Modularized power supply case for superconducting low-temperature system

Abstract

The utility model discloses a modularized power supply case for a superconducting low-temperature system. The modularized power supply case comprises a shell bottom plate, a front panel arranged on the front side of the shell bottom plate, shell side plates arranged on the side edges of the shell bottom plate in a surrounding mode and an upper cover plate arranged on the top of the shell bottom plate. A plurality of independent first power supply modules or second power supply modules are arranged on the bottom plate of the shell; according to the improved assembly structure of the power supply case, each power supply module can be independently disassembled and assembled, the assembly of the first power supply module or the second power supply module can be completed through the connection of the positioning pins and the positioning holes, and the assembly is simple and rapid; more importantly, the design of each group of positioning pins corresponds to the assembly of one first power supply module, and every two groups of positioning pins correspond to the assembly of one second power supply module, so that the power supply modules can be flexibly adjusted according to requirements, when different powers are needed, the power supply modules can be quickly and directly increased or reduced, the capacity expansion is convenient, and the cost is reduced. And the flexibility and the universality of the case are greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of power supply installation, in particular to a modular power supply chassis for a superconducting cryogenic system. Background Art

[0002] At present, superconducting cryogenic systems can exhibit superconducting states at low temperatures, which makes superconducting cryogenic systems have unique performance in experiments and applications. The high-precision power supply is a heating component in the superconducting cryogenic system. Generally, multiple sets of power modules can be installed, and the power modules are generally installed and protected by the metal shell of the power supply chassis. The existing power supply chassis shell is generally an integrated design, which is more specialized and highly customizable. It is difficult to adapt to the diverse needs of different superconducting systems and application scenarios. It is difficult for users to customize and configure the power supply system that meets their specific experiments or applications, and the versatility needs to be improved. And when a component needs to be upgraded or replaced, the entire chassis needs to be replaced, and it is difficult to upgrade a single component.

[0003] In addition, due to the integrated structure of the power supply chassis shell, after the shell is produced, the various parts are assembled inside the shell. During the installation process, all electronic components and wiring of each component are installed by using thermal capacitance, screw locking, bonding, etc. In this way, once a certain electronic component circuit fails, the normal operation of the entire production will be affected. When assembling or disassembling the shell structure, more special tools are required, and some components are difficult to disassemble after assembly, which will make maintenance and troubleshooting difficult. The problem detection and troubleshooting time is long and cumbersome, and more time and energy are required to eliminate and repair.

[0004] Therefore, further research and development is needed to solve the above-mentioned technical problems in the prior art. Utility Model Content

[0005] Therefore, in order to solve the problems existing in the above-mentioned prior art, the purpose of the utility model is to provide a modular power supply chassis for a superconducting cryogenic system. By improving the assembly structure of the power supply chassis, each power module can be independently disassembled and assembled, and the assembly of the first power module or the second power module can be completed by connecting the locating pins with the locating holes, and the assembly is simple and fast; more importantly, the design of each group of locating pins corresponds to the assembly of a first power module, and every two groups of locating pins correspond to the assembly of a second power module. In this way, the power module can be flexibly adjusted according to needs. When different power is required, the power modules can be quickly and directly increased or decreased, and the capacity expansion is convenient, which greatly improves the flexibility and versatility of the chassis.

[0006] The purpose of the utility model is achieved by the following technical solutions:

[0007] A modular power supply chassis for a superconducting cryogenic system, comprising a chassis shell for installing a power supply module, the chassis shell comprising a shell bottom plate, a front panel arranged on the front side of the shell bottom plate, a shell side plate arranged around the side of the shell bottom plate, and an upper cover plate arranged on the top of the shell bottom plate; a plurality of power supply installation parts for installing the power supply module are arranged on the shell bottom plate; the power supply installation parts are provided with positioning pins for positioning the bottom of the power supply module, the bottom of the power supply module is provided with positioning holes adapted to the positioning pins, the positioning pins are inserted in the positioning holes for interference connection, so that the power supply module is fixed on the power supply installation parts;

[0008] The power supply module includes a first power supply module, a second power supply module, and a bus power supply module; the power of the second power supply module is greater than the power of the first power supply module; each of the power supply installation parts can be adapted to install one of the first power supply modules, and two adjacent power supply installation parts can be adapted to install one of the second power supply modules together.

[0009] Furthermore, each of the power supply mounting parts is provided with a group of the positioning pins spaced apart along the length direction of the power supply module; and a plurality of groups of the positioning pins are spaced apart along the arrangement direction of the first power supply module or the second power supply module and the bus power supply module on the bottom plate of the shell.

