Automatic dispensing mechanism and semiconductor chip tape automatic dispensing equipment

Abstract

The utility model relates to an automatic dispensing mechanism and automatic dispensing equipment for a semiconductor chip belt. The automatic dispensing mechanism comprises a lifting driving assembly, a moving seat, a sliding plate, a controller and a dispensing part; the moving seat is mounted at the output end of the lifting driving assembly, and a first contact is arranged on the moving seat; the sliding plate is connected to the moving seat in a lifting sliding mode, a second contact is arranged at the position, corresponding to the first contact, of the sliding plate, the second contact is located above the first contact, and the second contact and the first contact are attached to each other; the controller is installed on the moving seat and electrically connected with the first contact and the second contact. And the dispensing piece is mounted on the sliding plate. The automatic dispensing equipment for the semiconductor chip tape comprises the automatic dispensing mechanism. The utility model solves the problem that the existing dispensing equipment is not provided with a calibration structure, so that the dispensing effect is uncontrollable.

Description

Technical Field

[0001] The utility model relates to the technical field of product dispensing, in particular to an automatic dispensing mechanism and automatic dispensing equipment for semiconductor chips. Background Art

[0002] Glue dispensing machine is also called glue coating machine, glue dripping machine, glue spraying machine, glue filling machine, etc. It is specially used to control fluids. It is an automated machine that drips and applies fluids on the surface or inside of products. It can achieve three-dimensional and four-dimensional path dispensing, precise positioning, precise glue control, no drawing, no leakage, and no dripping. Glue dispensing machine is mainly used for glue, paint and other liquids in product processes to accurately point, inject, apply and drip at the precise position of each product. It can be used to achieve dotting, drawing lines, circles or arcs.

[0003] Semiconductor chips are a way to miniaturize circuits in electronics and are usually manufactured on the surface of semiconductor wafers. During the production process, they are often processed by glue dispensing machines.

[0004] Referring to the invention patent with publication number CN114602741B, there is an existing roll material dispensing device, which drives the roll material to move through a feeding module, and then realizes the dispensing operation through the cooperation of a lifting module and a dispensing part; although this design can achieve efficient dispensing of the roll material, the dispensing part will inevitably shift or wear during the dispensing process, resulting in inaccurate positioning of the dispensing part and uncontrollable dispensing effect.

[0005] Therefore, it is necessary to provide a technical solution to solve the above problems. Utility Model Content

[0006] The utility model aims to solve the problem that the existing glue dispensing equipment is not provided with a glue dispensing part calibration structure, resulting in uncontrollable glue dispensing effect.

[0007] To achieve the above-mentioned purpose, the utility model provides an automatic glue dispensing mechanism, including a lifting drive assembly, a moving seat, a sliding plate, a controller and a glue dispensing member, wherein:

[0008] The movable seat is installed on the output end of the lifting drive component, and a first contact is arranged on the movable seat; the sliding plate is connected to the movable seat in a lifting and sliding manner, and a second contact is arranged on the sliding plate at a position corresponding to the first contact, and the second contact is located above the first contact, and the two are in contact with each other; the controller is installed on the movable seat, and is electrically connected to the first contact and the second contact respectively; the dispensing component is installed on the sliding plate.

[0009] More specifically, a visual detector and a fill light element are arranged on the outer side of the dispensing component, and the visual detector and the fill light element are both installed on the moving seat.

[0010] More specifically, the automatic dispensing mechanism further includes a horizontal driving component, and the lifting driving component is installed on the output end of the horizontal driving component.

[0011] A semiconductor chip tape automatic dispensing device comprises a dispensing device and an unwinding device and a rewinding device arranged on both sides of the dispensing device; the dispensing device comprises a dispensing machine frame and a track mechanism, a lifting mechanism and the above-mentioned automatic dispensing mechanism arranged on the dispensing machine frame; wherein:

[0012] The track mechanism is used to transport the semiconductor chip belt, and a hollow area is provided in the middle thereof;

[0013] The lifting mechanism is arranged below the track mechanism and is located at the hollow area;

[0014] The automatic glue dispensing mechanism corresponds to the position of the lifting mechanism, and the glue dispensing component is located above the track mechanism.

