Network equipment heat dissipation structure

Abstract

The utility model relates to the technical field of network equipment heat dissipation, and discloses a network equipment heat dissipation structure, the network equipment heat dissipation structure comprises a network equipment body, the top side of the network equipment body is fixedly connected with a heat dissipation box, stirring blades are arranged in the network equipment heat dissipation structure, heat generated by the network equipment body can form heat exchange with cooling liquid through heat conduction sheets, and the heat dissipation effect is improved. The heat-conducting fins can be used in a relatively low temperature state by using the cooling liquid, so that the purpose of dissipating heat of the network equipment body can be achieved, meanwhile, an output shaft of the motor is matched with three gears to drive a rotating rod to rotate, the rotating rod drives stirring blades to rotate, and the fluidity of the cooling liquid can be improved when the stirring blades rotate, so that the heat exchange efficiency can be improved; compared with a mode of natural heat dissipation through cooling fins in a comparison file, the situation that the heat dissipation effect is reduced due to the influence of the environment temperature can be effectively avoided, meanwhile, the heat dissipation efficiency can be effectively improved, the use limitation is reduced, and application and popularization are facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of network equipment, and in particular to a heat dissipation structure of network equipment. Background Art

[0002] As we all know, there are many types of network equipment, and they are increasing day by day. The basic network equipment includes computers, hubs, switches, bridges, routers, gateways, network interface cards, wireless access points, printers and modems, fiber optic transceivers, optical cables, etc. The heat dissipation structure has been widely used in the field of network equipment.

[0003] The patent document with publication number: CN218920844U discloses a heat dissipation structure for network equipment, including a shell, a circuit board is arranged inside the shell, a plurality of shock-absorbing springs are connected to the upper and lower inner walls of the shell respectively, the other ends of the plurality of shock-absorbing springs on the upper inner wall of the shell and the plurality of shock-absorbing springs on the lower inner wall are fixedly connected to pads respectively, the lower end faces of the plurality of pads on the upper side and the upper end faces of the plurality of pads on the lower side are fixedly connected to limited blocks respectively, two through holes are arranged on the two side walls of the shell respectively, a heat dissipation fan is arranged inside the four through holes respectively, and a dustproof net is arranged on the edge of one side of the four through holes respectively. In the utility model, a plurality of heat sinks are arranged on the upper end face of the shell, and the heat dissipation area and heat dissipation efficiency are greatly increased by cooperating with the internal protective block, and two heat dissipation fans are arranged on the two side walls of the shell respectively, and the internal heat dissipation efficiency is improved by rotating in the same direction.

[0004] However, in actual applications, the above-mentioned patent document is easily affected by the ambient temperature when using the heat sink for natural heat dissipation, especially in the summer in the southern region where the ambient temperature is generally high. At this time, the effect of natural heat dissipation using the heat sink will be relatively low and cannot meet the heat dissipation needs. This will also lead to greater limitations in use and is not conducive to promotion and use.

[0005] Therefore, those skilled in the art provide a network device heat dissipation structure to solve the problems raised in the above background technology. Utility Model Content

[0006] In order to solve the problem raised in the above background technology that the use of heat sinks for natural heat dissipation is easily affected by the ambient temperature, especially in the summer in southern regions where the ambient temperature is generally high. At this time, the effect of natural heat dissipation using heat sinks will be relatively low and cannot meet the heat dissipation needs, which will lead to greater limitations in use and is not conducive to promotion and use. The present application provides a network equipment heat dissipation structure.

[0007] A network equipment heat dissipation structure provided in the present application adopts the following technical solution: it includes a network equipment body, a heat dissipation box is fixedly connected to the top side of the network equipment body, rectangular holes are opened on the top side wall of the network equipment body and the bottom side wall of the heat dissipation box, the inner walls of the two rectangular holes are fixedly and sealed with the same heat conductive sheet, the interior of the heat dissipation box is filled with coolant, a motor is fixedly connected to the top side of the heat dissipation box, two rotating rods are rotatably connected to the inner wall of the top side of the heat dissipation box, the output shaft of the motor and the outer sides of the two rotating rods are fixedly sleeved with gears, the three gears are arranged in a straight meshing shape, and the outer sides of the two rotating rods are fixedly connected with paddles.

[0008] Preferably, semiconductor refrigeration sheets are fixedly mounted on both the left and right sides of the heat dissipation box, and the two semiconductor refrigeration sheets are symmetrically distributed.

[0009] Preferably, the heat sink and the heat conducting sheet are both made of copper.

