Semiconductor laser

Abstract

The utility model relates to the technical field of lasers, in particular to a semiconductor laser. The semiconductor laser provided by the utility model comprises a packaging shell, the packaging shell comprises a bottom wall and a side wall, and an accommodating cavity with an opening at one side is enclosed between the side wall and the bottom wall; a light outlet communicated with the containing cavity is formed in the upper edge of one side wall. According to the semiconductor laser provided by the utility model, the light outlet is arranged at the upper edge of the side wall, so that the distance between two semiconductor lasers can be reduced when a plurality of semiconductor lasers are coupled without bending the optical fiber, the volume of the coupled semiconductor lasers can be reduced, and the space is saved; and the optical fiber can be prevented from being bent and broken.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to a semiconductor laser. Background Art

[0002] Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as working materials. They are small in size, long in life, and can be pumped by simply injecting current. Therefore, semiconductor lasers are widely used in laser communications, optical storage, optical gyroscopes, laser printing, ranging, and radar. Semiconductor lasers include a packaging shell and a light-emitting mechanism. The light-emitting mechanism is packaged in the packaging shell, and a light outlet is provided on the side wall of the shell. The light-emitting mechanism reflects light to the light outlet through a reflector, and an optical fiber is connected to the light outlet.

[0003] The light outlet of the existing semiconductor laser is set in the middle of the shell in the height direction. When multiple semiconductor lasers are coupled, the optical fibers of two adjacent semiconductor lasers need to be combined. However, since the optical fiber is relatively brittle, it may break after bending. Therefore, in order to avoid optical fiber breakage, a certain distance is required between the two semiconductor laser shells to prevent the optical fiber from bending. Since the light outlet of the existing semiconductor laser is set in the middle, in order to avoid optical fiber breakage, the distance between the two semiconductor lasers needs to be increased, which increases the volume after optical fiber coupling, resulting in a large space occupied by the coupling module. Utility Model Content

[0004] (I) The technical problem to be solved by the present utility model is that the light outlet on the existing semiconductor laser housing is located in the middle of the housing in the height direction, which has the defect of occupying space when multiple semiconductor lasers are coupled.

[0005] (II) Technical solution

[0006] In order to solve the above technical problems, an embodiment of the utility model provides a semiconductor laser, including: a packaging shell, the packaging shell includes an upper cover and a base, the base and the packaging shell include a bottom wall and a side wall, and a accommodating cavity with an opening on one side is formed between the side wall and the bottom wall; a light outlet connected to the accommodating cavity is provided on the upper edge of one of the side walls.

[0007] According to an embodiment of the utility model, the semiconductor laser further comprises a light emitting mechanism and a transmission optical fiber, one end of the transmission optical fiber corresponds to the light emitting side of the light emitting mechanism, and the other end passes through the light outlet;

[0008] A support platform is provided in the accommodating cavity, the transmission optical fiber is fixed on the support platform, and the support platform is tilted from bottom to top from one end close to the light emitting side of the light emitting mechanism to the other end opposite thereto.

[0009] According to an embodiment of the utility model, the inclination angle of the support platform is 3-10 degrees.

[0010] According to an embodiment of the utility model, a mounting groove is provided on the support platform, and the transmission optical fiber is embedded in the mounting groove and fixed in the mounting groove by a first adhesive layer.

[0011] According to an embodiment of the utility model, the mounting groove includes an arc segment and a straight segment, one end of the straight segment extends to the light outlet, the other end of the straight segment is connected to one end of the arc segment, and the other end of the arc segment extends to the light outlet side of the light emitting mechanism;

[0012] The transmission optical fiber comprises a first optical fiber segment corresponding to the arc segment, a second optical fiber segment corresponding to the straight segment, and a third optical fiber segment located in the light outlet;

[0013] The first adhesive layer includes a first bonding layer, a second bonding layer and a third bonding layer. The first optical fiber segment is fixed in the arc segment through the first bonding layer, the second optical fiber segment is fixed in the straight segment through the second bonding layer, and the third optical fiber segment is fixed in the light outlet through the third bonding layer.

