Waste separating device for appearance punching process

By using springs A and spring B in the waste disengagement device of the flexible circuit board punching process, the scraps of product are automatically ejected, solving the problem of waste disengagement difficulties and improving process efficiency and product quality.

CN222464944UActive Publication Date: 2025-02-11ZHUHAI ZIXIANG ELECTRONICS TECH
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Patent Information

Application Number
CN202421039680.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-13
Publication Date
2025-02-11
Estimated Expiration
2034-05-13

AI Technical Summary

Technical Problem

During the appearance punching process of flexible circuit boards, it is difficult to disconnect waste, resulting in the inability to transport products normally, affecting product quality and process efficiency.

Method used

A waste material disengagement device is designed. By setting springs A and spring B between the punching upper mold and the lower mold, the spring force is transmitted to the debris ring, and the product scraps are automatically ejected to make it easier to separate from the positioning pin. .

Benefits of technology

It effectively solves the problem of difficult waste materials to escape, improves operating efficiency, reduces time and costs, and ensures the quality and punching accuracy of the products.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a waste material separating device of an appearance punching process in the technical field of flexible circuit board appearance punching processes, which comprises an upper punching die and a lower punching die, and the surface of the upper punching die is provided with a placing groove A. The waste material separating device is reasonable in structure. A spring A is arranged between a limiting ring on a positioning sleeve and a placement groove A in an upper punching die, and a spring B is arranged between a stripping ring and a placement groove B in a lower punching die, so that a flexible circuit board product needing a punching process is positioned by a positioning pin on the lower punching die, and after the positioning is finished, the flexible circuit board product is taken out from the lower punching die. The flexible circuit board product can be subjected to punching process treatment, the elastic force of the spring B is transmitted to the stripping ring to automatically bounce leftover materials generated by the flexible circuit board product, so that the leftover materials of the product are separated from the positioning pin more easily, the risk of product creasing is eliminated, the working efficiency is improved, and the time and the cost are saved.
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Description

Technical Field

[0001] The utility model relates to the technical field of the shape punching process of a flexible circuit board, in particular to a waste material separation device of the shape punching process. Background Art

[0002] During the last step of the single product shape punching process of the flexible circuit board, the single product and waste are separated after punching, and the equipment suction cup sucks up the single product and automatically transports it to the next station. Due to the influence of multiple factors such as product thickness, shrinkage, punching error, etc., the suction cup of the punching equipment is prone to abnormal waste being stuck in the straight body of the positioning pin during the automatic transportation and absorption of the product, resulting in the inability to smoothly carry out automatic transportation operations, and also causing quality abnormalities such as deformation and tearing of the positioning holes in the product. At the same time, affected by factors such as product shrinkage and punching, the force applied by the suction nozzle to the product is not enough to overcome the friction or tension between the product positioning hole and the mold positioning pin, and the product cannot be transported normally, thereby reducing the use effect of the waste separation device in the shape punching process, and also affecting the quality of the product after the punching process is completed.

[0003] Therefore, it is necessary to develop a waste separation device for the shape punching process. Utility Model Content

[0004] The purpose of the utility model is to provide a waste separation device for the shape punching process, by providing a stripper ring and a spring B, a spring A is set between the limit ring on the positioning sleeve and the placement groove A on the punching upper mold, and a spring B is set between the stripper ring and the placement groove B on the punching lower mold, so that the flexible circuit board product that needs the punching process is positioned by the positioning pin on the punching lower mold. After the positioning is completed, the flexible circuit board product can be subjected to the punching process, and the elastic force of the spring B is transmitted to the stripper ring to automatically bounce up the scraps generated by the flexible circuit board product, so that the product scraps and the positioning pins are easier to separate, eliminating the risk of product wrinkles and improving the operating efficiency, thereby saving time and cost, so as to solve the problem that the waste separation device for the shape punching process proposed in the above background technology is poor in effect and affects the quality and efficiency of the finished product.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a waste material separation device for the shape punching process, comprising a punching upper die and a punching lower die, a placement groove A is opened on the surface of the punching upper die, a placement groove B is opened on the surface of the punching lower die, and a mounting ring is installed at the lower part of the placement groove A;

[0006] A positioning sleeve is installed inside the mounting ring, and a positioning pin is installed at the inner center position of the placement groove B.

[0007] Preferably, a mounting hole is provided at the center of the surface of the mounting ring, and the inner wall of the mounting hole is slidably connected to the outer wall of the positioning sleeve.

[0008] Preferably, a limiting ring is provided at the top end of the positioning sleeve, a spring A is provided above the limiting ring, and the spring A is located above the inside of the placement groove A.