[0010] Preferably, a plug hole is provided on the top side of the heat dissipation box, a thermometer is inserted into the inner wall of the plug hole, and a measuring end of the thermometer is immersed in the coolant.

[0011] Preferably, the rear side of the heat dissipation box is fixedly connected with two liquid pipes, and valves are installed at the ports of the two liquid pipes.

[0012] In summary, this application includes the following beneficial technical effects:

[0013] 1. By setting the paddles, the heat generated by the network device body will form heat exchange between the heat conductive sheet and the coolant. The coolant can make the heat conductive sheet at a relatively low temperature, thereby achieving the purpose of heat dissipation of the network device body. At the same time, the output shaft of the motor cooperates with three gears to drive the rotating rod to rotate, and the rotating rod drives the paddles to rotate. When the paddles rotate, the fluidity of the coolant can be increased, thereby improving the heat exchange efficiency. Compared with the natural heat dissipation method using the heat sink in the comparative document, it can effectively avoid the situation where the heat dissipation effect is reduced due to the influence of ambient temperature. At the same time, it can effectively improve the heat dissipation efficiency, reduce the limitations of use, and is conducive to promotion and use.

[0014] 2. By setting up a semiconductor refrigeration sheet, when the coolant continues to absorb heat from the thermal conductive sheet, the temperature of the coolant itself is also rising. At this time, the semiconductor refrigeration sheet can be used to cool the coolant, thereby ensuring the cooling effect of the coolant on the thermal conductive sheet and ensuring the continuity of heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the main cross-sectional structure of a heat dissipation structure of a network device in an embodiment of the present application;

[0016] Figure 2It is a schematic diagram of a rear cross-sectional structure of a heat dissipation structure of a network device in an embodiment of the present application;

[0017] Figure 3 It is a schematic diagram of the appearance structure of a thermometer of a network device heat dissipation structure in an embodiment of the present application.

[0018] Explanation of the accompanying drawings: 1. Network device body; 2. Heat sink; 3. Heat conducting plate; 4. Motor; 5. Rotating rod; 6. Gear; 7. Paddle; 8. Semiconductor cooling plate; 9. Thermometer; 10. Liquid pipe. DETAILED DESCRIPTION

[0019] The following will be combined with the attached Figure 1-3 The technical solution of the utility model is described clearly and completely. Obviously, the described embodiments are part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] The present application embodiment discloses a network device heat dissipation structure, referring to Figure 1-3 , comprising a network device body 1, a heat sink 2 is fixedly connected to the top side of the network device body 1, a rectangular hole is opened on the top side wall of the network device body 1 and the bottom side wall of the heat sink 2, the inner walls of the two rectangular holes are fixedly and sealed with a same heat conducting sheet 3, the interior of the heat sink 2 is filled with coolant, a motor 4 is fixedly connected to the top side of the heat sink 2, two rotating rods 5 are rotatably connected to the inner wall of the top side of the heat sink 2, the output shaft of the motor 4 and the outer sides of the two rotating rods 5 are fixedly sleeved with gears 6, the three gears 6 are arranged in a straight meshing shape, and the outer sides of the two rotating rods 5 are fixedly connected with paddles 7; by setting the paddles 7, the heat generated by the network device body 1 The amount will form heat exchange between the heat conducting plate 3 and the coolant. The coolant can make the heat conducting plate 3 keep at a relatively low temperature, so as to achieve the purpose of heat dissipation of the network device body 1. At the same time, the output shaft of the motor 4 cooperates with the three gears 6 to drive the rotating rod 5 to rotate, and the rotating rod 5 drives the paddle 7 to rotate. When the paddle 7 rotates, the fluidity of the coolant can be increased, thereby improving the heat exchange efficiency. Compared with the method of using the heat sink for natural heat dissipation in the comparative document, it can effectively avoid the situation where the heat dissipation effect is reduced due to the influence of ambient temperature. At the same time, it can effectively improve the heat dissipation efficiency, reduce the limitations of use, and is conducive to promotion and use.

[0021] In the present application, semiconductor refrigeration sheets 8 are fixedly installed on the left and right sides of the heat dissipation box 2, and the two semiconductor refrigeration sheets 8 are symmetrically distributed. By setting the semiconductor refrigeration sheets 8, when the coolant continues to absorb heat from the thermal conductive sheet 3, the temperature of the coolant itself is also constantly increasing. At this time, the semiconductor refrigeration sheets 8 can be used to cool the coolant, thereby ensuring the cooling effect of the coolant on the thermal conductive sheet 3 and ensuring the continuity of heat dissipation.

