Memory testing device and system

Abstract

The utility model provides a memory testing device which comprises a butt joint module, the butt joint module is arranged on a rack, the butt joint module comprises a network connector, and the butt joint module obtains a testing instruction through the network connector. The test module is arranged in the test equipment, a memory to be tested is further arranged in the test equipment, the test module comprises a signal connector, and the test module is used for receiving the test instruction through the signal connector and testing the memory to be tested according to the test instruction. The rack is also provided with a guide rail, and the guide rail is used for enabling the test equipment to slide along the guide rail, so that the signal connector is connected to the network connector in a plug-in manner and receives a test instruction. The utility model further provides a memory testing system. Therefore, according to the memory test device and system provided by the invention, blind plugging between the signal connector of the test equipment and the server can be realized, and the test efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the field of memory testing technology, and in particular to a memory testing device and system. Background Art

[0002] When testing the memory, the test equipment receives the test instructions through the signal connector set on it, and performs corresponding tests on the memory according to the test instructions. However, the signal connector usually needs to be manually connected to the server to obtain the test instructions, which is inefficient and has the risk of wrong insertion. Utility Model Content

[0003] In view of the above problems, the present application provides a memory testing device and system, which can realize blind plugging and unplugging between a signal connector of a testing device and a server, and can improve testing efficiency.

[0004] In a first aspect, the present application provides a memory testing device, including: a docking module, the docking module is arranged on a rack, the docking module includes a network connector, and the docking module obtains a test instruction through the network connector. A test module, the test module is arranged in a test device, and a memory to be tested is also arranged in the test device. The test module includes a signal connector, and the test module is used to receive a test instruction through the signal connector and test the memory to be tested according to the test instruction. A guide rail is also arranged on the rack, and the guide rail is used to slide the test device along it so that the signal connector is plugged into the network connector and receives the test instruction.

[0005] In a possible implementation, the test module further includes a power connector, and the test device is used to receive power through the power connector. The power connector and the signal connector are spaced apart, and both extend in a first direction parallel to the surface of the test module.

[0006] In a possible implementation, the test module also includes a test end positioning piece, and the docking module also includes a rack end positioning piece. The test end positioning piece and the signal connector are spaced at a first distance, and the rack end positioning piece and the network connector are spaced at a second distance, and the first distance is equal to the second distance.

[0007] In a possible implementation, the test module further includes a power supply connector, the test module is perpendicular to the test module, the network connector is connected to the server through a network cable to receive a test instruction sent by the server, and the power supply connector is connected to a power supply. When the signal connector is plugged into the network connector, the power supply connector is plugged into the power supply connector and receives power from the power supply.

[0008] In a possible implementation, the power supply connector and the network connector both extend in a second direction perpendicular to the surface of the docking module, and the second direction is opposite to the first direction.

[0009] In a possible implementation, the test end positioning member includes a pin and / or a latch, and the rack end positioning member correspondingly includes a latch and / or a pin.

[0010] In a possible implementation, the test device also sends test result data of the memory to be tested through the signal connector, and uploads the test result data to the server through the network connector.

[0011] In a second aspect, the present application provides a memory test system, including: a server, the server is used to send a test instruction. A test device, the test device includes a memory to be tested, the test device is used to receive the test instruction and test the memory to be tested according to the test instruction. A rack, including a docking box and a guide rail, the docking box is connected to the server to receive the test instruction, and the guide rail is used to allow the test device to slide along it so that the test device is plugged into the docking box and receives the test instruction.

[0012] In a possible implementation, the docking box includes a docking module, a network connector is provided on the docking module, the network connector is connected to the server, and the docking box receives the test instruction through the network connector. The test device also includes a test module, a signal connector is provided on the test module, and when the test device is plugged into the docking box, the signal connector is plugged into the network connector and receives the test instruction.

[0013] In a possible implementation, the docking box further includes a shell, the docking module is accommodated in the shell, and the docking module is arranged on the inner side of the shell, and the network connector extends out of the shell.

