Eutectic machine

Abstract

The utility model discloses a eutectic machine, relates to industrial equipment technical field, and wherein the eutectic machine comprises a bonding jig assembly, a feeding mechanism, a wafer feeder and a turret manipulator, the bonding jig assembly is used for heating bonding of a eutectic chip and a wafer, the feeding mechanism is used for providing the eutectic chip for the bonding jig assembly, the wafer feeder is used for feeding the wafer to the bonding jig assembly, and the turret manipulator is used for feeding the wafer to the bonding jig assembly. The wafer feeder is used for providing a wafer disc for the bonding jig assembly, the wafer disc is provided with various wafers, and the turret mechanical arm is arranged between the wafer feeder and the feeding mechanism so that eutectic chips on the feeding mechanism and various wafer materials on the wafer disc can be sequentially placed into the bonding jig assembly. According to the technical scheme provided by the utility model, eutectic can be carried out on various wafers at the same time, and process automation is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of industrial equipment, in particular to a eutectic machine. Background Art

[0002] Eutectic welding is also called low-melting-point alloy welding. The basic characteristic of eutectic alloy is that two different materials can form an alloy at a certain weight ratio at a temperature far below their respective melting points. However, the eutectic machines currently on the market can generally only eutecticize one eutectic chip and one wafer at a time. When multiple wafers need to be eutectic, multiple devices must be used, or multiple eutectics must be completed on one device, which lengthens the process time and makes it difficult to control the accuracy. In addition, the current eutectic machines are mainly operated manually, which means that materials need to be manually clamped to the eutectic table of the eutectic machine for eutecticization, which increases the workload of employees, and manual operation has defects such as low precision and low production capacity. Utility Model Content

[0003] The main purpose of the utility model is to provide a eutectic machine, aiming to solve one of the above technical problems.

[0004] In order to achieve the above-mentioned purpose, the eutectic machine proposed in the utility model comprises:

[0005] Bonding jig assembly, used to heat and bond the eutectic chip to the wafer;

[0006] A feeding mechanism, used for providing eutectic chips to the bonding jig assembly;

[0007] A wafer feeder, used for providing a wafer tray to the bonding tool assembly, wherein the wafer tray is provided with a plurality of wafers; a plurality of wafer materials; and

[0008] The turret robot is arranged between the wafer feeder and the feeding mechanism so as to sequentially place the eutectic chips on the feeding mechanism and the various wafer materials on the wafer disk into the bonding jig assembly.

[0009] In one embodiment, the turret robot includes a plurality of negative pressure suction nozzles, which rotate around the axis of the turret robot, and the negative pressure suction nozzles are capable of sucking various wafers on the wafer feeder and eutectic chips on the feeding mechanism.

[0010] In one embodiment, the eutectic machine also includes a table and a gantry arranged on the table, the turret robot is arranged on the gantry and can rotate on the gantry, the wafer feeder and the feeding mechanism are arranged on the table and are arranged on opposite sides of the gantry.

[0011] In one embodiment, the wafer feeder includes a placement table and a first driving component for driving the placement table to approach or move away from the gantry.

[0012] In one embodiment, the feeding mechanism includes a supporting platform and a second driving component for driving the supporting platform to approach or move away from the gantry, and the eutectic chip is disposed on the supporting platform.

[0013] In one embodiment, the bonding jig assembly is arranged between the gantry and the feeding mechanism, the bonding jig assembly includes a glue dispensing assembly and a eutectic table, the eutectic table includes a heating assembly to heat the eutectic chip and wafer on the eutectic table, the glue dispensing assembly is arranged on the gantry, and includes a glue dispensing part and a glue dispensing lifting assembly, the glue dispensing lifting assembly makes the glue dispensing part approach or move away from the eutectic table, the eutectic table is arranged on the supporting platform, and is located on the side of the supporting platform close to the gantry.

[0014] In one embodiment, the eutectic machine also includes a height measuring device, which includes a first height sensor and a second height sensor, wherein the first height sensor is arranged corresponding to the eutectic table to detect the distance between the eutectic table and the turret robot, and the second height sensor is arranged corresponding to the wafer feeder to detect the distance between the wafer feeder and the turret robot, the feeding mechanism includes a first lifting component, and the first lifting component is connected to the supporting table to drive the supporting table to approach or move away from the turret robot, the wafer feeder includes a placing table, and a second lifting component, and the second lifting component drives the placing table to approach or move away from the turret robot.