[0010] Furthermore, each of the first power modules is provided with a group of positioning holes at the bottom, and each of the second power modules is provided with two groups of positioning holes at the bottom, and each group of the positioning holes is arranged corresponding to a group of the positioning pins; each of the first power modules is assembled to the bottom plate of the shell by connecting a group of positioning pins and the positioning holes; each of the second power modules is assembled to the bottom plate of the shell by connecting two adjacent groups of positioning pins and the positioning holes.

[0011] Furthermore, the rated power of the first power module is 120W, and the rated power of the second power module is 480W; four groups of positioning pins are arranged at intervals on the bottom plate of the shell, and two second power modules or four first power modules can be installed.

[0012] Furthermore, the rear side of the shell bottom plate is provided with a locking extension that is integrally bent upward, and a plurality of locking parts for simultaneously locking the adjacent first power module, second power module or bus power module are provided at intervals on the locking extension; and two locking holes are provided on each locking part.

[0013] Furthermore, both sides of the upper cover are bent downward to provide installation extensions, and one end of the shell side plate close to the front panel is provided with a cover plate mounting portion corresponding to the installation extension, and the upper cover is mounted on the mounting portion of the shell side plate through the installation extensions on both sides.

[0014] Furthermore, a control board mounting portion for mounting a control board is provided on one side of the shell bottom plate close to the front panel, a cooling fan for dissipating heat of the power modules is provided on one side of the first power module and the second power module close to the control board mounting portion, and a cooling cover plate with multiple cooling holes is provided on one side of the upper cover plate close to the cooling fan.

[0015] Furthermore, the front panel is connected to the shell bottom plate through a panel fixing frame, and the panel fixing frame is provided with inner folded edges extending toward the shell bottom plate on all four sides, and the inner folded edges and the edge of the shell bottom plate close to the front panel are respectively provided with connecting holes, and the panel fixing frame and the shell bottom plate are fixed by fasteners.

[0016] Furthermore, a plurality of ventilation holes are provided on the front panel.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. The utility model improves the assembly structure of the power supply chassis, so that each power module can be independently disassembled and assembled. The chassis as a whole includes a shell bottom plate, a front panel arranged on the front side of the shell bottom plate, a shell side plate arranged around the side of the shell bottom plate, and an upper cover plate arranged on the top of the shell bottom plate; a plurality of independent first power modules or second power modules are arranged on the shell bottom plate; the assembly of the first power module or the second power module can be completed by connecting the positioning pins with the positioning holes, and the assembly is simple and fast; more importantly, the design of each group of positioning pins corresponds to the assembly of a first power module, and every two groups of positioning pins correspond to the assembly of a second power module, so that the power module can be flexibly adjusted according to the needs. When different powers are required, the power modules can be quickly and directly added or reduced, and the expansion is convenient, which greatly improves the flexibility and versatility of the chassis;

[0019] In addition, the modular design can maximize the use of the internal space of the chassis, and each power module can be installed and replaced separately, making the replacement and maintenance of the power module very simple, greatly reducing downtime and maintenance costs;

[0020] 2. The rear side of the shell bottom plate is provided with a locking edge, on which a locking part is installed, which can lock adjacent power modules at the same time to ensure that they will not loosen or shake during transportation and use, thereby improving assembly stability; in addition, the panel fixing frame is fastened to the shell bottom plate through the connection hole, further enhancing the stability of the chassis assembly; the panel fixing frame is also designed independently, separated from the shell bottom plate, and adopts an inner folding edge around it. After the panel, circuit board, display screen, button and other modules are installed in the cavity formed by the inner folding edge, they are assembled with the edge of the shell bottom plate, which is more conducive to the installation of other components on the shell bottom plate, such as power modules, busbar power modules, etc.;

[0021] 3. Cooling fans are arranged on the front sides of the first power module and the second power module, and a heat dissipation cover with heat dissipation holes is arranged on the side of the upper cover close to the power module to simultaneously promote the heat dissipation of components such as the power module and the control board module. Such a design can effectively reduce the operating temperature of the power module and the control board, and improve the stability and reliability of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of a second power module assembled in a modular power supply chassis for a superconducting cryogenic system in a preferred embodiment of the utility model;

[0023] Figure 2 This is a partial structural exploded schematic diagram of a second power module assembled in a modular power supply chassis for a superconducting cryogenic system in a preferred embodiment of the utility model;

[0024] Figure 3 This is a partial structural exploded schematic diagram of another angle of the modular power supply chassis for superconducting cryogenic system of the preferred embodiment of the utility model for assembling the second power supply module;

