Adsorption type silicon wafer cleaning equipment

Abstract

The utility model belongs to the technical field of silicon wafer cleaning, and particularly relates to adsorption type silicon wafer cleaning equipment. The embodiment of the utility model provides adsorption type silicon wafer cleaning equipment which comprises a conveying mechanism, a front washing mechanism and a back washing mechanism, and the conveying mechanism is provided with a front washing station and a back washing station; the front washing mechanism and the back washing mechanism are arranged on the two sides of the front washing station and the two sides of the back washing station respectively. When the silicon wafer passes through the forward washing station along the conveying mechanism, the forward washing mechanism cleans the front surface of the silicon wafer; and when the silicon wafer passes through the back washing station along the conveying mechanism, the back washing mechanism cleans the back surface of the silicon wafer. The front washing mechanism and the back washing mechanism are respectively arranged on the conveying plane of the conveying mechanism, so that the front surface and the back surface of the silicon wafer can be washed in an assembly line form, the productivity is increased, and the labor cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer cleaning, and in particular relates to an adsorption type silicon wafer cleaning device. Background Art

[0002] After the silicon rod is squared, it forms silicon wafers. After the silicon wafers are cut, they need to be debonded, sliced, inserted, silicon powder cleaned, sorted and other processes before they can be textured.

[0003] In the above processes, the silicon powder cleaning process after silicon wafer cutting is completed by a trough-type equipment. However, the existing trough-type equipment has low production capacity and high labor costs. It is more complicated to automate the production line and many devices are used. Therefore, it is necessary to design an adsorption-type silicon wafer cleaning equipment. Utility Model Content

[0004] The utility model aims to provide an adsorption type silicon wafer cleaning device to solve the above problems.

[0005] In order to achieve the above-mentioned purpose, the embodiment of the utility model provides an adsorption type silicon wafer cleaning device, comprising: a conveying mechanism, a front washing mechanism and a back washing mechanism, wherein the conveying mechanism has a front washing station and a back washing station;

[0006] The front washing mechanism and the back washing mechanism are respectively arranged on both sides of the front washing station and the back washing station; wherein

[0007] When the silicon wafer passes through the front washing station along the conveying mechanism, the front washing mechanism cleans the front side of the silicon wafer;

[0008] When the silicon wafer passes through the back washing station along the conveying mechanism, the back washing mechanism cleans the back side of the silicon wafer.

[0009] Furthermore, the forward washing mechanism is located above the forward washing station, and comprises a forward washing brush roller and a forward washing spray head arranged on one side of the forward washing brush roller, and the water outlet end of the forward washing spray head faces the bottom of the forward washing brush roller.

[0010] Furthermore, the back washing mechanism is located below the back washing station, and comprises a back washing brush roller and a back washing spray head arranged on one side of the back washing brush roller, and the water outlet end of the back washing spray head faces the top of the back washing brush roller.

[0011] Furthermore, the conveying mechanism includes a plurality of lower rollers and a plurality of upper rollers, the upper rollers and the lower rollers are arranged at intervals, and the interval width corresponds to the thickness of the silicon wafer.

[0012] Furthermore, the lower roller is provided with guide blocks, and the guide blocks are sequentially retracted toward the center along both sides until they correspond to the width of the silicon wafer.

[0013] Furthermore, the lower roller is a vacuum rubber-coated roller.

[0014] Furthermore, the upper roller is a PVC foam upper pressure rod.

[0015] Furthermore, the adsorption-type silicon wafer cleaning device further comprises two adsorption mechanisms, and the two adsorption mechanisms correspond to the front washing mechanism and the back washing mechanism respectively;

[0016] The forward washing mechanism and the adsorption mechanism are respectively arranged on both sides of the forward washing station;

[0017] The back-washing mechanism and the adsorption mechanism are respectively arranged on both sides of the back-washing station.

[0018] Furthermore, the adsorption mechanism includes a lifting cylinder, a support frame and a plurality of suction cups, the support frame is installed on the movable end of the lifting cylinder, the plurality of suction cups are evenly arranged on the support frame, and the suction cups are arranged toward the conveying mechanism.

[0019] Compared with the prior art, the embodiments of the utility model have the following beneficial effects: by respectively arranging a front washing mechanism and a back washing mechanism on the conveying plane of the conveying mechanism, the front and back sides of the silicon wafer can be cleaned in the form of an assembly line, thereby increasing production capacity and reducing labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0021] Figure 1 The structure diagram of the adsorption type silicon wafer cleaning device of the utility model is shown;

[0022] Figure 2 Shows Figure 1 A partial enlarged view of part A;

[0023] Figure 3 Shows Figure 1 A partial enlarged view of part B;

[0024] Figure 4 A schematic diagram of the adsorption state of the adsorption mechanism of the utility model is shown;

[0025] Figure 5 The schematic diagram of the structure of the lower roller of the utility model is shown.

