Connection terminal structure

By introducing a buffer structure into the connection terminal structure, the problem that the pads are prone to crack after stress release in the traditional connection terminal are solved, the effect of stress release protection pads is achieved, and the cost is reduced.

CN222463491UActive Publication Date: 2025-02-11SUZHOU HENGMEI ELECTRON CO LTD
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Patent Information

Application Number
CN202420161799.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-23
Publication Date
2025-02-11
Estimated Expiration
2034-01-23

AI Technical Summary

Technical Problem

The structure of traditional connection terminals is prone to cracking the pad after stress is released, and there is a risk of material failure, deformation or cracking.

Method used

A connection terminal structure is designed, in which each connection terminal itself is provided with a buffering part structure, and the height of the buffering part is greater than or equal to the thickness of the PCB board, for releasing stress and protecting the pad.

Benefits of technology

It effectively reduces the risk of pad cracking, achieves the effect of stress relief to protect the pads on PCB board, and saves costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a connecting terminal structure, a terminal assembly is welded at the side end of a PCB, the welding part of the terminal assembly and the PCB is provided with a buffer part used for releasing stress, the height of the buffer part is greater than or equal to the thickness of the PCB, and the buffer part is provided with a plurality of connecting terminals. The terminal assembly comprises a first connecting terminal, a second connecting terminal, a third connecting terminal, a fourth connecting terminal, a fifth connecting terminal and a sixth connecting terminal which are arranged in the length direction of the PCB, and the first connecting terminal, the second connecting terminal and the third connecting terminal are all welded to the first surface of the PCB. And the fourth connecting terminal, the fifth connecting terminal and the sixth connecting terminal are welded on the second surface of the PCB, the connecting terminal structure provided by the utility model can effectively release stress by utilizing the buffer part structure of each connecting terminal, reduce the risk of cracking of a bonding pad on the PCB, and effectively achieve the effect of protecting the bonding pad by releasing the stress.
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Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to a connecting terminal structure. Background Art

[0002] The description in this section merely provides background information related to the disclosure of the present utility model and does not constitute prior art.

[0003] In printed circuit boards used in new energy vehicles, fuel vehicles, household appliances and other electronic products, stress release refers to the process of reducing or eliminating internal or surface stress through some physical or chemical means. During the manufacturing, processing and use of materials, the accumulation of internal or surface stress may cause material failure, deformation or cracking. The structure of traditional connection terminals pulls the pads when stressed, and there is a risk of cracking of the pads.

[0004] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the utility model and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology section of the utility model. Utility Model Content

[0005] In order to overcome the defects in the prior art, the utility model provides a connection terminal structure, which utilizes the buffer structure of each connection terminal itself to effectively achieve the effect of stress release and protection pad.

[0006] The utility model discloses a connecting terminal structure, comprising:

[0007] A PCB board, wherein a plurality of pads are arranged on the PCB board, and the PCB board has a first surface and a second surface opposite to each other;

[0008] A terminal assembly, wherein the terminal assembly is welded on the side end of the PCB board, wherein a buffer portion for releasing stress is provided at the welding point between the terminal assembly and the PCB board, and the height of the buffer portion is greater than or equal to the thickness of the PCB board, and the terminal assembly comprises a first connection terminal, a second connection terminal, a third connection terminal, a fourth connection terminal, a fifth connection terminal and a sixth connection terminal arranged along the length direction of the PCB board, wherein the first connection terminal, the second connection terminal and the third connection terminal are all welded on the first surface of the PCB board, and the fourth connection terminal, the fifth connection terminal and the sixth connection terminal are welded on the second surface of the PCB board.

[0009] Furthermore, in the above-mentioned connecting terminal structure, the buffer portion of the first connecting terminal is a first bending portion and a first connecting surface connected to the first bending portion, the first bending portion is welded on the side of the PCB board, the first connecting surface is welded on the first surface of the PCB board, the corner of the first bending portion is a right angle, and the height of the first bending portion is greater than or equal to the thickness of the PCB board.

[0010] Furthermore, in the above-mentioned connecting terminal structure, the buffer portion of the second connecting terminal is a second bending portion and a second connecting surface connected to the second bending portion, the second connecting surface is welded on the first surface of the PCB board, the second bending portion is arranged on the side of the second connecting surface away from the PCB board, the corner of the second bending portion is a right angle, and the height of the second bending portion is greater than or equal to the thickness of the PCB board.

