Vertical heat dissipation case and host

Abstract

The utility model provides a vertical heat dissipation case and host, including the case body, the case body includes cover plate, bottom plate, front plate, back plate, left side plate and right side plate, the surface of cover plate is provided with mainboard catch mouth and PCIe equipment fixing device, cover plate and bottom plate are provided with first heat dissipation hole that forms convection. According to the utility model, the mainboard baffle sheet port and the PCIe equipment fixing device are arranged on the cover plate of the case, so that main heating devices such as a mainboard comprising a CPU (Central Processing Unit), an MOS (Metal Oxide Semiconductor) tube and a VRM (Voltage Regulator Module), high-power-density PCIe equipment comprising a video card, a memory bank and a hard disk are vertically arranged in the case and are arranged along a natural air channel; meanwhile, the first heat dissipation holes for forming convection are formed in the cover plate and the bottom plate, so that hot air generated by main heating devices in the case is exhausted from bottom to top, the characteristic of natural upward convection of the hot air is conformed, and therefore the heat dissipation performance and the working stability of the host are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chassis, in particular to a vertical heat dissipation chassis and a host. Background Art

[0002] As a part of computer accessories, the main function of the chassis is to place and fix the electronic devices related to the host, and play a supporting and protective role. However, the design of the openings on the chassis indirectly affects the placement of the various electronic devices. For example, the motherboard baffle opening limits the spatial position of the motherboard in the chassis. Therefore, the chassis design will also affect the layout of the various electronic devices in the entire host, which will lead to two problems: the first is the wiring distance. The longer the wiring distance, the more serious the voltage drop and signal attenuation will be; the second is the impact on the air duct. A certain board or component placed horizontally will naturally hinder the natural upward flow of hot air. The blocked or improperly designed air duct will lead to unsatisfactory hot air discharge and heat accumulation, thereby affecting the performance, life and stability of the host.

[0003] In the existing design, the motherboard baffle and PCIe device fixing device on the chassis are set on the back plate, so that the motherboard, graphics card, memory stick and other electronic devices are placed horizontally. Therefore, the existing host heat dissipation method is mainly a horizontal heat dissipation method, which has a low heat dissipation efficiency. Therefore, the heat dissipation performance of the host is poor. Utility Model Content

[0004] In order to solve the above problems in the prior art, the utility model provides a vertical heat dissipation chassis and a host, which improve the heat dissipation performance of the host through vertical heat dissipation.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] In a first aspect, the utility model provides a vertical heat dissipation chassis, including a box body, wherein the box body includes a cover plate, a bottom plate, a front plate, a rear plate, a left plate and a right plate, the surface of the cover plate is provided with a motherboard baffle opening and a PCIe device fixing device, and the cover plate and the bottom plate are provided with a first heat dissipation hole for forming convection.

[0007] The beneficial effect of the utility model is that by arranging a mainboard baffle opening and a PCIe device fixing device on the cover plate of the chassis, the main heat-generating components including the mainboard including the CPU, MOS tube and VRM, the high-power-density PCIe device including the graphics card, the memory stick and the hard disk are placed vertically in the chassis, and at the same time, the first heat dissipation holes for forming convection are arranged on the cover plate and the bottom plate, so that the hot air generated by the main heat-generating components in the chassis is discharged from bottom to top, which conforms to the characteristic of upward convection of hot air, thereby improving the heat dissipation performance of the host.

[0008] Optionally, second heat dissipation holes are arranged on the left panel and the right panel, and the hole spacing between the second heat dissipation holes on either side panel of the left panel or the right panel is used to correspond to the hole spacing between the screw holes on the hard disk.

[0009] According to the above description, the second heat dissipation hole is reused as the hard disk mounting hole, thereby reducing the space occupied by the hard disk in the chassis, making the upward air duct in the chassis more unobstructed, and the heat convection and heat radiation efficiency higher. The hot air generated by the hard disk is unobstructed and can flow upward all the time, which can better dissipate heat.

[0010] Optionally, a first size of the second heat dissipation hole on any one of the left plate and the right plate in the first direction is the same as a plate distance between two adjacent second heat dissipation holes in the first direction;

[0011] The lateral dimension of the second heat dissipation hole is between 4.8 mm and 4.82 mm.