[0014] The present application uses the docking module and guide rails set on the rack to achieve that when the test device slides along the guide rail to the docking module, the signal connector on the test module in the test device and the network connector on the docking module are automatically plugged and connected, so that the test device can obtain the test instructions sent by the server through the signal connector and the network connector, and test the memory to be tested according to the test instructions. The degree of automation is high and blind plugging and unplugging can be achieved, reducing the error rate and failure rate of manual operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of a memory testing system provided in this application.

[0016] Figure 2 Schematic diagram of the rack and test equipment provided for this application.

[0017] Figure 3This is a structural diagram of the memory testing device provided in this application.

[0018] Figure 4 Block diagram of the rack and test equipment provided for this application. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly described below in conjunction with the drawings in the embodiments of the present application.

[0020] It is understandable that the connection relationship described in this application refers to direct or indirect connection. For example, the connection between A and B can be either a direct connection between A and B or an indirect connection between A and B through one or more other electrical components. For example, A and C can be directly connected, and C and B can be directly connected, so that A and B are connected through C. It is also understandable that the "A connects B" described in this application can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components.

[0021] In the description of this application, unless otherwise specified, " / " means "or", for example, A / B can mean A or B. "And / or" in this article is only a way to describe the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0022] In the description of this application, words such as "first" and "second" are only used to distinguish different objects, and do not limit the quantity and execution order, and words such as "first" and "second" do not necessarily limit differences. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0023] When testing the memory, the test equipment receives the test instructions through the signal connector set on it, and performs corresponding tests on the memory according to the test instructions. However, the signal connector usually needs to be manually connected to the server to obtain the test instructions, which is inefficient and has the risk of wrong insertion.

[0024] Therefore, the present application provides a memory testing device and system, which can realize blind plugging and unplugging between a signal connector of a testing device and a server, and can improve testing efficiency.

[0025] Specifically, see Figure 1 , Figure 1 The schematic diagram of the memory test system 10 provided in the present application includes a server 11 , a rack 12 and a test device 13 .

[0026] The memory to be tested is arranged in the test device 13. The test device 13 is used to test the memory to be tested, and the test may include specification test, compatibility test, signal quality and uniformity test, reliability test, electrical performance test, read / write performance test, etc.

[0027] In some embodiments, the memory to be tested may include a single-side contact memory module (SIMM), a dual inline memory module (DIMM), a solid state drive (SSD), a mechanical hard disk (HDD), a hybrid hard disk (HHD), and the like. Among them, DIMM may further include a small dual inline memory module (SODIMM), an unbuffered dual inline memory module (UDIMM), a registered dual inline memory module (RDIMM), and the like. This application does not impose any restrictions on the types of memory to be tested.

[0028] The test device 13 is connected to the server 11 through the rack 12. Specifically, in some embodiments, the test device 13 and / or the server 11 can be stored in the rack 12. For example, one or more layers of bearing structures can be provided on the rack 12 to carry one or more test devices 13 and / or servers 11. A transfer structure can be provided on the rack 12 as an electrical connection adapter between the server 11 and the test device 13. The transfer structure includes a junction box, an adapter board, etc. The transfer structure can be connected to the test device 13 and / or the server 11 through electronic components such as cables, circuit component pins, and connectors, and can also establish a communication connection with the test device 13 and / or the server 11 through wireless communication methods such as Wi-Fi, Bluetooth, Zigbee, and NFC.

[0029] The server 11 is used to send a test instruction to the test device 13, and the test device 13 performs a corresponding test on the memory to be tested according to the test instruction. The test instruction may include a test type, a test parameter, and the like.

[0030] See also Figure 2 , Figure 2 A schematic diagram of a rack 12 and a testing device 13 provided in the present application.