[0011] Furthermore, in the above-mentioned connecting terminal structure, the buffer portion of the third connecting terminal is a third bending portion and a third connecting surface connected to the third bending portion, the third connecting surface is welded on the first surface of the PCB board, the third bending portion is arranged on the side of the third connecting surface away from the PCB board, the corner of the third bending portion is an arc-shaped structure, and the height of the third bending portion is greater than or equal to the thickness of the PCB board.

[0012] Furthermore, in the above-mentioned connecting terminal structure, the buffer portion of the fourth connecting terminal is a fourth bending portion and a fourth connecting surface connected to the fourth bending portion, the fourth connecting surface is welded on the second surface of the PCB board, the fourth bending portion is arranged on the side of the fourth connecting surface away from the PCB board, the corner of the fourth bending portion is a right angle, and the height of the fourth bending portion is greater than or equal to the thickness of the PCB board.

[0013] Furthermore, in the above-mentioned connecting terminal structure, the buffer portion of the fifth connecting terminal is a fifth bending portion and a fifth connecting surface connected to the fifth bending portion, the fifth bending portion is welded on the side of the PCB board, the fifth connecting surface is welded on the second surface of the PCB board, the corner of the fifth bending portion is a right angle, and the height of the fifth bending portion is greater than or equal to the thickness of the PCB board.

[0014] Furthermore, in the above-mentioned connecting terminal structure, the buffer portion of the sixth connecting terminal is a sixth bending portion and a sixth connecting surface connected to the sixth bending portion, the sixth connecting surface is welded on the second surface of the PCB board, the sixth bending portion is arranged on the side of the sixth connecting surface away from the PCB board, the corner of the sixth bending portion is an arc-shaped structure, and the height of the sixth bending portion is greater than or equal to the thickness of the PCB board.

[0015] It can be seen from the above technical solution that the utility model has the following beneficial effects:

[0016] The connection terminal structure described in the utility model utilizes the buffer structure of each connection terminal itself to effectively release stress, reduce the risk of pad cracking, effectively achieve the effect of stress release and protection of the pad on the PCB, and at the same time achieve the purpose of cost saving.

[0017] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 This is a schematic diagram of the installation structure of the connecting terminal structure in the embodiment of the utility model;

[0020] Figure 2 It is a schematic diagram of the installation of the first connecting terminal in the embodiment of the utility model;

[0021] Figure 3 It is a schematic diagram of the installation of the second connecting terminal in the embodiment of the utility model;

[0022] Figure 4 It is a schematic diagram of the installation of the third connecting terminal in the embodiment of the utility model;

[0023] Figure 5 is a schematic diagram of the installation of the fourth connecting terminal in the embodiment of the utility model;

[0024] Figure 6 is a schematic diagram of the installation of the fifth connecting terminal in the embodiment of the utility model;

[0025] Figure 7 It is a schematic diagram of the installation of the sixth connecting terminal in the embodiment of the utility model.

[0026] The figure markings of the above drawings are: 1. first connecting terminal; 11. first bending portion; 12. first connecting surface; 2. second connecting terminal; 21. second bending portion; 22. second connecting surface; 3. third connecting terminal; 31. third bending portion; 32. third connecting surface; 4. fourth connecting terminal; 41. fourth bending portion; 42. fourth connecting surface; 5. fifth connecting terminal; 51. fifth bending portion; 52. fifth connecting surface; 6. sixth connecting terminal; 61. sixth bending portion; 62. sixth connecting surface; 7. PCB board; 71. first surface; 72. second surface. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] It should be noted that in the description of the present invention, the terms "first", "second", etc. are only used for descriptive purposes and to distinguish similar objects. There is no order of precedence between the two, and they cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0029] The utility model is described in detail below with reference to the accompanying drawings and embodiments.