[0025] Figure 4 This is a partial structural schematic diagram of a modular power supply chassis for a superconducting cryogenic system in a preferred embodiment of the utility model, omitting the power supply module;

[0026] Figure 5 This is a partial structural schematic diagram of a modular power supply chassis for a superconducting cryogenic system in a preferred embodiment of the utility model, omitting the power supply module and the upper cover plate;

[0027] Figure 6 This is a schematic diagram of the overall structure of a modular power supply chassis for a superconducting cryogenic system in a preferred embodiment of the utility model, in which a first power supply module is assembled;

[0028] Figure 7 This is a schematic diagram of the partial structure of a modular power supply chassis for a superconducting cryogenic system in a preferred embodiment of the utility model, in which a first power supply module is assembled;

[0029] Figure 8 This is a schematic diagram of the partial structure of the modular power supply chassis for superconducting cryogenic system in a preferred embodiment of the utility model, in which the first power supply module is assembled;

[0030] Fig. 9 This is a schematic diagram of the overall structure of the first power module of the modular power supply chassis for the superconducting cryogenic system of the preferred embodiment of the utility model;

[0031] Fig.10 This is a schematic diagram of the overall structure of the second power module of the modular power supply chassis for the superconducting cryogenic system in the preferred embodiment of the utility model.

[0032] In the figure:

[0033] 10. Chassis shell; 1. Shell bottom plate; 11. Power supply installation part; 12. Positioning pin; 13. Locking edge; 131. Locking part; 1311. Locking hole; 14. Control panel installation part; 2. Front panel; 21. Ventilation hole; 3. Shell side plate; 31. Cover installation part; 4. Upper cover; 41. Installation edge; 42. Heat dissipation cover; 5. Heat dissipation fan; 6. Panel fixing frame; 61. Inner folding edge; 611. Connection hole;

[0034] 20. Power module; 201. Positioning hole; 202. First power module; 203. Second power module; 204. Bus power module. DETAILED DESCRIPTION

[0035] In order to facilitate the understanding of the utility model, the technical solutions and advantages of the utility model are further described in detail below in conjunction with the accompanying drawings and embodiments. The specific structure and characteristics are described below in an exemplary manner, which should not constitute any limitation to the utility model. At the same time, any of the technical features mentioned below (including implicit or disclosed), as well as any technical features directly displayed or implied in the figure, can continue to be arbitrarily combined or deleted between these technical features, so as to form more other embodiments that may not be directly or indirectly mentioned in the utility model. The preferred implementation of the utility model is given in the accompanying drawings. However, the utility model can be implemented in many different forms and is not limited to the implementation described herein. On the contrary, the purpose of providing these implementations is to make the understanding of the disclosure of the utility model more thorough and comprehensive.

[0036] like Figure 1-10 As shown, a modular power supply chassis for a superconducting cryogenic system includes a chassis shell 10 for installing a power module 20. Of course, the chassis shell 10 is also equipped with other components that meet the functions of the power supply chassis, including but not limited to a PCB control board, a pin row, etc. The principle and structure thereof can all be referred to the prior art, and the present utility model will not elaborate on this.

[0037] The chassis shell 10 includes a shell bottom plate 1, a front panel 2 arranged on the front side of the shell bottom plate 1, a shell side panel 3 arranged around the side of the shell bottom plate 1 and an upper cover plate 4 arranged on the top of the shell bottom plate; the upper cover plate 4 covers the side close to the front panel 2. The shell bottom plate 1 is provided with a plurality of power supply mounting parts 11 for mounting the power supply module 20; the power supply mounting part 11 is provided with positioning pins 12 for positioning the bottom of the power supply module 20, and the bottom of the power supply module 20 is provided with positioning holes 201 adapted to the positioning pins 12, and the positioning pins 12 are inserted into the positioning holes 201 for interference connection so that the power supply module 20 is fixed on the power supply mounting part 11; in this embodiment, the power supply modules 20 are all independent modular designs, and their functional principles are not repeated here; a PCB control board is installed on the shell bottom plate 1 of the utility model, and a pin header is welded on the PCB control board, and the PCB on the power supply module 20 is welded with a pin row, and the power supply module 20 can be pressed and assembled onto the shell bottom plate 1 after aligning the positioning pins 12 and the positioning holes 201, and the pin row is inserted into the pin header on the control board to achieve connection.

