Magnetron sputtering coating machine

Abstract

The utility model discloses a magnetron sputtering coating machine, the magnetron sputtering coating machine comprises a base, and an equipment main body, a cryogenic system, a vacuumizing device, a power supply cabinet and a control cabinet which are arranged on the base, the cryogenic system is connected with the equipment main body and is used for cooling the interior of the equipment main body; the vacuum-pumping device is connected with the equipment main body and is used for carrying out vacuum treatment on the interior of the equipment main body, and the power supply cabinet and the control cabinet are connected with the equipment main body, the cryogenic system and the vacuum-pumping device respectively; the equipment body is arranged at one end of the base, the cryogenic system, the power supply cabinet and the control cabinet are sequentially arranged in the length direction of the base, and the vacuumizing device is located on one side of the cryogenic system, one side of the power supply cabinet and one side of the control cabinet. According to the utility model, all the parts are reasonably integrated on the base, so that the structure is compact, the occupied space is small, and the installation and the transportation are convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of coating equipment, and further relates to a magnetron sputtering coating machine. Background Art

[0002] At present, magnetron sputtering coating technology is widely used due to its advantages such as simple processing, convenient installation, dense coating layer, high bonding strength, and long-term mass production. The working principle of magnetron sputtering is that electrons collide with argon atoms in the process of flying toward the substrate under the action of the electric field E, causing them to ionize and produce Ar positive ions and new electrons; new electrons fly toward the substrate, and Ar ions are accelerated to fly toward the cathode target under the action of the electric field, and bombard the target surface with high energy, causing the target material to be sputtered. Among the sputtered particles, neutral target atoms or molecules are deposited on the substrate to form a thin film.

[0003] The coating machine can automatically and continuously perform low vacuum exhaust, arc ion bombardment pre-treatment, high vacuum exhaust, aluminum evaporation, anti-oxidation film coating and other processes in a vacuum, which requires a large number of parts. At present, due to the constraints of various standardized parts, the components of the coating machine are relatively scattered, occupying a large space, poor integration, and inconvenient to move.

[0004] Therefore, it is necessary to design a magnetron sputtering coating machine to solve the above problems. Summary of the invention

[0005] In view of the above technical problems, the purpose of the utility model is to provide a magnetron sputtering coating machine, which has a compact structure, occupies a small space, and is easy to install and transport by rationally integrating various components on a base.

[0006] In order to achieve the above-mentioned purpose, the utility model provides a magnetron sputtering coating machine, including a base and an equipment body, a cryogenic system, a vacuum device, a power supply cabinet and a control cabinet arranged on the base, wherein the cryogenic system is connected to the equipment body and is used to cool down the inside of the equipment body, the vacuum device is connected to the equipment body and is used to perform vacuum treatment on the inside of the equipment body, the power supply cabinet is respectively connected to the equipment body, the cryogenic system and the vacuum device, and the control cabinet is respectively connected to the equipment body, the cryogenic system and the vacuum device;

[0007] The equipment body is arranged at one end of the base, and the cryogenic system, the power cabinet, and the control cabinet are arranged in sequence along the length direction of the base. The cryogenic system is arranged close to the equipment body, and the vacuum pumping device is located on one side of the cryogenic system, the power cabinet, and the control cabinet.

[0008] In some embodiments, the equipment body includes a rotating cage and a magnetron sputtering device disposed in the rotating cage, the inner wall surface of the rotating cage is used to mount the product to be coated, and the rotating cage can rotate around the magnetron sputtering device so that the magnetron sputtering device can uniformly coat the product to be coated.

[0009] In some embodiments, the rotating cage is provided with a door, which is located at an end position of the base, and the door is used for an operator to enter the interior of the rotating cage.

[0010] In some embodiments, the device body further comprises:

[0011] A control console is arranged at one end of the base, and is used to operate and control the device body;

[0012] A ladder is arranged on one side of the base and is located at one end of the base close to the equipment body. The ladder is fixed on the equipment body and is used for an operator to climb to the top of the equipment body.

[0013] In some embodiments, the vacuum pumping device includes a first vacuum pumping mechanism and a second vacuum pumping mechanism, and the first vacuum pumping mechanism and the second vacuum pumping mechanism are respectively connected to the interior of the equipment body, the first vacuum pumping mechanism is used to perform low-pressure vacuum treatment on the interior of the equipment body, and the second vacuum pumping mechanism is used to perform high-pressure vacuum treatment on the interior of the equipment body.

