Endoscope camera shooting heat dissipation system and endoscope

Abstract

The utility model relates to the technical field of endoscope heat dissipation, and particularly discloses an endoscope camera shooting heat dissipation system and an endoscope. The endoscope camera shooting heat dissipation system comprises a case, a first heat exchange fan and a second heat exchange fan. Wherein the case is provided with an air inlet hole and an air outlet hole, and a functional module is arranged in the case. The first heat exchange fan is arranged in the case and can drive air to flow into the case from the air inlet hole and flow through the function module. The second heat exchange fan is arranged at the air outlet of the case, the air volume generated by the second heat exchange fan is larger than or equal to the air volume generated by the first heat exchange fan, and the second heat exchange fan is suitable for driving air to flow out of the case from the air outlet. According to the computer case, the first heat exchange fan guides cold air outside the computer case into the computer case and enables the cold air to flow through the function module so as to perform heat exchange to form hot air flow, then the hot air flow is discharged from the air outlet holes by the second heat exchange fan, the overall airflow direction is guaranteed, wind path disorder is prevented, and the heat dissipation effect is good.

Description

Technical Field

[0001] The present application relates to the technical field of endoscopes, and in particular to an endoscope camera heat dissipation system and an endoscope. Background Art

[0002] At present, the interior of the endoscope camera system is generally arranged with multiple functional modules, and each functional module is equipped with a chip board. During the operation of the endoscope camera system, the chip board will generate a large amount of heat, which may affect its operating efficiency, so the heat needs to be dissipated in time.

[0003] However, in the related art, the heat dissipation air path of the chassis of the endoscope camera system is chaotic, the heat dissipation effect is poor, and the operating stability of its internal functional modules is affected. Summary of the invention

[0004] In view of this, the present application provides an endoscope camera heat dissipation system and an endoscope to solve the problem that the chassis heat dissipation air path of the endoscope camera system is chaotic, the heat dissipation effect is poor, and the operating stability of the functional modules is affected.

[0005] In a first aspect, the present application provides an endoscope camera heat dissipation system, comprising a chassis, a first heat exchange fan and a second heat exchange fan. The chassis has an air inlet and an air outlet, and a functional module is provided inside the chassis. There is at least one first heat exchange fan, which is arranged inside the chassis. When the first heat exchange fan is started, it can drive air to flow from the air inlet into the chassis and flow through the functional module. There is at least one second heat exchange fan, which is arranged at the position of the air outlet of the chassis; the second heat exchange fan is suitable for driving air to flow out of the chassis from the air outlet; the air volume generated by at least one second heat exchange fan is greater than or equal to the air volume generated by at least one first heat exchange fan.

[0006] In some embodiments, at least one first heat exchange fan includes multiple first heat exchange fans, which are respectively installed inside the chassis and drive air to flow through the functional modules; the air volume generated by at least one second heat exchange fan is greater than or equal to the sum of the air volumes generated by the multiple first heat exchange fans.

[0007] In some embodiments, at least one second heat exchange fan includes multiple second heat exchange fans, and the multiple second heat exchange fans are respectively installed at the air outlet positions of the chassis; the sum of the air volumes generated by the multiple second heat exchange fans is greater than or equal to the air volume generated by at least one first heat exchange fan.

[0008] In some embodiments, at least one first heat exchange fan includes multiple first heat exchange fans, which are respectively installed inside the chassis and drive air to flow through the functional modules; at least one second heat exchange fan includes multiple second heat exchange fans, which are respectively installed at the air outlets of the chassis; the sum of the air volumes generated by the multiple second heat exchange fans is greater than or equal to the sum of the air volumes generated by the multiple first heat exchange fans.

[0009] In some embodiments, the air inlet includes a first air inlet and a second air inlet. The first air inlet has at least one group and faces the functional module, and an air inlet path is formed between the first air inlet and the first heat exchange fan. The second air inlet and the air outlet are respectively arranged at opposite ends of the chassis, and an air outlet path is formed between the second air inlet and the second heat exchange fan.

[0010] In some embodiments, the functional module is arranged on the bottom wall of the chassis, the first heat exchange fan is arranged on the top of the functional module, and the first air inlet is arranged on the side wall of the chassis; the distance between the first air inlet and the bottom wall of the chassis is smaller than the distance between the first heat exchange fan and the bottom wall of the chassis.