[0015] More specifically, the track mechanism includes a conveyor rail and a drive assembly; the conveyor rail is composed of two guide rails parallel to each other, and supporting ridges are arranged on the opposite surfaces of the two guide rails; a limit bar is arranged above the supporting ridge, and a first telescopic driver is arranged on the guide rail, and the first telescopic driver is used to drive the limit bar to move up and down; the drive assembly is arranged at the end of the conveyor rail, and it is used to drive the semiconductor chip belt to move along the conveyor rail.

[0016] More specifically, the driving assembly includes a driver, a conveying wheel, a pressure seat and a pressure wheel. The conveying wheel and the pressure seat are provided on the two guide rails. The conveying wheel is rotatably connected to the guide rail. The pressure seat is provided above the conveying wheel and one end of which is hinged to the guide rail. The pressure wheel is rotatably connected to the pressure seat. The driver is installed on the dispensing machine frame, and its output shaft is fixedly connected to the two conveying wheels.

[0017] More specifically, a rotating block is rotatably connected to the middle of the pressure seat, and a slider is slidably connected to one side of the pressure seat. A slot is provided on the side of the rotating block close to the slider, and an insertion rod is rotatably connected to the slider. The end of the insertion rod is placed in the slot, and the pressure seat is also provided with an adjusting part for adjusting the position of the slider; the pressure wheel is rotatably connected to the side of the rotating block away from the slider.

[0018] More specifically, a length detection component is provided on the conveying rail, and the length detection component includes an encoder and a detection gear. The encoder is installed on the conveying rail, and the detection gear is installed on the output end of the encoder.

[0019] More specifically, the lifting mechanism includes a second telescopic driver and a vacuum suction component. The second telescopic driver is installed on the dispensing machine frame. The vacuum suction component is arranged in the hollow area and connected to the output end of the second telescopic driver.

[0020] More specifically, the unwinding device includes an unwinding frame, an unwinding wheel and a winding wheel, the unwinding wheel and the winding wheel are distributed up and down and are both rotatably connected to the unwinding frame, and the unwinding frame is provided with a driving component for driving the unwinding wheel and the winding wheel to rotate; two groups of sensor components are arranged between the unwinding wheel and the winding wheel, the two groups of sensor components are distributed up and down and are installed on the unwinding frame.

[0021] The technical effects of the utility model are:

[0022] The present application adds a first contact, a second contact and a controller. Through the cooperation of the first contact and the second contact, the controller can accurately capture the moment when the dispensing part contacts the product and the total height of the moving seat's descent. The controller then adjusts the data of the lifting drive assembly to change the moving seat's descent position, ensuring that the dispensing part can be accurately moved into place during dispensing, so that the dispensing work can achieve the expected effect, thereby improving the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the structure of an automatic dispensing device for semiconductor chips involved in the utility model;

[0024] Figure 2 It is a structural schematic diagram of a glue dispensing device in an automatic glue dispensing device for semiconductor chips involved in the utility model;

[0025] Figure 3 It is a structural schematic diagram of an automatic glue dispensing mechanism in an automatic glue dispensing device for semiconductor chips involved in the utility model;

[0026] Figure 4 for Figure 3 The enlarged schematic diagram of point A in the middle;

[0027] Figure 5 It is a structural schematic diagram of a lifting mechanism in a semiconductor chip automatic dispensing device involved in the utility model;

[0028] Figure 6This is a structural schematic diagram of a track mechanism in an automatic dispensing device for semiconductor chips involved in the utility model;

[0029] Figure 7 It is a structural schematic diagram of another perspective of the track mechanism in the automatic dispensing device for semiconductor chips involved in the utility model;

[0030] Figure 8 for Figure 7 The enlarged schematic diagram of point B in the middle;

[0031] Fig. 9 for Figure 8 The enlarged schematic diagram of the center C;

[0032] Fig.10 This is a schematic diagram of the distribution of the corresponding pressing wheels on two guide rails in a semiconductor chip automatic dispensing device involved in the utility model;

[0033] Fig.11 The utility model is a schematic structural diagram of a pressure seat in an automatic dispensing device for semiconductor chips.

