Chip-on-film assembly of narrow-frame display screen

Abstract

The utility model discloses a chip on film component of a narrow frame display screen, which comprises a first substrate, a second substrate is arranged in the middle of the first substrate, an integrated circuit (IC) is arranged on the second substrate, and the extension area of the first substrate is larger than that of the second substrate. And the hardness of the second substrate is greater than that of the first substrate. When the chip-on-film assembly is bent, the soft first substrate absorbs most of bending deformation, bending stress is avoided, and an IC is better protected. In addition, a strip-shaped reinforcing transverse strip can be arranged on the periphery of the second substrate. The reinforcing transverse strip is connected with the first base plate in a bonding mode. When the chip-on-film assembly is bent, the reinforcing cross bars can improve the bending consistency of the first substrate, and further reduce the bending degree of the second substrate, thereby better protecting the IC.

Description

Technical Field

[0001] The utility model relates to a display device, more specifically, to a chip-on-chip film component of a narrow-frame display screen. Background Art

[0002] With the development of society, people's demand for full-screen and extremely narrow-framed display screens is increasing day by day, and high screen-to-body ratio has become the mainstream trend. Narrow-framed and full-screen display screen designs have become the mainstream. As shown in Figure 1, the current chip-on-chip assembly of the narrow-framed display screen includes a lower polarizer S1, a lower glass S2, an upper glass S3, and an upper polarizer S4. A film S5 is provided on the lower glass S2. Usually, the IC (i.e., integrated circuit) on the glass is changed to be bound to the film S5. However, since the film is flexible, in actual applications, the IC often breaks during bending and assembly operations.

[0003] Chinese patent document CN202121018756.0 discloses a conveniently detachable narrow-frame display screen, including an upper outer frame, the upper outer frame is in the shape of an elongated strip, the left and right ends of the upper outer frame are both hinged with a strip frame, the lower end of the strip frame is clamped with a right-angle frame, and the right-angle frames are fixedly connected by a lower outer frame. The inner sides of the upper outer frame, the lower outer frame, the right-angle frame and the strip frame are all provided with a placement groove for placing the display screen, the lower side of the right-angle frame is provided with an alignment groove, the left and right ends of the lower outer frame are provided with a convex block clamped with the alignment groove, the front side of the lower outer frame is provided with a slide groove, a limited block is slidably connected in the slide groove, a spring is provided above the limited block, the left and right ends of the spring are both connected to the clamping block, the clamping block protrudes from the lower outer frame, and a groove for placing the clamping block is provided on the right-angle frame. The outer side of the lower end of the bar frame is provided with a right-angled notch, and a snap-in groove 1 is provided on the notch. A convex strip matching the notch is provided on the inner side of the upper end of the right-angle frame, and a convex block snapped into the snap-in groove 1 is fixed on the inner side of the convex strip. An elastic pad is fixed on the lower side of the snap-in groove 1, and the upper side of the elastic pad is inclined toward the inner upper end, so that the snap-in is more stable. A snap-in groove 2 is provided on the lower side of the notch of the bar frame, and a convex point snapped into the snap-in groove 2 is fixed on the upper end of the right-angle frame. The upper end of the limit block is triangular, and the contact surface between the limit block and the snap-in block is a rough inclined surface for adjusting the position of the snap-in block. The lower end of the bar frame is snap-in with a bottom frame, and the bottom frame and the bar frame are fixedly connected by bolts. The contact surface between the bottom frame and the bar frame is inclined at a 45-degree angle with the horizontal plane. The inner sides of the upper outer frame, the bar frame and the bottom frame are all provided with a placement groove for placing the display screen.

[0004] Obviously, this patent is to install the display screen in steps by splitting the frame, avoiding inserting the display screen into the placement slot for a long time and reducing the pressure of the hand on the display screen during installation, but it cannot solve the bending problem of the chip-on-chip film component of the display screen.