[0014] According to an embodiment of the utility model, the first adhesive layer is formed by solidifying high-refractive index glue, the second adhesive layer is formed by solidifying sealing glue, and the third adhesive layer is formed by solidifying flexible glue.

[0015] According to an embodiment of the present invention, the mounting groove is in an arc shape, and one end of the mounting groove extends to the light outlet, and the other end of the mounting groove extends to the light emitting side of the light emitting mechanism.

[0016] According to an embodiment of the present invention, the radius of the circular arc segment is R, the radius of the transmission optical fiber is r, and R>200*r.

[0017] According to one embodiment of the utility model, the side wall includes a first side wall and a second side wall that are oppositely arranged, the second side wall is arranged along the light emitting direction of the semiconductor laser, the first side wall is arranged perpendicular to the light emitting direction of the semiconductor laser, and the light outlet is arranged at the upper edge of the first side wall.

[0018] According to an embodiment of the utility model, the side wall includes a body and a metal sealing ring arranged on the body, and the metal sealing ring is fixedly connected to the body; the density of the body is P1, the density of the metal sealing ring is P2, and P1<P2.

[0019] According to an embodiment of the utility model, a polarization beam combiner, a second fast axis collimator, a filter and a second axis collimator are sequentially arranged along the optical path between the light emitting side of the light emitting mechanism and the transmission optical fiber.

[0020] Beneficial effects of the utility model: The semiconductor laser provided by the utility model includes a packaging shell, the packaging shell includes a bottom wall and a side wall, the side wall and the bottom wall enclose a receiving cavity with an opening on one side; one of the upper edges of the side walls is provided with a light outlet connected to the receiving cavity. The semiconductor laser provided by the utility model, because its light outlet is provided at the upper edge of the side wall, can reduce the distance between two adjacent semiconductor lasers when multiple semiconductor lasers are coupled without bending the optical fiber, thereby reducing the volume of the semiconductor laser after coupling, saving space, and avoiding bending and breaking of the optical fiber. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A three-dimensional diagram of a semiconductor laser provided by an embodiment of the utility model;

[0023] Figure 2 An exploded diagram of a semiconductor laser provided by an embodiment of the utility model;

[0024] Figure 3 A three-dimensional diagram of a semiconductor laser with the upper cover removed provided by one embodiment of the utility model;

[0025] Figure 4 for Figure 3 A magnified view of part A;

[0026] Figure 5 for Figure 3 A magnified view of part B;

[0027] Figure 6 for Figure 3 Enlarged view of part C;

[0028] Figure 7 A schematic structural diagram of a base provided by an embodiment of the utility model;

[0029] Figure 8 for Figure 7 A magnified view of the D portion;

[0030] Fig. 9 It is a schematic diagram of the structure of the transmission optical fiber and the ferrule;

[0031] Fig.10 Schematic diagram of the structure of coupling multiple semiconductor lasers.

[0032] Icons: 1-packaging shell; 11-base; 111-side wall; 1111-light outlet; 112-bottom wall; 113-support platform; 1131-installation groove; 12-upper cover; 13-accommodating cavity; 131-polarization combiner; 132-second fast-axis collimator; 133-filter; 134-second slow-axis collimator; 135-transmission optical fiber; 1351-first optical fiber segment; 1352-second optical fiber segment; 1353-third optical fiber segment; 14-light-emitting mechanism; 141-laser chip; 142-first fast-axis collimator; 143-first slow-axis collimator; 144-heat sink; 145-reflector; 15-metal sealing ring; 16-optical fiber fixing mechanism; 161-support seat; 1611-fixing groove; 162-insert. DETAILED DESCRIPTION

[0033] In order to more clearly understand the above-mentioned purposes, features and advantages of the utility model, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0034] like Figures 1 to 9 As shown, the utility model provides a semiconductor laser, comprising: a packaging shell 1, the packaging shell 1 comprises an upper cover 12 and a base 11, the base 11 comprises a bottom wall 112 and a side wall 111, and a receiving cavity 13 with an opening on one side is formed between the side wall 111 and the bottom wall 112; a light outlet 1111 connected to the receiving cavity 13 is provided on the upper edge of one of the side walls 111.