[0015] In one embodiment, the eutectic machine also includes a loading mechanism, an unloading mechanism and a processing station, the loading mechanism and the unloading mechanism are respectively arranged at both ends of the extension direction of the feeding mechanism, the processing station is arranged between the loading mechanism and the unloading mechanism, and is arranged corresponding to the turret robot, the feeding mechanism passes through the processing station, the loading mechanism is used to feed the tray containing eutectic chips into the feeding mechanism, the unloading mechanism is used to recover the tray on the feeding mechanism, and the feeding mechanism can transport the tray from the loading mechanism to the unloading mechanism.

[0016] In one embodiment, the feeding mechanism includes a supporting platform and a third driving component that drives the supporting platform to move between the loading mechanism and the unloading mechanism, the third driving component passes through the processing station, and the supporting platform is used to support the material tray.

[0017] In one embodiment, the eutectic machine also includes a casing, the casing is formed with a accommodating space, and has a feed opening for the eutectic machine, the feed opening is arranged corresponding to the wafer feeder, the loading mechanism and the unloading mechanism are respectively arranged on both sides of the casing, the loading mechanism includes a loading casing, and a loading space is formed in the loading casing, the unloading mechanism includes a unloading casing, and a unloading space is formed in the unloading casing, and the casing is provided with a loading opening and a unloading opening, which sequentially connect the loading space, the accommodating space and the unloading space.

[0018] The eutectic machine in the technical solution of the utility model includes a bonding jig assembly, a feeding mechanism, a wafer feeder and a turret robot. The bonding jig assembly is used to heat and bond the eutectic chip to the wafer, the feeding mechanism is used to provide the eutectic chip to the bonding jig assembly, and the wafer feeder is used to provide the wafer disk to the bonding jig assembly, wherein the wafer disk is provided with a variety of wafers, that is, the feeding mechanism can support and place one type of eutectic material, the wafer feeder can support and place a variety of wafers, and the turret robot is arranged between the wafer feeder and the feeding mechanism, so as to be able to put the eutectic chip on the feeding mechanism and the various wafer materials on the wafer disk into the bonding jig assembly in sequence, so that the bonding jig assembly can eutecticize more than two eutectic materials at one time, thereby improving the yield when eutecticizing multiple eutectic materials and reducing production time. In the eutectic machine, the turret robot rotates between the wafer feeder and the feeding mechanism to supply wafers and eutectic chips to the bonding jig assembly to achieve fast and smooth feeding, which helps to improve the eutectic efficiency and yield of the eutectic machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0020] Figure 1 A schematic structural diagram of an embodiment of a eutectic machine provided by the utility model;

[0021] Figure 2 for Figure 1 A partial schematic diagram of the illustrated embodiment;

[0022] Figure 3 for Figure 1 Another partial schematic diagram of the illustrated embodiment;

[0023] Figure 4 for Figure 2 Schematic diagram of the structure of the bonding tool assembly;

[0024] Figure 5 for Figure 2 Structural diagram of the feeding mechanism;

[0025] Figure 6 for Figure 2 Schematic diagram of the structure of the wafer feeder;

[0026] Figure 7 for Figure 2 Schematic diagram of the structure of the transfer tower manipulator;

[0027] Figure 8 for Figure 2 Structural diagram of the medium height measuring device and the feeding mechanism;

[0028] Fig. 9 for Figure 2 Structural diagram of the loading mechanism, unloading mechanism and feeding mechanism;

[0029] Fig.10 for Figure 2 A partial schematic diagram of the crystal stage and feeding mechanism.

[0030] Description of Figure Numbers:

[0031] 100. bonding jig assembly; 11. glue dispensing assembly; 111. glue dispensing parts; 112. glue dispensing lifting assembly; 12. eutectic table;

[0032] 200, feeding mechanism; 21, supporting platform; 22, second driving assembly; 23, first lifting assembly; 24, third driving assembly; 25, processing station;

[0033] 300, wafer feeder; 31, placement table; 32, first driving assembly; 33, second lifting assembly;

[0034] 400, turret manipulator; 41, negative pressure nozzle;

[0035] 500, tabletop; 51, gantry;

[0036] 600, height measuring device; 61, first height sensor; 62, second height sensor;

[0037] 700, feeding mechanism; 71, feeding housing;

[0038] 800, unloading mechanism; 81, unloading machine housing; 82, unloading space;

[0039] 900, housing; 91, feed opening.