[0005] CN201310708475.1 discloses a display screen for realizing ultra-narrow frame, including a display panel and a driving circuit, characterized in that the driving circuit includes a driving signal sending end for connecting to an external driving board and a driving signal receiving end for transmitting driving signals to each pixel in the display panel, the driving signal sending end is set independently of the display panel, the driving signal receiving end is built into the display panel, and the driving signal sending end is wirelessly connected to the driving signal receiving end. The driving signal receiving end uses the gap between pixels in the display panel and / or the sealing area of ​​the display panel to complete the circuit arrangement. The driving signal receiving end is made in the display panel by film forming and etching on the substrate of the display panel. The driving signal sending end includes a front-end signal format converter for receiving the driving signal transmitted by the external driving board and a signal transmitter connected to the front-end signal format converter, and the signal transmitter is connected to the driving signal receiving end by wireless means. The driving signal receiving end includes a signal receiver connected to the signal transmitter by wireless means and a rear-end signal format converter connected to the signal receiver, and the rear-end signal format converter transmits the format-converted driving signal to each pixel of the display panel. The driving signal transmitting end also includes a parallel-to-serial converter for converting the multi-channel parallel driving signals sent by the external driving board into a single-channel serial driving signal, and the parallel-to-serial converter transmits the single-channel serial driving signal to the front-end signal format converter; the driving signal receiving end also includes a serial-to-parallel converter, and the back-end signal format converter transmits the format-converted driving signal to the serial-to-parallel converter, and the serial-to-parallel converter converts the driving signal into multi-channel parallel signals and outputs them to each pixel. The display panel is a glass substrate. The display panel is a flexible transparent substrate.

[0006] Obviously, the patent separates the sending and receiving structures of the drive signal. The drive signal sending end is independent of the display screen, and the drive signal receiving end is built into the display panel. The drive signal sending end and the drive signal receiving end are connected wirelessly. This method completely eliminates the drive wiring area of ​​the frame around the display panel, thereby reducing the width of the non-display frame. This process cost is relatively high. Utility Model Content

[0007] Based on this, it is necessary to provide a flip chip film assembly for a narrow-frame display screen in response to the above technical problems, comprising a first substrate, a second substrate is provided in the middle of the first substrate, an IC is provided on the second substrate, and the extension area of ​​the first substrate is larger than that of the second substrate. The hardness of the second substrate is greater than that of the first substrate. When the flip chip film assembly is bent, the softer first substrate absorbs most of the bending deformation to avoid bending stress, thereby better protecting the IC. In addition, a strip-shaped reinforcing horizontal bar can be provided around the periphery of the second substrate. The reinforcing horizontal bar is adhesively connected to the first substrate. When the flip chip film assembly is bent, the reinforcing horizontal bar can improve the bending consistency of the first substrate and further reduce the bending degree of the second substrate, thereby better protecting the IC.

[0008] A chip-on-film assembly for a narrow-border display screen, characterized in that the chip-on-film assembly for the narrow-border display screen comprises a first substrate, a second substrate is provided in the middle of the first substrate, an IC is provided on the second substrate, and the extension area of ​​the first substrate is larger than that of the second substrate.

[0009] As a preferred implementation of the chip-on-film assembly of the narrow-frame display screen provided by the present invention, the hardness of the second substrate is greater than that of the first substrate.

[0010] As a preferred implementation of the chip-on-film assembly of the narrow-frame display screen provided by the utility model, a strip-shaped reinforcing horizontal strip is arranged around the periphery of the second substrate.

[0011] As a preferred implementation of the chip-on-film assembly of the narrow-frame display screen provided by the utility model, the reinforcing horizontal bar is bonded and connected to the first substrate.

[0012] As a preferred implementation of the chip-on-film assembly of the narrow-frame display screen provided by the utility model, the hardness of the reinforcing horizontal strip is greater than that of the first substrate and less than that of the second substrate.

[0013] As a preferred implementation of the chip-on-film assembly of the narrow-frame display screen provided by the utility model, an insulating covering layer is provided on the surface of the IC.

[0014] As a preferred implementation of the chip-on-film assembly of the narrow-frame display screen provided by the utility model, the insulating covering layer completely covers the second substrate.

[0015] As a preferred implementation of the chip-on-film assembly of the narrow-frame display screen provided by the utility model, the insulating covering layer is a high-temperature resin.