[0011] In some embodiments, the endoscope camera heat dissipation system also includes a heat-conducting component, which is arranged between the functional module and the first heat exchange fan. The heat-conducting component at least includes a heat-conducting layer, and the heat-conducting layer is laid on the chip board of the functional module.

[0012] In some embodiments, the heat conductive component also includes a heat sink, which is arranged on the chip board of the functional module. The heat sink has a heat absorbing part and a heat dissipating part, and the heat absorbing part and the heat dissipating part are thermally connected; the heat absorbing part abuts the heat conductive layer, and the heat dissipating part faces the first heat exchange fan; in addition, the heat sink and the chip board of the functional module are locked and fixed by elastic fasteners.

[0013] In some embodiments, the air outlet is disposed on a side wall at one end of the chassis, and the second air inlet is disposed on a bottom wall at the other end of the chassis; and / or, the second heat exchange fan is disposed inside the chassis.

[0014] In a second aspect, the present application further provides an endoscope, and the endoscope of the second aspect includes the endoscope camera heat dissipation system of the first aspect.

[0015] Beneficial effects:

[0016] The endoscope camera cooling system of the first aspect has air inlet and outlet holes in the chassis, and a functional module and a first heat exchange fan are arranged inside the chassis. The functional module is located upstream of the air path of the first heat exchange fan. The functional module generates heat when running. The first heat exchange fan draws cold air outside the chassis into the chassis and flows through the functional module for heat exchange, thereby forming a hot air flow, and then the hot air flow is driven to the downstream of the air path of the first heat exchange fan; a second heat exchange fan is arranged at the position of the air outlet hole, and the second heat exchange fan discharges the hot air flow in the chassis from the air outlet hole. The air volume generated by the second heat exchange fan is greater than or equal to the air volume generated by the first heat exchange fan, thereby ensuring that the overall airflow direction is consistent, preventing air path confusion, and enhancing the heat dissipation effect of the functional module.

[0017] In addition, the endoscope of the second aspect includes the endoscope camera heat dissipation system of the first aspect, so the endoscope of the second aspect has all the beneficial effects of the endoscope camera heat dissipation system of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work. Description of the drawings:

[0020] Figure 1 A top view of the endoscope camera heat dissipation system according to an embodiment of the present application;

[0021] Figure 2 It is a left view of the endoscope camera heat dissipation system described in an embodiment of the present application;

[0022] Figure 3 It is a right side view of the endoscope camera heat dissipation system described in an embodiment of the present application;

[0023] Figure 4 It is a front view of the endoscope camera heat dissipation system according to an embodiment of the present application;

[0024] Figure 5 This is a wind path diagram of the endoscope camera cooling system described in an embodiment of the present application;

[0025] Figure 6 An exploded view of the heat-conducting component described in an embodiment of the present application;

[0026] Figure 7 This is an assembly diagram of the heat-conducting component described in an embodiment of the present application.

[0027] Description of reference numerals:

[0028] 100. Endoscope camera cooling system; 200. Functional module;

[0029] 110, chassis; 120, first heat exchange fan; 130, second heat exchange fan; 140, heat conduction component;

[0030] 111. Air inlet; 112. Air outlet;

[0031] 1111, first air inlet; 1112, second air inlet;

[0032] 141. heat conducting layer; 142. heat sink; 143. elastic fastener;

[0033] 210, chip board; 220, video output module; 230, video processing module; 240, power module; 250, video storage module. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0035] In order to deepen the understanding of this application solution, it is necessary to elaborate on the technical issues in detail in combination with relevant technologies. The specific contents are as follows:

[0036] There are multiple functional modules arranged inside the endoscope camera system, and each functional module is equipped with a chip board. During the operation of the endoscope camera system, the chip board generates heat, which needs to be dissipated in time. However, the heat dissipation air path of the chassis of the endoscope camera system is chaotic, the heat dissipation effect is poor, and the operation stability is affected.

[0037] In addition, endoscopes usually directly fix the heat sink and the heat-generating chip card together with ordinary screws, which puts a lot of force on the chip card and may damage the chip card, seriously affecting the performance of the whole machine, causing black screen, freeze, etc. Moreover, the design of the chassis heat dissipation holes is random and the height is not uniform, which easily leads to chaotic air flow inside the chassis, also affecting the stability of the whole machine performance.

[0038] In order to alleviate the above-mentioned technical problems, the present application provides an endoscope camera heat dissipation system and an endoscope. The embodiments of the present application are described in detail below in conjunction with Figures 1 to 4.

