Device for reducing dry etching residues

Abstract

The utility model relates to the technical field of panel etching, in particular to a device for reducing dry etching residues. The partition plate is provided with an avoiding opening, and the partition plate is fixed in the dry etching equipment through a connecting mechanism; wherein a plurality of hole sites are distributed on the end face of the partition plate, the hole sites are used for forming fluorinated product flowing channels, two channels are used for discharging fluorinated products, namely, the fluorinated products can be discharged through the traditional gap design, in addition, the fluorinated products can be discharged through the hole sites on the partition plate, and the fluorinated products can be discharged through the hole sites on the partition plate. According to the technical scheme, the fluorinated products generated in the etching process can be sucked away by the molecular pump through the hole sites in the partition plate, and the double discharge mode can effectively prevent excessive fluorinated products from being accumulated on the partition plate, so that the probability that the fluorinated products fall on the substrate is greatly reduced, the purpose of reducing etching residues is achieved, and the production yield of the substrate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of panel etching, in particular to a device for reducing dry etching residues. Background Art

[0002] During the production process of the TFT ARRAY dry etching station, the residue often exceeds the standard. From the test results, the residue is mainly concentrated on the four sides of the large board. The production process of the dry etching equipment is to etch away the non-metallic film layer through chemical reaction. During the etching process, a large amount of fluorinated products will be produced. The fluorinated products will be sucked away from the gap between the partition and the chamber wall by the molecular pump. For the specific structure, please refer to the attached figure in the manual. Figure 1 In the structure shown, 1 is a dry etching device, 2 is a lower electrode, 3 is a partition, and 4 is a gap formed between the partition and the dry etching device.

[0003] As time goes by, the products will fall onto the partition next to the lower electrode. Since the partition is solid in the prior art, the fluorination products that fall onto the partition are difficult to be sucked away by the molecular pump, and will accumulate more and more. When the amount reaches a certain level, the glass in the chamber moves and the dust will be blown up and fall onto the substrate. The dust that falls on the substrate will block the etching and cause etching residue. The residue will cause the product to have defects such as missing pens and bright spots. Once these occur, the product must be scrapped, which greatly increases the production cost. Therefore, it is imperative to improve the residue problem. Utility Model Content

[0004] The utility model aims to solve the above-mentioned shortcomings in the prior art and proposes a device for reducing dry engraving residues.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] Design a device to reduce dry etching residue, including:

[0007] A partition with an escape opening, wherein the partition is fixed in the dry etching device through a connecting mechanism;

[0008] There are a number of holes distributed on the end surface of the partition, and the holes are used to form a flow channel for the fluorinated product. A guide part for guiding the movement of the fluorinated product is also arranged on the end surface of the partition.

[0009] Furthermore, the hole positions include a tapered hole whose diameter decreases downward along the upper surface of the partition and a through hole connected to the lower end of the tapered hole, and the through hole penetrates to the lower surface of the partition.

[0010] Furthermore, the guide portion is an inclined surface arranged on the side of the upper end of the partition, and the inclined surface is inclined counterclockwise along the upper surface of the partition toward the lower surface thereof.

[0011] Furthermore, the outer periphery of the partition is spaced a predetermined distance from the inner wall of the dry etching device to form a discharge gap.

[0012] Furthermore, the connection mechanism includes a ceramic column fixed to the inner wall of the dry etching device, a sleeve is fixedly installed at the lower end of the partition, and a clamping piece is provided between the sleeve and the ceramic column.

[0013] Furthermore, the clamping member includes two clamping claws formed on the rear end of the sleeve, a clamping portion is arranged on the inner side of the clamping claws, and an annular groove matched with the clamping portion is arranged on the outer side of the ceramic column.

[0014] Furthermore, a toggle piece is arranged on the outer side of the claw.

[0015] The utility model proposes a device for reducing dry etching residues, and its beneficial effects are: the utility model adopts two channels for discharging fluorinated products, that is, the traditional gap design can be used to discharge the fluorinated products. In addition, the discharge can also be achieved through the holes on the partition. The fluorinated products generated during etching will be sucked away by the molecular pump through the holes on the partition. The double discharge method can effectively avoid excessive accumulation of fluorinated products on the partition, thereby greatly reducing the probability of fluorinated products falling on the substrate, achieving the purpose of reducing etching residues and improving the production yield of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the partition structure in the prior art;

[0017] Figure 2 This is a schematic diagram of the partition structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the connection mechanism structure of the utility model;

[0019] Figure 4 It is a schematic diagram of the guide structure of the utility model.

[0020] In the figure: 1. partition; 11. avoidance; 12. hole position; 121. tapered hole; 122. through hole; 13. guide part; 14. gap; 2. connecting mechanism; 21. ceramic column; 22. sleeve; 23. claw; 24. clamping part; 25. ring groove; 26. toggle piece; 3. dry engraving equipment. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] Reference Figure 1-4An embodiment of the utility model discloses a device for reducing dry etching residues, the device comprising a partition 1 with an escape opening 11, the partition 1 being fixed in a dry etching device 3 through a connecting mechanism 2;

[0023] A plurality of holes 12 are distributed on the end surface of the partition 1 , and the holes 12 are used to form a flow channel for the fluorinated product. A guide portion 13 for guiding the movement of the fluorinated product is also provided on the end surface of the partition 1 .

