Vapor chamber shell and vapor chamber
By embedding high-strength stainless steel reinforcements in the main plate body of the vapor chamber, a composite structure of the vapor chamber shell is formed, which solves the problem of insufficient tensile strength of the existing vapor chamber in high temperature environments and achieves high strength and low temperature. Cost production effects.
Patent Information
- Application Number
- CN202420349828.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-23
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-02-23
AI Technical Summary
The existing uniform temperature plates are insufficient in a high temperature environment, which makes it easy to expand the plate and deform, and it is difficult to remain fixed under the action of locking force, resulting in the problem of insufficient strength.
It adopts a composite structure of the vapor plate shell, and embeds high-strength stainless steel reinforcements in the main board body to form a composite structure of the main board body and the reinforcement body to improve the overall tensile strength.
It effectively improves the tensile strength of the vapor chamber, can remain stable in high-temperature environments, avoid deformation, and remain fixed under the action of locking force, meeting high-strength requirements while avoiding the high cost of adding new processes and materials.
Smart Images
Figure CN222378858U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of heat exchange technology, and in particular to a temperature homogenizing plate housing and a temperature homogenizing plate. Background Art
[0002] A temperature equalizer is a heat dissipation element with high efficiency of heat conduction. The heat dissipation medium enclosed in the plate-shaped cavity is cyclically actuated by the phase change of evaporation and condensation, so that it has the characteristics of rapid temperature equalization, thereby having the functions of rapid heat conduction and heat diffusion. Generally speaking, the structure of a temperature equalizer basically includes a vacuum sealed container formed by an outer shell, an internal capillary structure and an internal phase change medium. Most of the existing temperature equalizers use a copper substrate, a stainless steel substrate or an aluminum substrate as the shell. Although the stainless steel substrate has good tensile yield strength, its brazing process is complex, the cost is high, and the reliability is poor. It is difficult to achieve conventional applications. Therefore, copper substrates and aluminum substrates are still the majority in the existing technology.
[0003] In the prior art, in some usage scenarios, there are high requirements for the strength of the temperature equalizer. First, the temperature equalizer is used for heat dissipation in a high temperature of 150-350°C, and the air pressure inside the cavity generated in this temperature environment is much greater than the tensile strength of the shell of its general design thickness, which will cause expansion and deformation of the plate; second, the temperature equalizer needs to be fixed to the heat source under the locking of the lock, and the temperature equalizer can easily be deformed under the action of the locking force.
[0004] Therefore, how to improve the strength of the temperature equalizer within a limited cost has become an important technical problem that technicians in this field need to solve. Utility Model Content
[0005] In view of this, the present application provides a temperature vapor chamber housing and a temperature vapor chamber to solve the problem in the prior art of how to improve the strength of the temperature vapor chamber within a limited cost.
[0006] In order to achieve the above objectives, this application provides the following technical solutions:
[0007] A temperature homogenizing plate housing, comprising a main shell, wherein a first plate portion and a second plate portion of the main shell are located opposite to each other, and at least the first plate portion is configured to include:
[0008] Main board body;
[0009] A reinforcing body, embedded in the main body;
[0010] Wherein, the main body is made of a first material, the reinforcement body is made of a second material, and the strength of the reinforcement body is greater than the strength of the main body.
[0011] Optionally, the reinforcement body is an integrated structure, or the reinforcement body includes a plurality of separate structures.
[0012] Optionally, the reinforcement body includes a plurality of strip reinforcement bodies and / or a plurality of block reinforcement bodies.
[0013] Optionally, the reinforcement body includes a plurality of strip reinforcement bodies; wherein,
[0014] All of the strip-shaped reinforcement bodies are arranged side by side;
[0015] Alternatively, all of the strip-shaped reinforcement bodies cross each other vertically and horizontally to form a grid structure.
[0016] Optionally, any of the strip reinforcement bodies meets the parallel or perpendicular condition relative to the edge of the main body;
[0017] Alternatively, any of the strip-shaped reinforcement bodies meets an angle condition relative to an edge of the main body.