[0016] As a preferred implementation of the chip-on-film assembly of the narrow-frame display screen provided by the utility model, a plurality of heat dissipation openings are arranged on the top of the insulating cover layer.

[0017] As a preferred implementation of the chip-on-film assembly of the narrow-frame display screen provided by the utility model, the cross-section of the insulating cover layer is trapezoidal.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] When the flip chip assembly is bent, the softer first substrate absorbs most of the bending deformation, avoiding bending stress, thereby better protecting the IC.

[0020] In addition, a strip-shaped reinforcing bar can be provided around the second substrate. The reinforcing bar is bonded to the first substrate. When the flip chip assembly is bent, the reinforcing bar can improve the bending consistency of the first substrate and further reduce the bending degree of the second substrate, thereby better protecting the IC.

[0021] In addition, an insulating covering layer can be provided on the surface of the IC. The insulating covering layer completely covers the second substrate. By using the insulating covering layer, since the insulating covering layer completely covers the second substrate, the insulation performance of the IC can be effectively improved, and the leakage current between the IC and the first substrate and the second substrate can be reduced, thereby reducing energy consumption.

[0022] In addition, a plurality of heat dissipation openings may be provided on the top of the insulating cover layer, which are beneficial to the heat dissipation of the IC, thereby improving the stability and reliability of the circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the scheme in the utility model, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] FIG1 is a schematic structural diagram of a COF structure of an existing display screen;

[0025] FIG2 is a schematic structural diagram of a chip-on-film assembly of a narrow-frame display screen of the present invention;

[0026] FIG3 is a schematic structural diagram of a chip-on-film assembly of the narrow-frame display screen in FIG2 , which is a side view;

[0027] FIG4 is a schematic structural diagram of a chip-on-film assembly of a narrow-frame display screen of the present invention, which is another embodiment;

[0028] FIG5 is a schematic structural diagram of a chip-on-film assembly of a narrow-frame display screen of the present invention, which is another embodiment;

[0029] FIG6 is a schematic structural diagram of a chip-on-film assembly of a narrow-frame display screen of the present invention, which is another embodiment;

[0030] The markings in the figure are as follows: 1. first substrate; 2. second substrate; 3. IC; 4. insulating cover layer; 5. heat dissipation opening; 6. reinforcing horizontal bar. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the solution of the utility model, the following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0032] As described in the background technology, for smartphones, with the development of society, people's demand for full-screen and extremely narrow-framed display screens is increasing day by day, and high screen-to-body ratio has become the mainstream trend. Narrow-framed and full-screen display screen designs have become the mainstream. As shown in Figure 1, the current chip-on-chip film assembly of the narrow-framed display screen includes a lower polarizer S1, a lower glass S2, an upper glass S3 and an upper polarizer S4. A film S5 is provided on the lower glass S2. Usually, the IC (i.e., integrated circuit) on the glass is changed to be bound to the film S5. However, since the film is flexible, in actual applications, the IC often breaks during bending and assembly operations.

[0033] In order to solve this technical problem, the chip-on-film assembly of the narrow-frame display screen includes a first substrate 1, a second substrate 2 is provided in the middle of the first substrate 1, an IC 3 is provided on the second substrate 2, and the extension area of ​​the first substrate 1 is at least three times greater than that of the second substrate 2. The hardness of the second substrate 2 is greater than that of the first substrate 1. The thickness of the second substrate 2 can be equal to the thickness of the first substrate 1, and can also be greater than the thickness of the first substrate 1.

[0034] Through the above structural design, when the flip chip assembly is bent, the relatively soft first substrate 1 absorbs most of the bending deformation, avoiding bending stress, thereby better protecting the IC3.

[0035] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0036] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0038] Example 1

[0039] As shown in FIG. 2 and FIG. 3 , the chip-on-film assembly of the narrow-frame display screen includes a first substrate 1 , a second substrate 2 is disposed in the middle of the first substrate 1 , an IC 3 is disposed on the second substrate 2 , and the extension area of ​​the first substrate 1 is at least three times greater than that of the second substrate 2 .