[0030] Reference Figures 1 to 7 , this embodiment provides a connection terminal structure, including:

[0031] A PCB board 7, wherein a plurality of pads are provided on the PCB board 7, and the PCB board 7 has a first surface 71 and a second surface 72 opposite to each other;

[0032] refer to Figure 1 , a terminal assembly, the terminal assembly is welded on the side end of the PCB board 7, wherein the welding points between the terminal assembly and the PCB board 7 are provided with a buffer portion for releasing stress, the height of the buffer portion is greater than or equal to the thickness of the PCB board 7, the terminal assembly comprises a first connection terminal 1, a second connection terminal 2, a third connection terminal 3, a fourth connection terminal 4, a fifth connection terminal 5 and a sixth connection terminal 6 arranged along the length direction of the PCB board 7, the first connection terminal 1, the second connection terminal 2 and the third connection terminal 3 are all welded on the first surface 71 of the PCB board 7, and the fourth connection terminal 4, the fifth connection terminal 5 and the sixth connection terminal 6 are welded on the second surface 72 of the PCB board 7.

[0033] Stress relief is the process by which stress in an object or material is gradually released when it is subjected to pressure or strain. Stress relief may be gradual or sudden, depending on the nature of the object or material and the type and degree of stress. Stress relief may cause deformation, fracture or failure of the object or material, so the effects of stress relief need to be considered during the design and manufacturing process.

[0034] Specifically, refer to Figure 2 In this embodiment, the buffer portion of the first connecting terminal 1 is a first bending portion 11 and a first connecting surface 12 connected to the first bending portion 11. The first bending portion 11 is welded to the side of the PCB board 7, and the first connecting surface 12 is welded to the first surface 71 of the PCB board 7. The corner of the first bending portion 11 is a right angle, and the height of the first bending portion 11 is greater than or equal to the thickness of the PCB board 7. The structure of the first bending portion 11 can effectively release stress, play a buffering role, and reduce the risk of cracking of the pad on the PCB board.

[0035] Specifically, refer to Figure 3 In this embodiment, the buffer portion of the second connecting terminal 2 is a second bent portion 21 and a second connecting surface 22 connected to the second bent portion 21. The second connecting surface 22 is welded on the first surface 71 of the PCB board 7. The second bent portion 21 is arranged on the side of the second connecting surface 22 away from the PCB board 7. The corner of the second bent portion 21 is a right angle, and the height of the second bent portion 21 is greater than or equal to the thickness of the PCB board 7. The structure of the second bent portion 21 can effectively release stress, play a buffering role, and reduce the risk of cracking of the pad on the PCB board.

[0036] Specifically, refer to Figure 4 In this embodiment, the buffer portion of the third connection terminal 3 is a third bending portion 31 and a third connection surface 32 connected to the third bending portion 31. The third connection surface 32 is welded on the first surface 71 of the PCB board 7. The third bending portion 31 is arranged on the side of the third connection surface 32 away from the PCB board 7. The corner of the third bending portion 31 is an arc-shaped structure, and the height of the third bending portion 31 is greater than or equal to the thickness of the PCB board 7. The structure of the third bending portion 31 can effectively release stress, play a buffering role, and reduce the risk of cracking of the pad on the PCB board.

[0037] Specifically, refer to Figure 5In this embodiment, the buffer portion of the fourth connecting terminal 4 is a fourth bending portion 41 and a fourth connecting surface 42 connected to the fourth bending portion 41, the fourth connecting surface 42 is welded on the second surface 72 of the PCB board 7, the fourth bending portion 41 is arranged on the side of the fourth connecting surface 42 away from the PCB board 7, the corner of the fourth bending portion 41 is a right angle, and the height of the fourth bending portion 41 is greater than or equal to the thickness of the PCB board 7, the structure of the fourth bending portion 41 can effectively release stress, play a buffering role, and reduce the risk of cracking of the pad on the PCB board.

[0038] Specifically, refer to Figure 6 In this embodiment, the buffer portion of the fifth connection terminal 5 is a fifth bending portion 51 and a fifth connecting surface 52 connected to the fifth bending portion 51. The fifth bending portion 51 is welded to the side of the PCB board 7, and the fifth connecting surface 52 is welded to the second surface 72 of the PCB board 7. The corner of the fifth bending portion 51 is a right angle, and the height of the fifth bending portion 51 is greater than or equal to the thickness of the PCB board 7. The structure of the fifth bending portion 51 can effectively release stress, play a buffering role, and reduce the risk of cracking of the pad on the PCB board.