[0031] In some embodiments, the test device 13 is accommodated on the rack 12, and in other embodiments, the test device 13 is set independently of the rack 12. The present application does not impose any limitation on the positional relationship between the test device 13 and the rack 12, and the test device 13 is accommodated on the rack 12 as an example for description.

[0032] The rack 12 includes a docking box 121 and a guide rail 122. The docking box 121 includes a docking module 1211 and a housing. The docking module 1211 is received in the housing and disposed on the inner side of the housing.

[0033] The docking module 1211 is provided with a network connector 1211A and a power connector 1211B, wherein the network connector 1211A is connected to the server, and the power connector 1211B is connected to the power supply, that is, the docking module 1211 receives the test instruction sent by the server through the network connector 1211A, and the docking module 1211 also receives power through the power connector 1211B.

[0034] In some embodiments, the interface type of the network connector 1211A may include at least one of RJ-45, RJ-11, FC, SC, ST, and LC. That is, the network connector 1211A may be connected to the server via an Ethernet cable or via an optical fiber. The present application does not impose any limitation on the interface type of the network connector 1211A.

[0035] In some embodiments, the power supply may be a device that can provide AC and / or DC power, such as a power grid, an AC power supply, an inverter, an energy storage device, etc. For example, when the power supply is a power grid, the power grid may provide 220V AC as the power supply voltage.

[0036] In some embodiments, the guide rail 122 is disposed on the side of one or more layers of the bearing structure of the rack 12, and the docking box 121 is disposed at one end of the guide rail 122. The guide rail 122 is used to allow the test device 13 to slide along it, so that the test device 13 can slide in a direction close to the docking box 121 to be completely stored in the rack 12. At the same time, the plug-in connection between the test device 13 and the docking box 121 can also be achieved. Alternatively, the guide rail 122 can also allow the test device 13 to slide in a direction away from the docking box 121 to push the test device 13 out of the rack 12. At the same time, the plug-in connection between the test device 13 and the docking box 121 can also be disconnected.

[0037] Specifically, the test device 13 includes a test module 131 and a memory to be tested 132, and the test module 131 is electrically connected to the memory to be tested 132. The test module 131 and the docking module 1211 can constitute a memory test device. The test module 131 includes a signal connector 1311 and a power connector 1312, wherein the interface types of the signal connector 1311 and the power connector 1312 correspond to the network connector 1211A and the power connector 1211B, respectively. For example, if the interface type of the network connector 1211A is an RJ-45 male interface, then the interface type of the signal connector 1311 is an RJ-45 female.

[0038] When the test device 13 slides along the guide rail and is plugged into the docking box 121, the signal connector 1311 is plugged into the network connector 1211A, and the power connector 1312 is plugged into the power connector 1211B. At this time, the test module 131 can receive a test instruction sent from the server through the signal connector 1311 and the network connector 1211A, so that the memory to be tested 132 can be tested accordingly according to the test instruction. At the same time, the test module 131 can also receive a power supply voltage from the power supply source through the power connector 1312 and the power connector 1211B.

[0039] In some embodiments, the test logs, test results and other data generated by the test module 131 during the testing of the memory to be tested 132 can also be uploaded to the server through the signal connector 1311 and the network connector 1211A. That is, after the docking module 1211 is plugged into the test module 131, the test device 13 can obtain the test instructions, test programs, etc. issued by the server through the docking box 121 to test the memory to be tested 132, and the test device 13 can also upload the test results, test data, test logs, etc. of the memory to be tested 132 to the server through the docking box 121.

[0040] See also Figure 3 , Figure 3 The memory testing device 100 provided in the present application is a structural diagram. The memory testing device 100 includes a docking module 1211 and a testing module 131 .

[0041] The docking module 1211 also includes a circuit board 1211C, on which the network connector 1211A and the power connector 1211B are both arranged, wherein the power connector 1211B and the network connector 1211A are arranged at intervals, and the network connector 1211A and the power connector 1211B both extend in a first direction perpendicular to the surface of the circuit board 1211C. In this way, the area occupied by the connector on the circuit board can be reduced, and the space utilization and the plug-in efficiency can be improved.