[0009] Preferably, a stripping ring is installed above the outer wall of the positioning pin, the interior of the stripping ring is slidably connected to the outer wall of the positioning pin, and the outer wall of the stripping ring is slidably connected to the inner wall of the placement groove B.

[0010] Preferably, a spring B is provided below the outer wall of the positioning pin, and the spring B is located inside the placement groove B.

[0011] Preferably, the top end of the stripping ring is provided with product scraps, and the interior of the product scraps is slidably connected to the outer wall of the positioning pin.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] By providing a stripping ring and a spring B, a spring A is arranged between the limit ring on the positioning sleeve and the placement groove A on the punching upper mold, and a spring B is arranged between the stripping ring and the placement groove B on the punching lower mold, so that the flexible circuit board product that needs the punching process is positioned by the positioning pin on the punching lower mold. After the positioning is completed, the flexible circuit board product can be subjected to the punching process, and the elastic force of the spring B is transmitted to the stripping ring to automatically bounce up the scraps generated by the flexible circuit board product, so that the product scraps and the positioning pins are easier to separate, eliminating the risk of product wrinkles and improving the working efficiency, thereby saving time and cost.

[0014] High-precision positioning products achieve the purpose of improving punching accuracy by reducing the distance between the positioning pin and the product positioning sleeve. The waste separation device solves the problem of difficult waste separation of such high-precision positioning products. In conjunction with the stroke height of the die punching process, during the stroke from the upper punching die to the lower punching die, springs A and B are compressed and deformed to generate elastic force. When the upper punching die is separated from the lower punching die, springs A and B release the elastic force to bounce the product scraps off for processing. The waste separation device is suitable for all automatic punching dies, with high compatibility and strong applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The overall structural diagram provided by the utility model;

[0016] Figure 2 The utility model provides Figure 1 A magnified view of the structure at A;

[0017] Figure 3 The utility model provides Figure 1 Enlarged view of the structure at B in the figure.

[0018] In the figure: 1. Punching upper die; 101. Placement slot A; 2. Punching lower die; 201. Placement slot B; 3. Mounting ring; 301. Positioning sleeve; 302. Mounting hole; 303. Limiting ring; 304. Spring A; 4. Positioning pin; 401. Stripping ring; 402. Spring B; 403. Product scraps. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] The utility model provides the following technical solutions: waste separation device for the shape punching process, please refer to Figure 1-3 , comprising a punching upper die 1 and a punching lower die 2, a placement groove A101 is opened on the surface of the punching upper die 1, a placement groove B201 is opened on the surface of the punching lower die 2, and a mounting ring 3 is installed at the lower part of the placement groove A101;

[0021] A positioning sleeve 301 is installed inside the mounting ring 3, and a mounting hole 302 is opened at the center of the surface of the mounting ring 3. The inner wall of the mounting hole 302 is slidably connected with the outer wall of the positioning sleeve 301. The mounting ring 3 is arranged at the lower part of the placement groove A101 on the punching upper mold 1, and the positioning sleeve 301 is slidably arranged in the mounting hole 302 on the mounting ring 3, so that the positioning sleeve 301 can slide vertically up and down in the mounting ring 3. A limiting ring 303 is arranged at the top of the positioning sleeve 301. The limiting ring A spring A304 is arranged above 303, and the spring A304 is located above the inner part of the placement groove A101. A limiting ring 303 is arranged at the top of the positioning sleeve 301, and a spring A304 is arranged between the limiting ring 303 and the placement groove A101. The spring A304 has the effect of rebounding after being compressed and deformed. When the positioning sleeve 301 is compressed and moves upward, the spring A304 contracts and deforms. When the positioning sleeve 301 is free of pressure, the positioning sleeve 301 can be pushed to reset, and at the same time, it also plays a certain buffering role.

[0022] A locating pin 4 is installed at the inner center position of the placement groove B201, a stripping ring 401 is installed above the outer wall of the locating pin 4, the inside of the stripping ring 401 is slidably connected to the outer wall of the locating pin 4, the outer wall of the stripping ring 401 is slidably connected to the inner wall of the placement groove B201, a spring B402 is provided below the outer wall of the locating pin 4, the spring B402 is located inside the placement groove B201, a product scrap 403 is provided on the top of the stripping ring 401, the inside of the product scrap 403 is slidably connected to the outer wall of the locating pin 4, the locating pin 4 is provided inside the placement groove B201 on the punching die 2, and the stripping ring 401 is slidably mounted on the outer wall of the locating pin 4, The stripping ring 401 cooperates with the elastic effect of the spring B402 on the outer wall of the positioning pin 4 to keep the stripping ring 401 in a reset state. When the flexible circuit board product needs a punching process, it is positioned by the positioning pin 4 on the punching lower mold 2. After the positioning is completed, the positioning sleeve 301 on the punching upper mold 1 cooperates with the positioning pin 4 to adopt the positioning punching process for the flexible circuit board product. At the same time, the elastic force of the spring B402 is transmitted to the stripping ring 401 to automatically bounce up the scraps produced by the flexible circuit board product, making it easier to separate the product scraps 403 and the positioning pin 4, eliminating the risk of product wrinkling and improving work efficiency, thereby saving time and cost.

