Wafer CST anti-deformation jig

Abstract

The utility model relates to a wafer CST anti-deformation jig which comprises a bottom plate, and a jig module is arranged above the bottom plate. The jig module comprises a peripheral plate, and a plurality of layers of wafer bearing parts are uniformly arranged on the peripheral plate; the wafer bearing part comprises a left bearing plate, a middle bearing plate and a right bearing plate; a plurality of bearing bodies are uniformly arranged outwards along the left side bearing plate and the right side bearing plate by taking the middle bearing plate as a center, the bearing bodies are hollow cylinders, the cylinder areas are used as wafer bearing areas, the hollow areas are efficient heat dissipation hollow positions, and a point-ring position contact type wafer CST anti-deformation structure is formed.

Description

Technical Field

[0001] The utility model relates to semiconductor preparation technology, in particular to wafer processing auxiliary equipment, specifically, a wafer CST anti-deformation fixture. Background Art

[0002] During the wafer preparation process, a wafer baking and heating procedure is required. After the wafer is placed on a carrier plate, it is baked at a high temperature. However, during the current baking heating stage, some areas of the wafer are attached to the carrier plate, while some areas are suspended in the air, causing uneven heating of the wafer and affecting the wafer quality.

[0003] Therefore, it is necessary to provide a wafer CST anti-deformation fixture to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a wafer CST anti-deformation fixture.

[0005] The utility model achieves the above-mentioned purpose through the following technical solutions:

[0006] A wafer CST anti-deformation jig comprises a base plate, and a jig module is arranged above the base plate;

[0007] The fixture module includes a peripheral plate, on which a plurality of layers of wafer carrying parts are evenly arranged;

[0008] The wafer carrying part includes a left carrying plate, a middle carrying plate, and a right carrying plate;

[0009] With the middle carrier plate as the center, a number of carriers are evenly arranged along the left carrier plate and the right carrier plate outward. The carrier is a hollow cylinder. The column area is used as the wafer carrying area, and the hollow area is a hollow position for efficient heat dissipation, forming a point-circle contact type wafer CST anti-deformation structure.

[0010] Furthermore, a raising pad for supporting the fixture module is provided on the bottom plate.

[0011] Furthermore, the carrier is in the shape of a circular hollow cylinder.

[0012] Furthermore, a gentle butt-jointing slope is arranged on the outer ring edge of the carrier.

[0013] Furthermore, the gentle docking slope is used to prevent the wafer from colliding with the docking area, while reducing the contact surface between the column area and the wafer when the wafer is received, thereby forming a wafer safe loading structure.

[0014] Furthermore, the left side bearing plate and the right side bearing plate respectively face a plurality of bearing bodies arranged on the middle bearing plate, and the heights thereof gradually decrease.

[0015] Furthermore, a plurality of carriers with gradually decreasing heights form an inclined wafer carrying surface, thereby forming a structure to prevent the wafer from falling out.

[0016] Furthermore, a rear side impact pad is provided in the area of ​​the outer plate corresponding to the middle bearing plate.

[0017] Compared with the prior art, the utility model effectively ensures the wafer processing quality through the point-circle contact type wafer CST anti-deformation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is one of the structural schematic diagrams of the utility model.

[0019] Figure 2 This is the second structural diagram of the present utility model.

[0020] Figure 3 This is the third structural diagram of the present utility model.

[0021] Figure 4 This is the fourth structural diagram of the present utility model. DETAILED DESCRIPTION

[0022] Example:

[0023] See also Figure 1-4 , this embodiment is a wafer CST anti-deformation fixture, including a base plate 1, and a fixture module 100 is arranged above the base plate 1;

[0024] The fixture module 100 includes a peripheral plate 2 on which a plurality of wafer carrying portions 3 are evenly arranged;

[0025] The wafer carrying part 3 includes a left carrying plate 31, a middle carrying plate 30, and a right carrying plate 32;

[0026] With the middle carrier plate 30 as the center, a number of carriers 4 are evenly arranged outward along the left carrier plate 31 and the right carrier plate 32. The carrier body 4 is a hollow cylinder. The column area is used as a wafer carrying area, and the hollow area is a hollow position for efficient heat dissipation, forming a point-circle contact type wafer CST anti-deformation structure.

[0027] A raising pad 11 for supporting the fixture module 100 is provided on the bottom plate 1 .

[0028] The carrier 4 is in the shape of a circular hollow cylinder.

[0029] The outer edge of the carrier 4 is provided with a gentle butt-jointing slope 41 .

[0030] The gentle docking slope 41 is used to prevent the wafer from colliding with the docking area, and at the same time reduces the contact surface between the column area and the wafer when the wafer is received, thereby forming a wafer safe loading structure.

[0031] The left side bearing plate 31 and the right side bearing plate 32 are respectively facing a plurality of bearing bodies 4 arranged on the middle bearing plate 30 , and are in a shape of gradually decreasing height.

[0032] The plurality of carriers 4 with gradually decreasing heights form an inclined wafer carrying surface, thereby forming a structure to prevent the wafer from falling out.

[0033] The area of ​​the peripheral plate 2 corresponding to the middle bearing plate is provided with a rear side impact pad.

[0034] Compared with the prior art, the utility model effectively ensures the wafer processing quality through the point-circle contact type wafer CST anti-deformation structure.

[0035] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A wafer CST anti-deformation fixture, characterized by: It includes a bottom plate, and a fixture module is arranged above the bottom plate; The fixture module includes a peripheral plate, on which a plurality of layers of wafer carrying parts are evenly arranged; The wafer carrying part includes a left carrying plate, a middle carrying plate, and a right carrying plate; With the middle carrier plate as the center, a number of carriers are evenly arranged along the left carrier plate and the right carrier plate outward. The carrier is a hollow cylinder. The column area is used as the wafer carrying area, and the hollow area is a hollow position for efficient heat dissipation, forming a point-circle contact type wafer CST anti-deformation structure.

2. The wafer CST anti-deformation jig according to claim 1, characterized in that: A raising pad for carrying the fixture module is arranged on the bottom plate.

3. The wafer CST anti-deformation jig according to claim 2, characterized in that: The carrier is in the shape of a circular hollow cylinder.

4. The wafer CST anti-deformation jig according to claim 3, characterized in that: The outer ring edge of the carrier is provided with a gentle butt landslide.

5. The wafer CST anti-deformation jig according to claim 4, characterized in that: The gentle docking slope is used to prevent the wafer from colliding with the docking area, and at the same time reduces the contact surface between the column area and the wafer when the wafer is received, forming a wafer safe loading structure.

6. The wafer CST anti-deformation jig according to claim 5, characterized in that: The left side bearing plate and the right side bearing plate respectively face a plurality of bearing bodies arranged on the middle bearing plate, and the heights of the bearing bodies gradually decrease.

7. The wafer CST anti-deformation jig according to claim 6, characterized in that: A plurality of carriers with gradually decreasing heights form an inclined wafer carrying surface, thereby forming a structure to prevent the wafer from falling out.

8. The wafer CST anti-deformation jig according to claim 7, characterized in that: The area of ​​the outer plate corresponding to the middle load-bearing plate is provided with a rear side impact pad.

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