[0035] The semiconductor laser provided by the utility model has a light outlet 1111 disposed on the upper edge of the side wall 111. Fig.10 As shown, when multiple semiconductor lasers are coupled, the distance between two adjacent semiconductor lasers can be shortened without bending the optical fiber, thereby reducing the volume of the semiconductor lasers after coupling and saving space, while avoiding bending and breaking of the optical fiber.

[0036] According to an embodiment of the present invention, the semiconductor laser further comprises a light emitting mechanism 14 and a transmission optical fiber 135. Figure 2, Figure 3 , Figure 7 and Figure 8 One end of the transmission optical fiber 135 corresponds to the light emitting side of the light emitting mechanism 14, and the other end passes through the light outlet 1111; a support platform 113 is provided in the accommodating cavity 13, and the transmission optical fiber 135 is fixed on the support platform 113, and the support platform 113 is inclined from bottom to top from one end close to the light emitting side of the light emitting mechanism 14 to the other end opposite thereto.

[0037] In this embodiment, the light emitted by the light-emitting mechanism 14 can be directly transmitted through the transmission optical fiber 135 disposed inside the housing, so there is no need to additionally set up a reflector 145 to transmit the light emitted by the light-emitting mechanism 14 to the external optical fiber, which can reduce the volume of the package housing 1. At the same time, since there is no need to additionally set up a reflector 145, it can also reduce the cost of parts, reduce the assembly process, save assembly time, and improve assembly efficiency. In the embodiment, the transmission optical fiber 135 is supported by the support platform 113, and the support platform 113 can protect the transmission optical fiber 135, prevent the transmission optical fiber 135 from bending and deformation, and thus prevent the transmission optical fiber 135 from breaking.

[0038] In the present application, a light outlet 1111 is arranged at the upper edge of the packaging shell 1, the support platform 113 is arranged tilted, and the transmission optical fiber 135 is arranged tilted from the light outlet side of the light emitting mechanism 14 to the light outlet 1111. Fig.10 As shown, the light outlet 1111 can be set at the upper part of the side wall 111 of the packaging shell 1. When multiple semiconductor lasers are coupled, the distance between two semiconductor lasers can be shortened without bending the optical fiber, thereby reducing the volume of the semiconductor laser after coupling, saving space, and avoiding bending and breakage of the optical fiber.

[0039] like Figure 2 , Figure 3 , Figure 7 and Figure 8 As shown, the surface of the support platform 113 in the present application is an inclined surface, and the inclination angle of the inclined surface is 3-10 degrees. Preferably, in this embodiment, the inclination angle of the inclined surface of the support platform 113 is 8 degrees.

[0040] According to one embodiment of the utility model, Figure 2 , Figure 3 , Figure 7 and Figure 8, the support platform 113 is provided with a mounting groove 1131, and the transmission optical fiber 135 is embedded in the mounting groove 1131 and fixed in the mounting groove 1131 by a first adhesive layer. The diameter of the transmission optical fiber 135 can be interference fit or clearance fit with the mounting groove 1131; the transmission optical fiber 135 is limited by the mounting groove 1131 to prevent the transmission optical fiber 135 from moving. Preferably, the transmission optical fiber 135 is clearance fit with the mounting groove 1131, and the transmission optical fiber 135 is fixed to the inner wall of the mounting groove 1131 by a first adhesive layer. It can be understood that in this embodiment, the transmission optical fiber 135 can also be fixed to the support platform 113 by other fixing methods, for example, the transmission optical fiber 135 is fixed to the support platform 113 by a structure such as a wire clip, a clamp or a buckle, which can also achieve the purpose of fixing the transmission optical fiber 135 to the support platform 113 and preventing the transmission optical fiber 135 from moving and deforming. Its purpose does not deviate from the design concept of the utility model and should belong to the protection scope of the utility model.

