Semiconductor chip packaging device

Abstract

The utility model relates to the technical field of chip packaging devices, and discloses a semiconductor chip packaging device which comprises a workbench, and a movable plate is movably installed on the upper surface of the workbench. Through the arrangement of the movable plate, the movable box, the inclined block and the mounting groove, an operator places a chip in the mounting groove, then a motor is started to enable a rotating shaft to drive a disc to rotate, then a push-pull plate can drive the movable box to reciprocate left and right, and therefore the inclined block can push a tooth plate and the movable plate leftwards; when the push-pull plate pulls the moving box to move rightwards, the outer surface of the tooth plate extrudes and pushes the inclined surface of the inclined block, so that the inclined block enters the moving box, the moving box can smoothly move rightwards, and the inclined block can push the movable plate and the tooth plate leftwards by the same distance every time; therefore, the packaged chip moves leftwards.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging devices, and more specifically, to a semiconductor chip packaging device. Background Art

[0002] Semiconductor chip packaging technology is a process technology that wraps up memory chips to prevent them from contacting the outside world and preventing them from being damaged. The chip packaging process includes: grinding, dicing, mounting, pre-curing, bonding, plastic sealing, post-curing, deburring, electroplating, printing, cutting / molding, finished product testing and other process flows.

[0003] When packaging semiconductor chips, molten epoxy molding compound needs to be squeezed into the mold cavity to embed the semiconductor chip therein, thereby becoming a semiconductor device with a certain structural appearance. The semiconductor chip needs to be packaged using a packaging device, but the existing semiconductor chip packaging device can only package a single chip and cannot accurately package multiple identical chips at the same time, resulting in low semiconductor chip packaging efficiency, which in turn affects the production efficiency of semiconductor chips. Therefore, it needs to be improved. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a semiconductor chip packaging device, which has the advantage of being able to accurately package multiple chips at the same time.

[0005] To achieve the above object, the utility model provides the following technical solution: a semiconductor chip packaging device, comprising:

[0006] A workbench, wherein a movable plate is movably mounted on the upper surface of the workbench, and tooth plates are fixedly mounted on both the front and rear sides of the movable plate;

[0007] A pushing mechanism, wherein the pushing mechanism is arranged on the upper surface of the workbench;

[0008] A driving mechanism, wherein the driving mechanism is arranged at the bottom of the workbench;

[0009] The lifting of the ...

[0010] As a preferred technical solution of the utility model, the driving mechanism includes:

[0011] A motor, the top of which is fixedly connected to the bottom of the workbench, the other end of the motor output shaft is fixedly connected to a rotating shaft, the top end of which passes through the workbench and extends to the top of the workbench and is movably sleeved with the inner wall of the workbench;

[0012] The inner wall of the disk is fixedly sleeved with the outer surface of the rotating shaft, the top of the disk is hinged with a push-pull plate, and the left end of the push-pull plate is hinged with the right side of the moving box.

[0013] As a preferred technical solution of the utility model, a mounting groove is provided inside the movable plate, and a through hole is provided at the bottom of the inner surface of the mounting groove.

[0014] As a preferred technical solution of the utility model, a support frame is fixedly installed on the upper surface of the workbench, the inner wall of the support frame is movably connected to the outer surface of the pull rod, the interior of the support frame is fixedly connected to a box body, and the bottom of the box body is fixedly connected to a discharge pipe.

[0015] As a preferred technical solution of the utility model, a fixing box is fixedly installed on the bottom of the support frame, a circular hole is opened at the bottom of the fixing box, a fan is fixedly installed on the top of the support frame, an air inlet pipe is fixedly installed on the top of the fan, and an air outlet pipe is fixedly connected to the bottom of the fan, and the bottom end of the air outlet pipe passes through the support frame and the fixing box and extends to the interior of the fixing box.

[0016] As a preferred technical solution of the utility model, a fixed frame is fixedly installed on the left side of the bottom of the workbench, a movable plate is movably installed on the upper surface of the fixed frame, a round rod is fixedly connected to the top of the movable plate, the top of the round rod passes through the workbench and extends to the interior of the workbench and is movably connected to the inner wall of the workbench.

[0017] As a preferred technical solution of the utility model, a second spring is fixedly installed on the upper surface of the movable plate, the top of the second spring is fixedly connected to the bottom of the workbench, and the second spring will drive the movable plate to reset under the action of elastic force recovery.

