Inverter circuit board heat dissipation structure

Abstract

The utility model aims to provide an inversion circuit board heat dissipation structure which is arranged on an inversion circuit board and comprises a heat dissipation assembly and a fan, the heat dissipation assembly comprises two heat dissipation pieces, each heat dissipation piece comprises a base, a heat conduction block and a plurality of fins, the heat conduction block is arranged on the base, a power device is arranged on one side face of the heat conduction block, and the fan is arranged on the heat conduction block. The fins are arranged on the other side faces of the heat conduction blocks at intervals so that a heat dissipation groove can be formed between any two adjacent fins, and when the two bases are used for being adjacently arranged on an inverter circuit board, the fins on one heat conduction block can be aligned with the fins on the other heat conduction block in a one-to-one correspondence mode so that the heat dissipation grooves can be formed between any two adjacent fins. Therefore, the heat dissipation grooves in one heat conduction block and the heat dissipation grooves in the other heat conduction block form a plurality of heat dissipation channels, the fan is arranged at the same ends of the two heat conduction blocks, and the fan is aligned with the heat dissipation channels. In this way, the power device and the inverter circuit board can be quickly cooled.

Description

Technical Field

[0001] The utility model relates to the technical field of inverters, in particular to a heat dissipation structure of an inverter circuit board. Background Art

[0002] An inverter is a converter that converts direct current into alternating current. The main body of the inverter is the inverter circuit, and it also includes control, protection, and filtering circuits.

[0003] The main power device in the inverter circuit is the MOS tube. Since the MOS tube generates a lot of heat during operation, in order to avoid thermal damage to the circuit and devices, the MOS tube and other power devices need to be cooled.

[0004] For example, a Chinese patent document with publication number CN211701869U discloses a vehicle-mounted inverter, which includes an upper shell, a bottom shell fixedly connected to the upper shell, a cavity is provided between the upper shell and the bottom shell, and the vehicle-mounted inverter also includes a connection component and a circuit board, the circuit board is fixedly arranged in the cavity, and an electronic component installation area is provided on the circuit board; the connection component includes at least two connecting strips and a connecting block, the two connecting strips are fixedly arranged on the circuit board, the two connecting strips are respectively located on both sides of the electronic component installation area, and one end of the connecting block is fixedly connected to one end of the connecting strip. The vehicle-mounted inverter also includes at least two heat dissipation components, the two heat dissipation components are respectively fixedly arranged on both sides of the upper surface of the circuit board, the heat dissipation component includes a radiator and a heat dissipation fan, the radiator is fixedly arranged on the circuit board, the heat dissipation fan is fixedly arranged on the inner wall surface of the bottom shell vertical plate, and the heat dissipation fan abuts against the radiator. In this way, the circuit board is cooled by the installed radiator.

[0005] However, the existing heat dissipation method does not disclose a specific solution of the radiator. Therefore, in order to improve the timely heat dissipation of power devices, the inverter circuit board heat dissipation structure of the present application is proposed. Utility Model Content

[0006] The purpose of the utility model is to overcome the shortcomings of the prior art and provide an inverter circuit board heat dissipation structure which can effectively dissipate the heat of power devices.

[0007] The purpose of this utility model is achieved through the following technical solutions:

[0008] An inverter circuit board heat dissipation structure is used to be arranged on an inverter circuit board, comprising:

[0009] A heat dissipation assembly, wherein the heat dissipation assembly comprises two heat dissipating elements, wherein the heat dissipating elements comprise a base, a heat conducting block and a plurality of fins, wherein the heat conducting block is arranged on the base, and the power device is arranged on one side of the heat conducting block, and each of the fins is arranged on the other side of the heat conducting block at intervals, so that a heat dissipation slot is formed between any two adjacent fins, and when the two bases are arranged adjacently on the inverter circuit board, each of the fins on one of the heat conducting blocks is aligned with each of the fins on the other heat conducting block in a one-to-one correspondence, so that each of the heat dissipation slots on one of the heat conducting blocks and each of the heat dissipation slots on the other heat conducting block form a plurality of heat dissipation channels; and

[0010] A fan is disposed on the same end of the two heat-conducting blocks, and the fan is aligned with each of the heat dissipation channels.

[0011] Optionally, the thickness of the fin gradually decreases in a direction away from the heat conducting block.

[0012] Optionally, the surface of the fin is provided with wavy patterns.