[0041] According to one embodiment of the utility model, Figure 2 , Figure 3 , Figure 7 and Figure 8 The mounting groove 1131 includes an arc segment and a straight segment, one end of the straight segment extends to the light outlet 1111, the other end of the straight segment is connected to one end of the arc segment, and the other end of the arc segment extends to the light outlet side of the light emitting mechanism 14; the transmission optical fiber 135 includes a first optical fiber segment 1351 corresponding to the arc segment, a second optical fiber segment 1352 corresponding to the straight segment, and a third optical fiber segment 1353 located in the light outlet 1111; the first adhesive layer includes a first bonding layer, a second bonding layer and a third bonding layer, the first optical fiber segment 1351 is fixed in the arc segment through the first bonding layer, the second optical fiber segment 1352 is fixed in the straight segment through the second bonding layer, and the third optical fiber segment 1353 is fixed in the light outlet 1111 through the third bonding layer.

[0042] In the existing semiconductor laser, the high-power light emitted enters the optical fiber, and a small part enters the optical fiber cladding first, generating heat in the cladding, and the temperature of the optical fiber glue point increases, so that the glue ages and the stress generated by the high temperature burns the optical fiber, thereby causing the failure of the entire semiconductor laser. Therefore, in this embodiment, the first adhesive layer is formed by solidifying a high-refractive index glue, and specifically, the first adhesive layer is formed by solidifying a glue with a refractive index greater than 1.51. The first adhesive layer can remove the light leaked due to the bending of the first optical fiber segment 1351 and the coupling loss, and can reduce the temperature of the first optical fiber segment 1351. The second adhesive layer is formed by solidifying sealing glue. Specifically, the second adhesive layer is formed by solidifying sealing thermosetting glue suitable for metal and fiber optical fiber filling. The sealing glue is dispensed to fill the gap and improve the airtightness between the second optical fiber segment 1352 and the inner wall of the installation groove 1131; the third adhesive layer is formed by solidifying flexible glue. Specifically, the third adhesive layer is formed by solidifying UV-curing flexible glue with a hardness of D25. The flexible glue can seal the gap between the light outlet 1111 and the third optical fiber segment 1353, and can also alleviate the damage caused by the rigid bending of the third optical fiber segment 1353.

[0043] According to another embodiment of the utility model, in this embodiment, the mounting groove 1131 only includes an arc segment, and the corresponding transmission optical fiber 135 only includes a section of optical fiber corresponding to the arc segment and a section of optical fiber corresponding to the light outlet 1111, that is, the mounting groove 1131 is an arc shape as a whole, and one end of the mounting groove 1131 extends to the light outlet 1111, and the other end extends to the light outlet side of the light-emitting mechanism 14, which can also achieve the purpose of fixing the transmission optical fiber 135 by the mounting groove 1131 in the present application.

[0044] In this embodiment, since the mounting groove 1131 is arc-shaped and extends from the light-emitting side of the light-emitting mechanism 14 to the light-emitting port 1111, the corresponding transmission optical fiber 135 includes a first optical fiber segment 1351 corresponding to the mounting groove 1131 and a third optical fiber segment 1353 located in the light-emitting port 1111; the first adhesive layer includes a first bonding layer and a third bonding layer; wherein the first optical fiber segment 1351 is fixed in the mounting groove 1131 by the first bonding layer, and the third optical fiber segment 1353 is fixed in the light-emitting port 1111 by the third bonding layer.