[0026] In the figure:

[0027] 1. Conveying mechanism; 11. Lower roller; 12. Upper roller; 121. Guide block;

[0028] 2. Positive washing mechanism; 21. Positive washing brush roller; 22. Positive washing spray head;

[0029] 3. Back washing mechanism; 31. Back washing brush roller; 32. Back washing spray head;

[0030] 4. Adsorption mechanism; 41. Lifting cylinder; 42. Support frame; 43. Dry suction cup. DETAILED DESCRIPTION

[0031] Now the utility model is further described in detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the utility model in a schematic manner, and therefore only show the components related to the utility model.

[0032] Examples, such as Figures 1 to 5 As shown, this embodiment provides an adsorption-type silicon wafer cleaning device, including a conveying mechanism 1, a front washing mechanism 2, and a back washing mechanism 3. The conveying mechanism 1 is provided with a front washing station and a back washing station.

[0033] The front washing mechanism 2 and the back washing mechanism 3 are respectively arranged on both sides of the front washing station and the back washing station; during the front washing operation, the silicon wafer is transported to the front washing station by the conveying mechanism 1, and the front washing mechanism 2 cleans the front side of the silicon wafer; during the back washing operation, the silicon wafer is transported to the back washing station by the conveying mechanism 1, and the back washing mechanism 3 cleans the back side of the silicon wafer.

[0034] The positive washing mechanism 2 includes: a positive washing brush roller 21 and a positive washing spray head 22. The positive washing mechanism 2 is located above the positive washing station. The positive washing brush roller 21 and the positive washing spray head 22 are located on the same horizontal line, and the water outlet end of the positive washing spray head 22 is facing the bottom of the positive washing brush roller 21, where it connects with the silicon wafer. In this way, clean flowing water can wash away dirt while rolling the brush.

[0035] The back washing mechanism 3 includes: a back washing brush roller 31 and a back washing spray head 32. The back washing mechanism 2 is located below the back washing station. The back washing brush roller 31 and the back washing spray head 32 are located on the same horizontal line, and the water outlet end of the back washing spray head 32 is facing the top of the back washing brush roller 31, where it connects with the silicon wafer. In this way, clean running water can wash away dirt while the brush is rolling.

[0036] The conveying structure 1 includes: a plurality of lower rollers 11 and a plurality of upper rollers 12, and the upper rollers 12 and the lower rollers 11 are spaced a certain distance apart. Preferably, the distance between the two is equal to the thickness of the silicon wafer, so that the silicon wafer can be stably and reliably conveyed between each upper roller 12 and the lower roller 11.

[0037] Each lower roller 11 is provided with a pair of guide blocks 121, which are indented along both sides toward the center until they correspond to the width of the silicon wafer, so as to prevent the silicon wafer from deviating left or right during transmission. Preferably, the fixed position of the guide block 121 is adjustable, so as to facilitate the later application to silicon wafers of various sizes.

[0038] The lower roller 11 is a vacuum rubber-coated roller to prevent the silicon wafer from slipping left and right when being cleaned by the brush roller 21.

[0039] The upper roller 12 is a PVC foam upper pressure rod.

[0040] The adsorption type silicon wafer cleaning device further comprises two adsorption mechanisms 4 , which correspond to the front washing mechanism 2 and the back washing mechanism 3 respectively.

[0041] The positive washing mechanism 2 and the adsorption mechanism 4 are respectively arranged on both sides of the positive washing station, the positive washing mechanism 2 is above the positive washing station, and the adsorption mechanism 4 is below the positive washing station. When the conveying mechanism 1 conveys the silicon wafer to the positive washing station, the adsorption mechanism 4 starts to work, the lifting cylinder 41 rises and sucks air to make the suction cup 43 suck and lift the silicon wafer, and then lifts the silicon wafer, separates from the lower roller 11, and contacts the positive washing brush roller 21, and starts the positive washing process.

[0042] The positive washing brush roller 21 and the positive washing spray head 22 move left and right to clean the front side of the silicon wafer. Preferably, the number of the positive washing brush roller 21 and the positive washing spray head 22 can be greater than one to achieve a better cleaning effect.

[0043] The back washing mechanism 3 and the adsorption mechanism 4 are respectively arranged on both sides of the back washing station. The back washing mechanism 3 is below the back washing station, and the adsorption mechanism 4 is above the back washing station. The adsorption mechanism 4 can move left and right. When the conveying mechanism 1 conveys the silicon wafer to the cache position, the adsorption mechanism 4 starts to move towards the cache position, lowers the lifting cylinder 41 and uses the suction cup 43 to suck and extract the silicon wafer, and then moves to the back washing station to make the back of the silicon wafer contact with the back washing brush roller 31, and start the back washing process.

