Structure for reducing thickness of backlight rubber frame

Abstract

The utility model relates to a structure for reducing the thickness of a backlight rubber frame. The structure for reducing the thickness of the backlight rubber frame comprises a rubber frame, an injection molding assembly, a fixing assembly and a positioning assembly, wherein a groove is formed in the middle of the rubber frame; the injection molding assembly comprises a first sizing material part and a second sizing material part, and the first sizing material part and the second sizing material part are located on the two sides of the groove; the fixing assembly is arranged on the rubber frame; the positioning assembly is arranged on the rubber frame. According to the scheme provided by the invention, the thickness of the backlight rubber frame can be reduced under the condition of low cost, and the rubber material can be ensured to flow more uniformly during injection molding.

Description

Technical Field

[0001] The utility model relates to the technical field of display screens, in particular to a structure for reducing the thickness of a backlight glue frame. Background Art

[0002] In order to facilitate office work or travel, more and more consumers will prefer thin and light electronic display products.

[0003] In the related art, in order to make electronic display products thinner and lighter, the thickness of the backlight film is usually reduced and the bottom of the glue frame is made thinner. However, reducing the thickness of the backlight film will increase the cost accordingly, and the part of the bottom of the glue frame that is too thin, that is, the thin part, will easily cool down the glue during injection molding, thereby hindering the flow of the glue, resulting in insufficient filling of the glue. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a structure for reducing the thickness of a backlight glue frame, which can reduce the thickness of the backlight glue frame at a low cost and ensure that the glue flows more evenly during injection molding.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] The first aspect of the present application provides a structure for reducing the thickness of a backlight glue frame, comprising: a glue frame, a groove is opened in the middle of the glue frame; an injection molding component, the injection molding component includes a first glue part and a second glue part, the first glue part and the second glue part are located on both sides of the groove; a fixing component, the fixing component is arranged on the glue frame; and a positioning component is arranged on the glue frame.

[0007] The fixing assembly comprises a first clamping block, and the first clamping block is arranged on the glue frame.

[0008] The fixing assembly comprises a second clamping block, and the second clamping block is arranged on the glue rack.

[0009] The fixing assembly comprises a third clamping block, and the third clamping block is arranged on the glue rack.

[0010] The fixing assembly comprises a fourth clamping block, and the fourth clamping block is arranged on the glue rack.

[0011] The positioning assembly includes a first supporting column, and the first supporting column is arranged on the glue rack.

[0012] The positioning assembly includes a second supporting column, and the second supporting column is arranged on the glue rack.

[0013] The glue rack is also provided with a containing cavity.

[0014] A backlight assembly is also included, and the backlight assembly is arranged in the accommodating cavity.

[0015] The cross-sectional structure of the groove is a rectangular structure.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The present application provides a groove in the middle of the original rubber frame. During the injection molding process, the groove is correspondingly provided in the injection mold, and then the rubber flows in from both sides of the groove. Due to the provision of the groove, the flow path of the rubber is reduced, which is more conducive to the molding of the rubber frame, that is, the first rubber part and the second rubber part on both sides of the groove can be quickly molded with less rubber and thinner thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 It is a schematic structural diagram of a structure for reducing the thickness of a backlight adhesive frame in an embodiment of the utility model;

[0020] Figure 2 It is a structural schematic diagram of another implementation method of the structure for reducing the thickness of the backlight glue frame in one embodiment of the utility model. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0022] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0023] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0024] In the related art, in order to make electronic display products thinner and lighter, the thickness of the backlight film is usually reduced and the bottom of the glue frame is made thinner. However, reducing the thickness of the backlight film will increase the cost accordingly, and the part of the bottom of the glue frame that is too thin, that is, the thin part, will easily cool down the glue during injection molding, thereby hindering the flow of the glue, resulting in insufficient filling of the glue.

[0025] In view of the above problems, an embodiment of the present application provides a structure for thinning the thickness of a backlight glue frame, which can reduce the thickness of the backlight glue frame at a low cost and can also ensure that the glue flows more evenly during injection molding.

[0026] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0027] See also Figure 1 A structure for reducing the thickness of a backlight glue frame includes: a glue frame 100, an injection molding component 200, a fixing component 300 and a positioning component 400. A groove 110 is opened in the middle of the glue frame 100; the injection molding component 200 includes a first glue part 210 and a second glue part 220, and the first glue part 210 and the second glue part 220 are located on both sides of the groove 110; the fixing component 300 is arranged on the glue frame 100; and the positioning component 400 is arranged on the glue frame 100.