[0014] In some embodiments, the first vacuum pumping mechanism includes a pump group and a first pipeline, the pump group is disposed on the base, and the first pipeline is connected to the pump group and the device body, and is used to transport the gas inside the device body to the pump group;

[0015] The second vacuum pumping mechanism includes a molecular pump and a second pipeline. The molecular pump is arranged on the device body. The second pipeline is connected to the molecular pump and the device body and is used to transport the gas inside the device body to the molecular pump.

[0016] In some embodiments, it further comprises:

[0017] A wiring trough is arranged at an upper middle position of the base, one end of the wiring trough is connected to the device body, and the other end of the wiring trough is connected to the power cabinet and the control cabinet.

[0018] In some embodiments, the base includes a plurality of parallel and spaced cross beams, a plurality of parallel and spaced longitudinal beams, and a plurality of substrates, each of the cross beams being vertically fixedly connected to a plurality of the longitudinal beams, so that the plurality of cross beams and the plurality of longitudinal beams form a criss-cross frame structure, and the plurality of substrates are fixed to the top of the frame structure.

[0019] In some embodiments, the base further includes a plurality of hollow portions, and the plurality of hollow portions are respectively arranged on the lower side of the cryogenic system, the lower side of the power cabinet, the lower side of the control cabinet, and the lower side of the vacuum device.

[0020] In some embodiments, the base further comprises a mounting frame and a plurality of floor mats, the mounting frame is fixed on the base, and the vacuum device is mounted on the mounting frame;

[0021] A plurality of floor mats are fixed at intervals on the circumferential side of the bottom of the base, and the floor mats space the bottom of the base from the ground at a preset distance to form a forklift opening.

[0022] Compared with the prior art, the magnetron sputtering coating machine provided by the utility model has the following beneficial effects:

[0023] In the utility model, the equipment body, deep cooling system, vacuum pumping device, power cabinet and control cabinet are reasonably integrated on the base, so that the structure is compact, the space occupied is small, and the installation and transportation are convenient; based on the different vacuum requirements for coating of different coating products, a first vacuum pumping mechanism is set to perform low-pressure vacuum treatment on the inside of the equipment body, and a second vacuum pumping mechanism is set to perform high-pressure vacuum treatment on the inside of the equipment body, which can effectively improve the application scenarios of the coating equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The preferred implementation modes will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present utility model.

[0025] Figure 1 It is a structural schematic diagram of a magnetron sputtering coating machine according to a preferred embodiment of the utility model;

[0026] Figure 2 It is a front view of a magnetron sputtering coating machine according to a preferred embodiment of the utility model;

[0027] Figure 3 It is a left view of a magnetron sputtering coating machine according to a preferred embodiment of the utility model;

[0028] Figure 4 It is a top view of a magnetron sputtering coating machine according to a preferred embodiment of the utility model;

[0029] Figure 5 It is a structural schematic diagram of a base of a preferred embodiment of the utility model.

[0030] Description of Figure Numbers:

[0031] Base 1, cross beam 11, longitudinal beam 12, base plate 13, hollow part 14, mounting frame 15, floor mat 16, equipment body 2, compartment door 21, control console 22, ladder 23, cryogenic system 3, vacuum device 4, pump group 41, first pipeline 42, molecular pump 43, second pipeline 44, power cabinet 5, control cabinet 6, wiring trough 7. DETAILED DESCRIPTION

[0032] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the specific implementation methods of the utility model will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0033] In order to simplify the drawings, only the parts related to the utility model are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0034] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0035] In this article, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0036] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0037] In one embodiment, the reference specification Figures 1 to 4The utility model provides a magnetron sputtering coating machine, comprising a base 1 and an equipment body 2, a cryogenic system 3, a vacuum device 4, a power supply cabinet 5 and a control cabinet 6 arranged on the base 1. The cryogenic system 3 is connected to the equipment body 2 for cooling the inside of the equipment body 2. The vacuum device 4 is connected to the equipment body 2 for vacuum treatment of the inside of the equipment body 2. The power supply cabinet 5 is respectively connected to the equipment body 2, the cryogenic system 3 and the vacuum device 4. The control cabinet 6 is respectively connected to the equipment body 2, the cryogenic system 3 and the vacuum device 4.

[0038] The equipment body 2 is arranged at one end of the base 1, and the cryogenic system 3, the power cabinet 5, and the control cabinet 6 are arranged in sequence along the length direction of the base 1. The cryogenic system 3 is arranged close to the equipment body 2, and the vacuum pumping device 4 is located on one side of the cryogenic system 3, the power cabinet 5, and the control cabinet 6.

[0039] In this embodiment, the equipment body 2, cryogenic system 3, vacuum pumping device 4, power cabinet 5 and control cabinet 6 are reasonably integrated on the base 1, so that the structure is compact, the space occupied is small, and the installation and transportation are convenient.