[0012] According to the above description, it can be known that by limiting the above size, the requirement of reusing the second heat dissipation hole as a hard disk mounting hole can be met.

[0013] Optionally, the front plate is provided with a switch hole and / or a USB hole at a position close to the bottom plate.

[0014] According to the above description, by setting the switch hole and / or the USB hole at the lower position of the front plate, interference with PCIe devices such as graphics cards can be avoided.

[0015] Optionally, the front plate and the rear plate are provided with a first handle hole at a position close to the cover plate.

[0016] According to the above description, no additional handle is required, which improves the processing efficiency of the chassis and reduces the production cost of the chassis.

[0017] Optionally, the cover plate is provided with a second handle hole at a position close to the front plate and the rear plate.

[0018] According to the above description, the host can be picked up with one hand through the corresponding handle holes on the front plate and the front side of the cover plate, and the rear plate and the rear side of the cover plate.

[0019] Optionally, foot pads are provided at the four corners of the base plate.

[0020] Optionally, the motherboard baffle port is arranged in a side area of ​​the cover plate close to the rear plate, the PCIe device fixing device is arranged in a side area of ​​the cover plate close to the front plate, and a power connection port is provided on the rear plate close to the bottom plate.

[0021] According to the above description, it can be seen that by limiting the position of the motherboard baffle port, the PCIe device fixing device and the power connection port, the space utilization in the chassis is improved, so that more graphics cards or other PCIe devices can be inserted to enhance the working performance of the host.

[0022] In a second aspect, the utility model further provides a vertical heat dissipation host, using the vertical heat dissipation chassis described in the first aspect, and further comprising an electronic device, wherein the electronic device is installed in the heat dissipation chassis;

[0023] The electronic device includes a motherboard and a PCIe device, wherein one side of each external interface on the motherboard is located at the motherboard baffle opening and is arranged upward, and one side of each external interface on the PCIe device is located at the PCIe device fixing device and is arranged upward.

[0024] The beneficial effect of the utility model is that by arranging a mainboard baffle opening and a PCIe device fixing device on the cover plate of the chassis, the main heat-generating components such as the mainboard, high-power-density PCIe devices, memory sticks, hard disks, etc. are placed vertically in the chassis, and at the same time, the first heat dissipation holes for forming convection are arranged on the cover plate and the bottom plate, so that the hot air generated by the main heat-generating components in the chassis is discharged from bottom to top, which conforms to the characteristics of upward convection of hot air, thereby improving the heat dissipation performance of the host.

[0025] Optionally, the surface of the electronic device is coated with a layer of waterproof paint.

[0026] According to the above description, waterproof paint can be used to prevent electronic devices from malfunctioning due to contact with water. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a three-dimensional schematic diagram of a vertical heat dissipation chassis according to an embodiment of the utility model;

[0028] Figure 2 It is a schematic plan view of a cover plate involved in an embodiment of the utility model;

[0029] Figure 3 It is a schematic plan view of a base plate involved in an embodiment of the utility model;

[0030] Figure 4 It is a schematic plan view of the front plate involved in the embodiment of the utility model;

[0031] Figure 5 It is a schematic plan view of a rear plate involved in an embodiment of the utility model;

[0032] Figure 6 It is a schematic plan view of the left side panel involved in the embodiment of the utility model;

[0033] Figure 7It is a schematic plan view of the right side panel involved in the embodiment of the utility model;

[0034] Figure 8 for Figure 7 A magnified schematic diagram of the middle area A;

[0035] Fig. 9 It is a three-dimensional schematic diagram of a vertical heat dissipation host according to an embodiment of the utility model;

[0036] Fig.10 for Fig. 9 A three-dimensional schematic diagram after the front panel is removed.

[0037] [Description of Reference Numerals]

[0038] 100, box body; 200, electronic device;

[0039] 1. Cover plate; 11. Mainboard baffle opening; 12. PCIe device fixing device; 13. First heat dissipation hole;

[0040] 2. Base plate; 21. Foot pad;

[0041] 3. front plate; 31. first handle hole; 32. second handle hole;

[0042] 4. Rear panel; 41. Power connection port;

[0043] 5. left side panel; 51. second heat dissipation hole;

[0044] 6. Right side panel. DETAILED DESCRIPTION

[0045] In order to better understand the above technical solution, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a clearer and more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0046] The above and other technical contents, features and effects of the utility model will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings. Through the description of the specific implementation methods, the technical means and effects adopted by the utility model to achieve the predetermined purpose can be more deeply and specifically understood. However, the attached drawings are only for reference and explanation purposes, and are not used to limit the utility model.

