Novel Y waveguide packaging structure and fiber-optic gyroscope

Abstract

The utility model relates to the technical field of device packaging, in particular to a novel Y waveguide packaging structure and a fiber-optic gyroscope, which comprise a shell, a Y-shaped waveguide assembly and a cover plate, the cover plate is arranged on the shell and used for forming a containing cavity in the shell, and the Y-shaped waveguide assembly is arranged in the containing cavity; the shell comprises a fiber inlet surface and a fiber outlet surface, the fiber inlet surface and the fiber outlet surface are both arc-shaped so as to be matched with a mounting surface on the fiber-optic gyroscope, and the fiber inlet surface and the fiber outlet surface of the shell are arc-shaped so as to be matched with the mounting surface on the fiber-optic gyroscope, so that on the basis of not reducing the length of the Y waveguide, the fiber inlet surface and the fiber outlet surface of the shell are both arc-shaped so as to be matched with the mounting surface on the fiber-optic gyroscope. The diameter of the mounting surface of the fiber-optic gyroscope is reduced by changing the cuboid packaging structure, the size of the fiber-optic gyroscope is reduced, and the design tolerance of the fiber-optic gyroscope is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of device packaging, in particular to a novel Y-waveguide packaging structure and a fiber optic gyroscope. Background Art

[0002] Multifunctional integrated optical device, referred to as Y-waveguide, is a typical phase modulation device. Its optical path part consists of a Y-waveguide chip, an input optical fiber and two output optical fibers; the circuit part realizes the phase modulation function of the Y-waveguide by applying a modulation signal to the electrodes on the Y-waveguide chip.

[0003] The Y-waveguide is the core device for realizing interferometric digital closed-loop fiber optic gyroscopes. It is relatively large in size among the optoelectronic devices of fiber optic gyroscopes. Currently, the main solution to reduce the size of fiber optic gyroscopes is to reduce the length of the Y-waveguide. However, reducing the length of the Y-waveguide will increase the half-wave voltage of the Y-waveguide, which may eventually exceed the power supply capacity of the fiber optic gyroscope circuit and make closed-loop control impossible.

[0004] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in the field of this technology. Utility Model Content

[0005] The technical problem to be solved by the utility model is how to reduce the size of the optical fiber gyroscope without reducing the length of the Y waveguide.

[0006] The utility model adopts the following technical solutions:

[0007] In the first aspect, a novel Y-waveguide packaging structure is provided, comprising: a shell 1, a Y-type waveguide component 2 and a cover plate 3; the cover plate 3 is arranged on the shell 1, and is used to form a accommodating cavity 10 in the shell 1, and the Y-type waveguide component 2 is arranged in the accommodating cavity 10; the shell 1 includes a fiber entry surface 11 and a fiber exit surface 12, and the fiber entry surface 11 and the fiber exit surface 12 are both arc-shaped to match the mounting surface on the fiber optic gyroscope.

[0008] Preferably, the Y-type waveguide component 2 includes a Y-type waveguide chip 20, a first optical fiber 21, a second optical fiber 22 and a third optical fiber 23;

[0009] One end of the first optical fiber 21 is coupled to the input end of the Y-type waveguide chip 20 , one end of the second optical fiber 22 is coupled to the first output end of the Y-type waveguide chip 20 , and one end of the third optical fiber 23 is coupled to the second output end of the Y-type waveguide chip 20 .

[0010] Preferably, a bottom surface 13 and a mounting surface 14 are provided at the bottom of the accommodating cavity 10, and the mounting surface 14 is higher than the bottom surface 13; the Y-type waveguide chip 20 is arranged on the mounting surface 14; the first optical fiber 21, the second optical fiber 22 and the third optical fiber 23 are suspended relative to the bottom surface 13.

[0011] Preferably, a fiber entry hole 110 is provided on the fiber entry surface 11, and a fiber exit hole 120 is provided on the fiber exit surface 12; the other end of the first optical fiber 21 extends out of the fiber entry hole 110, and the other end of the second optical fiber 22 and the other end of the third optical fiber 23 both extend out of the fiber exit hole 120.

