Circuit board structure or packaging structure and mold
By using a main connection structure connected with concave and convexity on the circuit board or packaging structure, the contact area between the conductive metal and the substrate or insulating medium is increased, the problem of conductive metal falling off is solved, the binding force is improved and the production process is simplified, and it is suitable for PCB Board and chip package.
Patent Information
- Application Number
- CN202420773302.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-04-15
AI Technical Summary
The conductive metal part is prone to fall off on the circuit board or package insulation medium, resulting in insufficient binding force and affecting the stability and thermal conductivity of the device.
The main connection structure connected by the concave and convex obtained by the roughening process is adopted to increase the contact area between the conductive metal part and the circuit board substrate or the insulating medium part of the package, form the main connection structure connected by the concave and convex, increase the bonding force, and at the same time, This structure is simple and conveniently made in the mold.
Effectively prevent the conductive metal parts from falling off from the circuit board substrate or the insulating medium of the package, improve the binding force, is suitable for the production and processing of PCB board and chip packages, and does not increase the thickness of the circuit board or package, reducing the production cost.
Smart Images
Figure CN222366425U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of manufacturing circuit boards or electronic packages, in particular to a circuit board structure or a packaging structure and a mold for manufacturing a substrate part used on the circuit board structure or the packaging structure. Background Art
[0002] A circuit board is also called a printed circuit board or printed circuit board. The overall structure of a circuit board basically includes a substrate part (commonly made of insulating resin and glass fiber cloth composite materials) and a conductive metal part attached to the substrate part. In the scenario where the conductive metal is attached to the surface of the substrate, if the bonding strength between the coating and the substrate is insufficient, the conductive metal part will easily fall off from the substrate part.
[0003] Electronic packaging refers to the process of arranging, fixing and connecting semiconductor components and other components on a frame or packaging substrate, leading out the wiring terminals, and fixing them through plastic sealing with insulating media to form the overall main structure. Packaging can provide the functions of placing, fixing, sealing, protecting chips and enhancing thermal conductivity. With the development of the electronics industry, the interconnection density of devices has increased. In the packaging manufacturing process, part of the metal lines connecting the devices must be plated on the surface of the insulating medium. If the bonding force between the metal lines and the insulating medium is not enough, the conductive metal part will easily fall off from the insulating medium part. Utility Model Content
[0004] In order to solve the problems in the above-mentioned background technology, the first purpose of the utility model is to provide a circuit board structure or a packaging structure, so that the conductive metal part has a sufficiently strong bonding force with the circuit board substrate or the packaging insulating medium part, effectively preventing the conductive metal part from falling off the circuit board substrate or the packaging insulating medium. The utility model patent is suitable for the production of PCB boards as well as the production of chip packages.
[0005] A circuit board structure or packaging structure comprises a substrate part and a conductive metal part attached to the surface of the substrate part, wherein a plurality of concave-convex main connection structures formed by roughening treatment are formed between the substrate part and the conductive metal part.
[0006] By adopting the above technical solution, when the above structure is applicable to a circuit board, the above substrate portion refers to the substrate portion of a PCB board; when the above structure is applicable to electronic packaging, the above substrate portion refers to the packaging insulating medium portion; through the main connection structure connected in concave and convex directions, the contact area between the conductive metal portion and the circuit board substrate, or the conductive metal and the packaging insulating medium portion is increased, thereby increasing the bonding force between the two, and can effectively prevent the conductive metal portion from detaching from the circuit board substrate or the packaging insulating medium portion.
[0007] Preferably, the main connection structure forms a plurality of concave-convex connected sub-connection structures at the connection point.
[0008] By adopting the above technical solution, the contact area at the connection edge of the main connection structure can be increased, and the bonding force between the conductive metal part and the circuit board substrate or the packaging insulating medium part can be further increased.
[0009] Preferably, the shape of the sub-connection structure is the same as that of the main connection structure.