[0040] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0042] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0043] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0044] The utility model provides a eutectic machine.

[0045] See also Figures 1 to 10In one embodiment of the utility model, the eutectic machine includes a bonding jig assembly 100, a feeding mechanism 200, a wafer feeder 300 and a turret robot 400. The bonding jig assembly 100 is used to heat and bond the eutectic chip to the wafer, the feeding mechanism 200 is used to provide the eutectic chip to the bonding jig assembly 100, and the wafer feeder 300 is used to provide the wafer tray to the bonding jig assembly 100, wherein the wafer tray is provided with a variety of wafers, that is, the feeding mechanism 200 can support and place a type of eutectic material The wafer feeder 300 can support and place a variety of other types of eutectic materials. The turret robot 400 is arranged between the wafer feeder 300 and the feeding mechanism 200, and is arranged close to the bonding jig assembly 100, so that the eutectic chips on the feeding mechanism 200 and the various wafer materials on the wafer disk can be placed in the bonding jig assembly in sequence, so that the bonding jig assembly can eutecticize more than two eutectic materials at one time, improve the yield when eutecticizing multiple eutectic materials, and reduce production time. In the eutectic machine, the turret robot 400 rotates between the wafer feeder 300 and the feeding mechanism 200 to supply wafers and eutectic chips to the bonding jig assembly to achieve fast and stable feeding, which helps to improve the eutectic efficiency and yield of the eutectic machine.

[0046] In the eutectic machines currently on the market, in the machines that use a mechanical structure to feed the bonding jig assembly, there is usually only one material picking piece on the mechanical mechanism, and the bonding jig assembly is usually arranged between the feeding mechanism 200 and the wafer feeder 300. When it is necessary to feed the bonding jig assembly, the mechanical mechanism needs to first move to the feeding mechanism 200, then return to the bonding jig assembly, put down the eutectic chip, and then move to the wafer feeder 300, and then return to the bonding jig assembly to put down the wafer. In addition, the wafer feeder 300 on the eutectic machine on the market usually only supports one type of wafer. Therefore, when facing the situation of eutecticization of multiple wafers, it is necessary to manually clamp other wafers or perform multiple eutectic operations.

[0047] In one embodiment, the turret robot 400 includes a plurality of negative pressure suction nozzles 41, and the plurality of negative pressure suction nozzles 41 rotate around the axis of the turret robot 400, and the negative pressure suction nozzles 41 can suck a variety of wafers on the wafer feeder 300 and the eutectic chips on the feeding mechanism. That is, the turret robot 400 takes materials from the feeding mechanism 200 and the wafer feeder 300 by negative pressure suction. And it can be that during the process of the turret robot 400 rotating one circle, one negative pressure suction nozzle 41 takes materials from the eutectic chips on the feeding mechanism, and the other several negative pressure suction nozzles 41 take materials from different types of wafers on the wafer feeder 300 respectively, and during the rotation of the turret robot 400, the eutectic chips and wafers are sequentially transported to the bonding mold assembly 100, that is, the turret robot 400 rotates one circle to complete the feeding of the bonding mold assembly 100. In other embodiments, the turret robot 400 can also include a plurality of material taking claws.

[0048] In one embodiment, the eutectic machine further comprises a table 500 and a gantry 51 disposed on the table 500, the turret robot 400 is disposed on the gantry 51 and can rotate on the gantry 51, and the wafer feeder 300 and the feeding mechanism 200 are disposed on the table 500 and are disposed on opposite sides of the gantry 51. The gantry 51 helps to raise the height of the negative pressure suction nozzle 41 on the turret robot 400, so that there is a height difference between the negative pressure suction nozzle 41 and the feeding mechanism and the wafer feeder 300, so that the negative pressure suction nozzle 41 can be away from the feeding mechanism and the wafer feeder 300 after taking the material, and rotate after having a certain height difference with the feeding mechanism and the wafer feeder 300, so as to avoid knocking the remaining eutectic chips on the feeding mechanism or the remaining wafers on the wafer feeder 300 off the eutectic machine. In other embodiments, the turret robot 400 may be disposed on the table 500 , and the feeding mechanism 200 and the wafer feeder 300 may be installed below the table 500 through brackets.

