Cooling device for data center processor

By designing simplified liquid-cooling cabinets and circulation devices, the problem of cumbersome connection of existing liquid-cooling devices is solved, reducing costs and improving cooling efficiency, and is suitable for cooling of data center processors.

CN222356809UActive Publication Date: 2025-01-14GUANGDONG LIGHT SPEED DATA CO LTD
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Patent Information

Application Number
CN202421008677.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-10
Publication Date
2025-01-14
Estimated Expiration
2034-05-10

AI Technical Summary

Technical Problem

The existing liquid cooling devices are more complicated to connect in the cooling system of the data center processor, which increases construction and production costs.

Method used

A data center processor cooling device including a liquid cooling cabinet and a circulation device is designed. The circulation device consists of a temperature sensor, a controller, a first liquid pump, a liquid storage tank, a second liquid pump and a cooling box, and is monitored by a temperature sensor. It also controls the operation of the liquid pump and heat dissipation pipe to realize the circulation and recycling of coolant, simplifying the connection process.

Benefits of technology

It achieves simplicity of connection, reduces production costs, and improves cooling efficiency, and is suitable for data center processors of different specifications.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model is applied to the field of data center cooling devices, in particular to a data center processor cooling device, which comprises a liquid cooling cabinet and a circulating device connected with the liquid cooling cabinet, the circulating device comprises a temperature sensor, a controller, a first liquid pump, a liquid storage tank, a second liquid pump, a cooling tank and a third liquid pump, the liquid cooling cabinet, the first liquid pump, the liquid storage tank, the second liquid pump, the cooling tank and the third liquid pump are sequentially connected through a circulating pipe, the temperature sensor is placed in the liquid cooling cabinet and electrically connected with the controller, and the first liquid pump, the second liquid pump and the third liquid pump are connected with the controller. The liquid cooling cabinet, the first liquid pump, the liquid storage tank, the second liquid pump, the cooling tank and the third liquid pump are sequentially connected through the circulating pipe, so that the connection is simple and convenient, and the production cost is reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of data center cooling devices, in particular to a data center processor cooling device. Background Art

[0002] Datacenter Processing Unit (DPU) plays an important role in data center application scenarios. Especially with the rise of WSC (Warehouse-scale Computer), data centers of different sizes have become the core IT infrastructure, and the use prospects of DPU are very broad.

[0003] Liquid cooling is a heat dissipation technology that uses liquid to reduce the temperature of equipment. It is widely used in electronic equipment, computer hardware, and some high-performance systems and industrial equipment. Its working principle is based on the thermal conductivity of liquid. It absorbs and discharges the heat generated by the equipment through circulating liquid to maintain the temperature of the equipment within an acceptable range. Liquid cooling technology has the advantages of good heat exchange efficiency, flexibility and good portability. The existing liquid cooling device includes a liquid storage tank, a cooling device, a radiator, a liquid pump, a cold head and a water pipe. The coolant circulation connection is relatively cumbersome, which increases the construction cost and production cost of liquid cooling. Utility Model Content

[0004] The purpose of the utility model is to provide a data center processor cooling device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a data center processor cooling device, comprising a liquid cooling cabinet and a circulation device connected to the liquid cooling cabinet, the circulation device comprising a temperature sensor, a controller, a first liquid pump, a liquid storage tank, a second liquid pump, a cooling tank and a third liquid pump, the liquid cooling cabinet, the first liquid pump, the liquid storage tank, the second liquid pump, the cooling tank and the third liquid pump are connected in sequence end to end along the circulation direction of the cooling liquid flow, the temperature sensor is placed inside the liquid cooling cabinet and electrically connected to the controller, and the first liquid pump, the second liquid pump and the third liquid pump are electrically connected to the controller respectively.

[0006] Preferably, a card slot is provided on the inner side wall of the liquid cooling cabinet, and the length of the card slot is adjustable. A limit plate for limiting the data center processor is protruded below the card slot. A first liquid inlet and a first liquid outlet are provided below the liquid cooling cabinet, and the first liquid inlet is connected to the third liquid pump, and the first liquid outlet is connected to the first liquid pump. A storage slot for placing a temperature sensor is arranged on the inner side of the liquid cooling cabinet.

[0007] Preferably, the storage groove is provided with a first through hole.

[0008] Preferably, the controller is a PLC controller.

[0009] Preferably, the liquid storage tank includes a second liquid inlet, a second liquid outlet, an accommodating space and a first serpentine heat dissipation tube fixedly arranged in the accommodating space, one end of the first serpentine heat dissipation tube is connected to the second liquid inlet, and the other end of the first serpentine heat dissipation tube is connected to the second liquid outlet.

[0010] Preferably, the first liquid pump is communicated with the second liquid inlet, and the second liquid pump is communicated with the second liquid outlet.