[0040] In one embodiment, the reference specification Figure 5 The base 1 includes a plurality of parallel and spaced cross beams 11, a plurality of parallel and spaced longitudinal beams 12, and a plurality of base plates 13. Each cross beam 11 is vertically fixedly connected to a plurality of longitudinal beams 12, so that the cross beams 11 and the longitudinal beams 12 form a criss-crossed square frame structure, and a plurality of base plates 13 are fixed on the top of the square frame structure. For example, four cross beams 11 are provided, and the four cross beams 11 are all made of H-shaped steel; the longitudinal beams 12 on both sides are made of H-shaped steel, and the longitudinal beams 12 in the middle are made of square tubes. When making the base 1, firstly, the two ends of the four cross beams 11 are welded and fixed to the longitudinal beams 12 on both sides, and then the other longitudinal beams 12 are fixed to the four cross beams 11 at intervals to form a plurality of squares, and the base plates 13 are fixed to the squares or hollowed out.

[0041] Furthermore, the base 1 further includes a plurality of hollow portions 14, which are respectively arranged at the lower side of the cryogenic system 3, the lower side of the power cabinet 5, the lower side of the control cabinet 6 and the lower side of the vacuum device 4. By arranging the hollow portions 14 at the above-mentioned positions, the cryogenic system 3, the power cabinet 5, the control cabinet 6 and the vacuum device 4 can be directly fixed on the crossbeam 11 or the longitudinal beam 12, thereby improving the stability of the installation structure; at the same time, it can also reduce the use of materials, save costs, and reduce the overall weight.

[0042] Furthermore, the base 1 further comprises a mounting frame 15 and a plurality of floor mats 16. The mounting frame 15 is fixed on the base 1. The mounting frame 15 is welded by angle iron or square tube. The vacuum device 4 is mounted on the mounting frame 15. The plurality of floor mats 16 are fixed at intervals on the bottom circumference of the base 1. The floor mats 16 space the bottom of the base 1 from the ground by a preset distance to form a forklift opening.

[0043] In one embodiment, the reference specification Figures 1 to 4 The equipment body 2 includes a rotating cage and a magnetron sputtering device disposed in the rotating cage. The inner wall of the rotating cage is used to mount the product to be coated, and the rotating cage can rotate around the magnetron sputtering device so that the magnetron sputtering device can uniformly coat the product to be coated. The rotating cage is provided with a door 21, which is located at the end of the base 1, and is used for operators to enter the interior of the rotating cage.

[0044] Furthermore, the equipment body 2 also includes: a control panel 22 and a ladder 23. The control panel 22 is arranged on one side of the end of the base 1, and the control panel 22 is used to operate and control the equipment body 2; the ladder 23 is arranged on one side of the base 1 and is located at one end of the base 1 close to the equipment body 2. The ladder 23 is fixed on the equipment body 2 and is used for the operator to climb to the top of the equipment body 2.

[0045] Furthermore, the magnetron sputtering coating machine further includes: a wiring trough 7, which is arranged at the upper middle position of the base 1, one end of the wiring trough 7 is connected to the device body 2, and the other end of the wiring trough 7 is connected to the power cabinet 5 and the control cabinet 6. The wiring trough 7 is overhead arranged above the base 1 to avoid clutter of the lines and to protect the lines.

[0046] In one embodiment, the reference specification Figures 1 to 4 The vacuum pumping device 4 includes a first vacuum pumping mechanism and a second vacuum pumping mechanism, which are respectively connected to the interior of the equipment body 2. The first vacuum pumping mechanism is used to perform low-pressure vacuum treatment on the interior of the equipment body 2, and the second vacuum pumping mechanism is used to perform high-pressure vacuum treatment on the interior of the equipment body 2.

[0047] Specifically, the first vacuum pumping mechanism includes a pump group 41 and a first pipeline 42. The pump group 41 is arranged on the mounting frame 15 on the base 1. The first pipeline 42 is connected to the pump group 41 and the equipment body 2, and is used to transport the gas inside the equipment body 2 to the pump group 41.

[0048] The second vacuum pumping mechanism includes a molecular pump 43 and a second pipeline 44. The molecular pump 43 is fixed on the side wall of the device body 2. The second pipeline 44 is connected to the molecular pump 43 and the device body 2, and is used to transport the gas inside the device body 2 to the molecular pump 43. Two molecular pumps 43 and two second pipelines 44 are respectively provided, and the two groups of molecular pumps 43 and second pipelines 44 are symmetrically arranged on both sides of the device body 2.