[0039] First, refer to Figures 1 to 5The present application provides an endoscope camera heat dissipation system 100, comprising a chassis 110, a first heat exchange fan 120 and a second heat exchange fan 130. The chassis 110 is provided with an air inlet 111 and an air outlet 112, and at least one functional module 200 is provided inside the chassis 110. The first heat exchange fan 120 has at least one and is arranged inside the chassis 110. The first heat exchange fan 120 is configured to drive air from the air inlet 111 into the chassis 110 and flow through all functional modules 200 under the startup condition. The second heat exchange fan 130 has at least one and is arranged at the position of the air outlet 112; the second heat exchange fan 130 is suitable for driving air to flow out of the chassis 110 from the air outlet 112.

[0040] In some embodiments, when there is one first heat exchange fan 120 and one second heat exchange fan 130, the first heat exchange fan 120 is located in the chassis 110 and preferably is located above all functional modules 200 as a whole, the second heat exchange fan 130 is preferably located on the inner side of the chassis 110 at the air outlet 112, and the air volume generated by the second heat exchange fan 130 is greater than or equal to the air volume generated by the first heat exchange fan 120. When there is one first heat exchange fan 120 and there are multiple second heat exchange fans 130, the first heat exchange fan 120 is located in the chassis 110 and preferably is located above all functional modules 200 as a whole, the second heat exchange fan 130 is preferably located on both the inner and outer sides of the chassis 110 at the air outlet 112, and the sum of the air volumes generated by the second heat exchange fan 130 is greater than or equal to the air volume generated by the first heat exchange fan 120. In the case where there are multiple first heat exchange fans 120 and one second heat exchange fan 130, the first heat exchange fan 120 is located in the chassis 110 and preferably correspondingly disposed above each functional module 200, the second heat exchange fan 130 is preferably disposed on the inner side of the chassis 110 at the air outlet 112, and the air volume generated by the second heat exchange fan 130 is greater than or equal to the sum of the air volumes generated by the first heat exchange fan 120. In the case where there are multiple first heat exchange fans 120 and multiple second heat exchange fans 130, the first heat exchange fan 120 is located in the chassis 110 and preferably correspondingly disposed above each functional module 200, the second heat exchange fan 130 is preferably disposed on both the inner and outer sides of the chassis 110 at the air outlet 112, and the sum of the air volumes generated by the second heat exchange fan 130 is greater than or equal to the sum of the air volumes generated by the first heat exchange fan 120.

[0041] Specifically, the endoscope camera cooling system 100 of the first aspect is provided with an air inlet 111 and an air outlet 112 in the chassis 110, and a functional module 200 and a first heat exchange fan 120 are arranged inside the chassis 110. The functional module 200 is located upstream of the air path of the first heat exchange fan 120. The functional module 200 generates heat when running. The first heat exchange fan 120 sucks cold air outside the chassis 110 into the chassis 110 and flows through the functional module 200 for heat exchange to form a hot air flow, and then the hot air flow is driven to the downstream of the air path of the first heat exchange fan 120; a second heat exchange fan 130 is arranged at the position of the air outlet 112, and the second heat exchange fan 130 discharges the hot air flow in the chassis 110 from the air outlet 112. The air volume generated by the second heat exchange fan 130 is greater than or equal to the sum of the air volumes generated by all the first heat exchange fans 120, thereby ensuring the overall airflow direction and preventing air path confusion.

[0042] In some embodiments, the air volume generated by the second heat exchange fan 130 is greater than or equal to the sum of the air volumes of all the first heat exchange fans 120. It can be understood that the heat dissipation efficiency of the second heat exchange fan 130 is greater than or equal to the sum of the heat dissipation efficiencies of all the first heat exchange fans 120. It can also be understood that the air flow rate through the second heat exchange fan 130 is greater than or equal to the sum of the air flow rates of all the first heat exchange fans 120. It can also be understood that the wind speed generated by the second heat exchange fan 130 is greater than or equal to the sum of the wind speeds generated by all the first heat exchange fans 120.

[0043] Furthermore, the present application guides the air path through all functional modules 200 through the installation method of the first heat exchange fan 120 and the second heat exchange fan 130 in conjunction with the air inlet and outlet of the chassis 110, thereby playing a rectifying role, thereby performing heat exchange and having a significant heat dissipation effect.