[0013] Optionally, a spacing is provided between two fins aligned with each other on the two heat conducting blocks.

[0014] Optionally, a space-avoiding groove is opened on the base along the transverse direction so that the cross-sections of the two bases are in an "I"-shaped structure.

[0015] Optionally, the fins, the heat conducting block and the base are an integrally formed structure.

[0016] Optionally, a plurality of bosses are provided on the fin at one end of the heat conducting block away from the base, and intervals are provided between each of the bosses.

[0017] Optionally, a threaded groove is provided on the end of the heat conductive block, a locking bolt is passed through the fan, and the locking bolt is threadedly connected to the threaded groove, so that the fan is fixed on the end of the heat conductive block.

[0018] Optionally, a plurality of heat dissipation components are provided, a plurality of fans are provided, the heat dissipation components are arranged at intervals on the inverter circuit board, and the fans are respectively arranged on the heat dissipation components.

[0019] Compared with the prior art, the utility model has at least the following advantages:

[0020] The utility model provides an inverter circuit board heat dissipation structure, which is used to be arranged on the inverter circuit board, and includes a heat dissipation assembly and a fan. The heat dissipation assembly includes two heat dissipation members, and the heat dissipation members include a base, a heat conductive block and a plurality of fins. The heat conductive block is arranged on the base, and the power device is arranged on one side of the heat conductive block. Each fin is arranged on the other side of the heat conductive block at intervals, so that a heat dissipation groove is formed between any two adjacent fins. When the two bases are arranged adjacently on the inverter circuit board, each fin on one of the heat conductive blocks is aligned with each fin on the other heat conductive block in a one-to-one correspondence, so that each heat dissipation groove on one of the heat conductive blocks and each heat dissipation groove on the other heat conductive block form a plurality of heat dissipation channels. The fan is arranged on the same end of the two heat conductive blocks, and the fan is aligned with each heat dissipation channel. In this way, the heat generated by the power device can be quickly transferred to each fin through the heat conductive block. Since the fin is the inner wall structure of the heat dissipation channel formed, as the fan continues to rotate, air can continue to flow through each heat dissipation channel, so that the power device and the inverter circuit board can be quickly cooled and cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a structural schematic diagram of an inverter circuit board heat dissipation structure according to one embodiment of the utility model;

[0023] Figure 2 for Figure 1 A schematic structural diagram of the inverter circuit board heat dissipation structure from another angle shown;

[0024] Figure 3 It is a front view of the heat dissipation structure of the inverter circuit board according to one embodiment of the utility model;

[0025] Figure 4 This is a schematic diagram of the installation structure of a fan according to one embodiment of the present utility model;

[0026] Figure 5 It is a structural schematic diagram of a heat dissipation structure of an inverter circuit board according to another embodiment of the utility model.

[0027] Description of reference numerals:

[0028] 10. Inverter circuit board heat dissipation structure; 20. Inverter circuit board; 100. Heat dissipation assembly; 200. Fan; 110. Base; 120. Heat conductive block; 130. Fin; 30. Power device; 121. Heat dissipation slot; 131. Wave pattern; 111. Air avoidance slot; 140. Boss; 122. Threaded groove; 300. Locking bolt; 150. L-shaped plate; 160. Temperature sensor; 170. Semiconductor cooling sheet. DETAILED DESCRIPTION

[0029] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the accompanying drawings. The accompanying drawings show preferred embodiments of the present invention.

[0030] like Figures 1 to 3 As shown, an inverter circuit board heat dissipation structure 10 is used to be arranged on an inverter circuit board 20, which includes a heat dissipation component 100 and a fan 200. The heat dissipation component 100 includes two heat dissipation members, and the heat dissipation members include a base 110, a heat conductive block 120 and a plurality of fins 130. The heat conductive block 120 is arranged on the base 110, and the power device 30 is used to be arranged on one side of the heat conductive block 120. The fins 130 are arranged on the other side of the heat conductive block 120 at intervals, so that any two adjacent fins 130 are spaced apart from each other. A heat dissipation groove 121 is formed between the two bases 110. When the two bases 110 are adjacently arranged on the inverter circuit board 20, the fins 130 on one of the heat-conducting blocks 120 are aligned one-to-one with the fins 130 on the other heat-conducting block 120, so that the heat dissipation grooves 121 on one of the heat-conducting blocks 120 and the heat dissipation grooves 121 on the other heat-conducting block 120 form a plurality of heat dissipation channels. The fan 200 is arranged on the same end of the two heat-conducting blocks 120, and the fan 200 is aligned with each heat dissipation channel.

