Embedded high-voltage sensor packaging structure

Abstract

The utility model provides an embedded high-voltage sensor packaging structure, comprising a sensor body which comprises a silicon-based base and a silicon-based film covering the silicon-based base, and the silicon-based base is concavely provided with a hollow contact cavity in a silicon-based film covering area; the sensor body is inversely arranged on the circuit board, and the silicon-based thin film is fixedly connected with the end face of the circuit board through flexible glue; wherein at least two metal welding spots are arranged between the peripheral side of the sensor body and the circuit board, the capacitive sensor structure is adopted, the loss of the structure in media such as air is extremely small, the sensitivity to other factors is low, and the self-heating value is small. More importantly, the influence of the uneven surface of the sensor on the testing precision can be effectively avoided through connection in an inverted welding mode, and meanwhile the surface of the silicon-based thin film can be protected against damage.

Description

Technical Field

[0001] The utility model relates to a technical field, in particular to an embedded high-voltage sensor packaging structure. Background Art

[0002] Traditional resistive sensors generate a lot of heat when working, resulting in energy loss and heating of components, thus shortening the service life of the sensor.

[0003] Silicon-based capacitive sensors are much smaller than traditional sensors and can be installed in small spaces. In addition, capacitive sensors have low dielectric loss such as air, and the impact of other factors is also very small, and the heat generated by them is also very small.

[0004] In the prior art, the packaging of capacitive sensors generally uses an upright surface welding wire to connect the sensor and the circuit board, which can easily cause an uneven surface and affect the test accuracy. The upright mounting structure can also easily damage the thin film components on the sensor surface, resulting in poor stability.

[0005] In view of this, the inventor specially designed an embedded high-voltage sensor packaging structure, and this case was thus generated. Utility Model Content

[0006] In order to solve the above problems, the technical solution of the utility model is as follows:

[0007] An embedded high-voltage sensor packaging structure, comprising:

[0008] The sensor body comprises a silicon-based base and a silicon-based film covered on the silicon-based base, wherein the silicon-based base is provided with a hollow contact cavity in the area covered by the silicon-based film;

[0009] A circuit board, the sensor body is inverted on the circuit board and the silicon-based film is fixedly connected to the end surface of the circuit board by a flexible adhesive;

[0010] Wherein, at least two metal welding points are arranged between the peripheral side of the sensor body and the circuit board.

[0011] Preferably, the metal solder joints include at least one reinforcement solder joint not connected to the circuit and used to increase the contact force between the sensor and the circuit board and at least one connection solder joint connected to the circuit.

[0012] Preferably, the metal welding points are provided in four numbers and are symmetrically distributed on both sides of the silicon-based base, and the metal welding points are arranged on the same side as the silicon-based film.

[0013] Preferably, the metal welding spot includes two connecting welding spots arranged on the same side and another two reinforcing connecting welding spots arranged on the same side.

[0014] Preferably, the metal welding points include two connecting welding points and another two reinforcing welding points, and the connecting welding points and the reinforcing welding points are staggeredly distributed around the silicon-based base.

[0015] Preferably, the contact cavity is a columnar groove, and the silicon-based film includes a circular thin-sheet deformation section adapted to the shape of the contact cavity and a connecting section integrally extending outward along one side of the deformation section.

[0016] Preferably, one of the metal welding spots is disposed on the connecting section.

[0017] Preferably, the circuit board is a PCB circuit board or a flexible circuit board.

[0018] Preferably, the silicon-based base is in the shape of a rectangular parallelepiped, and the metal welding point is arranged on the edge of the silicon-based base.

[0019] The beneficial effects of the utility model are as follows:

[0020] The utility model uses a capacitive sensor structure, which has small losses in dielectrics such as air, is little affected by other factors, and generates very little heat. In addition, the connection structure through flip-chip welding can prevent the uneven surface of the sensor from affecting the test accuracy and protect the silicon-based film on the surface from damage.

[0021] In addition, the circuit board welded to the sensor device adopts a flexible circuit board, and reinforced solder joints are added on the surface of the sensor, and four-corner fusion welding is used to strengthen the connection between the sensor and the flexible circuit board.