[0040] It should be noted that the hardness of the second substrate 2 is greater than that of the first substrate 1. The thickness of the second substrate 2 may be equal to the thickness of the first substrate 1 or may be greater than the thickness of the first substrate 1.

[0041] The working mode of this embodiment is described below.

[0042] When the flip chip assembly is bent, the softer first substrate 1 absorbs most of the bending deformation to avoid bending stress, thereby better protecting the IC3.

[0043] Example 2

[0044] As shown in FIG. 4 , the chip-on-film assembly of the narrow-frame display screen provided in Example 1 is further optimized. Specifically, a strip-shaped reinforcing horizontal strip 6 is provided around the second substrate 2 .

[0045] It should be noted that the reinforcing bar 6 is bonded to the first substrate 1 .

[0046] The working method of this embodiment is described below.

[0047] When the chip-on-film assembly is bent, the reinforcing bar 6 can improve the bending consistency of the first substrate 1 and further reduce the bending degree of the second substrate 2, thereby better protecting the IC 3.

[0048] Example 3

[0049] As shown in FIG. 5 , the chip-on-film assembly of the narrow-frame display screen provided in Embodiment 1 or 2 is further optimized. Specifically, an insulating covering layer 4 is provided on the surface of the IC3.

[0050] It should be noted that the insulating cover layer 4 completely covers the second substrate 2 .

[0051] In addition, the insulating cover layer 4 is made of high temperature resin and has a trapezoidal cross section.

[0052] The working mode of this embodiment is described below.

[0053] By using the insulating cover layer 4, since the insulating cover layer 4 completely covers the second substrate 2, the insulation performance of the IC3 can be effectively improved, and the leakage current between the IC3 and the first substrate 1 and the second substrate 2 can be reduced, thereby reducing energy consumption.

[0054] Example 4

[0055] As shown in FIG. 6 , the chip-on-film assembly of the narrow-frame display screen provided in Embodiment 1 or 2 is further optimized. Specifically, a plurality of heat dissipation openings 5 ​​are provided on the top of the insulating cover layer 4 .

[0056] The working mode of this embodiment is described below.

[0057] The heat dissipation opening 5 is used to facilitate heat dissipation of the IC 3 , thereby improving the stability and reliability of the circuit.

[0058] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A chip-on-film assembly for a narrow-frame display screen, characterized in that: The chip-on-film assembly of the narrow-frame display screen comprises a first substrate (1), a second substrate (2) is provided in the middle of the first substrate (1), and the second substrate (2) is provided in the middle of the first substrate (1). An IC (3) is provided on the second substrate (2); the extension area of ​​the first substrate (1) is larger than that of the second substrate (2); the hardness of the second substrate (2) is greater than that of the first substrate (1); and the second substrate (2) The thickness is greater than or equal to the thickness of the first substrate (1).

2. The chip-on-film assembly for a narrow-frame display screen according to claim 1, characterized in that: The second substrate (2) is provided with a strip-shaped reinforcing horizontal strip (6) around its periphery.

3. The chip-on-film assembly for a narrow-frame display screen according to claim 2, wherein: The reinforcing horizontal strip (6) is bonded to the first substrate (1).

4. The chip-on-film assembly for a narrow-frame display screen according to claim 2, wherein: The hardness of the reinforcing horizontal strip (6) is greater than that of the first substrate (1) and less than that of the second substrate (2).

5. The chip-on-film assembly for a narrow-frame display screen according to claim 1, characterized in that: An insulating covering layer (4) is provided on the surface of the IC (3).

6. The chip-on-film assembly for a narrow-frame display screen according to claim 5, characterized in that: The insulating covering layer (4) completely covers the second substrate (2).

7. The chip-on-film assembly for a narrow-frame display screen according to claim 5, characterized in that: The insulating covering layer (4) is a high-temperature resin.

8. The chip-on-film assembly for a narrow-frame display screen according to claim 5, characterized in that: A plurality of heat dissipation openings (5) are provided on the top of the insulating cover layer (4).

9. The chip-on-film assembly for a narrow-frame display screen according to claim 5, characterized in that: The cross section of the insulating covering layer (4) is trapezoidal.

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