[0031] It should be noted that the base 110 is used to be installed on the inverter circuit board 20, the heat conductive block 120 is arranged on the base 110, each fin 130 is arranged on a side surface of the heat conductive block 120, and a gap is arranged between each fin 130, so that a heat dissipation groove 121 is formed between any two adjacent fins 130. Further, two heat sinks are installed adjacently on the inverter circuit board 20, and each fin 130 on one of the heat conductive blocks 120 is aligned with each fin 130 on the other heat conductive block 120. So that multiple relatively independent heat dissipation channels are formed in the two heat sinks. The heat dissipation channel is formed by the heat dissipation groove 121 on one heat sink and the heat dissipation groove 121 on the other heat sink. Further, the power device 30 (for example, a MOS tube) is fitted on the side surface of the heat conductive block 120 away from the heat dissipation channel. Further, the fan 200 is installed at the same end position of the two heat conductive blocks 120. So that the fan 200 is aligned with each heat dissipation channel formed. In this way, the heat generated by the power device 30 can be quickly transferred to each fin 130 through the heat conductive block 120. Since the fins 130 form an inner wall structure of the heat dissipation channel, as the fan 200 continues to rotate, air can continue to flow through each heat dissipation channel, thereby quickly dissipating heat and cooling the power device 30.

[0032] like Figure 3 As shown, in one embodiment, the thickness D of the fin 130 gradually decreases in the direction away from the heat conducting block 120. Thus, as the tail end of the fin 130 is set to a thinner structure, when the fan 200 continues to rotate, the cooling efficiency of the fin 130 can be accelerated.

[0033] like Figure 3 As shown, in one embodiment, a wave pattern 131 is provided on the surface of the fin 130. Thus, by providing the wave pattern 131 on the surface of the fin 130, the surface area of ​​the fin 130 is increased, that is, the heat dissipation area of ​​the heat dissipation channel is increased, thereby improving the heat dissipation efficiency.

[0034] In one embodiment, a distance is provided between two fins 130 aligned with each other on two heat conducting blocks 120. In this way, the heat dissipation channels formed are interconnected, so that the temperature between the fins 130 can be kept in a balanced state, avoiding excessive temperature difference between the fins 130 and facilitating heat dissipation.

[0035] In one embodiment, the fins 130, the heat conducting block 120, and the base 110 are an integrated structure. For example, the fins 130, the heat conducting block 120, and the base 110 are an integrated aluminum alloy structure, so that the heat generated by the power device 30 mounted on the side of the heat conducting block 120 can be quickly transferred to the heat conducting block 120, and finally transferred to each fin 130, and then the fan 200 continuously blows air to dissipate the heat.

[0036] like Figure 3 As shown, in one embodiment, a space-avoiding groove 111 is opened on the base 110 along the horizontal direction, so that the cross-section of the two bases 110 is an "I"-shaped structure.

[0037] It should be noted that since the inverter circuit board 20 is used to invert DC power into AC power (usually 220V50Hz), and since the base 110 is a metal structure (shown as an aluminum alloy material in the embodiment), by opening a horizontal air avoidance groove 111 on the base 110, it is equivalent to increasing the distance between the heat conductive block 120 and the inverter circuit board 20, thereby avoiding the generation of an arc between the heat conductive block 120 and the inverter circuit board 20.

[0038] like Figure 1 As shown, in one embodiment, a plurality of bosses 140 are disposed on the fin 130 at one end of the heat conducting block 120 away from the base 110, and intervals are disposed between the bosses 140. In this way, the surface area of ​​the fin 130 can be increased, thereby further improving the heat dissipation efficiency.

[0039] like Figure 3 and Figure 4 As shown, in one embodiment, a thread groove 122 is opened on the end of the heat conductive block 120, a locking bolt 300 is passed through the fan 200, and the locking bolt 300 is screwed with the thread groove 122 to fix the fan 200 on the end of the heat conductive block 120.

[0040] In this way, by opening a thread groove 122 on the heat conductive block 120, wherein the thread groove 122 is a non-closed structure connected to the heat dissipation groove 121, the inner wall area of ​​the heat dissipation groove 121 can also be increased, and the fan 200 can be fixed by screwing the locking bolt 300 while improving the heat dissipation efficiency.