[0018] Optionally, the reinforcement body further includes a plurality of block reinforcement bodies, and all of the block reinforcement bodies are dispersed among all of the strip reinforcement bodies.
[0019] Optionally, the width of the strip reinforcement body is 0.5 mm-5 mm, and the distance between two adjacent strip reinforcement bodies is 3 mm-10 mm.
[0020] Optionally, all of the block-shaped reinforcements are circular and have a diameter of 1 mm-10 mm, all of the block-shaped reinforcements are distributed in a rectangular array, and the center distance between two adjacent block-shaped reinforcements in the same row or column is 10 mm-15 mm.
[0021] Optionally, the main shell includes a first cover body and a second cover body, the first cover body is sealingly connected to the opening of the second cover body, and the first cover body is the first plate portion.
[0022] A temperature homogenizing plate, comprising:
[0023] A housing having a cavity;
[0024] A first capillary structure is located in the cavity and is in contact with the first plate portion;
[0025] A second capillary structure is located in the cavity and is in contact with the second plate portion;
[0026] A liquid injection tube, disposed outside the shell and communicated with the cavity;
[0027] A support body supported between the first plate portion and the second plate portion;
[0028] Wherein, the shell is a temperature homogenizing plate shell in any of the above items.
[0029] The heat spreader shell provided by the present application includes a main shell, the first plate portion and the second plate portion of the main shell are positioned oppositely, and at least the first plate portion is configured to include a main plate body and a reinforcing body embedded in the main plate body; wherein the main plate body is a first material body, the reinforcing body is a second material body, and the strength of the reinforcing body is greater than the strength of the main plate body. In this configuration, the second plate portion is used to contact the heat source, the first material body can be a conventional copper material, and the second material body can be a stainless steel material. The stainless steel material is embedded in the copper material, and the high strength advantage of the stainless steel material is introduced on the basis of retaining the original copper material body, and the strength of the heat spreader shell is strengthened through structural composite to meet the increasingly high strength requirements of the heat spreader; moreover, the heat spreader shell provided by the present application is not material composited, and still uses the original copper substrate or aluminum substrate as the main body, so that the existing manufacturing process and manufacturing equipment of the heat spreader produced based on the copper substrate or aluminum substrate can continue to be used, avoiding the high cost caused by adding a new process, avoiding the problem of expensive fixture costs, saving production costs to a great extent, and solving the problem of how to improve the strength of the heat spreader within a limited cost in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.
[0031] Figure 1 A schematic diagram of the exploded structure of the temperature homogenizing plate provided in an embodiment of the present application;
[0032] Figure 2 A schematic diagram of a first embodiment of a temperature homogenizing plate housing provided in an embodiment of the present application;
[0033] Figure 3 A schematic diagram of a second embodiment of a temperature homogenizing plate housing provided in an embodiment of the present application;
[0034] Figure 4 A schematic diagram of a third embodiment of a temperature vapor chamber housing provided in an embodiment of the present application;
[0035] Figure 5 A schematic diagram of a fourth embodiment of a temperature homogenizing plate housing provided in an embodiment of the present application;
[0036] Figure 6 A schematic diagram of a fifth embodiment of a temperature homogenizing plate housing provided in an embodiment of the present application;
[0037] Figure 7 A schematic diagram of a sixth embodiment of a temperature vapor chamber housing provided in an embodiment of the present application;
[0038] Figure 8 A schematic diagram of a seventh embodiment of a temperature homogenizing plate housing provided in an embodiment of the present application;
[0039] Fig. 9 A schematic diagram of an eighth embodiment of a temperature vapor chamber housing provided in an embodiment of the present application;
[0040] Fig.10 A schematic diagram of a ninth embodiment of a temperature homogenizing plate housing provided in an embodiment of the present application.