[0024] In some embodiments, the hole position 12 in the utility model includes a tapered hole 121 whose diameter decreases downward along the upper surface of the partition 1 and a through hole 122 connected to the lower end of the tapered hole 121, and the through hole 122 penetrates to the lower surface of the partition 1. Specifically, in this embodiment, by adopting the tapered hole 121, the maximum strength of the partition 1 can be retained while the largest entrance can be achieved. Through the large-area entrance design, it can be ensured that the fluorination products generated during etching can smoothly pass through the hole position 12 and move outward, thereby improving the discharge effect of the fluorination products.

[0025] Furthermore, the guide portion 13 in this embodiment is an inclined surface arranged on the side of the upper end of the partition 1, and the inclined surface is counterclockwise inclined along the upper surface of the partition 1 toward its lower surface. With an inclined surface design, when the molecular pump sucks the fluorinated product, the fluorinated product can slide out to the side along the inclined surface, thereby further optimizing the convenience of discharging the fluorinated product.

[0026] On the basis of the above-mentioned embodiments, the outer periphery of the partition 1 in this embodiment is a predetermined distance away from the inner wall of the dry etching device 3 to form a discharge gap 14. In this embodiment, two channels are used for the discharge of fluorinated products, that is, the traditional gap 14 can be designed to discharge the fluorinated products. In addition, the discharge can also be achieved through the hole 12 on the partition 1. The double discharge method can effectively avoid excessive accumulation of fluorinated products on the partition, thereby greatly reducing the probability of fluorinated products falling on the substrate, achieving the purpose of reducing etching residues and improving the production yield of the substrate.

[0027] In some embodiments, the connecting mechanism 2 in the utility model includes a ceramic column 21 fixed to the inner wall of the dry engraving equipment 3, and a sleeve 22 is fixedly installed at the lower end of the partition 1, and a clamping piece is arranged between the sleeve 22 and the ceramic column 21. Specifically, the ceramic column 21 described in this embodiment can be connected to the dry engraving equipment 3 by fasteners such as bolts, and can also be connected to the dry engraving equipment 3 by means of threads or the clamping piece structure in this embodiment.

[0028] On the basis of the above embodiments, the clamping part in this embodiment includes two claws 23 formed on the tail end of the sleeve 22, and a clamping portion 24 is arranged on the inner side of the claw 23, and an annular groove 25 matched with the clamping portion 24 is arranged on the outer side of the ceramic column 21. In addition, in order to facilitate the rotation of the claw 23 to achieve the separation of the claw 23 and the annular groove 25, a paddle plate 26 is arranged on the outer side of the claw 23 in this embodiment, that is, the partition 1 and the ceramic column 21 in this embodiment are detachably connected. The design purpose of adopting this structure is to facilitate the installation of the partition 1. During installation, the sleeve 22 and the ceramic column 21 are plugged in and the connection is completed by clamping the claw 23.

[0029] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A device for reducing dry etching residue, characterized in that: include; A partition (1) having an escape opening (11), wherein the partition (1) is fixed in a dry etching device (3) via a connecting mechanism (2); A plurality of holes (12) are distributed on the end surface of the partition (1), the holes (12) are used to form a flow channel for the fluorinated product, and a guide portion (13) is also provided on the end surface of the partition (1) for guiding the movement of the fluorinated product.

2. The device for reducing dry etching residue according to claim 1, characterized in that: The hole position (12) comprises a tapered hole (121) whose diameter decreases downward along the upper surface of the partition (1) and a through hole (122) connected to the lower end of the tapered hole (121), and the through hole (122) penetrates to the lower surface of the partition (1).

3. The device for reducing dry etching residue according to claim 1, characterized in that: The guide portion (13) is an inclined surface arranged on the side edge of the upper end of the partition (1), and the inclined surface is inclined counterclockwise along the upper surface of the partition (1) toward the lower surface thereof.

4. The device for reducing dry etching residue according to claim 1, characterized in that: The outer periphery of the partition (1) is spaced a predetermined distance from the inner wall of the dry etching device (3) to form a discharge gap (14).

5. The device for reducing dry etching residue according to claim 1, characterized in that: The connecting mechanism (2) comprises a ceramic column (21) fixed to the inner wall of the dry etching device (3), a sleeve (22) is fixedly mounted on the lower end of the partition (1), and a clamping piece is provided between the sleeve (22) and the ceramic column (21).

6. The device for reducing dry etching residue according to claim 5, characterized in that: The clamping member comprises two clamping claws (23) formed on the rear end of the sleeve (22), a clamping portion (24) is arranged on the inner side of the clamping claws (23), and an annular groove (25) matched with the clamping portion (24) is arranged on the outer side of the ceramic column (21).

7. The device for reducing dry etching residue according to claim 6, characterized in that: A toggle piece (26) is arranged on the outer side of the clamping claw (23).

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