas treatment system (130).

8. The pre-pass device according to any one of claims 1 to 7, characterized in that: The packaging inlet (111) and the packaging outlet (112) of the packaging container (110) are respectively provided with a packaging inlet valve (1111) and a packaging outlet valve (1121); the pre-opening device comprises a purge pipeline (230) and a purge valve (231); the purge valve (231) is provided on the purge pipeline (230) and is used to control the on-off of the purge pipeline (230); the purge pipeline (230) is connected between the carrier gas inlet pipe (210) and the mixing flow pipe (220).

9. The pre-pass device according to claim 8, characterized in that: The pre-pass device comprises a bypass pipe (240) and at least one bypass valve, wherein the bypass pipe (240) and the buffer assembly (120) are arranged in parallel between the gas outlet end of the mixed flow pipe (220) and the exhaust gas treatment system (130); the bypass valve is arranged at least at one end of the bypass pipe (240) close to the gas outlet end of the mixed flow pipe (220) and is used to control the on-off of the bypass pipe (240).

10. A vapor deposition system, characterized in that It comprises a deposition component (140) and a pre-pass device as described in any one of claims 1 to 9, wherein the deposition component (140) and the buffer component (120) are arranged in parallel between the gas outlet end of the mixing flow pipe (220) and the exhaust gas treatment system (130), and the gas inlet end and the gas outlet end of the deposition component (140) are both provided with deposition valves to control the on-off of the gas.

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