[0034] Markings in the figure:

[0035] 1. Glue dispensing device; 2. Unwinding device; 3. Rewinding device;

[0036] 11. Glue dispensing machine frame; 12. Track mechanism; 121. Drive assembly; 1211. Driver; 1212. Conveyor wheel; 1213. Press seat; 1214. Press wheel; 1215. Counterweight; 1216. Clutch; 1217. Rotating block; 1218. Slider; 1219. Insert rod; 1220. Position adjustment member; 122. Guide rail; 1221. Support convex strip; 123. Limit strip; 124. First telescopic driver; 125. Glue dispensing head plus Heater; 126, displacement detection mechanism; 1261, encoder; 1262, detection gear; 13, lifting mechanism; 131, second telescopic driver; 132, vacuum adsorption component; 14, automatic dispensing mechanism; 141, lifting drive assembly; 142, moving seat; 1421, first contact; 143, sliding plate; 1431, second contact; 145, dispensing component; 146, visual detector; 147, fill light element; 148, horizontal drive assembly;

[0037] 21. Unwinding frame; 22. Unwinding wheel; 23. Rewinding wheel; 24. Sensing component; 25. Supporting member. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0039] It should be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be a central element at the same time; when an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0041] In the description of the embodiments of the present invention, it should be understood that the directions or positional relationships indicated by “up”, “down”, “front”, “back”, “left”, “right”, “top”, “bottom”, “inside” and “outside”, etc., are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0042] Embodiment 1

[0043] See also Figure 3-4 , an automatic glue dispensing mechanism, comprising a lifting drive assembly 141, a moving seat 142, a sliding plate 143, a controller and a glue dispensing member 145, wherein:

[0044] The moving seat 142 is installed on the output end of the lifting drive component 141, and a first contact 1421 is provided on the moving seat 142; the sliding plate 143 is connected to the moving seat 142 in a lifting and sliding manner, and a second contact 1431 is provided on the sliding plate 143 at a position corresponding to the first contact 1421, and the second contact 1431 is located above the first contact 1421, and the two are in contact with each other; the controller is installed on the moving seat 142, and is electrically connected to the first contact 1421 and the second contact 1431 respectively; the dispensing component 145 is installed on the sliding plate 143.

[0045] Compared with the prior art, the automatic dispensing mechanism involved in the utility model is different in that the present application can realize automatic calibration of the dispensing point of the dispensing member 145; in actual application, the lifting drive component 141 controls the moving seat 142 to move downward to a specific position, so that the dispensing port of the dispensing member 145 moves to the product surface, thereby dispensing; after the above-mentioned dispensing work is repeated for a specific number of times (such as one hundred times, two hundred times, etc.), affected by various factors (such as wear of the dispensing part, displacement of the dispensing member 145, etc.), the dispensing position of the dispensing member 145 may change. At this time, a position calibration is required. The calibration process is that the lifting drive component 141 controls the movable seat 142 to move downward excessively. When the sliding plate 143 begins to move relative to the movable seat 142, the glue outlet portion of the glue dispensing component 145 just rests on the corresponding plane. At this time, the second contact 1431 will begin to separate from the first contact 1421. The controller detects the glue outlet position information of the glue dispensing component 145. According to the above position information and the moving distance of the movable seat 142, the change of the glue outlet position of the glue dispensing component 145 can be analyzed. Then, when the subsequent glue dispensing work is carried out, the lifting drive component 141 can make corresponding movement compensation to ensure that the glue dispensing component 145 can be moved into place, so that the glue dispensing can achieve the expected effect, thereby improving the yield rate.

[0046] In this embodiment, a visual detector 146 and a fill light element 147 are provided on the outside of the dispensing member 145, and both the visual detector 146 and the fill light element 147 are mounted on the moving seat 142. In practical application, the visual detector 146 detects the actual position of the product to ensure that the product is moved into place and avoids the occurrence of empty spots; and the fill light element 147 is used to illuminate the product, thereby improving the detection accuracy of the visual detector 146.

[0047] In this embodiment, the automatic dispensing mechanism 14 further includes a horizontal driving component 148 , and the lifting driving component 141 is installed on the output end of the horizontal driving component 148 .