[0038] The power module 20 includes a first power module 202, a second power module 203, and a bus power module 204; the power of the second power module 203 is greater than the power of the first power module 202; each of the power installation parts 11 can be adapted to install one of the first power modules 202, and two adjacent power installation parts 11 can be adapted to install one of the second power modules 203. In further detail, each of the power installation parts 11 is provided with a group of positioning pins 12 spaced apart along the length direction of the power module 20; the housing bottom plate 1 is provided with a plurality of groups of positioning pins 12 spaced apart along the arrangement direction of the first power module 202 or the second power module 203 and the bus power module 204.

[0039] In this embodiment, the bus power module 204 is a module used in the prior art for bus protection and management in the power system, ensuring the stable operation of the system and protecting related equipment from damage; specifically, it may include voltage monitoring and control, overcurrent protection, overvoltage and undervoltage protection, temperature monitoring and protection, fault diagnosis and alarm and other functions, which are not elaborated here.

[0040] Specifically, each of the first power modules 202 is provided with a group of positioning holes 201 at the bottom, and each of the second power modules 203 is provided with two groups of positioning holes 201 at the bottom, and each group of the positioning holes 201 is arranged corresponding to a group of the positioning pins 12; each of the first power modules 202 is assembled to the shell bottom plate 1 by connecting a group of positioning pins 12 with the positioning holes 201; each of the second power modules 203 is assembled to the shell bottom plate 1 by connecting two adjacent groups of positioning pins 12 with the positioning holes 201.

[0041] The power of the first power module 202 and the second power module 203 is explained. The rated power of the first power module 202 is 120W, and the rated power of the second power module 203 is 480W. Four groups of positioning pins 12 are arranged at intervals on the shell bottom plate 1, and two second power modules 203 or four first power modules 202 can be installed.

[0042] In this way, the design of each group of locating pins 12 corresponds to the assembly of a first power module 202, and every two groups of locating pins 12 correspond to the assembly of a second power module 203. In this way, the power module 20 can be flexibly adjusted according to needs. When different power is required, the power module 20 can be quickly and directly increased or decreased, and the capacity expansion is convenient, which greatly improves the flexibility and versatility of the chassis. In addition, through modular design, the internal space of the chassis can be utilized to the greatest extent. At the same time, each power module 20 can be installed and replaced separately, which makes the replacement and maintenance of the power module 20 very simple, greatly reducing downtime and maintenance costs.

[0043] Therefore, the power supply chassis of the utility model can adapt to power supplies with different power requirements, such as assembling two second power supply modules 203 and a bus power supply module 204; or four first power supply modules 202 and a bus power supply module 204; or one second power supply module 203 with two first power supply modules 202, etc., with convenient expansion, high flexibility, strong versatility, and small assembly restrictions.

[0044] The structure of the housing bottom plate 1 is further described. The rear side of the housing bottom plate 1 is provided with a locking extension 13 that is integrally bent upward. The locking extension 13 is provided with a plurality of locking portions 131 for simultaneously locking the adjacent first power module 202, second power module 203 or bus power module 204. The locking portions 131 are respectively provided with two locking holes 1311. The two locking holes 1311 on the locking portions 131 respectively lock one of the first power module 202, second power module 203 or bus power module 204, ensuring that it will not loosen or shake during transportation and use, thereby improving assembly stability.

[0045] Preferably, both sides of the upper cover plate 4 are bent downward to form mounting edges 41, and one end of the housing side plate 3 close to the front panel 2 is provided with a cover plate mounting portion 31 corresponding to the mounting edges 41, and the upper cover plate 4 is mounted on the mounting portion of the housing side plate 3 through the mounting edges 41 on both sides. This design further improves the connection stability between the upper cover plate 4 and the housing bottom plate 1, while maximizing the use of the physical space of the housing bottom plate 1.

[0046] Preferably, a control panel mounting portion 14 for mounting a control panel is provided on a side of the housing bottom plate 1 close to the front panel 2, a cooling fan 5 for cooling the power module 20 is provided on a side of the first power module 202 and the second power module 203 close to the control panel mounting portion 14, and a cooling cover plate 42 with a plurality of cooling holes is provided on a side of the upper cover plate 4 close to the cooling fan 5. In this embodiment, cooling fans 5 are provided on the front sides of the first power module 202 and the second power module 203, and a cooling cover plate 42 with cooling holes is provided on a side of the upper cover plate 4 close to the power module 20, so as to simultaneously promote the heat dissipation of components such as the power module 20 and the control panel module. Such a design can effectively reduce the operating temperature of the power module 20 and the control panel, and improve the stability and reliability of the system.