[0049] In one embodiment, the bonding jig assembly is arranged between the gantry 51 and the feeding mechanism, the bonding jig assembly includes a glue dispensing assembly 11 and a eutectic table 12, the eutectic table 12 includes a heating assembly to heat the eutectic chip and wafer on the eutectic table 12, the glue dispensing assembly 11 is arranged on the gantry 51 and is located on a side close to the feeding mechanism 200, the glue dispensing assembly 11 includes a glue dispensing part 111 and a glue dispensing lifting assembly 112, the glue dispensing lifting assembly 112 is used to make the glue dispensing part 111 close to or away from the eutectic table 12, the eutectic table 12 is arranged on the supporting platform 21 and is located on a side of the supporting platform 21 close to the gantry 51, so that the eutectic table 12 can move between the negative pressure suction nozzle 41 and the glue dispensing part 111. Among them, the eutectic chip is first placed on the eutectic table 12, then the glue dispensing part 111 moves down and dispenses glue on the eutectic chip, and then the glue dispensing part 111 moves up, so that the turret robot 400 places the wafer at the glue dispensing location, and the eutectic table 12 heats the eutectic chip and the wafer to complete the eutectic.

[0050] The eutectic machine also includes a height measuring device 600, which includes a first height sensor 61 and a second height sensor 62. The first height sensor 61 is set corresponding to the eutectic table 12 to detect the distance between the eutectic table 12 and the turret robot 400. The second height sensor 62 is set corresponding to the wafer feeder 300 to detect the distance between the wafer feeder 300 and the turret robot 400. The feeding mechanism includes a first lifting component 23 and a supporting platform 21. The first lifting component 23 is connected to the supporting platform 21 to drive the supporting platform 21 to approach or move away from the turret robot 400. The wafer feeder 300 includes a placement table 31 and a second lifting component 33. The second lifting component 33 drives the placement table 31 to approach or move away from the turret robot 400. That is, the approach or distance between the negative pressure suction nozzle 41 and the feeding mechanism and the wafer feeder 300 in the height direction is respectively achieved by the first lifting component 23 and the second lifting component 33. Taking the material picking of the turret manipulator 400 to the feeding mechanism 200 as an example, when the turret manipulator 400 needs to pick up materials from the feeding mechanism 200, the first lifting component 23 drives the support platform 21 to move upward, and when the first height sensor 61 detects that the distance between the negative pressure suction nozzle 41 and the support platform 21 reaches a first preset value, the negative pressure suction nozzle 41 can absorb the eutectic chip, and then the first lifting component 23 drives the support platform 21 to move downward, and when the first height sensor 61 detects that the distance between the negative pressure suction nozzle 41 and the support platform 21 reaches a second preset value, the negative pressure suction nozzle There is relative movement between the turret robot 41 and the support table 21, so that the negative pressure suction nozzle 41 with the eutectic chip adsorbed thereon moves to the eutectic table 12; when the turret robot 400 needs to feed the eutectic table 12, the first lifting component 23 drives the support table 21 to move up, and when the first height sensor 61 detects that the distance between the negative pressure suction nozzle 41 and the eutectic table 12 reaches the first preset value, the eutectic chip on the negative pressure suction nozzle 41 can abut against the eutectic table 12, and the negative pressure suction nozzle 41 can stop adsorbing the eutectic chip, and then the first lifting component 23 drives the support table 21 to move down. The operation of the turret robot 400 when taking materials from the wafer feeder 300 is consistent with the operation of the turret robot 400 when taking materials from the support table 21. In other embodiments, the turret robot 400 can also have a lifting drive component to drive the turret robot 400 to move in the height direction.

