Grinding and polishing equipment for semiconductor substrate wafer production

Abstract

The utility model discloses grinding and polishing equipment for semiconductor substrate wafer production, which belongs to the technical field of grinding equipment and comprises an equipment body and two supporting legs arranged at the bottom of the equipment body, and a liquid collecting component for collecting polishing liquid is arranged between the two supporting legs. A supporting box is fixedly connected to the bottom face of the inner wall of the equipment body, and an objective table is slidably connected to the inner wall of the supporting box. According to the wafer polishing device, a wafer is placed on the objective table, the distance between the objective table and the polishing disc is adjusted through the control assembly according to the thickness needing to be polished, then the wafer can be clamped through the clamping assembly, and the problem that the wafer polishing effect is affected due to the fact that the wafer shifts during polishing is solved; and in addition, polishing solution waste water generated during polishing can be collected through the liquid collecting assembly, and the polishing solution waste water and the polished wafer are prevented from polluting the polishing solution waste water and the polished wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding equipment, and in particular to a grinding and polishing equipment used for the production of semiconductor substrate wafers. Background Art

[0002] Semiconductor substrate wafer, also known as wafer, is the basic material for the production of silicon semiconductor circuits. Due to its round shape, it is called a wafer. It originates from silica ore on the surface of the earth's crust. After a series of complex refining and processing processes, high-purity polycrystalline silicon is finally obtained. The wafer can be processed into various circuit component structures on the silicon wafer, thus becoming an integrated circuit product with specific electrical functions. In addition to its function as a semiconductor material, the wafer also plays a role of mechanical support. During the entire production and processing process of the wafer, the burrs and uneven areas on the surface of the wafer raw material need to be ground and polished.

[0003] After searching, the applicant found that a Chinese patent disclosed "a polishing device for semiconductor wafer production", and its publication number is "CN211220177U". This patent mainly sets up an automatic liquid adding device, so that when the operator is polishing the semiconductor crystal, the automatic liquid adding device regularly drips the polishing liquid onto the surface of the semiconductor crystal, so that the operator does not need to be distracted to add the polishing liquid, and the operator can concentrate on polishing the semiconductor crystal;

[0004] The above-mentioned device can automatically add polishing liquid through a series of structures so that the operator can concentrate on polishing the semiconductor crystal. However, the above-mentioned device cannot collect the dripping polishing liquid waste water when actually used, which leads to the problem that the polishing liquid waste water will accumulate on the workbench and pollute the polished wafer when the device is used for a long time. In addition, the above-mentioned device cannot clamp and fix the wafer, which will cause the wafer to shift during grinding and polishing, thereby affecting the grinding and polishing effect. Utility Model Content

[0005] The purpose of the utility model is to provide a grinding and polishing device for semiconductor substrate wafer production to solve the problem that the above-mentioned device proposed in the above-mentioned background technology cannot collect the dripping polishing liquid waste water and cannot fix the wafer.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a grinding and polishing device for semiconductor substrate wafer production, comprising a device body and two supporting legs arranged at the bottom of the device body, a liquid collecting component for collecting polishing liquid is arranged between the two supporting legs, the bottom surface of the inner wall of the device body is fixedly connected to a supporting box, the inner wall of the supporting box is slidably connected to a stage, the interior of the supporting box is provided with a control component that can promote the up and down movement of the stage, the top of the stage is provided with a clamping component that can clamp and fix the wafer, the top surface of the device body is fixedly connected to a motor, the output end of the motor passes through the top surface of the device body and extends to the interior of the device body, and the output end of the motor is fixedly connected to a grinding disc.

[0007] Preferably, the liquid collection assembly comprises two support blocks, opposite sides of the two support blocks are fixedly connected to opposite sides of two support legs respectively, and the top surfaces of the two support blocks are slidably connected to a liquid collection drawer.

[0008] Preferably, the liquid collecting assembly further comprises a plurality of lower liquid holes formed on the top surface of the stage and a liquid outlet groove formed on the bottom surface of the stage, and the plurality of lower liquid holes are in communication with the liquid outlet groove.

[0009] Preferably, the liquid collecting assembly further comprises a liquid collecting trough, which is disposed on the bottom surface of the inner wall of the supporting box and penetrates through the bottom surface of the inner wall of the equipment body to communicate with the interior of the liquid collecting drawer.

[0010] Preferably, the control component includes two cavities opened inside the support box, one side of the inner wall of the two cavities is fixedly connected to an electric telescopic rod, the output ends of the two electric telescopic rods pass through the opposite sides of the inner walls of the two cavities and extend to the interior of the support box, and the output ends of the two electric telescopic rods are fixedly connected to a trapezoidal block.

[0011] Preferably, the clamping assembly includes eight springs, and the eight springs are grouped in pairs, one end of each group of springs is fixedly connected to one side of the top surface of the loading platform, the other end of each group of springs is commonly fixedly connected to an arc-shaped clamping block, and one side of the four arc-shaped clamping blocks is fixedly connected to an anti-wear pad.

[0012] Preferably, both sides of the bottom of the stage are inclined surfaces, and the two inclined surfaces are in contact with the inclined surfaces of the two trapezoidal blocks respectively.