[0012] Preferably, the side of the housing 1 is further provided with a first lead 15, a second lead 16 and a third lead 17; the first lead 15 is fixed to the side of the housing 1 for grounding;

[0013] The second lead 16 passes through the side surface of the housing 1 to be connected to the first electrode of the Y-type waveguide chip 20 ; the third lead 17 passes through the side surface of the housing 1 to be connected to the second electrode of the Y-type waveguide chip 20 .

[0014] Preferably, the second lead 16 and the third lead 17 are insulated and fixed to the side of the housing 1 by glass sealing; the second lead 16 and the third lead 17 are both connected to the electrodes of the Y-type waveguide chip 20 by gold wires.

[0015] Preferably, the model of the Y-type waveguide chip 20 is 1512, 1520, 1312 or 1320.

[0016] Preferably, the cover plate 3 is supported by the side surface of the shell 1 , the fiber entry surface 11 and the fiber exit surface 12 and is bonded with glue to be packaged with the shell 1 .

[0017] Preferably, the material of the shell 1 is one or more of Kovar and stainless steel.

[0018] In a second aspect, a fiber optic gyroscope is provided, wherein the novel Y-waveguide packaging structure as described in the first aspect is arranged on a mounting surface of the fiber optic gyroscope.

[0019] Compared with the prior art, the beneficial effects of the utility model are:

[0020] The utility model sets the fiber entry surface 11 and the fiber exit surface 12 of the shell 1 to be arc-shaped to match the mounting surface on the fiber optic gyroscope. On the basis of not reducing the length of the Y waveguide, the diameter of the mounting surface of the fiber optic gyroscope is reduced by changing the packaging structure of the rectangular parallelepiped, thereby reducing the size of the fiber optic gyroscope and increasing the design tolerance of the fiber optic gyroscope. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a schematic diagram of the overall structure of a novel Y-waveguide packaging structure provided by an embodiment of the utility model;

[0023] Figure 2 It is a schematic diagram of the internal structure of a novel Y-waveguide packaging structure provided by an embodiment of the utility model;

[0024] Figure 3 It is a structural schematic diagram of the fiber entry and fiber exit surfaces of a novel Y-waveguide packaging structure provided by an embodiment of the utility model;

[0025] Figure 4 This is a schematic structural diagram of a novel Y-waveguide packaging structure provided by an embodiment of the utility model and used in a fiber optic gyroscope;

[0026] Figure 5 This is a structural schematic diagram of a cover plate of a novel Y-waveguide packaging structure provided by an embodiment of the utility model;

[0027] Figure 6 It is a structural schematic diagram of a Y-type waveguide component of a novel Y-waveguide packaging structure provided by an embodiment of the utility model;

[0028] Figure 7 This is a schematic diagram of the structure inside a shell of a novel Y-waveguide packaging structure provided by an embodiment of the utility model;

[0029] Figure 8 It is a structural schematic diagram of a fiber optic gyroscope provided by an embodiment of the utility model.

[0030] In all drawings, like reference numerals refer to like structures, wherein:

[0031] Shell 1, accommodating cavity 10, fiber inlet surface 11, fiber inlet hole 110, fiber outlet surface 12, fiber outlet hole 120, bottom surface 13, mounting table 14, first lead 15, second lead 16, third lead 17, Y-type waveguide component 2, Y-type waveguide chip 20, first optical fiber 21, second optical fiber 22, third optical fiber 23, cover plate 3. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0033] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above terms due to reasons such as the order and position of appearance, it is not limited to that they can be carried in combination by one embodiment or example.

[0034] In the description of the present utility model, the terms "first" and "second" are used for descriptive purposes only, and shall not be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "multiple" is two or more. In addition, for example, the description may also use the method of adding "A" and "B" at the end to describe the same type of nouns as two independent individuals. In this case, the corresponding features defined as "A" and "B" are only used to distinguish the same type of individuals for description purposes, and shall not be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.

[0035] When describing some embodiments, the expressions "coupling", "coupling" and "connection" and their derivatives may be used. For example, when describing some embodiments, the term "connection" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupling" may be used to indicate that two or more components are in direct physical or electrical contact. However, the terms "connection" or "coupling" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other, such as "optical path coupling", "wireless connection", etc. The embodiments disclosed here are not necessarily limited to the contents of the present utility model.