[0047] Preferably, the front panel 2 is connected to the shell bottom plate 1 through a panel fixing frame 6, and the panel fixing frame 6 is provided with inner folded edges 61 extending toward the shell bottom plate 1. The inner folded edges 61 and the edge of the shell bottom plate 1 close to the front panel 2 are respectively provided with connection holes 611, and the panel fixing frame 6 and the shell bottom plate 1 are fixed by fasteners. Furthermore, a plurality of ventilation holes 21 are provided on the front panel 2. In this embodiment, the front panel 2 and the panel fixing frame 6 are both independently designed structures, and the panels, circuit boards, display screens, buttons and other modules are installed in the cavity formed by the inner folded edges 61 of the panel fixing frame 6, and then assembled with the edge of the shell bottom plate 1, which is more conducive to the installation of other components on the shell bottom plate 1, such as the power module 20 and the busbar power module 204.

[0048] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. For ordinary technicians in this field, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A modular power supply chassis for a superconducting cryogenic system, characterized in that: The invention comprises a chassis shell for installing a power module, wherein the chassis shell comprises a shell bottom plate, a front panel arranged on the front side of the shell bottom plate, a shell side plate arranged around the side of the shell bottom plate, and an upper cover plate arranged on the top of the shell bottom plate; a plurality of power supply installation parts for installing the power module are arranged on the shell bottom plate; the power supply installation parts are provided with positioning pins for positioning the bottom of the power module, the bottom of the power module is provided with positioning holes adapted to the positioning pins, the positioning pins are inserted into the positioning holes for interference connection, so that the power module is fixed on the power supply installation parts; The power supply module includes a first power supply module, a second power supply module, and a bus power supply module; the power of the second power supply module is greater than the power of the first power supply module; each of the power supply installation parts can be adapted to install one of the first power supply modules, and two adjacent power supply installation parts can be adapted to install one of the second power supply modules together.

2. The modular power supply chassis for a superconducting cryogenic system according to claim 1, characterized in that: Each of the power supply mounting parts is provided with a group of positioning pins spaced apart along the length direction of the power supply module; and a plurality of groups of positioning pins are spaced apart along the arrangement direction of the first power supply module or the second power supply module and the bus power supply module on the bottom plate of the shell.

3. The modular power supply chassis for a superconducting cryogenic system according to claim 2, characterized in that: Each of the first power modules is provided with a group of positioning holes at the bottom, and each of the second power modules is provided with two groups of positioning holes at the bottom, and each group of the positioning holes is arranged corresponding to a group of the positioning pins; each of the first power modules is assembled to the bottom plate of the shell by connecting a group of positioning pins with the positioning holes; each of the second power modules is assembled to the bottom plate of the shell by connecting two adjacent groups of positioning pins with the positioning holes.

4. The modular power supply chassis for a superconducting cryogenic system according to claim 3, characterized in that: The rated power of the first power module is 120W, and the rated power of the second power module is 480W; four groups of positioning pins are arranged at intervals on the bottom plate of the shell, and two second power modules or four first power modules can be installed.

5. The modular power supply chassis for a superconducting cryogenic system according to claim 1, characterized in that: The rear side of the shell bottom plate is provided with a locking extension that is bent upward as a whole, and a plurality of locking parts for simultaneously locking the adjacent first power module, second power module or bus power module are provided at intervals on the locking extension; and two locking holes are provided on each locking part.

6. The modular power supply chassis for a superconducting cryogenic system according to claim 1, characterized in that: Both sides of the upper cover are bent downward to provide installation extensions, and one end of the shell side plate close to the front panel is provided with a cover plate installation portion corresponding to the installation extension. The upper cover is mounted on the installation portion of the shell side plate through the installation extensions on both sides.

7. The modular power supply chassis for a superconducting cryogenic system according to claim 6, characterized in that: A control board mounting portion for mounting a control board is provided on one side of the shell bottom plate close to the front panel, a cooling fan for dissipating heat of the power modules is provided on one side of the first power module and the second power module close to the control board mounting portion, and a cooling cover plate with a plurality of cooling holes is provided on one side of the upper cover plate close to the cooling fan.

8. The modular power supply chassis for a superconducting cryogenic system according to claim 1, characterized in that: The front panel is connected to the shell bottom plate through a panel fixing frame. The panel fixing frame is provided with inner folded edges extending toward the shell bottom plate. The inner folded edges and the edge of the shell bottom plate close to the front panel are respectively provided with connecting holes. The panel fixing frame and the shell bottom plate are fixed by fasteners.

9. The modular power supply chassis for a superconducting cryogenic system according to claim 1, characterized in that: The front panel is provided with a plurality of ventilation holes.

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