[0048] Embodiment 2

[0049] See also Figures 1 to 11 , a semiconductor chip tape automatic dispensing device, comprising a dispensing device 1 and a reeling device 2 and a reeling device 3 arranged on both sides of the dispensing device 1; the dispensing device 1 comprises a dispensing machine frame 11 and a track mechanism 12, a lifting mechanism 13 and an automatic dispensing mechanism 14 involved in the first embodiment arranged on the dispensing machine frame 11; wherein:

[0050] The track mechanism 12 is used to transport the semiconductor chip tape, and a hollow area is provided in the middle thereof;

[0051] The lifting mechanism 13 is arranged below the track mechanism 12 and is located in the hollow area;

[0052] The automatic glue dispensing mechanism 14 corresponds to the position of the lifting mechanism 13 , and the glue dispensing component 145 is located above the track mechanism 12 .

[0053] The working process of the automatic glue dispensing device for semiconductor chip tapes involved in the utility model is as follows: the unwinding device 2 outputs the semiconductor chip tape, the semiconductor chip tape passes through the track mechanism 12, and is reeled onto the reeling device 3, and the lifting mechanism 13 is used to support and fix the semiconductor chip tape on the track mechanism 12, and the automatic glue dispensing mechanism 14 dispenses glue to the semiconductor chip tape fixed by the lifting mechanism 13; during glue dispensing, the lifting drive component 141 controls the moving seat 142 to move downward to a specific position, so that the glue outlet of the glue dispensing part 145 moves to the surface of the product, thereby dispensing glue, and after the automatic glue dispensing mechanism 14 repeats the glue dispensing work for a specific number of times, the lifting drive component 141 will When the movable seat 142 is controlled to move downward once and the sliding plate 143 begins to move relative to the movable seat 142, the dispensing component 145 just rests on the corresponding plane. At this time, the second contact 1431 will begin to separate from the first contact 1421. The controller detects the glue discharge point information of the dispensing component 145. The change of the glue discharge point of the dispensing component 145 can be analyzed according to the above position information and the moving distance of the movable seat 142, so as to complete a calibration. In this way, when the subsequent dispensing work is carried out, the lifting drive component 141 can make corresponding movement compensation to ensure that the dispensing component 145 can be moved into place, so that the dispensing work can achieve the expected effect, thereby improving the yield rate.

[0054] In this embodiment, the track mechanism 12 includes a conveying rail and a driving component 121; the conveying rail is composed of two parallel guide rails 122, and supporting ridges 1221 are arranged on the opposite surfaces of the two guide rails 122; a limit bar 123 is arranged above the supporting ridge 1221, and a first telescopic driver 124 is arranged on the guide rail 122, and the first telescopic driver 124 is used to drive the limit bar 123 to move up and down; the driving component 121 is arranged at the end of the conveying rail, and is used to drive the semiconductor chip belt to move along the conveying rail. In actual application, the semiconductor chip belt is arranged between the two guide rails 122, and its two sides are respectively placed on the corresponding supporting convex strips 1221. In this way, the contact area between the semiconductor chip belt and the conveying rail can be reduced, the risk of wear of the semiconductor chip belt is reduced, and the conveying stability of the semiconductor chip belt is improved. After the driving component 121 drives the semiconductor chip belt to move once, the first telescopic driver 124 will drive the limit bar 123 downward, so that the limit bar 123 and the guide rail 122 cooperate to fix the semiconductor chip belt, avoid the semiconductor chip belt from being offset, and improve the quality of subsequent dispensing work.

[0055] In this embodiment, the driving assembly 121 includes a driver 1211, a conveying wheel 1212, a pressure seat 1213 and a pressure wheel 1214. The two guide rails 122 are provided with conveying wheels 1212 and pressure seats 1213. The conveying wheel 1212 is rotatably connected to the guide rail 122. The pressure seat 1213 is arranged above the conveying wheel 1212, and one end of the pressure seat 1213 is hinged to the guide rail 122. The pressure wheel 1214 is rotatably connected to the pressure seat 1213. The driver 1211 is installed on the dispensing machine frame 11, and its output shaft is fixedly connected to the two conveying wheels 1212. In actual application, the semiconductor chip belt passes between the conveying wheel 1212 and the pressure wheel 1214. Under the gravity of the pressure seat 1213, the pressure wheel 1214 is pressed tightly against the semiconductor chip belt, so that the semiconductor chip belt is in close contact with the conveying wheel 1212, thereby improving the moving stability of the semiconductor chip belt.