[0039] Specifically, refer to Figure 7 In this embodiment, the buffer portion of the sixth connection terminal 6 is a sixth bending portion 61 and a sixth connection surface 62 connected to the sixth bending portion 61, the sixth connection surface 62 is welded on the second surface 72 of the PCB board 7, the sixth bending portion 61 is arranged on the side of the sixth connection surface 62 away from the PCB board 7, the corner of the sixth bending portion 61 is an arc-shaped structure, and the height of the sixth bending portion 61 is greater than or equal to the thickness of the PCB board 7, the structure of the sixth bending portion 61 can effectively release stress, play a buffering role, and reduce the risk of cracking of the pad on the PCB board.

[0040] The utility model uses specific embodiments to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the technical solution and core idea of ​​the utility model. At the same time, for ordinary technicians in this field, according to the idea of ​​the utility model, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. A connecting terminal structure, characterized in that: include: A PCB board, wherein a plurality of pads are arranged on the PCB board, and the PCB board has a first surface and a second surface opposite to each other; A terminal assembly, wherein the terminal assembly is welded on the side end of the PCB board, wherein a buffer portion for releasing stress is provided at the welding point between the terminal assembly and the PCB board, and the height of the buffer portion is greater than or equal to the thickness of the PCB board, and the terminal assembly comprises a first connection terminal, a second connection terminal, a third connection terminal, a fourth connection terminal, a fifth connection terminal and a sixth connection terminal arranged along the length direction of the PCB board, wherein the first connection terminal, the second connection terminal and the third connection terminal are all welded on the first surface of the PCB board, and the fourth connection terminal, the fifth connection terminal and the sixth connection terminal are welded on the second surface of the PCB board.

2. The connecting terminal structure according to claim 1, characterized in that: The buffer portion of the first connecting terminal is a first bending portion and a first connecting surface connected to the first bending portion, the first bending portion is welded to the side of the PCB board, the first connecting surface is welded to the first surface of the PCB board, the corner of the first bending portion is a right angle, and the height of the first bending portion is greater than or equal to the thickness of the PCB board.

3. The connecting terminal structure according to claim 1, characterized in that: The buffer portion of the second connecting terminal is a second bending portion and a second connecting surface connected to the second bending portion, the second connecting surface is welded on the first surface of the PCB board, the second bending portion is arranged on the side of the second connecting surface away from the PCB board, the corner of the second bending portion is a right angle, and the height of the second bending portion is greater than or equal to the thickness of the PCB board.

4. The connecting terminal structure according to claim 1, characterized in that: The buffer portion of the third connecting terminal is a third bending portion and a third connecting surface connected to the third bending portion, the third connecting surface is welded on the first surface of the PCB board, the third bending portion is arranged on a side of the third connecting surface away from the PCB board, the corner of the third bending portion is an arc-shaped structure, and the height of the third bending portion is greater than or equal to the thickness of the PCB board.

5. The connecting terminal structure according to claim 1, characterized in that: The buffer portion of the fourth connecting terminal is a fourth bending portion and a fourth connecting surface connected to the fourth bending portion, the fourth connecting surface is welded on the second surface of the PCB board, the fourth bending portion is arranged on the side of the fourth connecting surface away from the PCB board, the corner of the fourth bending portion is a right angle, and the height of the fourth bending portion is greater than or equal to the thickness of the PCB board.

6. The connecting terminal structure according to claim 1, characterized in that: The buffer portion of the fifth connecting terminal is a fifth bending portion and a fifth connecting surface connected to the fifth bending portion, the fifth bending portion is welded to the side of the PCB board, the fifth connecting surface is welded to the second surface of the PCB board, the corner of the fifth bending portion is a right angle, and the height of the fifth bending portion is greater than or equal to the thickness of the PCB board.

7. The connecting terminal structure according to claim 1, characterized in that: The buffer portion of the sixth connecting terminal is a sixth bending portion and a sixth connecting surface connected to the sixth bending portion, the sixth connecting surface is welded on the second surface of the PCB board, the sixth bending portion is arranged on the side of the sixth connecting surface away from the PCB board, the corner of the sixth bending portion is an arc-shaped structure, and the height of the sixth bending portion is greater than or equal to the thickness of the PCB board.