[0051] In one embodiment, the wafer feeder 300 includes a placement table 31, and a first drive assembly 32 that drives the placement table 31 to approach or move away from the gantry 51. Since the overlap between the placement table 31 and the moving range of the negative pressure suction nozzle 41 is limited, in order to enable the negative pressure suction nozzle 41 to pick up any wafer on the placement table 31, the wafer plate can be close to or away from the gantry 51 through the first drive assembly 32. Further, the first drive can drive the placement table 31 to move along the length and width directions of the table 500, which helps the negative pressure suction nozzle 41 to pick up any wafer on the placement table 31. The feeding mechanism 200 includes a supporting table 21, and a second drive assembly 22 that drives the supporting table 21 to approach or move away from the gantry 51, and the eutectic chip is arranged on the supporting table 21. Since the supporting table 21 is connected to the eutectic table 12, that is, when the supporting table 21 moves, the eutectic table 12 also moves. When the negative pressure nozzle 41 takes the eutectic chip on the support table 21 away from the eutectic table 12, the second drive component 22 can drive the support table 21 to approach the negative pressure nozzle 41; after the material is taken, the second drive component 22 can drive the support table 21 away from the negative pressure nozzle 41, so that the eutectic table 12 is close to the negative pressure nozzle 41; the second drive component 22 can drive the eutectic table 12 to move between the turret robot 400 and the glue dispensing part 111, that is, when the eutectic chip is placed on the eutectic table 12, the second drive component 22 drives the eutectic table 12 to approach the glue dispensing part 111 to dispense glue on the eutectic chip. After dispensing glue, the second drive component 22 drives the eutectic table 12 to approach the turret robot 400 to place the wafer at the dispensing location. In other embodiments, the turret robot 400 can also include a translation drive component to make the negative pressure nozzle 41 approach or move away from the feeding mechanism 200 and the wafer feeder 300.

[0052] In one embodiment, the eutectic machine also includes a loading mechanism 700, a unloading mechanism 800 and a processing station 25. The loading mechanism 700 and the unloading mechanism are respectively arranged at both ends of the extension direction of the feeding mechanism 200. The processing station 25 is arranged between the loading mechanism 700 and the unloading mechanism 800, and is arranged corresponding to the turret robot 400. The feeding mechanism 200 passes through the processing station 25. The loading mechanism 700 is used to feed the tray containing the eutectic chips into the feeding mechanism 200. The unloading mechanism 800 is used to recover the tray on the feeding mechanism 200. The feeding mechanism 200 can transport the tray from the loading mechanism 700 to the unloading mechanism 800. The tray in the loading mechanism 700 is loaded with a plurality of eutectic chips that have not been eutectic. After the tray is delivered to the support table 21, the support table 21 moves to the processing station 25, the turret manipulator 400 takes the eutectic chips in the tray, and puts the eutectic chips that have completed eutectic on the eutectic table 12 back to the tray. When all the workpiece chips on the tray have completed eutectic, the feeding mechanism 200 delivers the tray on the support table 21 to the unloading mechanism 800. In other embodiments, the loading mechanism 700 and the unloading mechanism 800 may not be provided, and the tray on the support table 21 may be replaced manually.

[0053] In one embodiment, the feeding mechanism 200 includes a support platform 21 and a third driving assembly 24 that drives the support platform 21 to move between the loading mechanism 700 and the unloading mechanism 800. The third driving assembly 24 passes through the processing station 25, and the support platform 21 is used to support the material tray. At the same time, the third driving assembly 24 can also cooperate with the second driving assembly 22 to drive the support platform 21 to approach or move away from the negative pressure suction nozzle 41 when it is at the processing station 25, so as to make the movement of the support platform 21 more precise.

[0054] In one embodiment, the eutectic machine further comprises a housing 900, the housing 900 is formed with a receiving space, and has a feed opening 91 for the eutectic machine, the feed opening 91 is arranged corresponding to the wafer feeder 300, so as to replace the wafer disc on the wafer feeder 300, the loading mechanism 700 and the unloading mechanism 800 are arranged on both sides of the housing 900, the loading mechanism 700 comprises a loading housing 71, the loading housing 71 is formed with a loading space, the unloading mechanism 800 comprises an unloading housing 81, the unloading housing 81 is formed with an unloading space 82, and the housing 900 is provided with a loading opening and an unloading opening, which sequentially connect the loading space, the receiving space and the unloading space 82. The tray passes through the loading opening and the unloading opening in sequence, that is, passes through the loading space, the receiving space and the unloading space 82 in sequence. The loading housing 71 and the unloading housing 81 can protect the trays on the loading mechanism 700 and the unloading mechanism 800 respectively, so as to prevent the eutectic chips in the trays from being damaged due to the external environment and other reasons. The loading mechanism 700 and the unloading mechanism 800 are arranged on the outside of the housing 900, so as to facilitate the maintenance or replacement of the loading mechanism 700 and the unloading mechanism 800, and will not affect the operation of other structures in the accommodation space. In other embodiments, the loading mechanism 700 and the unloading mechanism 800 can also be located in the accommodation space.