[0036] In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0037] Embodiment 1:

[0038] The mounting surface of the Y-waveguide on the existing fiber optic gyroscope is generally circular, but the packaging structure of the existing Y-waveguide shell is generally rectangular. In theory, the minimum diameter of the circular mounting surface on the fiber optic gyroscope is required to be greater than or equal to the diagonal of the rectangle. The length of the diagonal and the length and width of the Y-waveguide satisfy the Pythagorean theorem. For example, the current 1310nm Y-waveguide with a length of 20mm and a width of 7mm has a diagonal length of 21.19mm. Therefore, the diameter of the mounting surface on the fiber optic gyroscope must be greater than 21.19mm. This will cause the overall size of the fiber optic gyroscope to become larger. In optoelectronic devices, the size of the fiber optic gyroscope needs to be as small as possible while ensuring that the function is not damaged. Therefore, the packaging structure of the Y-waveguide needs to be compressed without reducing the length.

[0039] To solve the above problems, the present invention provides a novel Y-waveguide packaging structure. Figure 1 and Figure 2 As shown, it includes: a housing 1, a Y-shaped waveguide component 2 and a cover plate 3; the cover plate 3 is arranged on the housing 1, and is used to form a receiving cavity 10 in the housing 1, and the Y-shaped waveguide component 2 is arranged in the receiving cavity 10; Figure 3 and Figure 4 As shown, the housing 1 includes a fiber entry surface 11 and a fiber exit surface 12, both of which are arc-shaped to match the mounting surface on the fiber optic gyroscope. Correspondingly, the two end surfaces of the cover plate 3 are also arc-shaped.

[0040] The shell 1 is the main part of the entire packaging structure. The material of the shell 1 is one or more of Kovar and stainless steel, which plays a role in protecting the internal components. The shell 1 has a fiber entry surface 11 and a fiber exit surface 12, which are symmetrically distributed on both sides of the shell 1 and are both arc-shaped. The arc-shaped design is to match the mounting surface on the fiber optic gyroscope to ensure that the entire packaging structure can be smoothly installed on the mounting surface on the fiber optic gyroscope.

[0041] In one embodiment, the mounting surface on the fiber optic gyroscope is circular. When the novel Y-waveguide packaging structure is mounted on the mounting surface on the fiber optic gyroscope, the circle where the fiber entry surface 11 and the fiber exit surface 12 are located is cocentric with the circle where the mounting surface is located.

[0042] The fiber entry surface 11 refers to a surface where the optical fiber signal enters the housing 1 , and the fiber exit surface 12 refers to the other surface where the optical fiber signal is output from the housing 1 .

[0043] The Y-type waveguide component 2 is the core part of the packaging structure, which is used to guide and modulate the optical signal. The specific modulation process is not described in detail in this embodiment. The Y-type waveguide component 2 introduces the optical signal from the fiber input surface 11 and guides the optical signal to the fiber output surface 12 through its branches.

[0044] like Figure 5 As shown, the cover plate 3 is a special-shaped surface, which can be divided into two arc surfaces and a rectangular surface to match the cross-section of the housing 1. The function of the cover plate 3 is to seal the housing 1 and protect the Y-type waveguide component 2 from the influence of the external environment. The design of the cover plate 3 should ensure close fit with the housing 1 to prevent optical signal leakage or external interference. The cover plate 3 is supported by the side of the housing 1, the fiber inlet surface 11 and the fiber outlet surface 12 and bonded by glue to be packaged with the housing 1. The cover plate 3 is connected to the housing 1 through the side of the housing 1. This connection method can provide stable support to prevent the cover plate 3 from shifting during operation. Using glue to bond at the connection between the cover plate 3 and the housing 1 can fill a small gap and improve the sealing of the packaging structure. Through this packaging method, the connection between the cover plate 3 and the housing 1 is both firm and sealed, which helps to protect the internal Y-type waveguide component 2 from the influence of the external environment and ensure the stable transmission of the optical signal. The design of this packaging structure takes into account the efficiency of the optical signal and the reliability of the packaging, which helps to improve the performance of optical sensors such as fiber optic gyroscopes.