[0044] The back-washing brush roller 31 and the back-washing spray head 32 move left and right to clean the back side of the silicon wafer. Preferably, the number of the back-washing brush roller 31 and the back-washing spray head 32 can be greater than one to achieve a better cleaning effect.

[0045] After completing the forward washing operation, the adsorption mechanism 4 retracts and the silicon wafer is placed on the conveying mechanism 1, which continues to be conveyed to the immersion tank by the conveying mechanism 1 for immersion operation and then conveyed to the cache position. The adsorption mechanism 4 of the back washing station can move left and right. When the silicon wafer is moved to the cache position, the back washing station performs back washing. After completing the back washing operation, the adsorption mechanism 4 places the silicon wafer on the conveying mechanism 1, thereby completing the silicon wafer cleaning operation.

[0046] Compared with the prior art, the embodiments of the utility model have the following improvement effects: by respectively arranging a front washing mechanism and a back washing mechanism on the conveying plane of the conveying mechanism, the silicon wafer can be cleaned on the front and back sides in the form of an assembly line, thereby increasing production capacity and reducing labor costs.

[0047] It is worth mentioning that the technical features such as other components of the adsorption silicon wafer cleaning equipment involved in this utility model patent application should be regarded as prior art. The specific structure, working principle and possible control method and spatial layout method of these technical features can be selected according to the conventional methods in the field and should not be regarded as the inventive point of this utility model patent. This utility model patent will not be further elaborated.

[0048] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. For those skilled in the art, the utility model may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An adsorption type silicon wafer cleaning device, characterized in that: include: A conveying mechanism (1), a front washing mechanism (2) and a back washing mechanism (3), wherein the conveying mechanism (1) is provided with a front washing station and a back washing station; The front washing mechanism (2) and the back washing mechanism (3) are respectively arranged on both sides of the front washing station and the back washing station; in When the silicon wafer passes through the front washing station along the conveying mechanism (1), the front washing mechanism (2) cleans the front side of the silicon wafer; When the silicon wafer passes through the back washing station along the conveying mechanism (1), the back washing mechanism (3) cleans the back side of the silicon wafer.

2. The adsorption type silicon wafer cleaning device according to claim 1, characterized in that: The forward washing mechanism (2) is located above the forward washing station, and comprises a forward washing brush roller (21) and a forward washing spray head (22) arranged on one side of the forward washing brush roller (21), and a water outlet end of the forward washing spray head (22) faces the bottom of the forward washing brush roller (21).

3. The adsorption type silicon wafer cleaning equipment according to claim 1, characterized in that: The back-washing mechanism (3) is located below the back-washing station, and comprises a back-washing brush roller (31) and a back-washing spray head (32) arranged on one side of the back-washing brush roller (31), and a water outlet end of the back-washing spray head (32) faces the top of the back-washing brush roller (31).

4. The adsorption type silicon wafer cleaning device according to claim 1, characterized in that: The conveying mechanism (1) comprises a plurality of lower rollers (11) and a plurality of upper rollers (12); the upper rollers (12) and the lower rollers (11) are arranged at intervals, and the width of the intervals corresponds to the thickness of the silicon wafers.

5. The adsorption type silicon wafer cleaning equipment according to claim 4, characterized in that: The lower roller (11) is provided with a guide block (121), and the guide block (121) is sequentially retracted toward the center along both sides until it corresponds to the width of the silicon wafer.

6. The adsorption type silicon wafer cleaning device according to claim 4, characterized in that: The lower roller (11) is a vacuum rubber-coated roller.

7. The adsorption type silicon wafer cleaning device according to claim 4, characterized in that: The upper roller (12) is a PVC foam upper pressure rod.

8. The adsorption type silicon wafer cleaning device according to claim 1, characterized in that: The adsorption-type silicon wafer cleaning device further comprises two adsorption mechanisms (4), wherein the two adsorption mechanisms (4) correspond to the front washing mechanism (2) and the back washing mechanism (3) respectively; The forward washing mechanism (2) and the adsorption mechanism (4) are respectively arranged on both sides of the forward washing station; The backwash mechanism (3) and the adsorption mechanism (4) are respectively arranged on both sides of the backwash station.

9. The adsorption type silicon wafer cleaning device according to claim 8, characterized in that: The adsorption mechanism (4) comprises a lifting cylinder (41), a support frame (42) and a plurality of suction cups (43), wherein the support frame (42) is mounted on the movable end of the lifting cylinder (41), and the plurality of suction cups (43) are evenly arranged on the support frame (42), and the suction cups (43) are arranged toward the conveying mechanism (1).

Images