[0044] More specifically, when the first heat exchange fan 120 and the second heat exchange fan 130 are started, the fan blades rotate to generate airflow, thereby driving the air in the upstream of the air path to the downstream of the air path.

[0045] In some embodiments, the air inlet 111 and the air outlet 112 are a collection of multiple small holes, which can achieve ventilation while preventing larger foreign objects from entering the chassis 110 to a certain extent.

[0046] It should be noted that the present scheme may include four embodiments. Specifically, a first heat exchange fan drives air to flow through a functional module; multiple first heat exchange fans drive air to flow through multiple functional modules; a first heat exchange fan drives air to flow through multiple functional modules; multiple first heat exchange fans drive air to flow through a functional module; the above embodiments all fall within the protection scope of the present application.

[0047] In some embodiments, reference Figures 1 to 3 and Figure 5The air inlet 111 includes a first air inlet 1111 and a second air inlet 1112. The first air inlet 1111 has at least one group and faces the functional module 200. The first air inlet 1111 and the first heat exchange fan 120 form an air inlet path. The second air inlet 1112 and the air outlet 112 are respectively arranged at opposite ends of the chassis 110, and the second air inlet 1112 and the second heat exchange fan 130 form an air outlet path.

[0048] Specifically, in this solution, an air inlet path is formed between the first air inlet hole 1111 and the first heat exchange fan 120, and an air outlet path is formed between the second air inlet hole 1112 and the second heat exchange fan 130, thereby achieving a clear design of the air path, avoiding confusion in the air path, making the air flow smoother, and enhancing the heat dissipation effect.

[0049] In some embodiments, reference Figure 2 , Figure 3 ,as well as Figures 5 to 7 The functional module 200 is arranged on the bottom wall of the chassis 110, the first heat exchange fan 120 is arranged on the top of the functional module 200, and the first air inlet hole 1111 is arranged on the side wall of the chassis 110; the distance between the first air inlet hole 1111 and the bottom wall of the chassis 110 is smaller than the distance between the first heat exchange fan 120 and the bottom wall of the chassis 110.

[0050] Specifically, the first heat exchange fan 120 is arranged at the top of the functional module 200 and is higher than the first air inlet 1111. The first air inlet 1111 faces the functional module 200. When the first heat exchange fan 120 is started, the cold air outside the chassis 110 flows into the inside of the chassis. The functional module is located between the first heat exchange fan and the first air inlet, ensuring that the cold air flows from bottom to top through the functional module 200, thereby performing heat exchange to form a hot air flow, and then being drawn to the top of the chassis 110 by the first heat exchange fan 120, thereby better realizing the design of the air inlet path.

[0051] In particular, the first heat exchange fan 120 may not be arranged at the top of the functional module 200, but may be arranged at the extension of the line connecting the first air inlet 1111 and the functional module 200. In short, the functional module 200 can be located upstream of the air path of the first heat exchange fan 120, so as to achieve the purpose of placing the functional module above the path of the cold air flow, which also falls within the protection scope of the present application.

[0052] In some embodiments, reference Figure 6 and Figure 7 The endoscope camera heat dissipation system 100 further includes a heat conducting component 140 , which is disposed between the functional module 200 and the first heat exchange fan 120 .

[0053] Specifically, the present solution adds a heat conducting component 140 to conduct the heat generated by the functional module 200 to the first heat exchange fan 120 as much as possible, thereby enhancing the heat dissipation effect.

[0054] In some embodiments, reference Figure 6 and Figure 7 The heat-conducting component 140 includes a heat-conducting layer 141 , and the heat-conducting layer 141 is laid on the chip board 210 of the functional module 200 .

[0055] Specifically, this solution is a specific implementation of the heat-conducting component 140, which conducts heat by laying the chip board 210 through the heat-conducting layer 141, and has a good heat-conducting effect.

[0056] More specifically, the heat-conducting layer 141 may be, but is not limited to, thermally conductive silicone grease, thermally conductive glue, and thermally conductive silicone sheet.

[0057] Furthermore, the present solution needs to first confirm the position and shape of the chip board 210 and then adaptively design the size and thickness of the heat conducting layer 141 .

[0058] In some embodiments, reference Figure 6 and Figure 7 The heat-conducting component 140 also includes a heat sink 142, which is disposed on the chip board 210 of the functional module 200. The heat sink 142 has a heat-absorbing part and a heat-dissipating part, and the heat-absorbing part and the heat-dissipating part are thermally connected; the heat-absorbing part abuts against the heat-conducting layer 141, and the heat-dissipating part faces the first heat exchange fan 120.