[0056] Preferably, a counterweight block 1215 is detachably connected to the pressure seat 1213. Different counterweight blocks 1215 can be replaced according to different semiconductor chip strips, thereby changing the pressure applied by the pressure wheel 1214 to the semiconductor chip strip to meet the use requirements of different semiconductor chip strips.

[0057] In this embodiment, two sets of driving components 121 are provided, and are respectively arranged at two ends of the conveying rail. The driving component 121 also includes a clutch 1216 , and the driver 1211 and the conveying wheel 1212 are connected through the clutch 1216 . It should be understood that before the dispensing work begins, the position of the semiconductor chip belt needs to be adjusted so that the chips on the semiconductor chip belt are aligned with the dispensing part 145. The adjustment process is: use the visual detector 146 on the automatic dispensing mechanism 14 to detect the position of the chips on the semiconductor chip belt to detect whether the chips are accurately aligned with the dispensing part 145. If there is a deviation in the chip position, the two sets of drive components 121 cooperate to drive the semiconductor chip belt to move forward or reverse for adjustment so that the chips on the semiconductor chip belt are moved into place; specifically, when forward movement is required, the clutch 1216 in the drive component 121 at the rear end will control the driver 1211 to connect with the conveying wheel 1212, and the clutch 1216 in the drive component 121 at the front end will control the driver 1211 to disconnect from the conveying wheel 1212. At this time, the drive component 121 at the rear end can drive the semiconductor chip belt to move forward, and when reverse movement is required, the clutch 1216 switches to the opposite state to the above state, so that the drive component 121 at the front end can drive the semiconductor chip belt to move reversely.

[0058] In this embodiment, a rotating block 1217 is rotatably connected to the middle of the pressure seat 1213, and a slider 1218 is slidably connected to one side of the pressure seat 1213. A slot is provided on the side of the rotating block 1217 close to the slider 1218. An insertion rod 1219 is rotatably connected to the slider 1218, and the end of the insertion rod 1219 is placed in the slot. A position adjustment member 1220 for adjusting the slider 1218 is provided on the pressure seat 1213; the pressure wheel 1214 is rotatably connected to the side of the rotating block 1217 away from the slider 1218. Preferably, the position adjustment member 1220 includes two micro cylinders provided at both ends of the slider 1218. In actual application, the position adjustment member 1220 can control the rotation of the rotating block 1217 by adjusting the position of the slider 1218, so as to change the inclination angle of the pressure wheel 1214. For details, please refer to Fig.10 When the semiconductor chip belt moves forward, the position adjustment member 1220 will adjust the position of the slider 1218 so that the corresponding pressure wheels 1214 on the two guide rails 122 are distributed in an outward-facing "X" shape. At this time, the semiconductor chip belt will be subjected to the outward pushing tension applied by the pressure wheels 1214 during the movement, so that the semiconductor chip belt on the track mechanism 12 remains in a tensioned state, thereby improving the processing quality during subsequent dispensing. When the semiconductor chip belt needs to move in the opposite direction, the position adjustment member 1220 will adjust the position of the slider 1218 again, so that the corresponding pressure wheels 1214 on the two guide rails 122 are distributed in an inward-facing "X" shape, so that when the semiconductor chip belt moves in the opposite direction, it will still be subjected to the outward pushing tension, ensuring that the semiconductor chip belt on the track mechanism 12 always remains in a tensioned state.

[0059] In this embodiment, a dispensing head heater 125 is provided on either side of the conveying rail, and the dispensing head heater 125 corresponds to the position of the automatic dispensing mechanism 14. Before the dispensing work starts, the dispensing part 145 will move into the dispensing head heater 125 to heat and melt the glue at the dispensing part of the dispensing part 145 to avoid clogging of the dispensing part 145.

[0060] In this embodiment, an ion wind emitter is provided on the conveyor rail. In actual application, the ion wind emitter blows ion wind to the semiconductor chip belt, which can blow away dust on the semiconductor chip belt and remove static electricity attached to the semiconductor chip belt, so as to keep the semiconductor chip clean and tidy, which is conducive to improving the dispensing quality.