[0047] Unless otherwise specified, throughout the specification and claims, "include" and "comprising" have the same meaning as "including but not limited to". "Connect" or its variants refer to the direct or indirect connection between two or more components, modules or systems, which can be physical, logical, or a combination thereof. " / " means "or", covering the following interpretations: any item in the list, all items in the list, and any combination of all items in the list. Words using the singular or plural number can also represent the singular or plural case, respectively.

[0048] Embodiment 1

[0049] Please refer to Figures 1 to 8 , a vertical heat dissipation chassis, including a chassis 100, such as Figure 1 As shown, the box body 100 includes a cover plate 1, a bottom plate 2, a front plate 3, a rear plate 4, a left side plate 5 and a right side plate 6. Figure 1 This is an implementation method in which the second heat dissipation hole 51 is placed horizontally. Figures 2 to 8 The second heat dissipation hole 51 is placed vertically. Figure 2 and Figure 8 The supporting bar structure in the PCIe device fixing device 12 is omitted, and only the plug-in structure of the PCIe device fixing device 12 is retained.

[0050] like Figure 2 and 3 As shown, the surface of the cover plate 1 is provided with a motherboard baffle 11 and a PCIe device fixing device 12, and the cover plate 1 and the bottom plate 2 are provided with a first heat dissipation hole 13 for forming convection. Therefore, the main heat generating components including the motherboard of the CPU, MOS tube and VRM, the high power density PCIe device including the graphics card, the memory bar and the hard disk are vertically placed in the box 100. With the help of the first heat dissipation hole 13 for up and down convection, the hot air generated by the main heat generating components in the box 100 is discharged from bottom to top. Since the hot air density is low and the cold air density is high, the hot air is naturally convected upward without forced air cooling. Therefore, the hot air in this embodiment meets the characteristics of upward convection of hot air, thereby improving the heat dissipation performance and working stability of the host.

[0051] At the same time, placing the graphics card vertically in accordance with the direction of gravity can also reduce the impact of vibration on the graphics card during transportation or operation of the host and the probability of the graphics card being damaged by vibration, thereby further improving the working stability and life expectancy of the host.

[0052] Specifically, the motherboard baffle opening 11 is arranged in a side area of ​​the cover plate 1 close to the rear plate 4, the PCIe device fixing device 12 is arranged in a side area of ​​the cover plate 1 close to the front plate 3, and the rear plate 4 is provided with a power connection opening 41 at a position close to the bottom plate 2. Figure 2As shown, the left side of the cover plate 1 near the rear plate 4 is the mainboard baffle opening 11, and the right side is the first heat dissipation hole 13, which position just corresponds to the position of the CPU cooling fan on the mainboard, thereby further improving the heat dissipation performance of the host.

[0053] Therefore, the motherboard, power supply and hard disk defined later are all designed to be attached to the board, so that the internal space of the box 100 can be used to accommodate more graphics cards and / or other PCIe devices to enrich the functions of the host and improve the working performance of the host. For example, for the most mainstream NVIDIA RTX 4090 graphics card for current rendering, games, scientific computing, AI reasoning and other applications, it supports the simultaneous insertion of 4 turbo cards or 3 fan cards. It breaks the limitation of the existing highest-end tower workstation that can only insert two 4090 turbo cards at a time.

[0054] At the same time, if Figure 4 and Figure 5 It can be seen that the front plate 3 and the rear plate 4 are also covered with first heat dissipation holes 13, that is, heat dissipation holes are opened on the six sides of the box body 100 to maximize the heat dissipation performance of the host. It should be noted that the first heat dissipation holes 13 in this embodiment are not limited to Figure 2 The circular holes shown in the figure may also be regular holes such as long circular holes, wavy holes, and five-pointed star holes, or irregular holes. The second heat dissipation holes 51 are not limited to Figure 2 The long round holes shown can also be regular holes or irregular holes.