[0023] Working principle: When using the utility model, a mounting ring 3 is arranged at the lower part of the placement groove A101 on the punching upper mold 1, and a positioning sleeve 301 is arranged in a sliding manner in the mounting hole 302 on the mounting ring 3, so that the positioning sleeve 301 can slide vertically up and down in the mounting ring 3, and a limiting ring 303 is arranged at the top of the positioning sleeve 301, and a spring A304 is arranged between the limiting ring 303 and the placement groove A101, and the spring A304 has the effect of rebounding after being compressed and deformed, so that the positioning sleeve 301 is pressed and moved upward. When the spring A304 is in motion, it contracts and deforms. When the positioning sleeve 301 is free of pressure, the positioning sleeve 301 can be pushed to reset, and it also plays a certain buffering role. By setting a positioning pin 4 inside the placement groove B201 on the punching lower mold 2, and slidingly sleeve the stripping ring 401 on the outer wall of the positioning pin 4, the stripping ring 401 cooperates with the elastic effect of the spring B402 on the outer wall of the positioning pin 4 to keep the stripping ring 401 in a reset state. When the flexible circuit board product that needs the punching process is punched, the positioning pin 4 on the punching lower mold 2 is used for After positioning is completed, the positioning sleeve 301 on the punching die 1 cooperates with the positioning pin 4 to perform positioning punching on the flexible circuit board product. At the same time, the elastic force of the spring B402 is transmitted to the stripping ring 401 to automatically bounce up the scraps of the flexible circuit board product, making it easier to separate the scraps 403 of the product from the positioning pin 4, eliminating the risk of product wrinkling and improving the operating efficiency, thereby saving time and cost. The high-precision positioning product is achieved by reducing the distance between the positioning pin 4 and the product positioning sleeve 301. In order to improve the punching accuracy, the waste separation device solves the problem of the difficulty in separating waste from such high-precision positioned products. In conjunction with the stroke height of the die punching process, during the stroke from the upper punching die 1 to the lower punching die 2, the spring A304 and the spring B402 are compressed and deformed to generate elastic force. When the upper punching die 1 separates from the lower punching die 2, the spring A304 and the spring B402 release the elastic force, and the product scraps 403 are bounced up and separated for processing. The waste separation device is suitable for all automatic punching dies, with high compatibility and strong applicability.

[0024] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A waste material separation device for a shape punching process, comprising an upper punching die (1) and a lower punching die (2), wherein a placement groove A (101) is provided on the surface of the upper punching die (1), and a placement groove B (201) is provided on the surface of the lower punching die (2), characterized in that: A mounting ring (3) is installed at the lower part of the placement groove A (101); A positioning sleeve (301) is installed inside the mounting ring (3), and a positioning pin (4) is installed at the inner center position of the placement groove B (201).

2. The waste separation device for the profile punching process according to claim 1, characterized in that: A mounting hole (302) is provided at the center of the surface of the mounting ring (3), and the inner wall of the mounting hole (302) is slidably connected to the outer wall of the positioning sleeve (301).

3. The waste separation device for the profile punching process according to claim 1, characterized in that: A limiting ring (303) is arranged at the top end of the positioning sleeve (301), and a spring A (304) is arranged above the limiting ring (303). The spring A (304) is located above the interior of the placement groove A (101).

4. The waste material separation device for the profile punching process according to claim 1, characterized in that: A stripping ring (401) is installed above the outer wall of the positioning pin (4), the interior of the stripping ring (401) is slidably connected to the outer wall of the positioning pin (4), and the outer wall of the stripping ring (401) is slidably connected to the inner wall of the placement groove B (201).

5. The waste material separation device for the profile punching process according to claim 4, characterized in that: A spring B (402) is provided below the outer wall of the positioning pin (4), and the spring B (402) is located inside the placement groove B (201).

6. The waste material separation device for the profile punching process according to claim 5, characterized in that: The top end of the stripping ring (401) is provided with product scraps (403), and the interior of the product scraps (403) is slidably connected to the outer wall of the positioning pin (4).