[0055] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A eutectic machine, characterized in that: include: Bonding jig assembly, used to heat and bond the eutectic chip to the wafer; A feeding mechanism, used for providing eutectic chips to the bonding jig assembly; A wafer feeder, used for providing a wafer tray to the bonding tool assembly, wherein the wafer tray is provided with a plurality of wafers; as well as The turret robot is arranged between the wafer feeder and the feeding mechanism so as to sequentially place the eutectic chips on the feeding mechanism and the various wafer materials on the wafer disk into the bonding jig assembly.

2. In the eutectic machine as described in claim 1, the turret robot comprises a plurality of negative pressure suction nozzles, and the plurality of negative pressure suction nozzles rotate around the axis of the turret robot, and the negative pressure suction nozzles are capable of sucking a variety of wafers on the wafer feeder and the eutectic chips on the feeding mechanism.

3. The eutectic machine as described in claim 1, further comprising a table and a gantry arranged on the table, the turret robot is arranged on the gantry and can rotate on the gantry, the wafer feeder and the feeding mechanism are arranged on the table and are arranged on opposite sides of the gantry. 4 . The eutectic machine as claimed in claim 3 , wherein the wafer feeder comprises a placement table and a first driving component for driving the placement table to approach or move away from the gantry.

5. The eutectic machine as claimed in claim 3, wherein the feeding mechanism comprises a supporting platform and a second driving component for driving the supporting platform to approach or move away from the gantry, and the eutectic chip is arranged on the supporting platform.

6. The eutectic machine as described in claim 5, wherein the bonding jig assembly is arranged between the gantry and the feeding mechanism, the bonding jig assembly includes a glue dispensing assembly and a eutectic table, the eutectic table includes a heating assembly to heat the eutectic chips and wafers on the eutectic table, the glue dispensing assembly is arranged on the gantry, and includes a glue dispensing part and a glue dispensing lifting assembly, the glue dispensing lifting assembly enables the glue dispensing part to be close to or away from the eutectic table, and the eutectic table is arranged on the supporting table and is located on the side of the supporting table close to the gantry.

7. The eutectic machine as described in claim 6, further comprising a height measuring device, wherein the height measuring device comprises a first height sensor and a second height sensor, wherein the first height sensor is arranged corresponding to the eutectic table to detect the distance between the eutectic table and the turret robot, and the second height sensor is arranged corresponding to the wafer feeder to detect the distance between the wafer feeder and the turret robot, the feeding mechanism comprises a first lifting component, and the first lifting component is connected to the supporting table to drive the supporting table to approach or move away from the turret robot, the wafer feeder comprises a placing table, and a second lifting component, and the second lifting component drives the placing table to approach or move away from the turret robot.

8. The eutectic machine as described in claim 1, further comprising a loading mechanism, an unloading mechanism and a processing station, wherein the loading mechanism and the unloading mechanism are respectively arranged at both ends of the extension direction of the feeding mechanism, the processing station is arranged between the loading mechanism and the unloading mechanism, and is arranged corresponding to the turret manipulator, the feeding mechanism passes through the processing station, the loading mechanism is used to feed the tray containing eutectic chips into the feeding mechanism, the unloading mechanism is used to recover the tray on the feeding mechanism, and the feeding mechanism can transport the tray from the loading mechanism to the unloading mechanism.

9. The eutectic machine as described in claim 8, wherein the feeding mechanism includes a supporting table and a third driving component that drives the supporting table to move between the loading mechanism and the unloading mechanism, the third driving component passes through the processing station, and the supporting table is used to support the material tray.

10. The eutectic machine as described in claim 9, further comprising a casing, wherein the casing is formed with a accommodating space and has a feed opening for the eutectic machine, wherein the feed opening is arranged corresponding to the wafer feeder, wherein the loading mechanism and the unloading mechanism are respectively arranged on both sides of the casing, wherein the loading mechanism comprises a loading casing, wherein a loading space is formed in the loading casing, wherein the unloading mechanism comprises a unloading casing, wherein a unloading space is formed in the unloading casing, wherein a loading opening and a unloading opening are provided on the casing, and the loading space, the accommodating space and the unloading space are sequentially connected.

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