[0055] like Figures 6 to 8 As shown, second heat dissipation holes 51 are arranged on the left side plate 5 and the right side plate 6, and the hole spacing between the second heat dissipation holes 51 on either side plate of the left side plate 5 and the right side plate 6 is used to correspond to the hole spacing between the screw holes on the hard disk. Therefore, the second heat dissipation holes 51 are reused as hard disk installation holes, thereby reducing the space occupied by the hard disk in the chassis, and the hard disk can also achieve better heat dissipation effect when placed vertically.

[0056] Therefore, compared with the existing chassis, this embodiment eliminates the dedicated hard disk bay or hard disk fixing device, and also reduces the volume and weight of the chassis and the entire machine.

[0057] like Figure 7 and Figure 8As shown, in this embodiment, the hole spacing between the several second heat dissipation holes 51 on the right side plate 6 is used to correspond to the hole spacing between the screw holes on the hard disk. Specifically, the first dimension of the second heat dissipation holes 51 on the right side plate 6 in the first direction is the same as the plate spacing between two adjacent second heat dissipation holes 51 in the first direction. In this embodiment, the first direction is horizontal, and the first dimension, that is, the horizontal dimension L1 of the second heat dissipation hole 51 is between 4.8-4.82 mm. The horizontal dimension of the second heat dissipation hole 51 can be further optimized to between 4.81-4.815 mm. If it is for more convenient processing, it is preferably 4.8 mm. If it is compatible with processing convenience and processing accuracy, it is preferably 4.81 mm. If it is for higher processing accuracy, it is preferably 4.8125 mm. Other 4.815 mm and 4.82 mm are both acceptable. Among them, in Figure 1 In the arrangement of the second heat dissipation holes 51 shown, the first direction is vertical, and the first dimension is the vertical dimension of the second heat dissipation holes 51. When different types of second heat dissipation holes are arranged in different ways, as long as the size of the second heat dissipation holes 51 in any direction is the same as the board distance between adjacent second heat dissipation holes 51 in the same direction, it will be sufficient.

[0058] Therefore, the hole distance between two screw holes in one direction on the current standard 2.5-inch hard disk and 3.5-inch hard disk must be 77 mm, the former is the long side, and the latter is the short side. When the lateral dimension L1 of the second heat dissipation hole 51 is 4.8 mm, the lateral plate distance L2 between two adjacent second heat dissipation holes 51 is also 4.8 mm. Therefore, the hole distance between the two second heat dissipation holes 51 on the left and right sides, including the seven second heat dissipation holes 51 across the middle, is 4.8*8*(L1+L2)=76.8 mm. Correspondingly, when it is 4.81 mm, 4.8125 mm, 4.815 mm and 4.82 mm, it is 76.96 mm, 77 mm, 77.04 mm and 77.12 mm respectively. Since the thread diameter of the screw fixing the hard disk is less than 4.4 mm, it is sufficient to accommodate a gap of up to 0.2 mm, thereby meeting the demand for the second heat dissipation hole 51 to be reused as a hard disk mounting hole.

[0059] like Figure 6 As shown, in this embodiment, the structural design of the second heat dissipation holes 51 on the left side plate 5 is the same as that of the right side plate 6, except that the transverse plate distance L2 between adjacent second heat dissipation holes 51 on the left side plate 5 is smaller than that on the right side plate 6, so that more heat dissipation holes are retained, thereby further improving the heat dissipation performance.

[0060] In this embodiment, the front panel 3 is provided with a switch hole and / or a USB hole near the bottom panel 2 to avoid interference with PCIe devices such as graphics cards. At the same time, the front IO panel and connecting cables of the chassis are simplified, thereby improving the use of the internal space of the chassis.

[0061] In this embodiment, foot pads 21 are provided at the four corners of the bottom plate 2 to avoid direct contact with the bottom surface and to avoid affecting the heat dissipation duct of the power supply because the fan of the power supply faces downward in this embodiment.

[0062] like Figure 4 and Figure 5 It can be seen that the front plate 3 and the rear plate 4 are provided with a first handle hole 31 at a position close to the cover plate 1. In this way, the user can carry the host with both hands, and there is no need to add additional handles to other parts of the chassis, and no special mechanism or processing measures are required to set the handles. It only needs to be processed when the hole is opened, which improves the processing efficiency of the chassis and reduces the production cost of the chassis.

