Heat insulation film layer and heat insulation circuit board thereof

Abstract

The utility model discloses a heat insulation film layer and a heat insulation circuit board thereof, comprising an adhesive layer, an aerogel layer, a uniform heat layer and a protective layer which are laminated together in sequence. The adhesive layer is used for being bonded with a heating body, the aerogel layer is used for heat insulation and heat transfer, the heat uniformizing layer is used for uniformizing heat transfer, the protective layer is used for protecting the aerogel layer and the heat uniformizing layer, the heat insulation film layer covers a component which is severe in heating, such as a heating IC, and then the surface of the heating IC is not exposed. Therefore, a tester and a user do not touch a heating IC by mistake and only touch the heat insulation film layer with certain heat insulation performance, so that scald is avoided.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a heat-insulating film layer and a heat-insulating circuit board thereof. Background Art

[0002] In the prior art, the USB components in the camera module using multiple electronic components are usually equipped with multiple voltage conversion ICs. When such ICs are working, the surface temperature rises quickly, and it can rise to above 70°C in 1-2 minutes. Both testers and users are at risk of being burned by accidentally touching the IC surface during contact. Therefore, it is urgent to propose a structure for heat insulation treatment of such ICs. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a heat-insulating film layer and a heat-insulating circuit board thereof.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A heat-insulating film layer comprises: an adhesive layer, an aerogel layer, a heat-leveling layer and a protective layer, wherein the adhesive layer, the aerogel layer, the heat-leveling layer and the protective layer are stacked together in sequence.

[0006] In one embodiment, the uniform heat layer is one of a graphite sheet, a graphene sheet, and a carbon nanotube sheet.

[0007] In one embodiment, the adhesive layer is an epoxy resin layer.

[0008] In one embodiment, the thickness of the adhesive layer is in the range of 0.02 mm to 0.2 mm.

[0009] In one embodiment, the thickness of the aerogel layer is in the range of 0.02 mm to 0.2 mm.

[0010] In one embodiment, the thickness of the heat-leveling layer is in the range of 0.02 mm to 0.5 mm.

[0011] In one embodiment, the thickness of the protective layer is in the range of 0.01 mm to 0.1 mm.

[0012] A heat-insulating circuit board comprises the above-mentioned heat-insulating film layer, and further comprises: a circuit board and an IC, wherein the IC is welded on the circuit board, and the heat-insulating film layer is adhered to the IC through the adhesive layer.

[0013] In one embodiment, the thermal insulation film layer is adhered to the top surface of the IC.

[0014] In one embodiment, the circuit board is a PCB.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] 1. The thermal insulation film layer and the thermal insulation circuit board of the utility model are provided with an adhesive layer, an aerogel layer, a uniform heat layer and a protective layer. The adhesive layer, the aerogel layer, the uniform heat layer and the protective layer are stacked together in sequence. The adhesive layer is used for bonding with the heating element, the aerogel layer is used for heat insulation and heat transfer, the uniform heat layer is used for uniform heat transfer, and the protective layer is used for protecting the aerogel layer and the uniform heat layer. The thermal insulation film layer is covered on components that generate a lot of heat, such as a heating IC, so that the surface of the heating IC is not exposed, so that the tester and the user will not accidentally touch the heating IC, but will only touch the thermal insulation film layer with certain thermal insulation performance, thereby avoiding burns.

[0017] 2. The thermal insulation film layer and the thermal insulation circuit board of the utility model use the thermal insulation film to be attached to the top surface or the side surface of the IC, which can protect the IC from external impact and play a buffering and protective role. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 It is a schematic structural diagram of a heat-insulating film layer in one embodiment of the utility model;

[0020] Figure 2 It is a schematic structural diagram of a heat-insulating circuit board in one embodiment of the utility model.

[0021] Reference numerals:

[0022] Thermal insulation film layer 100 , adhesive layer 11 , aerogel layer 12 , heat-leveling layer 13 , protective layer 14 , thermal insulation circuit board 200 , circuit board 21 , and IC 22 . DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0024] This application proposes a thermal insulation film layer 100, see Figure 1, including an adhesive layer 11, an aerogel layer 12, a uniform heat layer 13 and a protective layer 14. The adhesive layer 11, the aerogel layer 12, the uniform heat layer 13 and the protective layer 14 are stacked together in sequence. The adhesive layer 11 is used for bonding with the heating element, the aerogel layer 12 is used for heat insulation and heat transfer, the uniform heat layer 13 is used for uniform heat transfer, and the protective layer 14 is used to protect the aerogel layer 12 and the uniform heat layer 13. The thermal insulation film layer 100 is covered on components that generate a lot of heat, such as the heating IC 22, so that the surface of the heating IC 22 is not exposed, so that the tester and the user will not accidentally touch the heating IC 22, but will only touch the thermal insulation film layer 100 with certain thermal insulation performance, thereby avoiding burns. After the thermal insulation film layer is attached to the IC, it needs to be compacted with relevant jigs to prevent it from falling off.