[0041] In one embodiment, a plurality of heat dissipation components 100 are provided, a plurality of fans 200 are provided, each heat dissipation component 100 is provided at intervals on the inverter circuit board 20, and each fan 200 is provided on each heat dissipation component 100. In this way, by providing a plurality of heat dissipation components 100 on the inverter circuit board 20, the heat dissipation efficiency of the power device 30 / inverter circuit board 20 can be improved.

[0042] like Figure 5As shown, in one embodiment, the heat sink further includes an L-shaped plate 150, the L-shaped plate 150 abuts against a side of the power device 30 away from the heat conductive block 120, and the L-shaped plate 150 also abuts against the heat conductive block 120, so that the power device 30 is located between the L-shaped plate 150 and the heat conductive block 120. In this way, the L-shaped plate 150 abuts against one side of the power device 30, and the heat conductive block 120 abuts against the other side of the power device 30, thereby improving the heat dissipation efficiency of the power device 30.

[0043] like Figure 5 As shown, in one embodiment, the heat sink further includes a temperature sensor 160 . The temperature sensor 160 is disposed on the inverter circuit board 20 , and the temperature sensor 160 is in contact with the heat conductive block 120 .

[0044] like Figure 1 As shown, in one embodiment, a semiconductor cooling sheet 170 is disposed on a side surface of the heat conducting block 120 away from the fins 130 , and the power device 30 is attached to the semiconductor cooling sheet 170 .

[0045] It should be noted that when the semiconductor cooling sheet 170 is powered on, one side is cooled and the other side is heated, wherein the cooling side is in contact with the power device 30 and the heated side is in contact with the heat conducting block 120. In this way, under the action of the semiconductor cooling sheet 170, the heat dissipation efficiency of the power device 30 can be accelerated.

[0046] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An inverter circuit board heat dissipation structure, used to be arranged on an inverter circuit board, characterized in that: include: A heat dissipation assembly, wherein the heat dissipation assembly comprises two heat dissipating elements, wherein the heat dissipating elements comprise a base, a heat conducting block and a plurality of fins, wherein the heat conducting block is arranged on the base, and the power device is arranged on one side of the heat conducting block, and each of the fins is arranged on the other side of the heat conducting block at intervals, so that a heat dissipation slot is formed between any two adjacent fins, and when the two bases are arranged adjacently on the inverter circuit board, each of the fins on one of the heat conducting blocks is aligned with each of the fins on the other heat conducting block in a one-to-one correspondence, so that each of the heat dissipation slots on one of the heat conducting blocks and each of the heat dissipation slots on the other heat conducting block form a plurality of heat dissipation channels; and A fan is disposed on the same end of the two heat-conducting blocks, and the fan is aligned with each of the heat dissipation channels.

2. The inverter circuit board heat dissipation structure according to claim 1, characterized in that: The thickness of the fin gradually decreases in a direction away from the heat conducting block.

3. The inverter circuit board heat dissipation structure according to claim 1, characterized in that: The surface of the fin is provided with wave patterns.

4. The inverter circuit board heat dissipation structure according to claim 1, characterized in that: A spacing is arranged between the two fins aligned with each other on the two heat conducting blocks.

5. The inverter circuit board heat dissipation structure according to claim 1, characterized in that: The base is provided with a space-avoiding groove along the transverse direction so that the cross-sections of the two bases are in an "I"-shaped structure.

6. The inverter circuit board heat dissipation structure according to claim 1, characterized in that: The fins, the heat conducting block and the base are an integrally formed structure.

7. The inverter circuit board heat dissipation structure according to claim 1, characterized in that: A plurality of bosses are arranged on the fins at one end of the heat conducting block away from the base, and intervals are arranged between the bosses.

8. The inverter circuit board heat dissipation structure according to claim 1, characterized in that: A thread groove is formed on the end of the heat conducting block, a locking bolt is passed through the fan, and the locking bolt is screwed to the thread groove so that the fan is fixedly arranged on the end of the heat conducting block.

9. The inverter circuit board heat dissipation structure according to claim 1, characterized in that: There are a plurality of heat dissipation components, a plurality of fans, and each of the heat dissipation components is arranged on the inverter circuit board at intervals, and each of the fans is arranged on each of the heat dissipation components.

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