[0063] like Figure 2 As shown, the cover plate 1 is provided with a second handle hole 32 at a position close to the front plate 3 and the rear plate 4, so that the front plate 3 and the front side of the cover plate 1 form a structural design that can be carried with one hand. Similarly, the rear plate 4 and the rear side of the cover plate 1 also form a structural design that can be carried with one hand, so that the user can extract the host with one hand.

[0064] In this embodiment, the structures of the first handle hole 31 and the second handle hole 32 are the same or similar, and the corners of the first handle hole 31 and the second handle hole 32 are provided with transition chamfers, such as arc chamfers. The size of the first handle hole 31 is a square structure as a whole, such as Figure 2 Although the second handle hole 32 at the upper middle part has a step, it still presents a square structure as a whole. The length and width of the first handle hole 31 and the second handle hole 32 are designed according to the length and width of the user's hand. The width of a Chinese palm is usually between 7-9 cm and the palm thickness is less than 2.5 cm. In this embodiment, it can be designed as 10 cm long and 2.5 cm wide to avoid the problem of "cutting the user's hand" when carrying the host.

[0065] In this embodiment, the main materials and / or processing techniques include the following two:

[0066] The first type is aluminum profiles and stampings. Aluminum profiles are mainly 6061 aluminum alloy or 6063 aluminum alloy. It is stamped in one piece, and then the connecting angles are connected by connectors.

[0067] The second is sheet metal processing, mainly iron, steel and galvanized sheets.

[0068] Embodiment 2

[0069] A vertical heat dissipation chassis, which is different from the embodiment in the design of the first handle hole 31. The design of the first handle hole 31 in this embodiment is as follows: the front plate 3 and the rear plate 4 are provided with the first handle hole 31 at a position close to the cover plate 1.

[0070] That is, in this embodiment, the cover plate 1 is not provided with the second handle hole 32 at the position close to the front plate 3 and the rear plate 4 .

[0071] Embodiment 3

[0072] A vertical heat dissipation chassis, which is different from the embodiment in the design of the first handle hole 31. The design of the first handle hole 31 in this embodiment is as follows: the front plate 3 and the rear plate 4 are provided with the first handle hole 31 at a position close to the cover plate 1, and the cover plate 1 is provided with a second handle hole 32 at a position close to the front plate 3.

[0073] That is, in this embodiment, the cover plate 1 is not provided with the second handle hole 32 at a position close to the rear plate 4 .

[0074] Embodiment 4

[0075] A vertical heat dissipation chassis, which is different from the embodiment in the design of the first handle hole 31. The design of the first handle hole 31 in this embodiment is as follows: the front plate 3 and the rear plate 4 are provided with the first handle hole 31 at a position close to the cover plate 1, and the cover plate 1 is provided with a second handle hole 32 at a position close to the rear plate 4.

[0076] That is, in this embodiment, the cover plate 1 is not provided with the second handle hole 32 at a position close to the front plate 3 .

[0077] Embodiment 5

[0078] like Fig. 9 and Fig.10 It can be seen that a vertical heat dissipation host uses any one of the vertical heat dissipation chassis of embodiments 1 to 4, and also includes an electronic device 200, which is installed in a box body 100 in the heat dissipation chassis;

[0079] The electronic device 200 includes a motherboard and a PCIe device. The side where each external interface on the motherboard is located is located at the motherboard baffle opening 11 and is arranged upward. Fig. 9 At the position pointed by the electronic device 200, the side where each external interface of the PCIe device is located is located at the PCIe device fixing device 12 and is arranged upward. Fig.10 The location pointed by the electronic device 200 is the PCIe device.

[0080] In this embodiment, a layer of waterproof paint is coated on the surface of the electronic device 200 to prevent the electronic device 200 from malfunctioning when it comes into contact with water.

[0081] Among them, a vertical heat dissipation host in this embodiment is a workstation host or a server host, and can also be applied to a personal host in other embodiments.

[0082] From the overall design point of view, this embodiment also has the following advantages:

[0083] 1. Reduce the overall complexity of the device and the material and processing costs.

[0084] 2. Compared with the existing graphics card vertical installation chassis, there is no need for a special graphics card vertical installation device or bracket, and there is no need for a special design for each graphics card.