[0028] It should be noted that the first adhesive part 210 and the second adhesive part 220 are formed by injection molding. The present application opens a groove 110 in the middle of the original adhesive frame 100. That is, during the injection molding process, a groove is correspondingly set in the injection mold, and then the adhesive flows in from both sides of the groove. Since the groove is set, the flow stroke of the adhesive is reduced, which is more conducive to the molding of the adhesive frame 100. That is, the first adhesive part 210 and the second adhesive part 220 on both sides of the groove 100 can be quickly molded with less adhesive and thinner thickness. Among them, the groove 110 is located at the center of the adhesive frame 100, and the fixing component 300 and the positioning component 400 are both used to fix and position the circuit board.

[0029] See also Figure 1In one embodiment, the fixing assembly 300 includes a first clamping block 310, and the first clamping block 310 is disposed on the glue rack 100. Specifically, the fixing assembly 300 includes a second clamping block 320, and the second clamping block 320 is disposed on the glue rack 100. Specifically, the fixing assembly 300 includes a third clamping block 330, and the third clamping block 330 is disposed on the glue rack 100. Specifically, the fixing assembly 300 includes a fourth clamping block 340, and the fourth clamping block 340 is disposed on the glue rack 100.

[0030] It should be noted that the first clamping block 310, the second clamping block 320, the third clamping block 330 and the fourth clamping block 340 are used to install the circuit board. Among them, the first clamping block 310 is provided with a first inclined portion, and the second clamping block 320 is provided with a second inclined portion. By providing the first inclined portion and the second inclined portion, when the circuit board needs to be removed, an inclined slope is provided so that it can slide out easily. That is, the provision of the first inclined portion and the second inclined portion is to facilitate the removal and installation of the circuit board.

[0031] See also Figure 1 In one embodiment, the positioning assembly 400 includes a first support column 410 , and the first support column 410 is disposed on the glue rack 100 . Specifically, the positioning assembly 400 includes a second support column 420 , and the second support column 420 is disposed on the glue rack 100 .

[0032] It should be noted that the first support column 410 and the second support column 420 are used to penetrate holes of a circuit board to play a positioning role.

[0033] See also Figure 2 In one embodiment, the plastic frame 100 is further provided with a receiving cavity 120 . Specifically, the plastic frame 100 further includes a backlight assembly 500 , which is disposed in the receiving cavity 120 .

[0034] It should be noted that the accommodating cavity 120 is used to install a backlight component 500 such as a light guide plate.

[0035] See also Figure 1 In one embodiment, the cross-sectional structure of the groove 110 is a rectangular structure. It should be noted that the cross-sectional structure of the groove 110 can be a rectangular structure or a structure of other shapes.

[0036] The present application provides a groove in the middle of the original rubber frame. During the injection molding process, the rubber flows in from both sides of the groove. Due to the provision of the groove, the flow path of the rubber is reduced, which is more conducive to the molding of the rubber frame, that is, the first rubber part and the second rubber part on both sides of the groove can be molded quickly with less rubber and thinner thickness.

[0037] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the various embodiments have their own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application can be adjusted in order, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.

[0038] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A structure for reducing the thickness of a backlight adhesive frame, characterized in that: include: A glue rack, wherein a groove is formed in the middle of the glue rack; An injection molding component, the injection molding component comprising a first rubber part and a second rubber part, wherein the first rubber part and the second rubber part are located at two sides of the groove; A fixing component, the fixing component is arranged on the glue frame; A positioning component is arranged on the glue rack.

2. The structure for reducing the thickness of the backlight adhesive frame according to claim 1, characterized in that: The fixing assembly comprises a first clamping block, and the first clamping block is arranged on the glue frame.

3. The structure for reducing the thickness of the backlight adhesive frame according to claim 1, characterized in that: The fixing assembly comprises a second clamping block, and the second clamping block is arranged on the glue rack.

4. The structure for reducing the thickness of the backlight adhesive frame according to claim 1, characterized in that: The fixing assembly comprises a third clamping block, and the third clamping block is arranged on the glue rack.

5. The structure for reducing the thickness of the backlight adhesive frame according to claim 1, characterized in that: The fixing assembly comprises a fourth clamping block, and the fourth clamping block is arranged on the glue rack.

6. The structure for reducing the thickness of the backlight adhesive frame according to claim 1, characterized in that: The positioning assembly includes a first supporting column, and the first supporting column is arranged on the glue rack.

7. The structure for reducing the thickness of the backlight adhesive frame according to claim 1, characterized in that: The positioning assembly includes a second supporting column, and the second supporting column is arranged on the glue rack.

8. The structure for reducing the thickness of the backlight adhesive frame according to claim 1, characterized in that: The glue rack is also provided with a containing cavity.

9. The structure for reducing the thickness of the backlight adhesive frame according to claim 8, characterized in that: A backlight assembly is also included, and the backlight assembly is arranged in the accommodating cavity.

10. The structure for reducing the thickness of the backlight adhesive frame according to claim 1, characterized in that: The cross-sectional structure of the groove is a rectangular structure.

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