[0045] In one embodiment, Figure 6 As shown, the Y-type waveguide component 2 includes a Y-type waveguide chip 20, a first optical fiber 21, a second optical fiber 22 and a third optical fiber 23; one end of the first optical fiber 21 is coupled to the input end of the Y-type waveguide chip 20, one end of the second optical fiber 22 is coupled to the first output end of the Y-type waveguide chip 20, and one end of the third optical fiber 23 is coupled to the second output end of the Y-type waveguide chip 20.

[0046] The Y-type waveguide chip 20 is the core of the Y-type waveguide assembly 2, and has three input / output ports, and is shaped like the letter "Y". The Y-type waveguide chip 20 is usually made of semiconductor materials, such as silicon or indium phosphide, and can also be made of other optically transparent materials. The waveguide structure on the Y-type waveguide chip 20 can be manufactured by micro-machining technology, such as photolithography, etching and metallization, to achieve transmission and branching of optical signals.

[0047] One end of the first optical fiber 21 is coupled to the input end of the Y-type waveguide chip 20, and the coupling here refers to the close contact between the end of the optical fiber and the input port of the waveguide chip to realize the transmission of the optical signal. Coupling usually uses a coupler or an optical fiber connector to improve the reliability and efficiency of the connection. The specific coupling method is no longer repeated in this embodiment. One end of the second optical fiber 22 is coupled to the first output end of the Y-type waveguide chip 20. The output port is usually a fiber port separated from the waveguide chip, which is used to guide the optical signal to be output from the chip. One end of the third optical fiber 23 is coupled to the second output end of the Y-type waveguide chip 20, and similar to the second optical fiber 22, the third optical fiber 23 is also used to guide the optical signal out of the output port of the waveguide chip. The first optical fiber, the second optical fiber and the third optical fiber can all be single-core fiber arrays (Fiber Array, abbreviated as FA).

[0048] In the Y-type waveguide component 2, the optical signal enters the input end of the waveguide chip from the first optical fiber 21, and is then divided into two parts by the Y-type waveguide chip 20, one part of the optical signal is coupled to the second optical fiber 22 through the first output port, and the other part is coupled to the third optical fiber 23 through the second output port. In this way, the Y-type waveguide chip 20 realizes the separation and routing of optical signals, so that optical signals of different paths can be processed differently in subsequent optical systems. In one embodiment, the model of the Y-type waveguide chip 20 is 1512, 1520, 1312 or 1320. Among them, the front 13 and 15 represent the wavelengths of 1310nm and 1550nm respectively, and the rear 12 and 20 represent the length of the Y-type waveguide chip 20.

[0049] In one embodiment, Figure 7 As shown, a bottom surface 13 and a mounting surface 14 are provided at the bottom of the accommodating cavity 10, and the mounting surface 14 is higher than the bottom surface 13; the Y-type waveguide chip 20 is arranged on the mounting surface 14; the first optical fiber 21, the second optical fiber 22 and the third optical fiber 23 are suspended relative to the bottom surface 13.

[0050] The center point of the Y-type waveguide chip 20 basically coincides with the center point of the mounting table 14. The accommodating cavity 10 is a space designed to accommodate the Y-type waveguide component 2. The bottom surface 13 is the lowest part of the accommodating cavity 10, which is used to provide stable support for the Y-type waveguide component 2. The mounting table 14 is located on the bottom surface 13 and is higher than the bottom surface 13. The mounting table 14 provides a higher placement position for the Y-type waveguide chip 20, which may help improve the coupling efficiency between the chip and the optical fiber or provide better thermal management. The length of the mounting table 14 is shorter than the length of the Y-type waveguide chip 20, which can be set to 2 cm, and the height of the mounting table 14 is higher than the height of the bottom surface 13 of the shell 1, which can be set to 4 mm.