[0010] By adopting the above technical solution, the conductive metal part and the circuit board substrate or the package insulating medium part are not easily separated from each other at any main connection structure, and the production and processing of the circuit board is also convenient.
[0011] Preferably, the base material portion is disposed in a convex shape at the main connection structure, and the conductive metal portion is disposed in a concave shape at the main connection structure.
[0012] By adopting the above technical solution, since the circuit board substrate or the packaging insulating medium part has a certain thickness, and the conductive metal part is usually a thin layer of electroplating, the protrusions of the conductive metal part on the substrate part are concave; in the concave part formed between the protrusions on the substrate part, the conductive metal part needs to increase the electroplating thickness and be in a convex shape.
[0013] Preferably, the main connection structure on the substrate portion protrudes from the substrate portion by a height of 0.1-1000 microns.
[0014] By adopting the above technical solution, the setting of the main connection structure will not increase the thickness of the circuit board substrate or the packaging insulating medium too much, will not affect the normal use of the circuit, and can even be used on a flexible circuit board.
[0015] Preferably, the cross section of the main connection structure of the circuit board substrate or the packaging insulating medium along the length direction is in any geometric shape or any combination of geometric shapes such as triangle, hexagon, quadrilateral or circle.
[0016] By adopting the above technical solution, the shape of the main connection structure can be set as needed, and a shape that is not easy to fall off is preferred.
[0017] In order to solve the problems in the above-mentioned background technology, the second purpose of the utility model is to provide a mold for making a circuit board, which can simply and conveniently make the substrate part of the circuit board, and the substrate part can have a sufficiently strong bonding force with the conductive metal part and prevent the conductive metal part from separating from the substrate part.
[0018] A mold for circuit board pressing or electronic packaging comprises a mold main body, and the mold is used to make any one of the above-mentioned substrate parts.
[0019] Preferably, the mold body is a circuit board pressing mold or a packaging injection mold.
[0020] By adopting the above technical solution, the substrate part in the circuit board structure or the packaging insulating medium part in the electronic packaging structure can be simply and conveniently manufactured with low manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a schematic cross-sectional structure diagram of the circuit board structure or packaging structure of the utility model;
[0022] Figure 2 for Figure 1 A magnified view of part A;
[0023] Figure 3 It is a front view of a circuit board structure or a packaging structure, wherein the raised portion of the main connection structure is in a triangular shape;
[0024] Figure 4 A front view of a circuit board structure or a packaging structure, wherein the protruding portion of the main connection structure is hexagonal;
[0025] Figure 5 It is a schematic diagram of the molding state of the mold body and the circuit board substrate, or the mold body and the packaging insulating medium part.
[0026] In the figure: 1. substrate part; 2. conductive metal part; 3. main connection structure; 4. sub-connection structure; 5. mold body. DETAILED DESCRIPTION
[0027] In order to make the content of the utility model more clearly understood, the utility model is further described below based on specific embodiments in combination with the accompanying drawings.
[0028] It should be noted that the terms "center", "upper", "lower", "front", "back", "left", "right", "inner", "outer" and the like used herein to indicate directions or positional relationships are based on directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. Unless otherwise specified, "plurality" means two or more.
[0029] Unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood by specific circumstances.