[0013] Preferably, the liquid collecting trough is aligned with the liquid outlet trough.

[0014] The technical effects and advantages of the utility model are as follows: the utility model places a wafer on a stage and adjusts the distance between the stage and the grinding disc through a control component according to the thickness to be polished, and then clamps the wafer through a clamping component to prevent the wafer from shifting during polishing, thereby affecting the polishing effect of the wafer; and the polishing liquid waste water during polishing can be collected through a liquid collecting component to prevent the polishing liquid waste water from contaminating the polished wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0016] Figure 2 It is a three-dimensional structural schematic diagram of the support box of the utility model.

[0017] Figure 3 It is a front view cross-sectional structural schematic diagram of the utility model.

[0018] Figure 4 It is a schematic diagram of the three-dimensional structure of the loading platform of the utility model.

[0019] In the figure: 1. Equipment body; 2. Liquid collecting component; 3. Clamping component; 4. Control component; 6. Grinding disc; 7. Loading table; 8. Support box; 9. Motor; 10. Support leg; 201. Lower liquid hole; 202. Liquid outlet tank; 203. Support block; 204. Liquid collecting drawer; 205. Liquid collecting tank; 301. Spring; 302. Arc clamping block; 303. Anti-wear pad; 402. Cavity; 403. Electric telescopic rod; 404. Trapezoidal block. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] The utility model provides Figure 1-4The grinding and polishing equipment for semiconductor substrate wafer production shown in the figure comprises an equipment body 1 and two supporting legs 10 arranged at the bottom of the equipment body 1, a liquid collecting component 2 for collecting polishing liquid is arranged between the two supporting legs 10, a supporting box 8 is fixedly connected to the bottom surface of the inner wall of the equipment body 1, a stage 7 is slidably connected to the inner wall of the supporting box 8, a control component 4 capable of promoting the up and down movement of the stage 7 is arranged inside the supporting box 8, a clamping component 3 capable of clamping and fixing the wafer is arranged on the top of the stage 7, a motor 9 is fixedly connected to the top surface of the equipment body 1, and the motor 9 is fixedly connected to the top surface of the equipment body 1. The output end of the motor 9 passes through the top surface of the equipment body 1 and extends to the interior of the equipment body 1. The output end of the motor 9 is fixedly connected to the grinding disc 6. The wafer is placed on the stage 7 and the distance between the stage 7 and the grinding disc 6 is adjusted by the control component 4 according to the thickness to be polished. Then, the wafer can be clamped by the clamping component 3 to prevent the wafer from shifting during polishing, thereby affecting the polishing effect of the wafer. The polishing liquid waste water during polishing can be collected through the liquid collecting component 2 to avoid the polishing liquid waste water from polluting the polished wafer.

[0022] like Figure 1 , Figure 3 and Figure 4 As shown, the liquid collecting component 2 includes two support blocks 203, and the opposite sides of the two support blocks 203 are fixedly connected to the opposite sides of the two support legs 10 respectively. The top surfaces of the two support blocks 203 are slidably connected with a liquid collecting drawer 204. The liquid collecting drawer 204 can effectively collect the waste water of the polishing liquid. The liquid collecting component 2 also includes a plurality of lower liquid holes 201 opened on the top surface of the stage 7 and a liquid outlet trough 202 opened on the bottom surface of the stage 7. The plurality of lower liquid holes 201 are communicated with the liquid outlet trough 202. The liquid collecting component 2 also includes a liquid collecting trough 205. The liquid collecting trough 205 can send the polishing liquid waste water flowing out of the lower liquid holes 201 and the liquid outlet trough 202 into the interior of the liquid collecting drawer 204. The liquid collecting trough 205 is opened on the bottom surface of the inner wall of the support box 8 and passes through the bottom surface of the inner wall of the equipment body 1 to communicate with the interior of the liquid collecting drawer 204.

[0023] like Figure 3 As shown, the control component 4 includes two cavities 402 opened inside the support box 8, one side of the inner wall of the two cavities 402 is fixedly connected with an electric telescopic rod 403, the output ends of the two electric telescopic rods 403 pass through the opposite sides of the inner walls of the two cavities 402 and extend to the inside of the support box 8, the output ends of the two electric telescopic rods 403 are fixedly connected with trapezoidal blocks 404, and the two trapezoidal blocks 404 can be moved by the two electric telescopic rods 403 to prompt the worktable 7 to move up and down.

[0024] like Figure 2As shown, the clamping assembly 3 includes eight springs 301, and the eight springs 301 are grouped in pairs. One end of each group of springs 301 is fixedly connected to one side of the top surface of the stage 7, and the other end of each group of springs 301 is fixedly connected to an arc-shaped clamping block 302. The arc-shaped clamping block 302 can clamp the wafer to prevent the wafer from shifting during grinding and polishing. One side of the four arc-shaped clamping blocks 302 is fixedly connected to an anti-wear pad 303. The anti-wear pad 303 can protect the wafer when the arc-shaped clamping block 302 clamps the wafer to prevent the side of the wafer from being worn.