[0051] The Y-type waveguide chip 20 is arranged on the mounting table 14. Since the first optical fiber 21 is coupled to the first input end of the Y-type waveguide chip 20, the second optical fiber 22 and the third optical fiber 23 are respectively coupled to the first output end and the second output end of the Y-type waveguide chip 20, and because the Y-type waveguide chip 20 is arranged on the mounting table 14 higher than the bottom surface 13, the first optical fiber 21, the second optical fiber 22 and the third optical fiber 23 are suspended relative to the bottom surface 13, which means that they are not in direct contact with the bottom surface 13. The suspended state of the optical fiber is used to maintain a specific distance and angle between the optical fiber and the Y-type waveguide chip 20 to ensure efficient transmission of optical signals. At the same time, it is used to reduce the stress at the coupling point between the optical fiber and the Y-type waveguide chip 20. In this structure, the Y-type waveguide chip 20 is arranged on the mounting table 14, which may help to improve the coupling efficiency between the chip and the optical fiber, and also facilitate the installation and maintenance of the chip. The suspended design of the optical fiber helps to reduce the friction and contact between the optical fiber and the bottom surface 13, thereby reducing signal loss and improving the stability of the system.

[0052] In one embodiment, continue to refer to Figure 7 A fiber inlet hole 110 is provided on the fiber inlet surface 11, and a fiber outlet hole 120 is provided on the fiber outlet surface 12; the other end of the first optical fiber 21 extends out of the fiber inlet hole 110, and the other end of the second optical fiber 22 and the other end of the third optical fiber 23 both extend out of the fiber outlet hole 120.

[0053] The fiber inlet hole 110 is located on the fiber inlet surface 11, and is a hole for coupling the first optical fiber 21 with the Y-type waveguide chip 20. The other end of the first optical fiber 21 extends out of the fiber inlet hole 110, that is, one end of the first optical fiber 21 is coupled with the input port of the Y-type waveguide chip 20 through the fiber inlet hole 110. The fiber outlet hole 120 is located on the fiber outlet surface 12, and is a hole for separating the optical fiber from the waveguide chip. The other ends of the second optical fiber 22 and the third optical fiber 23 both extend out of the fiber outlet hole 120, that is, one end of these two optical fibers are coupled with the two output ports of the Y-type waveguide chip 20 through the fiber outlet holes 120, respectively.

[0054] By applying glue in the fiber inlet hole 110 and curing it to fix the pigtail of the first optical fiber 21, and by applying glue in the fiber outlet hole 120 and curing it to fix the pigtails of the second optical fiber 22 and the third optical fiber 23, the influence of the optical fiber stress outside the shell 1 on the coupling point of the Y-type waveguide chip 20 is reduced, thereby improving the reliability of the Y-type waveguide component 2.

[0055] In one embodiment, continue to refer to Figure 7The side of the shell 1 is also provided with a first lead 15, a second lead 16 and a third lead 17; the first lead 15 is fixed to the side of the shell 1 for grounding; the second lead 16 passes through the side of the shell 1 and is connected to the first electrode of the Y-type waveguide chip 20; the third lead 17 passes through the side of the shell 1 and is connected to the second electrode of the Y-type waveguide chip 20.

[0056] The first lead 15 is fixed to the side of the housing 1 and is used for grounding. The purpose of grounding is to eliminate or reduce unnecessary electromagnetic interference.

[0057] The second lead 16 passes through the side surface of the housing 1 and is connected to the first electrode of the Y-type waveguide chip 20 . The second lead 16 is used to transmit an electrical signal from an external circuit to the first electrode of the Y-type waveguide chip 20 .

[0058] The third lead 17 passes through the side of the housing 1 and is connected to the second electrode of the Y-type waveguide chip 20. The third lead 17 is used to transmit the electrical signal from the external circuit to the second electrode of the Y-type waveguide chip 20. The second lead 16 and the third lead 17 are insulated and fixed to the side of the housing 1 by glass sealing; the second lead 16 and the third lead 17 are both connected to the electrode of the Y-type waveguide chip 20 by gold wire.

[0059] Through these three leads, electrical control and signal transmission of the Y-type waveguide chip 20 can be achieved. This design allows the Y-type waveguide chip to control electrical signals while processing optical signals, thereby expanding the functions and application scope of the Y-type waveguide chip. The specific method and process of electrical control and signal transmission of the Y-type waveguide chip 20 will not be described in detail in this embodiment.

[0060] In this embodiment, the fiber entry surface 11 and the fiber exit surface 12 of the shell 1 are set to be arc-shaped to match the mounting surface on the fiber optic gyroscope. On the basis of not reducing the length of the Y waveguide, the diameter of the mounting surface of the fiber optic gyroscope is reduced by changing the packaging structure of the rectangular parallelepiped, thereby reducing the size of the fiber optic gyroscope and increasing the design tolerance of the fiber optic gyroscope.