[0022] In the present application, the heat sink 2 and the heat conducting sheet 3 are both made of copper. By setting the heat sink 2 and the heat conducting sheet 3 to be both made of copper, it is ensured that the temperature is in the optimal state during heat exchange and conduction.

[0023] In the present application, a socket is provided on the top side of the heat dissipation box 2, a thermometer 9 is installed on the inner wall of the socket, and the measuring end of the thermometer 9 is immersed in the coolant; by setting the thermometer 9, the stability of the coolant can be monitored in real time by observing the thermometer 9, thereby improving the convenience of use.

[0024] In the present application, the rear side of the heat sink 2 is fixedly connected with two liquid pipes 10, and valves are installed at the ends of the two liquid pipes 10; by setting the liquid pipes 10 and cooperating with each other, the coolant inside the heat sink 2 can be easily replenished and replaced.

[0025] The standard parts used in the utility model can all be purchased from the market, and special-shaped parts can be customized according to the instructions and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt the conventional models in the existing technology, and the circuit connection adopts the conventional connection method in the existing technology, which will not be described in detail here.

[0026] The implementation principle of a heat dissipation structure of a network device in the embodiment of the present application is as follows: when in use, the heat generated by the network device body 1 will form heat exchange between the heat conductive sheet 3 and the coolant. The coolant can make the heat conductive sheet 3 use in a relatively low temperature state, thereby achieving the purpose of heat dissipation of the network device body 1. At the same time, the output shaft of the motor 4 cooperates with the three gears 6 to drive the rotating rod 5 to rotate, and the rotating rod 5 drives the paddle 7 to rotate. When the paddle 7 rotates, the fluidity of the coolant can be increased, thereby improving the heat exchange efficiency. Compared with the method of using the heat sink for natural heat dissipation in the comparative document, it can effectively avoid the situation where the heat dissipation effect is reduced due to the influence of the ambient temperature. It can effectively improve the heat dissipation efficiency, reduce the limitation of use, and is conducive to popularization and use. When the coolant continues to absorb heat from the heat conducting plate 3, the temperature of the coolant itself is also constantly rising. At this time, the semiconductor refrigeration plate 8 can be used to cool the coolant, thereby ensuring the cooling effect of the coolant on the heat conducting plate 3 and ensuring the continuity of heat dissipation. The heat dissipation box 2 and the heat conducting plate 3 are both made of copper, thereby ensuring that the temperature is in the optimal state during heat exchange and conduction. The stability of the coolant can be monitored in real time by observing the thermometer 9, thereby improving the convenience of use. The two liquid pipes 10 cooperate with each other to facilitate the replenishment and replacement of the coolant inside the heat dissipation box 2.

[0027] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0028] Secondly: In the drawings of the embodiments disclosed in the present invention, only the structures involved in the embodiments disclosed in the present invention are involved, and other structures can refer to the usual design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

Claims

1. A network device heat dissipation structure, comprising a network device body (1), characterized in that: The top side of the network device body (1) is fixedly connected to a heat dissipation box (2), the top side wall of the network device body (1) and the bottom side wall of the heat dissipation box (2) are both provided with rectangular holes, the inner walls of the two rectangular holes are fixedly and sealedly installed with a same heat conducting sheet (3), the interior of the heat dissipation box (2) is filled with cooling liquid, the top side of the heat dissipation box (2) is fixedly connected to a motor (4), the inner wall of the top side of the heat dissipation box (2) is rotatably connected to two rotating rods (5), the output shaft of the motor (4) and the outer sides of the two rotating rods (5) are both fixedly sleeved with gears (6), the three gears (6) are arranged in a straight meshing shape, and the outer sides of the two rotating rods (5) are both fixedly connected with paddles (7).

2. A network equipment heat dissipation structure according to claim 1, characterized in that: Semiconductor refrigeration sheets (8) are fixedly mounted on both the left and right sides of the heat dissipation box (2), and the two semiconductor refrigeration sheets (8) are symmetrically distributed.

3. A network equipment heat dissipation structure according to claim 1, characterized in that: The heat dissipation box (2) and the heat conducting sheet (3) are both made of copper.

4. The network equipment heat dissipation structure according to claim 1, characterized in that: The top side of the heat dissipation box (2) is provided with an insertion hole, the inner wall of the insertion hole is plugged with a thermometer (9), and the measuring end of the thermometer (9) is immersed in the cooling liquid.

5. The network equipment heat dissipation structure according to claim 1, characterized in that: The rear side of the heat dissipation box (2) is fixedly connected to two liquid pipes (10), and valves are installed at the ends of the two liquid pipes (10).

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