[0018] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0019] 1. The utility model provides a movable plate, a mobile box, an inclined block and a mounting groove. The operator places the chip inside the mounting groove and then starts the motor to make the rotating shaft drive the disc to rotate, so that the push-pull plate can drive the mobile box to reciprocate left and right, so that the inclined block can push the toothed plate and the movable plate to the left. When the push-pull plate pulls the mobile box to move to the right, the outer surface of the toothed plate will squeeze and push the inclined surface of the inclined block, so that the inclined block enters the interior of the mobile box, so that the mobile box can move to the right smoothly, and the inclined block can push the movable plate and the toothed plate to the left by the same distance each time, so that the packaged chip moves to the left, and the unpackaged chip continues to move to the bottom of the discharge pipe, so that multiple chips can be accurately packaged at the same time, thereby improving the chip packaging efficiency.

[0020] 2. The utility model sets a through hole, a movable plate and a round rod. When the operator starts the fan, the air inlet pipe can suck in the air, and then blow it out from the round hole through the air outlet pipe and the fixed box, so as to cool the packaged chip. When the through hole moves to the top of the round rod, the operator can lift the movable plate upward, thereby driving the round rod to move upward, so that the round rod can pass through the through hole to push the chip out from the inside of the installation groove, avoiding the packaged chip from being stuck with the inner surface of the installation groove and being difficult to remove. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the utility model;

[0022] Figure 2 It is a cross-sectional structural schematic diagram of the rotating shaft of the utility model;

[0023] Figure 3 It is a schematic diagram of the cross-sectional structure of the front side of the utility model;

[0024] Figure 4 It is a schematic diagram of the cross-sectional structure of the top of the utility model;

[0025] Figure 5 It is a cross-sectional structural schematic diagram of a round rod of the utility model;

[0026] Figure 6 for Figure 4 Schematic diagram of the local enlarged structure at point A in the middle.

[0027] In the figure: 1. workbench; 2. movable plate; 3. tooth plate; 4. moving box; 5. pull rod; 6. inclined block; 7. first spring; 8. slot; 9. fixed shaft; 10. rotating block; 11. motor; 12. rotating shaft; 13. disc; 14. push-pull plate; 15. limit block; 16. mounting slot; 17. through hole; 18. support frame; 19. box; 20. discharge pipe; 21. fixed box; 22. round hole; 23. fan; 24. air inlet pipe; 25. air outlet pipe; 26. fixed frame; 27. movable plate; 28. round rod; 29. ​​second spring. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] like Figures 1 to 6 As shown, the utility model provides a semiconductor chip packaging device, comprising:

[0030] A workbench 1, a movable plate 2 is movably mounted on the upper surface of the workbench 1, and tooth plates 3 are fixedly mounted on both the front and rear sides of the movable plate 2;

[0031] A pushing mechanism, which is arranged on the upper surface of the workbench 1;

[0032] A driving mechanism, which is arranged at the bottom of the workbench 1;

[0033] Among them, the pushing mechanism includes a moving box 4, the bottom of the moving box 4 is movably connected to the upper surface of the workbench 1, the bottom of the moving box 4 is fixedly connected to a limiting block 15, the outer surface of the limiting block 15 is movably connected to the inner wall of the workbench 1, the inside of the moving box 4 is movably sleeved with a pull rod 5, the front end of the pull rod 5 is fixedly connected with an inclined block 6, the front end of the inclined block 6 penetrates the moving box 4 and extends to the outside of the moving box 4 and is movably connected to the outer surface of the tooth plate 3, the outer surface of the inclined block 6 is movably connected to the inner surface of the moving box 4, the rear side of the inclined block 6 is fixedly connected with a first spring 7, the other end of the first spring 7 is fixedly connected to the inner surface of the moving box 4, the first spring 7 will push the inclined block 6 to reset under the action of elastic recovery, the outer surface of the pull rod 5 is provided with a slot 8, the outer surface of the moving box 4 is fixedly installed with a fixed shaft 9, and the outer surface of the fixed shaft 9 is movably sleeved with a rotating block 10.

[0034] When the mobile box 4 moves to the left, it will drive the inclined block 6 to move to the left, so that the inclined block 6 can push the tooth plate 3 to move to the left, so that the movable plate 2 can move to the left. When the inclined block 6 moves to the right, the outer surface of the tooth plate 3 will squeeze and push the inclined surface of the inclined block 6, so that the inclined block 6 enters the interior of the mobile box 4, and then the mobile box 4 can move smoothly to the right. At this time, the first spring 7 will push the inclined block 6 to move outward under the action of elastic recovery, so that the inclined block 6 is reset.