[0061] Embodiment 2:

[0062] In Example 1, a novel Y-waveguide packaging structure is proposed. In this embodiment, a fiber optic gyroscope is proposed. Figure 8 As shown, the novel Y-waveguide packaging structure described in Embodiment 1 is arranged on the mounting surface Z of the fiber optic gyroscope. Other structures of the fiber optic gyroscope will not be described in detail in this embodiment.

[0063] For the specific structure of the novel Y-waveguide packaging structure, please refer to Example 1, which will not be repeated in this embodiment.

[0064] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A novel Y-waveguide packaging structure, characterized in that: include: A shell (1), a Y-type waveguide component (2) and a cover plate (3); the cover plate (3) is arranged on the shell (1) and is used to form a receiving cavity (10) in the shell (1), and the Y-type waveguide component (2) is arranged in the receiving cavity (10); the shell (1) comprises a fiber entry surface (11) and a fiber exit surface (12), and the fiber entry surface (11) and the fiber exit surface (12) are both arc-shaped so as to match the mounting surface on the optical fiber gyroscope.

2. The novel Y-waveguide packaging structure according to claim 1 is characterized in that: The Y-type waveguide component (2) comprises a Y-type waveguide chip (20), a first optical fiber (21), a second optical fiber (22) and a third optical fiber (23); One end of the first optical fiber (21) is coupled to the input end of the Y-type waveguide chip (20), one end of the second optical fiber (22) is coupled to the first output end of the Y-type waveguide chip (20), and one end of the third optical fiber (23) is coupled to the second output end of the Y-type waveguide chip (20).

3. The novel Y-waveguide packaging structure according to claim 2 is characterized in that: The bottom of the accommodating cavity (10) is provided with a bottom surface (13) and a mounting surface (14), and the mounting surface (14) is higher than the bottom surface (13); the Y-shaped waveguide chip (20) is arranged on the mounting surface (14); and the first optical fiber (21), the second optical fiber (22) and the third optical fiber (23) are suspended relative to the bottom surface (13).

4. The novel Y-waveguide packaging structure according to claim 2 is characterized in that: The fiber entry surface (11) is provided with a fiber entry hole (110), and the fiber exit surface (12) is provided with a fiber exit hole (120); the other end of the first optical fiber (21) extends out of the fiber entry hole (110), and the other end of the second optical fiber (22) and the other end of the third optical fiber (23) both extend out of the fiber exit hole (120).

5. The novel Y-waveguide packaging structure according to claim 2 is characterized in that: A first lead (15), a second lead (16) and a third lead (17) are also provided on the side of the housing (1); the first lead (15) is fixed on the side of the housing (1) and is used for grounding; The second lead (16) passes through the side surface of the housing (1) and is connected to the first electrode of the Y-type waveguide chip (20); and the third lead (17) passes through the side surface of the housing (1) and is connected to the second electrode of the Y-type waveguide chip (20).

6. The novel Y-waveguide packaging structure according to claim 5, characterized in that: The second lead (16) and the third lead (17) are insulated and fixed to the side surface of the housing (1) by glass sealing; the second lead (16) and the third lead (17) are both connected to the electrodes of the Y-type waveguide chip (20) by gold wires.

7. The novel Y-waveguide packaging structure according to claim 2 is characterized in that: The model of the Y-type waveguide chip (20) is 1512, 1520, 1312 or 1320.

8. The novel Y-waveguide packaging structure according to any one of claims 1 to 7, characterized in that: The cover plate (3) is supported by the side surface of the shell (1), the fiber entry surface (11) and the fiber exit surface (12) and is bonded by glue so as to be encapsulated with the shell (1).

9. The novel Y-waveguide packaging structure according to any one of claims 1 to 7, characterized in that: The material of the shell (1) is one or more of Kovar and stainless steel.

10. A fiber optic gyroscope, characterized in that: The novel Y-waveguide packaging structure as described in any one of claims 1 to 9 is arranged on the mounting surface of the fiber optic gyroscope.

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