[0059] Specifically, this solution is a preferred implementation of the heat conduction component 140, and a heat sink 142 is added to conduct heat, thereby further improving the heat conduction effect.

[0060] More specifically, the radiator 142 is divided into air-cooled and water-cooled types. It is generally connected to the heat dissipation component through a metal seat, and then the heat is transferred to the cooling fins through a heat pipe welded to the metal seat. Relative to this solution, the metal seat is the heat-absorbing part of the radiator 142, and the cooling fins are the heat-dissipating part of the radiator 142.

[0061] In some embodiments, reference Figure 6 and Figure 7 The heat sink 142 and the chip board 210 of the functional module 200 are locked and fixed by an elastic fastener 143 .

[0062] Specifically, in this embodiment, the fixing method of the heat sink 142 and the chip board 210 is further preferably set, and the two are locked and fixed by elastic fasteners 143 to ensure that the clamping force buffer is controllable to avoid the clamping force exceeding the tolerable range of the chip board 210 and damaging the chip board 210.

[0063] More specifically, the elastic fastener 143 may be a spring bolt assembly or a spring screw assembly.

[0064] In some embodiments, reference Figures 1 to 3 and Figure 5 There are multiple functional modules 200, and multiple first heat exchange fans 120 are correspondingly arranged. A first heat exchange fan 120 is respectively arranged on the top of each functional module 200; multiple functional modules 200 are distributed on both sides of the chassis 110, and multiple groups of first air inlet holes 1111 are arranged on the side walls of both sides of the chassis 110, and the multiple groups of first air inlet holes 1111 are arranged corresponding to the multiple functional modules 200.

[0065] Specifically, this scheme is a setting method of multiple functional modules 200, and a first heat exchange fan 120 is respectively provided on the top of each functional module 200; multiple functional modules 200 are distributed on both sides of the chassis 110, and the side walls of the chassis 110 are respectively provided with first air inlet holes 1111 to ensure that the cold air flows through all the functional modules 200.

[0066] More specifically, the functional module 200 includes but is not limited to a video output module 220, a video processing module 230, a video storage module 250, and a power module 240. In an optional embodiment, the video output module 220 and the video processing module 230 are arranged on the left side of the chassis 110, and two groups of first air inlet holes 1111 are provided on the left side wall of the chassis 110 to correspond thereto; the video storage module 250 and the power module 240 are arranged on the right side of the chassis 110, and since the power module 240 occupies a smaller volume and generates less heat, only one group of first air inlet holes 1111 corresponding to the video storage module 250 can be provided on the right side wall of the chassis 110.

[0067] In particular, multiple functional modules 200 can also be located on one side of the chassis 110, and a first air inlet 1111 can be opened on the side wall of this side. A first heat exchange fan 120 can be set on the other side of the chassis 110, which can also achieve the effect of airflow flowing through all functional modules 200. Therefore, it also falls within the protection scope of this application.

[0068] In some embodiments, reference Figure 1 , Figure 4 and Figure 5 The air outlet 112 is disposed on the side wall of one end of the chassis 110 , and the second heat exchange fan 130 is disposed inside the chassis 110 ; the second air inlet 1112 is disposed on the bottom wall of the other end of the chassis 110 .

[0069] Specifically, this solution is a preferred implementation of the air outlet path. The second heat exchange fan 130 and the second air inlet 1112 are respectively arranged at both ends of the chassis 110, so that the air flow is smooth and the air outlet path flows through all functional modules 200.

[0070] In addition, the second air inlet hole 1112 is disposed on the bottom wall of the chassis 110 , and the airflow first meets the functional module 200 disposed on the bottom wall and exchanges heat again, further enhancing the heat dissipation effect.

[0071] Furthermore, the second heat exchange fan 130 is disposed inside the chassis 110 , which reduces the occupied space of the entire machine and avoids interference between the second heat exchange fan 130 and external components.

[0072] In particular, the second air inlet 1112 may also be disposed on the top wall or the side wall of the chassis 110 , which can also achieve the purpose of unobstructed air outlet path and will not compete with the air inlet path for airflow.

[0073] In a second aspect, the present application further provides an endoscope, comprising the endoscope camera heat dissipation system 100 of the first aspect.