[0035] The driving mechanism includes:

[0036] A motor 11, the top of the motor 11 is fixedly connected to the bottom of the workbench 1, the other end of the output shaft of the motor 11 is fixedly connected to a rotating shaft 12, the top end of the rotating shaft 12 passes through the workbench 1 and extends to the top of the workbench 1 and is movably sleeved with the inner wall of the workbench 1;

[0037] The inner wall of the disk 13 is fixedly sleeved with the outer surface of the rotating shaft 12 , and a push-pull plate 14 is hinged on the top of the disk 13 , and the left end of the push-pull plate 14 is hinged to the right side of the moving box 4 .

[0038] When the disc 13 continues to rotate, the push-pull plate 14 will drive the moving box 4 to reciprocate left and right.

[0039] A mounting groove 16 is formed inside the movable plate 2 , and a through hole 17 is formed at the bottom of the inner surface of the mounting groove 16 .

[0040] The operator can place the chip to be packaged inside the mounting groove 16 for packaging.

[0041] A support frame 18 is fixedly installed on the upper surface of the workbench 1, the inner wall of the support frame 18 is movably connected to the outer surface of the pull rod 5, a box body 19 is fixedly connected inside the support frame 18, and a discharge pipe 20 is fixedly connected to the bottom of the box body 19.

[0042] By providing the discharge pipe 20 , the epoxy molding compound in a molten state inside the box 19 can enter into the installation groove 16 through the discharge pipe 20 , so as to package the chip.

[0043] Among them, a fixing box 21 is fixedly installed at the bottom of the support frame 18, a circular hole 22 is opened at the bottom of the fixing box 21, a fan 23 is fixedly installed on the top of the support frame 18, an air inlet pipe 24 is fixedly installed on the top of the fan 23, and an air outlet pipe 25 is fixedly connected to the bottom of the fan 23. The bottom end of the air outlet pipe 25 passes through the support frame 18 and the fixing box 21 and extends to the interior of the fixing box 21.

[0044] The operator can start the fan 23 so that the air inlet pipe 24 can suck air and then blow it out from the circular hole 22 through the air outlet pipe 25 and the fixing box 21, so as to cool the packaged chip.

[0045] Among them, a fixed frame 26 is fixedly installed on the left side of the bottom of the workbench 1, a movable plate 27 is movably installed on the upper surface of the fixed frame 26, and a round rod 28 is fixedly connected to the top of the movable plate 27. The top end of the round rod 28 penetrates the workbench 1 and extends to the interior of the workbench 1 and is movably connected to the inner wall of the workbench 1.

[0046] When the through hole 17 moves to above the round rod 28 , the operator can lift the movable plate 27 upward to drive the round rod 28 to move upward, so that the round rod 28 passes through the through hole 17 and pushes the chip out of the mounting groove 16 .

[0047] A second spring 29 is fixedly mounted on the upper surface of the movable plate 27 , and the top of the second spring 29 is fixedly connected to the bottom of the workbench 1 . The second spring 29 can drive the movable plate 27 to reset under the action of elastic force recovery.

[0048] When the moving plate 27 moves upward, it will compress the second spring 29, so that the second spring 29 can push the moving plate 27 to return to its original position under the action of elastic force recovery.

[0049] The working principle and use process of this utility model:

[0050] First, the operator places the semiconductor chip to be packaged inside the mounting groove 16, and then starts the motor 11 to make the rotating shaft 12 drive the disc 13 to rotate, so that the push-pull plate 14 can drive the moving box 4 to reciprocate left and right. When the moving box 4 moves to the left, the inclined block 6 will push the toothed plate 3 and the movable plate 2 to move to the left. When the moving box 4 moves to the right, the outer surface of the toothed plate 3 will squeeze and push the inclined surface of the inclined block 6, so that the inclined block 6 enters the interior of the moving box 4, so that the moving box 4 can move smoothly to the right. The first spring 7 will push the inclined block 6 outward to reset under the action of elastic recovery, and so on and so forth, so that the inclined block 6 can push the toothed plate 3 and the movable plate 2 to the left by the same distance each time, so that the packaged semiconductor chip can be moved from the bottom of the discharge pipe 20, and the unpackaged chip will move to the right to the bottom of the discharge pipe 20, so that multiple chips can be accurately packaged at the same time, thereby improving production efficiency.