[0041] exist Figure 1-Figure 10 middle:
[0042] 1. First cover body; 2. Second cover body; 3. First capillary structure; 4. Second capillary structure; 5. Liquid injection tube; 6. Support body;
[0043] 11. Main body; 12. Strip reinforcement; 13. Block reinforcement. DETAILED DESCRIPTION
[0044] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0045] like Figure 1-Figure 10 As shown, the embodiment of the present application provides a temperature equalization board housing, including a main shell provided with a sealed cavity, the main shell is generally a flat structure, and the two plate parts with the largest area are the first plate part and the second plate part, the first plate part and the second plate part of the main shell are opposite to each other, and the second plate part is used to contact the heat source, at least the first plate part is configured to include a main board body 11 and a reinforcing body embedded in the main board body 11, that is, the main board body 11 and the reinforcing body are an integral structure; wherein, the main board body 11 is a first material body, the reinforcing body is a second material body, and the strength of the reinforcing body is greater than the strength of the main board body 11. The first material body can be a conventional copper material or aluminum material, and the second material body can be a stainless steel material or other high-strength material. Since the second plate part is close to the heat source, generally speaking, the shape of the second plate part can be maintained by physical restriction, so deformation often occurs on the side away from the heat source, that is, the first plate part, so at least the first plate part has a composite structure reinforcement design, of course, it is also feasible to have this design for both the first plate part and the second plate part.
[0046] In this way, the second material body is embedded in the first material body, and the high strength advantage of the second material body is introduced on the basis of retaining the original main body of the first material body. For example, stainless steel is embedded in copper material, and the high strength advantage of stainless steel is introduced on the basis of retaining the original main body of copper material. The strength of the temperature equalizing board shell is strengthened through structural composite to meet the increasingly high strength requirements of the temperature equalizing board. Moreover, the temperature equalizing board shell provided by the present application is not subjected to material composite, but still uses the original copper substrate or aluminum substrate as the main body. In this way, the existing manufacturing process and manufacturing equipment of the temperature equalizing board produced based on the copper substrate or aluminum substrate can continue to be used, avoiding the high cost caused by adding new processes, avoiding the problem of expensive fixture costs, saving production costs to a great extent, and solving the problem of how to improve the strength of the temperature equalizing board within a limited cost in the prior art.
[0047] It should be noted that the reinforcement body can be formed into the main body 11 by powder deposition, inlaying, pressing, etc.
[0048] Moreover, the heat spreader housing provided by the present application does not require copper solder during the production process, and there is no problem of air leakage, cold soldering, or solder contamination of the capillary structure of the internal cavity. In addition, the manufacturing process is also simplified, saving a lot of manpower and material resources for assembling and disassembling welding jigs, and is suitable for mass production.
[0049] Moreover, compared with the prior art methods of enhancing strength by thickening the shell plate, sandblasting the shell surface, grinding the shell surface, adding an anti-deformation structure inside the shell, adding a reinforcing plate outside the shell, etc., the temperature equalizing plate shell provided in the present application avoids: the problem of high cost of increasing the thickness of the plate; the problem of increasing grinding and sandblasting, complex process, high defect rate and high cost; the problem of adding internal structure, high product cost and consumables, and too many internal structures easily blocking the gas circuit and affecting performance; the problem of adding a reinforcing plate, which adds a part and increases the cost, and adds a brazing process, which increases the cost of the jig and the overall cost.
[0050] In a preferred embodiment, the main housing includes a first cover 1 and a second cover 2; wherein the first cover 1 and the second cover 2 can both be relatively shallow and thin without a cover box; or the first cover 1 can be a flat plate and the second cover 2 can be relatively shallow and thin without a cover box, and the first cover 1 is sealed to the opening of the second cover 2. In this case, the first cover 1 as a whole is the first plate portion, and the largest part of the second cover 2 is the second plate portion, that is, the main housing is composed of two split structures spliced together, and the first plate portion is a flat plate, which is convenient for the production and processing of structural composites. Of course, it is also feasible to design a splicing method of two plates with a frame structure.