[0045] The first adhesive layer is formed by solidifying a high refractive index glue; specifically, the first adhesive layer is formed by solidifying a glue with a refractive index greater than 1.51, and the first adhesive layer can remove light leaked due to bending of the first optical fiber segment 1351 and coupling loss, and can reduce the temperature of the first optical fiber segment 1351. The third adhesive layer is formed by solidifying a flexible glue; specifically, the third adhesive layer is formed by solidifying a UV-cured flexible glue with a hardness of D25, and the flexible glue can seal the gap between the light outlet 1111 and the third optical fiber segment 1353, and can also alleviate the damage caused by the rigid bending of the third optical fiber segment 1353.

[0046] According to one embodiment of the utility model, the radius of the arc segment is R, the radius of the transmission optical fiber 135 is r, R>200*r, and in this embodiment, the bending radius of the transmission optical fiber 135 is greater than 200 times the radius of the transmission optical fiber 135, so that the problem of breakage of the transmission optical fiber 135 due to a large bending angle can be avoided.

[0047] In this embodiment, Figure 3 and Figure 4 As shown, the light-emitting mechanism 14 includes a plurality of light-emitting units, each of which includes a heat sink 144, a laser chip 141, a first fast-axis collimator 142, a first slow-axis collimator 143, a reflector 145, etc. The laser chip 141 is arranged on the heat sink 144, the first fast-axis collimator 142, the first slow-axis collimator 143, and the first reflector 145 are arranged in sequence along the optical path, and the light emitted from the plurality of light-emitting units is collected to the light-emitting side. In order to avoid the light emitted from the plurality of light-emitting units from being blocked, as shown in FIG. Figure 3 , Figure 7 and Figure 8 As shown, the multiple heat sinks 144 in the multiple groups of light-emitting units are distributed in a step-like manner, and the light-emitting side of the entire light path is located at the position of the heat sink 144.

[0048] In this embodiment, a heat dissipation layer is provided between the heat sink 144 and the laser chip 141 . The heat dissipation coefficient of the heat dissipation layer is greater than the heat dissipation coefficient of the heat sink 144 . The material of the heat dissipation layer can be copper, and the thickness of the heat dissipation layer is greater than or equal to 20 μm.

[0049] According to one embodiment of the utility model, Figure 2 , Figure 3 and Figure 5As shown, the semiconductor laser further includes a polarization beam combiner 131, a second fast axis collimator 132, a filter 133 and a second slow axis collimator 134, which are sequentially arranged along the optical path between the light-emitting side of the light-emitting mechanism 14 and the transmission optical fiber 135. The light beam collected by the light-emitting mechanism 14 first enters the polarization beam combiner 131 from the light-emitting side to combine laser beams of different polarization states, and then enters the second fast axis collimator to compress and focus the laser beam in the fast axis direction, and the compressed light beam passes through the filter 133, which can transmit the laser beam in the 901-999nm band and reflect the laser beam in the 1001-1099nm band; the light beam after passing through the filter 133 enters the second slow axis collimator 134, is compressed and focused in the slow axis direction by the second slow axis collimator 134, and then is input into the transmission optical fiber 135.

[0050] like Figure 1 and Figure 2 As shown, the packaging shell 1 includes a base 11 and an upper cover 12, the base 11 is in a rectangular frame, the base 11 includes a bottom wall 112 and a side wall 111, the side wall 111 includes a first side wall and a second side wall that are oppositely arranged, the length of the first side wall is greater than the length of the second side wall, the second side wall is arranged along the light emitting direction of the semiconductor laser, the first side wall is arranged perpendicular to the light emitting direction of the semiconductor laser, the light outlet 1111 is arranged at the upper edge of the first side wall, the light outlet 1111 is arranged at the upper edge of the first side wall, the two first side walls and the two second side walls form a frame structure and are vertically connected to the bottom wall 112; the light outlet 1111 is arranged at the upper edge of the first side wall and close to the corner position; wherein the bottom wall 112 and the side wall 111 are made of light alloy material, which can reduce the weight of the entire shell, preferably, the bottom wall 112 and the side wall 111 are made of aluminum alloy material; as shown Figure 8 and Fig. 9 As shown, the side wall 111 includes a body and a metal sealing ring 15 disposed on the body, and the metal sealing ring 15 is fixedly connected to the body; the density of the body is P1, and the density of the metal sealing ring 15 is P2, P1<P2. Optionally, in this embodiment, the metal sealing ring 15 is made of stainless steel material, which can ensure the sealing effect of the connection between the upper cover 12 and the side wall 111. The metal sealing ring 15 and the upper edge of the side wall 111 are combined by welding under high temperature and high pressure conditions.