[0042] The test module 131 also includes a circuit board 1313, and the signal connector 1311 and the power connector 1312 are both arranged on the circuit board 1313, wherein the test module 131 and the docking module 1211 are perpendicular to each other. In this way, the plug-in efficiency between the test module 131 and the docking module 1211 can be improved, and the plug-in difficulty between the test module 131 and the docking module 1211 can be reduced. Since the docking module 1211 is arranged on the inner side of the docking box 121, other electronic components can be arranged on the inner bottom surface, inner top surface and other positions of the docking box 121, thereby increasing the integration of the docking box 121 and increasing the utilization rate of the internal space of the docking box 121.

[0043] The signal connector 1311 and the power connector 1312 are spaced apart, and the spacing distance between the signal connector 1311 and the power connector 1312 is equal to the spacing distance between the power connector 1211B and the network connector 1211A, so that the power connector 1211B and the power connector 1312, and the network connector 1211A and the signal connector 1311 can be simultaneously plugged and connected. The signal connector 1311 and the power connector 1312 both extend along the second direction of the surface of the circuit board 1313, and the first direction is opposite to the second direction.

[0044] In some embodiments, the circuit board 1211C is also provided with a rack-end positioning piece 1211D, and the number of the rack-end positioning piece 1211D can be one or more, and the rack-end positioning piece 1211D, the network connector 1211A, and the power connector 1211B are all arranged at intervals, wherein the rack-end positioning piece 1211D can include positioning elements such as pins, latches, screws, and studs. In addition, the circuit board 1313 is provided with a test-end positioning piece 1314 corresponding to the rack-end positioning piece 1211D, and the number and layout position of the test-end positioning piece 1314 are both corresponding to the rack-end positioning piece 1211D. For example, when the rack-end positioning piece 1211D is a pin, the corresponding test-end positioning piece 1314 is a latch. For another example, when the number of the rack-end positioning members 1211D is 2 and they are respectively arranged between the network connector 1211A and the first side 121A of the circuit board 1211C and between the power connector 1211B and the second side 121B of the circuit board 1211C, the number of the test-end positioning members 1314 is also 2 and they are respectively and correspondingly arranged between the signal connector 1311 and the first side 131A of the circuit board 1313 and between the power connector 1312 and the second side 131B of the circuit board 1313. In addition, the spacing distance between the rack-end positioning member 1211D and the corresponding connector is equal to the spacing distance between the test-end positioning member 1314 and the corresponding connector. In this way, since the plug-in accuracy of the positioning piece is higher than the plug-in accuracy of the connector, when the docking module 1211 and the test module 131 are plugged together, the rack-end positioning piece 1211D and the test-end positioning piece 1314 can improve the plug-in accuracy between the docking module 1211 and the test module 131, and reduce the failure rate caused by the mismatch of the plug-in position between the docking module 1211 and the test module 131.

[0045] See also Figure 4 , Figure 4 The structure diagram of the rack 12 and the test equipment 13 provided in the present application. The rack 12 is provided with a frame 123 and a multi-layer carrier 124, and the multi-layer carrier 124 can carry the test equipment 13 and be fixed to the test equipment 13. A guide rail 122 is provided on the side of each layer of the carrier 124, and the carrier 124 can slide along the direction of the guide rail 122 to realize the loading or unloading of the test equipment 13 in the rack 12.

[0046] The rack 12 is also provided with a docking box 121, which includes a docking module 1211 and a shell 1212. The docking module 1211 is accommodated in the shell 1212. The docking box 121 is provided at one end of the fixing member 125 and is connected to the frame 123 through the fixing member 125. The fixing member 125 is vertically arranged opposite to the guide rail 122, and the projection of the fixing member 125 in the Z direction falls on one end of the guide rail 122. The network connector 1211A and the power connector 1211B of the docking module 1211 in the docking box 121 extend out of the shell 1212 and extend parallel to the direction of the guide rail 1211. In this way, when the test device 13 slides along the guide rail 122 toward the docking box 121, the signal connector 1311 on the test device 13 and the power connector 1312 can be plugged and connected with the network connector 1211A and the power connector 1211B respectively.