[0074] Specifically, the endoscope in this solution includes the endoscope camera cooling system 100, so the endoscope in this solution has all the beneficial effects of the endoscope camera cooling system 100. In addition, the endoscope in this solution also includes other components, and only the components related to this solution are listed here, but it does not limit the structure of the endoscope.

[0075] Although the embodiments of the present application are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. An endoscope camera heat dissipation system, characterized in that: include: A chassis (110) having an air inlet (111) and an air outlet (112), wherein a functional module (200) is arranged inside the chassis; at least one first heat exchange fan (120) disposed inside the chassis (110); the first heat exchange fan (120) can drive air to flow from the air inlet (111) into the chassis (110) and flow through the functional module (200); The second heat exchange fan (130) has at least one and is arranged at the position of the air outlet (112); the air volume generated by the at least one second heat exchange fan (130) is greater than or equal to the air volume generated by the at least one first heat exchange fan (120).

2. The endoscope camera heat dissipation system according to claim 1, characterized in that: The at least one first heat exchange fan (120) comprises a plurality of first heat exchange fans (120), wherein the plurality of first heat exchange fans (120) are respectively installed in the chassis (110) and drive air to flow through the functional module (200); The air volume generated by the at least one second heat exchange fan (130) is greater than or equal to the sum of the air volumes generated by the plurality of first heat exchange fans (120).

3. The endoscope camera heat dissipation system according to claim 1, characterized in that: The at least one second heat exchange fan (130) comprises a plurality of second heat exchange fans (130), and the plurality of second heat exchange fans (130) are respectively installed at the positions of the air outlet holes (112); The sum of the air volumes generated by the plurality of second heat exchange fans (130) is greater than or equal to the air volume generated by the at least one first heat exchange fan (120).

4. The endoscope camera heat dissipation system according to claim 1, characterized in that: The at least one first heat exchange fan (120) comprises a plurality of first heat exchange fans (120), wherein the plurality of first heat exchange fans (120) are respectively installed inside the chassis (110) and drive air to flow through the functional module (200); The at least one second heat exchange fan (130) comprises a plurality of second heat exchange fans (130), and the plurality of second heat exchange fans (130) are respectively installed at the positions of the air outlet holes (112); The sum of the air volumes generated by the plurality of second heat exchange fans (130) is greater than or equal to the sum of the air volumes generated by the plurality of first heat exchange fans (120).

5. The endoscope camera heat dissipation system according to claim 1, characterized in that: The air inlet (111) comprises: The first air inlet holes (1111) have at least one group and face the functional module (200), and an air inlet path is formed between the first air inlet holes (1111) and the first heat exchange fan (120); The second air inlet hole (1112) and the air outlet hole (112) are respectively arranged at two opposite ends of the chassis (110), and an air outlet path is formed between the second air inlet hole (1112) and the second heat exchange fan (130).

6. The endoscope camera heat dissipation system according to claim 5, characterized in that: The functional module (200) is arranged on the bottom wall of the chassis (110), the first heat exchange fan (120) is arranged on the top of the functional module (200), and the first air inlet (1111) is arranged on the side wall of the chassis (110); The distance between the first air inlet hole (1111) and the bottom wall of the chassis (110) is smaller than the distance between the first heat exchange fan (120) and the bottom wall of the chassis (110).

7. The endoscope camera heat dissipation system according to claim 6, characterized in that: The endoscope camera heat dissipation system further comprises a heat conduction component (140), wherein the heat conduction component (140) is installed inside the chassis (110) and is located between the functional module (200) and the first heat exchange fan (120); The heat-conducting component (140) comprises at least a heat-conducting layer (141), and the heat-conducting layer (141) is laid on the chip board (210) of the functional module (200).

8. The endoscope camera heat dissipation system according to claim 7, characterized in that: The heat-conducting component (140) further comprises a heat sink (142), and the heat sink (142) is locked to the chip board (210) of the functional module (200) via an elastic fastener (143); The heat sink (142) comprises a heat absorbing portion and a heat dissipating portion which are heat-conductively connected, the heat absorbing portion abuts against the heat conducting layer (141), and the heat dissipating portion faces the first heat exchange fan (120).

9. The endoscope camera heat dissipation system according to any one of claims 5 to 8, characterized in that: The second heat exchange fan (130) is arranged inside the chassis (110).

10. An endoscope, characterized in that: An endoscope camera cooling system (100) comprising any one of claims 1 to 9.

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