[0051] According to one embodiment of the utility model, Figure 3 , Figure 6 , Figure 7 and Figure 8As shown, the semiconductor laser further includes an optical fiber fixing mechanism 16, and one end of the transmission optical fiber 135 close to the light emitting side of the light emitting mechanism 14 is placed on the optical fiber fixing mechanism 16; in this embodiment, the end of the transmission optical fiber 135 is supported and limited by the optical fiber fixing mechanism 16. The side of the transmission optical fiber 135 facing the light emitting mechanism 14 is a laser coupling end, which is used to receive focused laser light.

[0052] like Figure 6 and Figure 8 As shown, the optical fiber fixing mechanism 16 includes a support seat 161 and a core insert 162. The support seat 161 is fixed in the accommodating cavity 13, and the core insert 162 is placed on the support seat 161. The end of the transmission optical fiber 135 close to the light-emitting side of the light-emitting mechanism 14 passes through the core insert 162 toward the light-emitting side of the light-emitting mechanism 14. In this embodiment, the transmission optical fiber 135 is fixed by the core insert 162, and the core insert 162 is fixed on the support seat 161, and then the transmission optical fiber 135 is fixed by the core insert 162 and the support seat 161; optionally, as Figure 6 and Figure 8 As shown, a fixing groove 1611 is formed on the support seat 161 , and the insert 162 is embedded in the fixing groove 1611 .

[0053] According to one embodiment of the utility model, Figure 6 , Figure 8 and Fig. 9 As shown, the ferrule 162 is columnar, and a through channel is formed inside the optical fiber along the length direction. The transmission optical fiber 135 is inserted into the channel, and the inner wall of the channel and the transmission optical fiber 135 are connected by a second adhesive layer. In this embodiment, the ferrule 162 is a cylindrical structure, and a through channel is formed inside. The diameter of the channel is slightly larger than the diameter of the transmission optical fiber 135. One end of the transmission optical fiber 135 passes through the channel, and glue is filled between the outer wall of the transmission optical fiber 135 and the inner wall of the channel to form a second adhesive layer, thereby realizing the assembly and fixation between the transmission optical fiber 135 and the ferrule 162.

[0054] According to one embodiment of the utility model, the second adhesive layer is formed by solidifying high-refractive index glue, and the high-refractive index glue is used to strip off the laser transmitted in the cladding to reduce light loss. At the same time, since the light entering the cladding of the transmission optical fiber 135 is reduced, the heat generated in the cladding of the transmission optical fiber 135 is also reduced, which has the effect of lowering the temperature of the transmission optical fiber 135.

[0055] According to an embodiment of the present invention, the ferrule 162 is made of a heat-conducting material. Preferably, the ferrule 162 is a ceramic ferrule 162. The ceramic ferrule 162 has good thermal conductivity and can dissipate heat for the transmission optical fiber 135, thereby reducing the temperature of the transmission optical fiber 135. It should be noted that in the above embodiment, the ferrule 162 can also be made of other heat-conducting materials, for example, the ferrule 162 is made of a material with a high melting point, high light transmittance, and a refractive index greater than that of quartz glass. As long as the effect of fixing the optical fiber and dissipating heat can be achieved, the design concept of the present invention can also be achieved, and it should belong to the protection scope of the present invention.