[0022] In particular, the silicon-based film and the flexible circuit board are bonded together by a flexible adhesive, which not only improves the adhesion but also protects the surface of the silicon-based film. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0024] in:

[0025] Figure 1 It is a schematic diagram of the overall structure of the sensor body in the utility model;

[0026] Figure 2 It is a schematic diagram of the explosion structure of the sensor body in the utility model;

[0027] Figure 3 It is a schematic diagram of the overall structure of the utility model;

[0028] Figure 4 It is a structural representation diagram of the oil pressure test;

[0029] Figure 5 It is a structural table view for force pressure verification;

[0030] Figure 6 It is a state change diagram of the force pressure verification of the utility model.

[0031] Description of labels:

[0032] 10. Sensor body; 11. Silicon-based base; 12. Silicon-based film; 121. Deformation section; 122. Connection section; 13. Contact cavity; 20. Circuit board; 30. Flexible glue; 40. Metal solder joint; 41. Connection solder joint; 42. Reinforced connection solder joint; 50. Hydraulic calibration bench; 51. Oil; 60. Pressure bench; 61. Flexible block; 62. Groove; 63. Pressure display instrument; 64. Universal joint; 65. Pressure testing device. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and more understandable, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0034] See also Figures 1 to 3 , is an embedded high-voltage sensor packaging structure as the best embodiment of the utility model, comprising:

[0035] The sensor body 10 includes a silicon-based base 11 and a silicon-based film 12 covered on the silicon-based base 11. The silicon-based base 11 is provided with a hollow contact cavity 13 in the area covered by the silicon-based film 12.

[0036] Circuit board 20, sensor body 10 is placed upside down on circuit board 20 and the silicon-based film 12 is fixedly connected to the end surface of circuit board 20 by flexible glue 30;

[0037] At least two metal welding points 40 are disposed between the peripheral side of the sensor body 10 and the circuit board 20 .

[0038] Preferably, Figure 1 , 2 As shown, the metal solder joint 40 includes at least one enhanced connection solder joint 42 that is not connected to the circuit and is used to increase the contact force between the sensor and the circuit board 20, and at least one connection solder joint 41 that is connected to the circuit. The enhanced connection solder joint 42 that is not connected to the circuit is added to the surface of the sensor, and the solder joint uses four-corner fusion welding to strengthen the connection between the sensor and the flexible circuit board 20.

[0039] Preferably, Figure 1 , 2As shown, in this embodiment, four metal solder joints 40 are provided and symmetrically distributed on both sides of the silicon-based base 11 , and the metal solder joints 40 and the silicon-based film 12 are arranged on the same side.

[0040] Furthermore, in this embodiment, the metal solder joint 40 includes two connecting solder joints 41 arranged on the same side and another two enhanced connecting solder joints 42 arranged on the same side. In addition, the metal solder joint 40 may also include two connecting solder joints 41 and another two enhanced connecting solder joints 42. The connecting solder joints 41 and the enhanced connecting solder joints 42 are staggeredly distributed around the silicon-based base 11.

[0041] Preferably, Figure 2 As shown, the contact cavity 13 is a columnar groove 62 , and the silicon-based film 12 includes a circular thin sheet-shaped deformation section 121 adapted to the shape of the contact cavity 13 and a connecting section 122 integrally extending outward along one side of the deformation section 121 .

[0042] Preferably, Figure 2 As shown, one of the metal welding points 40 is disposed on the connecting section 122 .

[0043] Preferably, the circuit board 20 is a PCB circuit board 20 or a flexible circuit board 20 . In this embodiment, the circuit board 20 is a flexible circuit board 20 .

[0044] Preferably, Figure 2 As shown, the silicon-based base 11 is in a rectangular parallelepiped shape, and the metal welding point 40 is arranged on the edge of the silicon-based base 11 .

[0045] In addition, the following verification test methods are included in this section as sensors:

[0046] Oil pressure test: Figure 4 As shown, a sealed cavity is made, and after the sensor and the flexible circuit board 20 are welded, the wiring is placed in the oil 51 of the sealed cavity and pressurized on a hydraulic test bench 50 to observe the change in the capacitance value of the sensor.