[0011] Preferably, the cooling box is provided with a third liquid outlet and a third liquid inlet, the third liquid pump is connected to the third liquid outlet, and the second liquid pump is connected to the third liquid inlet.

[0012] Preferably, the cooling box further comprises a second serpentine heat dissipation tube, one end of the second serpentine heat dissipation tube is connected to the third liquid outlet, and the other end of the second serpentine heat dissipation tube is connected to the third liquid inlet.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. A processor cooling device for a data center comprises a liquid cooling cabinet and a circulation device connected to the liquid cooling cabinet, wherein the circulation device comprises a temperature sensor, a controller, a first liquid pump, a liquid storage tank, a second liquid pump, a cooling tank and a third liquid pump, wherein the liquid cooling cabinet, the first liquid pump, the liquid storage tank, the second liquid pump, the cooling tank and the third liquid pump are connected end to end in sequence along the circulation direction of the cooling liquid flow, wherein the temperature sensor is placed inside the liquid cooling cabinet and is electrically connected to the controller, and the first liquid pump, the second liquid pump and the third liquid pump are electrically connected to the controller respectively, thereby realizing that the utility model is easy to connect and reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the overall structure of the cooling cabinet of the utility model;

[0017] Figure 3 It is a cross-sectional view of the cooling cabinet of the utility model;

[0018] In the figure: a liquid cooling cabinet 1, a card slot 10, a storage slot 11, a first through hole 110, a first liquid inlet 12, a first liquid outlet 13, a limit plate 14, a circulation device 2, a temperature sensor 20, a controller 21, a first liquid pump 22, a liquid storage tank 23, a second liquid pump 24, a cooling tank 25, and a third liquid pump 26. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate directions or positional relationships based on the attached Figure 1 The orientation or position relationship shown is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] like Figures 1 to 3 As shown, the present embodiment is a data center processor cooling device, comprising a liquid cooling cabinet 1 and a circulation device 2 connected to the liquid cooling cabinet 1, the circulation device 2 comprising a temperature sensor 20, a controller 21, a first liquid pump 22, a liquid storage tank 23, a second liquid pump 24, a cooling box 25 and a third liquid pump 26, the liquid cooling cabinet 1, the first liquid pump 22, the liquid storage tank 23, the second liquid pump 24, the cooling box 25 and the third liquid pump 26 are connected in sequence end to end along the cooling liquid flow circulation direction, so as to realize the overall connection of the circulation device of the present invention, the temperature sensor 20 is placed inside the liquid cooling cabinet 1 and is electrically connected to the controller 21, and the temperature monitoring function of the present invention is realized by monitoring by the temperature sensor 20, the first liquid pump 22, the second liquid pump 24 and the third liquid pump 26 are respectively electrically connected to the controller 21, and the first liquid pump 22, the second liquid pump 24 and the third liquid pump 26 are controlled by the controller 21 to realize the operation of the first liquid pump 22, the second liquid pump 24 and the third liquid pump 26.

[0023] Specifically, the liquid cooling cabinet 1 includes a card slot 10, a storage slot 11, a first liquid inlet 12, a first liquid outlet 13 and a limit plate 14. The card slot 10 includes a long card slot 10 or a short card slot 10, so that the utility model can be used to place data center processors of different specifications. A limit plate 14 for limiting the data center processor is provided below the card slot 10. A first liquid inlet 12 and a first liquid outlet 13 are provided below the limit plate 14. The first liquid inlet 12 is connected to the third liquid pump 26 through a circulation pipe. The first liquid outlet 13 is connected to the first liquid pump 22 through a circulation pipe. A storage groove 11 for placing the temperature sensor 20 is arranged on the inner side of the liquid cooling cabinet 1. The stability of the temperature sensor 20 of the utility model is enhanced by the limiting of the storage groove 11. The storage groove 11 is provided with a first through hole 110. The liquid enters the first storage groove 11 through the first through hole 110. The temperature sensor 20 is in direct contact with the liquid, thereby improving the temperature detection function of the temperature sensor 20 of the utility model more accurately.

[0024] Furthermore, the liquid storage tank 23 includes a second liquid inlet, a second liquid outlet, an accommodating space and a first serpentine heat dissipation tube, the first serpentine heat dissipation tube is arranged in the accommodating space, one end of the first serpentine heat dissipation tube is connected with the second liquid inlet, and the other end of the serpentine heat dissipation tube is connected with the second liquid outlet, the liquid extracted by the first liquid pump 22 flows to the serpentine heat dissipation tube, and the heat dissipation area is increased through the serpentine heat dissipation tube, thereby enhancing the cooling efficiency of the coolant of the utility model, the first liquid pump 22 is connected with the second liquid inlet, and the second liquid pump 24 is connected with the second liquid outlet, the first liquid pump 22 is operated to realize the recovery of the coolant, and the second liquid pump 24 is operated to realize the transportation of the coolant of the utility model.