[0025] like Figure 3 and Figure 4 As shown, both sides of the bottom of the stage 7 are inclined surfaces and the two inclined surfaces are in contact with the inclined surfaces of the two trapezoidal blocks 404 respectively. The two trapezoidal blocks 404 cooperate with the two inclined surfaces of the stage 7 to enable the stage 7 to move up and down, and the positions of the liquid collecting tank 205 and the liquid outlet tank 202 are aligned.

[0026] Working principle of the utility model: when the device is used, the wafer to be polished is first placed on the top surface of the stage 7, and then the wafer is clamped and fixed by using four sets of springs 301 and four arc-shaped clamping blocks 302 to prevent the wafer from being displaced during the polishing process and affecting the polishing effect. Then, when the wafer is fixed, the two electric telescopic rods 403 are started at the same time, and the two electric telescopic rods 403 are started to drive the two trapezoidal blocks 404 to move in relative directions, and the two trapezoidal blocks 404 are used to cooperate with the two inclined surfaces on both sides of the stage 7 so that as the two trapezoidal blocks 404 move in opposite directions, the two trapezoidal blocks 404 can move in opposite directions. The displacement stage 7 of block 404 can move upward with the fixed wafer close to the grinding disk 6, and then start the motor 9 to drive the grinding disk 6 to rotate, and add polishing liquid on the grinding surface of the wafer during the grinding process, and then the waste water of the polishing liquid flows into the interior of the stage 7 through the lower liquid hole 201 on the top surface of the stage 7, and flows into the interior of the liquid collecting tank 205 from the liquid outlet 202 at the bottom of the stage 7, and finally enters the interior of the liquid collecting drawer 204, and the waste water of the polishing liquid is collected and processed through the liquid collecting drawer 204. The original text highlights the innovative structure and does not elaborate on the prior art.

[0027] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A grinding and polishing device for semiconductor substrate wafer production, comprising a device body (1) and two supporting legs (10) arranged at the bottom of the device body (1), characterized in that: A liquid collecting component (2) for collecting polishing liquid is provided between the two supporting legs (10); a supporting box (8) is fixedly connected to the bottom surface of the inner wall of the device body (1); a loading platform (7) is slidably connected to the inner wall of the supporting box (8); a control component (4) capable of facilitating the up and down movement of the loading platform (7) is provided inside the supporting box (8); a clamping component (3) capable of clamping and fixing a wafer is provided on the top of the loading platform (7); a motor (9) is fixedly connected to the top surface of the device body (1); an output end of the motor (9) passes through the top surface of the device body (1) and extends to the inside of the device body (1); and a grinding disc (6) is fixedly connected to the output end of the motor (9).

2. The grinding and polishing equipment for semiconductor substrate wafer production according to claim 1, characterized in that: The liquid collection assembly (2) comprises two support blocks (203), the opposite sides of the two support blocks (203) are respectively fixedly connected to the opposite sides of the two support legs (10), and the top surfaces of the two support blocks (203) are slidably connected to a liquid collection drawer (204).

3. The grinding and polishing equipment for semiconductor substrate wafer production according to claim 2, characterized in that: The liquid collecting component (2) further comprises a plurality of lower liquid holes (201) provided on the top surface of the loading platform (7) and a liquid outlet groove (202) provided on the bottom surface of the loading platform (7), wherein the plurality of lower liquid holes (201) are in communication with the liquid outlet groove (202).

4. The grinding and polishing equipment for semiconductor substrate wafer production according to claim 3, characterized in that: The liquid collecting assembly (2) further comprises a liquid collecting trough (205), which is disposed on the bottom surface of the inner wall of the supporting box (8) and penetrates through the bottom surface of the inner wall of the equipment body (1) and communicates with the interior of the liquid collecting drawer (204).

5. The grinding and polishing equipment for semiconductor substrate wafer production according to claim 1, characterized in that: The control assembly (4) comprises two cavities (402) opened inside the support box (8), one side of the inner wall of the two cavities (402) is fixedly connected to an electric telescopic rod (403), the output ends of the two electric telescopic rods (403) pass through the opposite side of the inner wall of the two cavities (402) and extend to the inside of the support box (8), and the output ends of the two electric telescopic rods (403) are fixedly connected to a trapezoidal block (404).

6. The grinding and polishing equipment for semiconductor substrate wafer production according to claim 1, characterized in that: The clamping assembly (3) comprises eight springs (301), wherein the eight springs (301) are grouped in pairs, one end of each group of springs (301) is fixedly connected to one side of the top surface of the loading platform (7), the other end of each group of springs (301) is fixedly connected to an arc-shaped clamping block (302), and one side of the four arc-shaped clamping blocks (302) is fixedly connected to an anti-wear pad (303).

7. The grinding and polishing equipment for semiconductor substrate wafer production according to claim 5, characterized in that: Both sides of the bottom of the object carrier (7) are inclined surfaces, and the two inclined surfaces are in contact with the inclined surfaces of the two trapezoidal blocks (404) respectively.

8. The grinding and polishing equipment for semiconductor substrate wafer production according to claim 4, characterized in that: The liquid collecting trough (205) is aligned with the liquid outlet trough (202).

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