[0056] In the description of the present invention, it should be noted that the terms "upper" and "lower" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0057] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the insides of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor laser, characterized in that: include: A packaging shell (1), the packaging shell (1) comprising an upper cover (12) and a base (11), the base (11) comprising a bottom wall (112) and a side wall (111), the side wall (111) and the bottom wall (112) forming a receiving cavity (13) with one side open; A light outlet (1111) communicating with the accommodating cavity (13) is provided on an upper edge of one of the side walls (111).

2. The semiconductor laser according to claim 1, characterized in that The semiconductor laser also includes a light emitting mechanism (14) and a transmission optical fiber (135), one end of the transmission optical fiber (135) corresponds to the light emitting side of the light emitting mechanism (14), and the other end passes through the light emitting port (1111); A support platform (113) is provided in the accommodating cavity (13), the transmission optical fiber (135) is fixed on the support platform (113), and the support platform (113) is inclined from bottom to top from one end close to the light emitting side of the light emitting mechanism (14) to the other end opposite thereto.

3. The semiconductor laser according to claim 2, characterized in that The supporting platform (113) has an inclination angle of 3-10 degrees.

4. The semiconductor laser according to claim 2, characterized in that The support platform (113) is provided with a mounting groove (1131), and the transmission optical fiber (135) is embedded in the mounting groove (1131) and fixed in the mounting groove (1131) by a first adhesive layer.

5. The semiconductor laser according to claim 4, characterized in that The mounting groove (1131) comprises an arc segment and a straight segment, one end of the straight segment extends to the light outlet (1111), the other end of the straight segment is connected to one end of the arc segment, and the other end of the arc segment extends to the light outlet side of the light emitting mechanism (14); The transmission optical fiber (135) comprises a first optical fiber segment (1351) corresponding to the circular arc segment, a second optical fiber segment (1352) corresponding to the straight line segment, and a third optical fiber segment (1353) located in the light outlet (1111); The first adhesive layer includes a first bonding layer, a second bonding layer and a third bonding layer. The first optical fiber segment (1351) is fixed in the circular arc segment through the first bonding layer, the second optical fiber segment (1352) is fixed in the straight line segment through the second bonding layer, and the third optical fiber segment (1353) is fixed in the light outlet (1111) through the third bonding layer.

6. The semiconductor laser according to claim 5, characterized in that The first adhesive layer is formed by solidifying high-refractive-index glue, the second adhesive layer is formed by solidifying sealing glue, and the third adhesive layer is formed by solidifying flexible glue.

7. The semiconductor laser according to claim 5, characterized in that The radius of the circular arc segment is R, the radius of the transmission optical fiber (135) is r, and R>200*r.

8. The semiconductor laser according to claim 4, characterized in that The mounting groove (1131) is in an arc shape, and one end of the mounting groove extends to the light outlet (1111), and the other end of the mounting groove extends to the light outlet side of the light emitting mechanism (14).

9. The semiconductor laser according to any one of claims 1 to 8, characterized in that: The side wall (111) comprises a first side wall and a second side wall which are arranged opposite to each other, the second side wall is arranged along the light emitting direction of the semiconductor laser, the first side wall is arranged perpendicular to the light emitting direction of the semiconductor laser, and the light outlet (1111) is arranged at the upper edge of the first side wall.

10. The semiconductor laser according to any one of claims 1 to 8, characterized in that: The side wall (111) comprises a body and a metal sealing ring (15) arranged on the body, wherein the metal sealing ring (15) is fixedly connected to the body; the density of the body is P1, the density of the metal sealing ring (15) is P2, and P1<P2.

11. The semiconductor laser according to any one of claims 2 to 8, characterized in that: A polarization beam combiner (131), a second fast axis collimator (132), a filter (133) and a second slow axis collimator (134) are sequentially arranged along the optical path between the light-emitting side of the light-emitting mechanism (14) and the transmission optical fiber (135).

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