[0051] In a specific embodiment, the reinforcement body is an integrated structure, or the reinforcement body includes a plurality of separate structures. In this way, the reinforcement body with an integrated structure design has high strength points that are continuous and integrated, which has a better effect in strengthening the strength of the first plate portion; while the reinforcement body with a separate structure design is easier to implement in terms of structural design and production.
[0052] In another specific embodiment, the reinforcement body includes a plurality of strip reinforcement bodies 12 and / or a plurality of block reinforcement bodies 13. In this way, the strip reinforcement body 12 structure has a certain span, and its strength enhancement range is large; the block reinforcement body 13 structure is concentrated and occupies a small area, and the original structural performance of the main body 11 is highly retained; the two methods can be selectively and flexibly applied according to the situation.
[0053] In an optional embodiment, the reinforcement body includes a plurality of strip reinforcement bodies 12; wherein all the strip reinforcement bodies 12 are arranged side by side, parallel to each other, and evenly dispersed; or, all the strip reinforcement bodies 12 are crisscrossed vertically and horizontally to form a grid structure. In this way, each strip reinforcement body 12 is independently distributed, and the mold design required is easier; the strip reinforcement bodies 12 are connected as a whole, and the effect of enhancing the strength of the first plate portion is better.
[0054] Furthermore, any strip reinforcement 12 satisfies the parallel or perpendicular condition relative to the edge of the main body 11, that is, parallel, approximately parallel, or perpendicular, approximately perpendicular; or, any strip reinforcement 12 satisfies the angle condition relative to the edge of the main body 11, that is, the strip reinforcement 12 is inclined, and can be at an angle of 45°.
[0055] In addition, on the basis of the strip reinforcement 12, the reinforcement may further include a plurality of block reinforcements 13, and all the block reinforcements 13 are dispersed among all the strip reinforcements 12. In this way, the advantages of the reinforcement are comprehensively improved.
[0056] In an optional embodiment, the reinforcement body includes a plurality of dispersed block reinforcement bodies 13, wherein all block reinforcement bodies 13 have the same size, or all block reinforcement bodies 13 have at least two different sizes. In this way, a variety of design solutions are provided, which can be flexibly selected for application.
[0057] For the design in which the reinforcement body has a strip reinforcement body 12, in terms of size, the width of the strip body is 0.5 mm-5 mm, and the distance between two adjacent strip bodies is 3 mm-10 mm.
[0058] For the design in which the reinforcement has block reinforcements 13, in terms of size, all block reinforcements 13 are round and have a diameter of 1mm-10mm, all block reinforcements 13 are distributed in a rectangular array, and the center distance between two adjacent block reinforcements 13 in the same row or column is 10mm-15mm.
[0059] For the design in which the reinforcement body has block reinforcement bodies 13 of different sizes, in terms of size, all block reinforcement bodies 13 are circular and have two different sizes, and the diameter of any block reinforcement body 13 is 1mm-10mm; all small-sized block reinforcement bodies 13 are distributed in a rectangular array, and all large-sized block reinforcement bodies 13 are distributed in a rectangular array, and the small-sized block reinforcement bodies 13 and the large-sized block reinforcement bodies 13 are distributed alternately, and the center distance between two adjacent small-sized block reinforcement bodies 13 in the same row or column is 10mm-15mm, and the center distance between two adjacent large-sized block reinforcement bodies 13 in the same row or column is 10mm-15mm.
[0060] After testing and verification, for conventional specifications of heat spreaders, the above-mentioned design scheme and design dimensions can be combined to enhance the strength of the heat spreader to meet the use requirements of high temperature or high pressure environments.