[0085] 3. This embodiment realizes the radiator heat dissipation mode without modifying or modifying the main body to meet the requirements of scenarios with higher power density and harsh environment. Specifically, there is a space of several centimeters between the two handle holes on the front and rear panels to install the radiator, and the radiator fixing screw holes can just reuse the heat dissipation holes on the front and / or rear panels.

[0086] At the same time, the water cooling solution generally only requires the top cover to use a sheet metal part that is recessed in the traditional PCIe fixing device.

[0087] 4. Regardless of the number or type of PCIe devices, CPUs, and memory modules installed, the chassis itself only needs one 8025 / 9025 fan located on the cover 1, facing away from the CPU, and / or one 12025 / 14025 / 12038 / 12038 fan located on the bottom plate 2, facing each PCIe device.

[0088] Compared with the existing chassis, the number of fans is reduced, the requirements for fan wind pressure and / or air volume are lowered, the space occupied by the fans in the chassis is reduced, and the weight of the host is further reduced.

[0089] 5. Through the limitation of the internal layout design of the chassis in the above-mentioned embodiment, the size of the chassis is reduced due to the idea of ​​ubiquitous reuse, and the distances between various electronic devices 200 and their connected counterparts are just close, which ultimately makes the lengths of several major connecting wires such as graphics card power cables, hard disk cables such as SFF, SAS or SATA data cables and power cables, fan 4Pin cables, etc. greatly shortened compared with existing chassis, thereby significantly reducing or even almost eliminating voltage drops and signal attenuation in various places.

[0090] In the description of the present utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0091] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0092] In the present utility model, unless otherwise clearly specified and limited, when a first feature is “on” or “below” a second feature, it may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, when a first feature is “above”, “above” or “above” a second feature, it may be that the first feature is directly above or obliquely above the second feature, or it may simply mean that the first feature is higher in level than the second feature. When a first feature is “below”, “below” or “below” a second feature, it may be that the first feature is directly below or obliquely below the second feature, or it may simply mean that the first feature is lower in level than the second feature.

[0093] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "embodiment", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0094] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. Vertical heat dissipation chassis, characterized in that: The invention comprises a box body, which comprises a cover plate, a bottom plate, a front plate, a back plate, a left plate and a right plate. The surface of the cover plate is provided with a mainboard baffle opening and a PCIe device fixing device. The cover plate and the bottom plate are provided with first heat dissipation holes for forming convection.

2. The vertical heat dissipation chassis according to claim 1, characterized in that: The left side plate and the right side plate are provided with second heat dissipation holes, and the hole spacing between the second heat dissipation holes on either side plate of the left side plate and the right side plate is used to correspond to the hole spacing between the screw holes on the hard disk.

3. The vertical heat dissipation chassis according to claim 2, characterized in that: A first size of the second heat dissipation hole on either side of the left side plate or the right side plate in the first direction is the same as a plate distance between two adjacent second heat dissipation holes in the first direction; The first dimension is between 4.8-4.82 mm.

4. The vertical heat dissipation chassis according to claim 1, characterized in that: The front plate is provided with a switch hole and / or a USB hole at a position close to the bottom plate.

5. The vertical heat dissipation chassis according to claim 1, characterized in that: The front plate and the rear plate are provided with first handle holes at positions close to the cover plate.

6. The vertical heat dissipation chassis according to claim 5, characterized in that: The cover plate is provided with a second handle hole at a position close to the front plate and the rear plate.

7. The vertical heat dissipation chassis according to claim 5, characterized in that: The four corners of the bottom plate are provided with foot pads.

8. The vertical heat dissipation chassis according to any one of claims 1 to 7, characterized in that: The mainboard baffle port is arranged in a side area of ​​the cover plate close to the rear plate, the PCIe device fixing device is arranged in a side area of ​​the cover plate close to the front plate, and a power connection port is provided in a position of the rear plate close to the bottom plate.

9. Vertical heat dissipation host, characterized in that: The vertical heat dissipation chassis according to any one of claims 1 to 8 further comprises an electronic device, wherein the electronic device is installed in the heat dissipation chassis; The electronic device includes a motherboard and a PCIe device, wherein one side of each external interface on the motherboard is located at the motherboard baffle opening and is arranged upward, and one side of each external interface on the PCIe device is located at the PCIe device fixing device and is arranged upward.

10. The vertical heat dissipation host according to claim 9, characterized in that: The surface of the electronic device is coated with a layer of waterproof paint.

Images