[0030] Embodiment 1
[0031] like Figure 1-4 As shown, a circuit board structure or packaging structure comprises a substrate portion 1 (the substrate portion can be a circuit board substrate or a packaging insulating medium portion) and a conductive metal portion 2 attached to the surface of the substrate portion 1, wherein a plurality of concave-convex main connection structures formed by roughening treatment are formed between the substrate portion 1 and the conductive metal portion 2 (it should be noted here that the concave-convex structure on the surface of the substrate portion 1 can only be formed by roughening treatment, otherwise it will be impossible to demold; the substrate portion 1 can be arranged in a concave shape at the main connection structure 3, and at this time, the conductive metal portion 2 is arranged in a convex shape at the main connection structure 3; considering that the substrate portion 1 has The conductive metal part 2 is usually a thin layer of electroplating. Preferably, the substrate part 1 is provided in a convex shape at the main connection structure 3, and the conductive metal part 2 is provided in a concave shape at the main connection structure 3. In the concave part formed between the convexities on the substrate part 1, the conductive metal part 2 needs to increase the electroplating thickness and be convex). The height of the main connection structure 3 on the substrate part 1 protruding from the substrate part 1 is 0.1-1000 microns (it should be noted here that since the circuit board is relatively thin, especially used in some small electronic products, the thickness of the main connection structure 3 should not be too thick);
[0032] The main connection structure 3 is formed with a number of concave-convex connected sub-connection structures 4 made by roughening treatment at the connection (it should be noted here that the sub-connection structures 4 are preferably evenly distributed along the connection edge of the main connection structure 3), and the shape of the sub-connection structure 4 is the same as that of the main connection structure 3 (it should be noted here that the shape of the sub-connection structure 4 can also be different from that of the main connection structure 3, mainly considering that the manufacturing of the substrate part can be relatively simple and convenient, and easy to demold, preferably the two have the same shape). The main connection structure and the sub-connection structure are preferably irregular rough structures produced after roughening treatment.
[0033] Along the length direction of the substrate part 1, the cross-section of its main connecting structure 3 is any geometric shape or any combination of geometric shapes such as triangle, hexagon, quadrilateral or circle (it should be noted here that the main connecting structure 3 can be any regular or irregular shape, mainly to facilitate demoulding but not to make it difficult for the substrate part 1 and the conductive metal part 2 to separate).
[0034] Embodiment 2
[0035] like Figure 5 As shown, a mold for making a circuit board includes a mold body 5, and the mold body 5 is a molded part. The mold body 5 is used to make a substrate part 1 of a circuit board described in Example 1.
[0036] It should be noted that the mold body 5 can also be a pressed pad, that is, the base material portion is not molded by injection molding, but is molded by pressing.
[0037] Embodiment 3
[0038] like Figure 5 As shown, a mold for making a packaging insulating medium part for a packaging structure includes a mold body 5, and the mold body 5 is a molded part. The mold body 5 is used to make a packaging insulating medium part 1 for a packaging structure described in Example 1.
[0039] It should be noted that the mold body 5 can also be a pressed pad, that is, the base material portion is not molded by injection molding, but is molded by pressing.
[0040] The above embodiments are only preferred implementation modes of the present utility model, and cannot be used to limit the protection scope of the present utility model. Any non-substantial changes and modifications made by technicians in this field on the basis of the utility model shall fall within the protection scope of the present utility model.
Claims
1. A circuit board structure or packaging structure, comprising a substrate portion and a conductive metal portion attached to a surface of the substrate portion, characterized in that: A plurality of main connection structures connected by concave and convex parts are formed between the substrate part and the conductive metal part through roughening treatment.
2. The circuit board structure or packaging structure according to claim 1, characterized in that: The main connection structure is formed with a plurality of concave-convex connected sub-connection structures obtained by roughening treatment at the connection position.
3. The circuit board structure or packaging structure according to claim 2, characterized in that: The shape of the sub-connection structure is the same as that of the main connection structure.
4. The circuit board structure or packaging structure according to claim 1, characterized in that: The base material part is arranged in a convex shape at the main connection structure, and the conductive metal part is arranged in a concave shape at the main connection structure.
5. The circuit board structure or packaging structure according to claim 4, characterized in that: The main connection structure on the substrate part protrudes from the substrate part by a height of 0.1-1000 microns.
6. The circuit board structure or packaging structure according to claim 1, characterized in that: The cross section of the main connection structure of the substrate portion along the length direction is in any geometric shape or any combination of geometric shapes such as triangle, hexagon, quadrilateral or circle.
7. A mold, comprising a mold body, characterized in that: The mold body is used to manufacture the substrate portion of any circuit board structure or packaging structure as claimed in claims 1-5.
8. The mold according to claim 7, characterized in that: The mold body is a circuit board pressing mold or a packaging injection mold.