[0061] Based on the above-mentioned temperature averaging board shell, the embodiment of the present application further provides a temperature averaging board, which includes a shell, a first capillary structure 3 located in the cavity and in contact with the first plate portion, a second capillary structure 4 located in the cavity and in contact with the second plate portion, and a liquid injection tube 5 arranged outside the shell and connected to the cavity. The shell is provided with a cavity, and the liquid injection tube 5 is used to inject coolant into the cavity and form a vacuum. The shell is the above-mentioned temperature averaging board shell. Since the temperature averaging board has the above-mentioned temperature averaging board shell, the beneficial effects of the temperature averaging board brought by the temperature averaging board shell can be found in the above content, which will not be repeated here.
[0062] Furthermore, it is preferred to provide a support body 6 between the first plate portion and the second plate portion. The support body 6 also plays a certain structural reinforcement role inside the temperature equalizing plate. The support body 6 can be columnar, prism or cylinder, etc., that is, the support body 6 passes through the first capillary structure 3 and the second capillary structure 4, and the two ends are respectively abutted against the first plate portion and the second plate portion; of course, the support body 6 can also be a three-dimensional structure such as a truncated cone with a gradually changing cross-section, a polyhedron, etc.
[0063] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.
[0064] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.
[0065] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.
[0066] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.
[0067] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.
[0068] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.
Claims
1. A temperature homogenizing plate housing, characterized in that: The main housing comprises a first plate portion and a second plate portion of the main housing, wherein the first plate portion is arranged to comprise: Main board body (11); A reinforcing body, embedded in the main body (11); The main body (11) is made of a first material, the reinforcement body is made of a second material, and the strength of the reinforcement body is greater than the strength of the main body (11).
2. The temperature homogenizing plate housing according to claim 1, characterized in that: The reinforcement body is an integrated structure, or the reinforcement body includes a plurality of separate structures.
3. The temperature homogenizing plate housing according to claim 1, characterized in that: The reinforcement body comprises a plurality of strip reinforcement bodies (12) and / or a plurality of block reinforcement bodies (13).
4. The temperature homogenizing plate housing according to claim 1, characterized in that: The reinforcement body comprises a plurality of strip reinforcement bodies (12); wherein, All the strip-shaped reinforcement bodies (12) are arranged side by side; Alternatively, all of the strip-shaped reinforcement bodies (12) are cross-linked vertically and horizontally to form a grid structure.
5. The temperature homogenizing plate housing according to claim 4, characterized in that: Any of the strip-shaped reinforcement bodies (12) meets the condition of being parallel or perpendicular to the edge of the main body (11); Alternatively, any of the strip-shaped reinforcement bodies (12) satisfies an angle condition relative to the edge of the main body (11).
6. The temperature homogenizing plate housing according to claim 4, characterized in that: The reinforcement body further comprises a plurality of block reinforcement bodies (13), and all of the block reinforcement bodies (13) are dispersedly distributed between all of the strip reinforcement bodies (12).
7. The temperature homogenizing plate housing according to claim 4 or 5, characterized in that: The width of the strip-shaped reinforcement body (12) is 0.5 mm to 5 mm, and the distance between two adjacent strip-shaped reinforcement bodies (12) is 3 mm to 10 mm.
8. The temperature homogenizing plate housing according to claim 6, characterized in that: All the block-shaped reinforcement bodies (13) are circular and have a diameter of 1 mm-10 mm. All the block-shaped reinforcement bodies (13) are distributed in a rectangular array, and the center distance between two adjacent block-shaped reinforcement bodies (13) in the same row or column is 10 mm-15 mm.
9. The temperature homogenizing plate housing according to claim 1, characterized in that: The main shell comprises a first cover body (1) and a second cover body (2), the first cover body (1) is sealedly connected to the opening of the second cover body (2), and the first cover body (1) is the first plate portion.
10. A temperature equalizing plate, characterized in that: include: A housing having a cavity; A first capillary structure (3), located in the cavity and in contact with the first plate portion; A second capillary structure (4), located in the cavity and in contact with the second plate portion; A liquid injection pipe (5), arranged outside the shell and communicating with the cavity; A support body (6), supported between the first plate portion and the second plate portion; Wherein, the shell is a temperature homogenizing plate shell as described in any one of claims 1-9.