[0061] In this embodiment, a displacement detection mechanism 126 is provided on the conveying rail, and the displacement detection mechanism 126 includes an encoder 1261 and a detection gear 1262. The encoder 1261 is installed on the conveying rail, and the detection gear 1262 is installed on the output end of the encoder 1261. It should be noted that the side of the semiconductor chip belt is provided with an array of holes, and the teeth of the detection gear 1262 are placed in the hole. In actual application, the movement of the semiconductor chip belt will drive the detection gear 1262 to rotate, and the encoder 1261 can detect the displacement of the semiconductor chip belt by analyzing the rotation angle of the detection gear 1262, and then determine whether the next chip is accurately moved to the position; for example, assuming that the semiconductor chip belt moves normally once, the rotation angle of the detection gear 1262 is a°, if the encoder 1261 detects that the rotation angle of the detection gear 1262 is greater than or less than a°, it means that the movement of the semiconductor chip belt does not meet the standard, and the chip is not moved to the position. At this time, it is necessary to readjust the position of the semiconductor chip belt to realign the chip with the dispensing member 145. The above design can ensure that the chip and the dispensing part 145 are accurately aligned, thereby improving the processing quality.

[0062] In this embodiment, the lifting mechanism 13 includes a second telescopic driver 131 and a vacuum adsorbent 132. The second telescopic driver 131 is installed on the dispensing machine frame 11. The vacuum adsorbent 132 is arranged in the hollow area and connected to the output end of the second telescopic driver 131. In actual application, the second telescopic driver 131 drives the vacuum adsorbent 132 upward, and the vacuum adsorbent 132 adsorbs and fixes the semiconductor chip belt, so that the automatic dispensing mechanism 14 can stably dispense the chips on the semiconductor chip belt.

[0063] In this embodiment, the unwinding device 2 includes an unwinding frame 21, an unwinding wheel 22 and a winding wheel 23. The unwinding wheel 22 and the winding wheel 23 are distributed up and down and are both rotatably connected to the unwinding frame 21. The unwinding frame 21 is provided with a driving component for driving the unwinding wheel 22 and the winding wheel 23 to rotate; two groups of sensor components 24 are arranged between the unwinding wheel 22 and the winding wheel 23, and the two groups of sensor components 24 are distributed up and down and are installed on the unwinding frame 21. In actual application, the unwinding wheel 22 unwinds the material roll, and the semiconductor chip tape in the material roll is transported to the track mechanism 12, while the release film roll in the material roll is wound onto the reel-in 23; it should be understood that a naturally hanging semiconductor chip tape buffer section is provided between the unwinding wheel 22 and the track mechanism 12, and the semiconductor chip tape buffer section is mainly provided to realize soft transmission, so that during the movement of the semiconductor chip tape, the semiconductor chip tape on the unwinding wheel 22 and the track mechanism 12 will not be subjected to rigid tension, thereby improving the smoothness and stability of the movement of the semiconductor chip tape on the track mechanism 12, and avoiding the breakage of the semiconductor chip tape, the semiconductor chip tape buffer section should not be too long or too short, and the position detected by the two sets of sensor components 24 is the threshold value that the lowest point of the semiconductor chip tape buffer section can reach. When the sensor component 24 detects an abnormality, it means that the semiconductor chip tape buffer section is too long or too short. At this time, the sensor component 24 will feedback information to make the device alarm.

[0064] In this embodiment, a receiving groove is provided on the unwinding frame 21, and the receiving groove is located between the unwinding wheel 22 and the winding wheel 23, and a supporting member 25 is provided in the receiving groove. It should be understood that when the coil on the unwinding device 2 is exhausted, a new coil needs to be loaded and connected with the old coil. At this time, the supporting member 25 can be pulled outward to place the new coil and the old coil, so as to facilitate the staff to perform the coil connection operation.

[0065] In this embodiment, an ion wind emitter is also provided on the unwinding frame 21 to remove dust and static electricity from the semiconductor chip tape.

[0066] It should be noted that the structure of the winding device 3 is the same as that of the unwinding device 2, so no further details will be given here.