[0047] Pressure verification: Figure 5 , 6 As shown, a flexible block 61 is designed according to the size of the sensor, the sensor is placed in the groove 62 of the flexible block 61, pressure is applied to the pressure platform 60 of the pressure testing device 65, and the pressure display instrument 63 on the testing device and the capacitance change are observed to verify the accuracy of the oil pressure.

[0048] The groove 62 is provided to prevent the upper and lower surfaces from contacting each other, which may cause the actual force loaded on the sensor surface to not meet the applied value. A universal joint 64 is added above the pressure platform 60 for automatic leveling.

[0049] The beneficial effects of the utility model are as follows:

[0050] The utility model uses a capacitive sensor structure, which has small losses in air and other media, is little affected by other factors, and generates very little heat. In addition, the connection structure through flip-chip welding can prevent the uneven surface of the sensor from affecting the test accuracy and protect the silicon-based film 12 on the surface from damage.

[0051] In addition, the circuit board 20 to which the sensor device is soldered uses a flexible circuit board 20 .

[0052] In particular, the silicon-based film 12 and the flexible circuit board 20 are bonded together by the flexible adhesive 30 , which not only improves the adhesiveness but also protects the surface of the silicon-based film 12 .

[0053] The utility model is described above by way of example in conjunction with the accompanying drawings. It is obvious that the specific implementation of the utility model is not limited to the above-mentioned method. As long as various non-substantial improvements are made using the method concept and technical solution of the utility model, or the concept and technical solution of the utility model are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. An embedded high-voltage sensor packaging structure, characterized in that: include: A sensor body (10) comprises a silicon-based base (11) and a silicon-based film (12) covering the silicon-based base (11), wherein the silicon-based base (11) is provided with a hollow contact cavity (13) in a region covered by the silicon-based film (12); A circuit board (20), wherein the sensor body (10) is placed upside down on the circuit board (20) and the silicon-based film (12) is fixedly connected to the end surface of the circuit board (20) via a flexible adhesive (30); Wherein, at least two metal welding points (40) are provided between the peripheral side of the sensor body (10) and the circuit board (20).

2. The embedded high-voltage sensor packaging structure according to claim 1, characterized in that: The metal solder joint (40) comprises at least one reinforcing solder joint (42) not connected to the circuit and used to increase the contact force between the sensor and the circuit board (20) and at least one connecting solder joint (41) connected to the circuit.

3. The embedded high-voltage sensor packaging structure according to claim 2, characterized in that: The metal welding points (40) are provided in four numbers and are symmetrically distributed on both sides of the silicon-based base (11); the metal welding points (40) are arranged on the same side as the silicon-based film (12).

4. The embedded high-voltage sensor packaging structure according to claim 3, characterized in that: The metal welding point (40) comprises two connecting welding points (41) arranged on the same side and another two reinforcing welding points (42) arranged on the same side.

5. The embedded high-voltage sensor packaging structure according to claim 3, characterized in that: The metal welding points (40) include two connecting welding points (41) and two other reinforcing welding points (42); the connecting welding points (41) and the reinforcing welding points (42) are staggeredly distributed around the silicon-based base (11).

6. The embedded high-voltage sensor packaging structure according to claim 1, characterized in that: The contact cavity (13) is a columnar groove (62), and the silicon-based film (12) comprises a circular thin sheet-shaped deformation section (121) adapted to the shape of the contact cavity (13) and a connecting section (122) extending outwardly along one side of the deformation section (121).

7. The embedded high-voltage sensor packaging structure according to claim 6, characterized in that: One of the metal welding points (40) is disposed on the connecting section (122).

8. The embedded high-voltage sensor packaging structure according to claim 1, characterized in that: The circuit board (20) is a PCB circuit board (20) or a flexible circuit board (20).

9. The embedded high-voltage sensor packaging structure according to claim 1, characterized in that: The silicon-based base (11) is in the shape of a rectangular parallelepiped, and the metal welding point (40) is arranged on the edge of the silicon-based base (11).

Images