[0025] It should be noted that if the ICs 22 are relatively dispersed, the thermal insulation film layer 100 can be sequentially attached to the surface and side of the ICs 22. If the ICs 22 are relatively concentrated, a larger thermal insulation film layer 100 can be used to cover the surface and side of all the ICs 22.

[0026] In one embodiment, the uniform heat layer 13 is one of a graphite sheet, a graphene sheet, and a carbon nanotube sheet, which can transfer heat evenly, thereby reducing the temperature in the heat-generating components, allowing the heat to be conducted away, and preventing the heat-generating components from being burned.

[0027] The adhesive layer 11 of the present application adopts a self-curing epoxy resin layer, which reduces the process of heat curing and the like, improves work efficiency, and reduces labor costs.

[0028] Preferably, the thickness of the adhesive layer 11 is in the range of 0.02 mm to 0.2 mm.

[0029] Preferably, the thickness of the aerogel layer 12 is in the range of 0.02 mm to 0.2 mm. The aerogel layer 12 has the characteristics of high porosity and low density. It mainly plays a heat insulating role to prevent people from being scalded, but also has the function of heat transfer to conduct heat from the heating components, thereby preventing heat from accumulating on the components, thereby protecting the heating components.

[0030] Preferably, the thickness of the heat-leveling layer 13 is in the range of 0.02 mm to 0.5 mm.

[0031] Preferably, the thickness of the protective layer 14 is in the range of 0.01 mm to 0.1 mm.

[0032] This application proposes a heat-insulated circuit board 200, see Figure 1 and Figure 2, including the above-mentioned thermal insulation film layer 100, and also including: a circuit board 21 and an IC22, the IC22 is welded on the circuit board 21, and the thermal insulation film layer 100 is adhered to the IC22 through the adhesive layer 11. The thermal insulation film layer 100 is covered on the IC22, so that the surface of the heating IC22 is not exposed, so that the tester and the user will not accidentally touch the heating IC22, but will only touch the thermal insulation film layer 100 with certain thermal insulation performance, thereby avoiding burns and providing certain protection for the staff. In addition, the use of thermal insulation film attached to the top or side of the IC can protect the IC from external force impact, and has a buffering and protective effect.

[0033] Because the staff accidentally touches the heating IC22, usually the top surface of IC22, so the thermal insulation film layer 100 is adhered to the top surface of IC22. Adhering only to the top surface of IC22 can also reduce the use of raw materials, and the side of IC22 is not adhered to the thermal insulation film layer 100, which can be used for the heat dissipation of IC22, preventing the heat accumulation in IC22 and causing damage to IC22 and circuit board 21, thereby further improving the service life of the product, but the side of IC22 can also be attached with the thermal insulation film layer 100. In addition, because the structural strength of PCB is higher than that of FPC, it can withstand higher temperatures and is not easy to deform, so the circuit board 21 of the present application is PCB.

[0034] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A thermal insulation film layer, characterized in that: include: An adhesive layer, an aerogel layer, a heat-leveling layer and a protective layer, wherein the adhesive layer, the aerogel layer, the heat-leveling layer and the protective layer are stacked together in sequence.

2. The thermal insulation film layer according to claim 1, characterized in that: The uniform heat layer is one of a graphite sheet, a graphene sheet, and a carbon nanotube sheet.

3. The thermal insulation film layer according to claim 1, characterized in that: The adhesive layer is an epoxy resin layer.

4. The thermal insulation film layer according to claim 1, characterized in that: The thickness of the adhesive layer is in the range of 0.02 mm to 0.2 mm.

5. The thermal insulation film layer according to claim 1, characterized in that: The thickness of the aerogel layer ranges from 0.02 mm to 0.2 mm.

6. The thermal insulation film layer according to claim 1, characterized in that: The thickness of the uniform heat layer ranges from 0.02 mm to 0.5 mm.

7. The thermal insulation film layer according to claim 1, characterized in that: The thickness of the protective layer is in the range of 0.01 mm to 0.1 mm.

8. A thermal insulation circuit board, comprising the thermal insulation film layer according to any one of claims 1 to 7, characterized in that: Also includes: A circuit board and an IC, wherein the IC is soldered on the circuit board, and the thermal insulation film layer is adhered to the IC through the adhesive layer.

9. The heat-insulated circuit board according to claim 8, characterized in that: The thermal insulation film layer is adhered to the top surface of the IC.

10. The heat-insulated circuit board according to claim 8, characterized in that: The circuit board is a PCB.

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