[0067] The above description is only a preferred embodiment of the present invention, and its structure is not limited to the shapes listed above. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic dispensing mechanism, characterized in that: It includes a lifting drive assembly, a moving seat, a sliding plate, a controller and a dispensing component, wherein: The movable seat is installed on the output end of the lifting drive component, and a first contact is arranged on the movable seat; the sliding plate is connected to the movable seat in a lifting and sliding manner, and a second contact is arranged on the sliding plate at a position corresponding to the first contact, and the second contact is located above the first contact, and the two are in contact with each other; the controller is installed on the movable seat, and is electrically connected to the first contact and the second contact respectively; the dispensing component is installed on the sliding plate.

2. The automatic dispensing mechanism according to claim 1, characterized in that: A visual detector and a fill light element are arranged on the outer side of the dispensing component, and both the visual detector and the fill light element are installed on the moving seat.

3. The automatic dispensing mechanism according to claim 1, characterized in that: The automatic dispensing mechanism also includes a horizontal driving component, and the lifting driving component is installed on the output end of the horizontal driving component.

4. A semiconductor chip tape automatic dispensing device, characterized in that: It comprises a dispensing device and an unwinding device and a rewinding device arranged on both sides of the dispensing device; the dispensing device comprises a dispensing machine frame and a track mechanism, a lifting mechanism and an automatic dispensing mechanism according to any one of claims 1 to 3 arranged on the dispensing machine frame; wherein: The track mechanism is used to transport the semiconductor chip belt, and a hollow area is provided in the middle thereof; The lifting mechanism is arranged below the track mechanism and is located at the hollow area; The automatic glue dispensing mechanism corresponds to the position of the lifting mechanism, and the glue dispensing component is located above the track mechanism.

5. The automatic dispensing device for semiconductor chips according to claim 4, characterized in that: The track mechanism includes a conveying rail and a driving assembly; the conveying rail is composed of two guide rails parallel to each other, and supporting convex strips are arranged on the opposite surfaces of the two guide rails; a limit strip is arranged above the supporting convex strip, and a first telescopic driver is arranged on the guide rail, and the first telescopic driver is used to drive the limit strip to move up and down; the driving assembly is arranged at the end of the conveying rail, and it is used to drive the semiconductor chip belt to move along the conveying rail.

6. The automatic dispensing device for semiconductor chips according to claim 5, characterized in that: The driving assembly includes a driver, a conveying wheel, a pressure seat and a pressure wheel. The conveying wheel and the pressure seat are arranged on the two guide rails. The conveying wheel is rotatably connected to the guide rail. The pressure seat is arranged above the conveying wheel and one end of the pressure seat is hinged to the guide rail. The pressure wheel is rotatably connected to the pressure seat. The driver is installed on the dispensing machine frame, and its output shaft is fixedly connected to the two conveying wheels.

7. The automatic dispensing device for semiconductor chips according to claim 6, characterized in that: The middle part of the pressure seat is rotatably connected to a rotating block, and one side of the pressure seat is slidably connected to a slider. A slot is provided on the side of the rotating block close to the slider, and an insertion rod is rotatably connected to the slider. The end of the insertion rod is placed in the slot. The pressure seat is also provided with a position adjustment member for adjusting the slider; the pressure wheel is rotatably connected to the side of the rotating block away from the slider.

8. The automatic dispensing device for semiconductor chips according to claim 5, characterized in that: The conveying rail is provided with a length detection component, which includes an encoder and a detection gear. The encoder is installed on the conveying rail, and the detection gear is installed on the output end of the encoder.

9. The automatic dispensing device for semiconductor chips according to claim 4, characterized in that: The lifting mechanism includes a second telescopic driver and a vacuum suction component. The second telescopic driver is installed on the dispensing machine frame. The vacuum suction component is arranged in the hollow area and connected to the output end of the second telescopic driver.

10. The automatic dispensing device for semiconductor chips according to claim 4, characterized in that: The unwinding device includes an unwinding frame, an unwinding wheel and a rewinding wheel, wherein the unwinding wheel and the rewinding wheel are distributed up and down and are both rotatably connected to the unwinding frame, and the unwinding frame is provided with a driving component for driving the unwinding wheel and the rewinding wheel to rotate; two groups of sensor components are arranged between the unwinding wheel and the rewinding wheel, and the two groups of sensor components are distributed up and down and are installed on the unwinding frame.

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