[0025] Furthermore, the cooling box is provided with a third liquid outlet and a third liquid inlet, the third liquid pump is connected to the third liquid outlet, and the second liquid pump is connected to the third liquid inlet. Through the operation of the second liquid pump and the third liquid pump, the inflow and output of the coolant of the utility model are realized. The cooling box (25) also includes a second serpentine heat dissipation pipe, one end of the second serpentine heat dissipation pipe is connected to the third liquid outlet, and the other end of the second serpentine heat dissipation pipe is connected to the third liquid inlet. The heat dissipation area is increased by the serpentine heat dissipation pipe, and the cooling efficiency of the coolant of the utility model is improved.

[0026] Furthermore, the coolant is a fluorinated liquid.

[0027] Furthermore, the controller 21 is a PLC controller, which is a prior art, and its working principle can be referred to patent application number: CN201110192070.8.

[0028] The method of using this embodiment is as follows: The method of using this embodiment is as follows: The temperature sensor 20 in the liquid-cooling cabinet 1 detects the temperature of the coolant in the liquid-cooling cabinet 1 and transmits a temperature signal to the controller 21. When the specified temperature is reached, a signal is input to the controller 21. The controller 21 first controls the first liquid pump 22 to extract the coolant in the liquid-cooling cabinet 1, and the extracted coolant is transported to the liquid storage tank 23 for the first cooling. The controller 21 controls the third liquid pump 26 again to transport the coolant in the cooling box 25 to the liquid-cooling cabinet 1, thereby realizing the delivery of the coolant required by the liquid-cooling cabinet 1. Finally, the controller 21 controls the second liquid pump 24 to transport the coolant in the liquid storage tank 23 to the cooling box 25 for secondary cooling, thereby realizing the transmission and collection of the coolant.

[0029] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein with equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A data center processor cooling device, characterized in that: The invention comprises a liquid cooling cabinet (1) and a circulation device (2) connected to the liquid cooling cabinet (1); the circulation device (2) comprises a temperature sensor (20), a controller (21), a first liquid pump (22), a liquid storage tank (23), a second liquid pump (24), a cooling tank (25) and a third liquid pump (26); the liquid cooling cabinet (1), the first liquid pump (22), the liquid storage tank (23), the second liquid pump (24), the cooling tank (25) and the third liquid pump (26) are connected end to end in sequence along the circulation direction of the cooling liquid flow; the temperature sensor (20) is placed inside the liquid cooling cabinet (1) and is electrically connected to the controller (21); the first liquid pump (22), the second liquid pump (24) and the third liquid pump (26) are electrically connected to the controller (21) respectively.

2. A data center processor cooling device according to claim 1, characterized in that: The inner side wall of the liquid cooling cabinet (1) is provided with a slot (10), the length of the slot (10) is adjustable, a limit plate (14) for limiting the position of a data center processor is protruding below the slot (10), a first liquid inlet (12) and a first liquid outlet (13) are provided below the liquid cooling cabinet (1), the first liquid inlet (12) is connected to a third liquid pump (26), and the first liquid outlet (13) is connected to a first liquid pump (22), and a storage slot (11) for placing a temperature sensor (20) is arranged on the inner side surface of the liquid cooling cabinet (1).

3. A data center processor cooling device according to claim 2, characterized in that: The storage groove (11) is provided with a first through hole (110).

4. A data center processor cooling device according to claim 2, characterized in that: The controller (21) is a PLC controller (21).

5. The data center processor cooling device according to claim 1, characterized in that: The liquid storage tank (23) comprises a second liquid inlet, a second liquid outlet, an accommodating space, and a first serpentine heat dissipation tube fixedly arranged in the accommodating space, one end of the first serpentine heat dissipation tube being connected to the second liquid inlet, and the other end of the first serpentine heat dissipation tube being connected to the second liquid outlet.

6. A data center processor cooling device according to claim 5, characterized in that: The first liquid pump (22) is connected to the second liquid inlet, and the second liquid pump (24) is connected to the second liquid outlet.

7. A data center processor cooling device according to claim 1, characterized in that: The cooling box (25) is provided with a third liquid outlet and a third liquid inlet, the third liquid pump (26) is connected to the third liquid outlet, and the second liquid pump (24) is connected to the third liquid inlet.

8. A data center processor cooling device according to claim 7, characterized in that: The cooling box (25) also includes a second serpentine heat dissipation pipe, one end of the second serpentine heat dissipation pipe is connected to the third liquid outlet, and the other end of the second serpentine heat dissipation pipe is connected to the third liquid inlet.

Citation Information

Patent Citations

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