[0047] Therefore, the memory testing device and system provided by the present application can realize blind plugging and unplugging between the signal connector of the testing equipment and the server, and can improve the testing efficiency.

[0048] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not intended to be limiting of the present application. As long as they are within the spirit and scope of the present application, appropriate changes and modifications to the above embodiments are within the scope of protection claimed in the present application.

Claims

1. A memory testing device, characterized in that: include: A docking module, wherein the docking module is disposed on the rack and comprises a network connector, and the docking module obtains a test instruction through the network connector; A test module, wherein the test module is disposed in a test device, and the test device is slidably disposed on a guide rail of the rack; Among them, the test module includes a signal connector, and the signal connector is used to be plugged and connected with the network connector when the test device slides along the guide rail, so that the test module receives the test instruction through the signal connector and tests the memory to be tested in the test device according to the test instruction.

2. The memory testing device according to claim 1, wherein: The test module further comprises a power connector, and the test device is used to receive power through the power connector; The power connector and the signal connector are spaced apart from each other, and both the power connector and the signal connector extend in a first direction parallel to the surface of the test module.

3. The memory testing device according to claim 2, wherein: The test module further includes a test end positioning piece, and the docking module further includes a rack end positioning piece, wherein the test end positioning piece is used to be plugged and connected with the rack end positioning piece when the test device slides along the guide rail; The test end positioning piece and the signal connector are spaced apart by a first distance, the rack end positioning piece and the network connector are spaced apart by a second distance, and the first distance is equal to the second distance.

4. The memory testing device according to claim 2, wherein: The docking module further includes a power supply connector, the test module is perpendicular to the docking module, and the power supply connector is used to connect to a power supply and is arranged corresponding to the power supply connector; When the signal connector is plug-connected to the network connector, the power connector is plug-connected to the power supply connector to receive power from the power supply through the power supply connector.

5. The memory testing device according to claim 4, characterized in that: The extending direction of the power supply connector and the network connector is perpendicular to the surface of the docking module and opposite to the first direction.

6. The memory testing device according to claim 3, characterized in that: The test end positioning piece includes a pin and / or a latch, and the rack end positioning piece correspondingly includes a latch and / or a pin.

7. The memory testing device according to any one of claims 1 to 6, characterized in that: The test module also uploads the test result data of the memory to be tested to the server through the connected signal connector and the network connector.

8. A memory testing system, characterized in that: include: A server, the server being arranged on a rack and used for sending a test instruction; A docking box, the docking box is arranged on the rack, the docking box includes a docking module, the docking module includes a network connector, and the docking module is connected to the server through the network connector to obtain the test instruction; A test device, wherein the test device is slidably disposed on the guide rail of the rack, the test device comprises a test module, the test module comprises a signal connector, and the signal connector is used to be plugged and connected with the network connector when the test device slides along the guide rail, so that the test module receives the test instruction through the signal connector and tests the memory to be tested in the test device according to the test instruction.

9. The memory test system according to claim 8, characterized in that: The docking box further comprises a shell, the docking module is accommodated in the shell, and the network connector is exposed from one side of the shell; The test module is disposed in the test device, and the signal connector of the test module is exposed from one side of the test device.

10. The memory test system according to claim 8, wherein: The docking module is also provided with a rack end positioning piece, the test module includes a test end positioning piece and is arranged corresponding to the rack end positioning piece, and the test end positioning piece is used to be plugged and connected with the rack end positioning piece when the test device slides along the guide rail; The test end positioning piece and the signal connector are spaced apart by a first distance, the rack end positioning piece and the network connector are spaced apart by a second distance, and the first distance is equal to the second distance.

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