[0051] The operator can start the fan 23 so that the air inlet pipe 24 draws in air, and then discharges it from the circular hole 22 through the air outlet pipe 25 and the fixed box 21, so as to cool the packaged semiconductor chip. When the through hole 17 moves to the top of the round rod 28, the operator can lift the movable plate 27 upward, thereby driving the round rod 28 to move upward, so that the round rod 28 can pass through the through hole 17 to push the chip out from the inside of the mounting groove 16, avoiding the packaged chip from being locked with the inner surface of the mounting groove 16 and being difficult to remove. When the movable plate 2 moves to the far left, the operator can pull the pull rod 5 outward and then rotate the rotating block 10 so that the rotating block 10 enters the inside of the slot 8, thereby fixing the pull rod 5, and then allowing the inclined block 6 to remain disengaged from the tooth plate 3, so that the operator can pull the movable plate 2 to reset.

[0052] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0053] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging device, characterized in that: Included are: A workbench (1), wherein a movable plate (2) is movably mounted on the upper surface of the workbench (1), and tooth plates (3) are fixedly mounted on both the front and rear sides of the movable plate (2); A pushing mechanism, wherein the pushing mechanism is arranged on the upper surface of the workbench (1); A driving mechanism, wherein the driving mechanism is arranged at the bottom of the workbench (1); The pushing mechanism comprises a moving box (4), the bottom of the moving box (4) is movably connected to the upper surface of the workbench (1), the bottom of the moving box (4) is fixedly connected to a limit block (15), the outer surface of the limit block (15) is movably connected to the inner wall of the workbench (1), the interior of the moving box (4) is movably sleeved with a pull rod (5), the front end of the pull rod (5) is fixedly connected to an inclined block (6), the front end of the inclined block (6) passes through the moving box (4) and extends to the outside of the moving box (4) and is connected to the outer surface of the tooth plate (3). The surface is movably connected, the outer surface of the inclined block (6) is movably connected to the inner surface of the moving box (4), the rear side of the inclined block (6) is fixedly connected with a first spring (7), the other end of the first spring (7) is fixedly connected to the inner surface of the moving box (4), and the first spring (7) pushes the inclined block (6) to return to its original position under the action of elastic recovery, the outer surface of the pull rod (5) is provided with a card slot (8), the outer surface of the moving box (4) is fixedly installed with a fixed shaft (9), and the outer surface of the fixed shaft (9) is movably sleeved with a rotating block (10).

2. The semiconductor chip packaging device according to claim 1, characterized in that: The driving mechanism comprises: A motor (11), the top of the motor (11) is fixedly connected to the bottom of the workbench (1), the other end of the output shaft of the motor (11) is fixedly connected to a rotating shaft (12), the top end of the rotating shaft (12) passes through the workbench (1) and extends to the top of the workbench (1) and is movably sleeved with the inner wall of the workbench (1); A disc (13), the inner wall of which is fixedly sleeved with the outer surface of the rotating shaft (12), a push-pull plate (14) is hingedly connected to the top of the disc (13), and the left end of the push-pull plate (14) is hingedly connected to the right side of the moving box (4).

3. The semiconductor chip packaging device according to claim 1, characterized in that: A mounting groove (16) is provided inside the movable plate (2), and a through hole (17) is provided at the bottom of the inner surface of the mounting groove (16).

4. The semiconductor chip packaging device according to claim 1, characterized in that: A support frame (18) is fixedly mounted on the upper surface of the workbench (1), the inner wall of the support frame (18) is movably sleeved with the outer surface of the pull rod (5), a box body (19) is fixedly sleeved inside the support frame (18), and a discharge pipe (20) is fixedly sleeved at the bottom of the box body (19).

5. The semiconductor chip packaging device according to claim 4, characterized in that: A fixing box (21) is fixedly mounted on the bottom of the support frame (18), a circular hole (22) is opened on the bottom of the fixing box (21), a fan (23) is fixedly mounted on the top of the support frame (18), an air inlet pipe (24) is fixedly mounted on the top of the fan (23), an air outlet pipe (25) is fixedly connected to the bottom of the fan (23), and the bottom end of the air outlet pipe (25) passes through the support frame (18) and the fixing box (21) and extends to the interior of the fixing box (21).

6. The semiconductor chip packaging device according to claim 1, characterized in that: A fixed frame (26) is fixedly installed on the left side of the bottom of the workbench (1), a movable plate (27) is movably installed on the upper surface of the fixed frame (26), a round rod (28) is fixedly connected to the top of the movable plate (27), and the top end of the round rod (28) passes through the workbench (1) and extends to the inside of the workbench (1) and is movably connected to the inner wall of the workbench (1).

7. The semiconductor chip packaging device according to claim 6, characterized in that: A second spring (29) is fixedly mounted on the upper surface of the movable plate (27); the top end of the second spring (29) is fixedly connected to the bottom of the workbench (1); and the second spring (29) drives the movable plate (27) to reset under the action of elastic force recovery.

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