[0049] In this embodiment, based on the different vacuum requirements for coating of different coating products, a first vacuum pumping mechanism is provided to perform low-pressure vacuum treatment on the inside of the equipment body 2, and a second vacuum pumping mechanism is provided to perform high-pressure vacuum treatment on the inside of the equipment body 2. This can effectively improve the application scenarios of the coating equipment and improve the coating efficiency and yield rate.

[0050] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0051] It should be noted that the above embodiments can be freely combined as needed. The above are only preferred implementations of the utility model. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the utility model, and these improvements and modifications should also be regarded as the protection scope of the utility model.

Claims

1. A magnetron sputtering coating machine, characterized in that: It includes a base and an equipment body, a cryogenic system, a vacuum pumping device, a power supply cabinet and a control cabinet arranged on the base, wherein the cryogenic system is connected to the equipment body and is used to cool the inside of the equipment body, the vacuum pumping device is connected to the equipment body and is used to perform vacuum treatment on the inside of the equipment body, the power supply cabinet is respectively connected to the equipment body, the cryogenic system and the vacuum pumping device, and the control cabinet is respectively connected to the equipment body, the cryogenic system and the vacuum pumping device; The equipment body is arranged at one end of the base, and the cryogenic system, the power cabinet, and the control cabinet are arranged in sequence along the length direction of the base. The cryogenic system is arranged close to the equipment body, and the vacuum pumping device is located on one side of the cryogenic system, the power cabinet, and the control cabinet.

2. The magnetron sputtering coating machine according to claim 1, characterized in that: The equipment body includes a rotating cage and a magnetron sputtering device arranged in the rotating cage. The inner wall surface of the rotating cage is used to install the product to be coated, and the rotating cage can rotate around the magnetron sputtering device so that the magnetron sputtering device can uniformly coat the product to be coated.

3. The magnetron sputtering coating machine according to claim 2, characterized in that: The rotating cage is provided with a door, which is located at the end of the base and is used for operators to enter the interior of the rotating cage.

4. The magnetron sputtering coating machine according to claim 3, characterized in that: The device body also includes: A control console is arranged at one end of the base, and is used to operate and control the device body; A ladder is arranged on one side of the base and is located at one end of the base close to the equipment body. The ladder is fixed on the equipment body and is used for an operator to climb to the top of the equipment body.

5. The magnetron sputtering coating machine according to claim 1, characterized in that: The vacuum pumping device includes a first vacuum pumping mechanism and a second vacuum pumping mechanism, the first vacuum pumping mechanism and the second vacuum pumping mechanism are respectively connected to the interior of the equipment body, the first vacuum pumping mechanism is used to perform low-pressure vacuum treatment on the interior of the equipment body, and the second vacuum pumping mechanism is used to perform high-pressure vacuum treatment on the interior of the equipment body.

6. The magnetron sputtering coating machine according to claim 5, characterized in that: The first vacuum pumping mechanism includes a pump group and a first pipeline, the pump group is arranged on the base, and the first pipeline is connected to the pump group and the device body, and is used to transport the gas inside the device body to the pump group; The second vacuum pumping mechanism includes a molecular pump and a second pipeline. The molecular pump is arranged on the device body. The second pipeline is connected to the molecular pump and the device body and is used to transport the gas inside the device body to the molecular pump.

7. The magnetron sputtering coating machine according to claim 1, characterized in that: Also includes: A wiring trough is arranged at an upper middle position of the base, one end of the wiring trough is connected to the device body, and the other end of the wiring trough is connected to the power cabinet and the control cabinet.

8. The magnetron sputtering coating machine according to claim 1, characterized in that: The base includes a plurality of parallel and spaced cross beams, a plurality of parallel and spaced longitudinal beams and a plurality of base plates, each of the cross beams is vertically fixedly connected to a plurality of longitudinal beams, so that the cross beams and the longitudinal beams form a criss-crossed square frame structure, and the plurality of base plates are fixed on the top of the square frame structure.

9. The magnetron sputtering coating machine according to claim 8, characterized in that: The base also includes a plurality of hollow portions, which are respectively arranged on the lower side of the cryogenic system, the lower side of the power cabinet, the lower side of the control cabinet and the lower side of the vacuum device.

10. The magnetron sputtering coating machine according to claim 9, characterized in that: The base also includes a mounting frame and a plurality of floor mats, the mounting frame is fixed on the base, and the vacuum device is installed on the mounting frame; A plurality of floor mats are fixed at intervals on the circumferential side of the bottom of the base, and the floor mats space the bottom of the base from the ground at a preset distance to form a forklift opening.

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