Semiconductor integrated device structure
By embedding insulated heat conduction plates inside the packaging ceramics and allowing the pins to come into contact with the copper plate through their through holes, the problems of high temperature burning during welding and heat accumulation during work are solved, and effective heat transfer and heat dissipation are achieved, avoiding chip burning and Desolder.
Patent Information
- Application Number
- CN202420314291.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-20
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-02-20
AI Technical Summary
During semiconductor packaging, the high temperature during soldering of the hot air gun can easily burn the chip, and the high temperature during the chip operation accumulates at the pins, causing the solder to melt and desolder.
An insulating heat conducting plate is embedded in the lower part of the encapsulated ceramic. The pin passes through the through hole of the insulating heat conducting plate and extends the insulating heat conducting plate to the outside and contacts the copper plate above the chip, thereby directly transferring heat to the pin when welding, And dissipate heat through the copper plate when the chip is working.
Reduce the heat of the wafer, avoid chip burning, and avoid desoldering caused by excessive heat at the pins through effective heat dissipation.
Smart Images
Figure CN222483363U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging structures, in particular to a semiconductor integrated device structure. Background Art
[0002] After the invention and mass production of transistors, various solid-state semiconductor components such as diodes and transistors were used in large quantities, replacing the functions and roles of vacuum tubes in circuits. In the mid-to-late 20th century, advances in semiconductor manufacturing technology made integrated circuits possible. Compared with hand-assembled circuits using individual discrete electronic components, integrated circuits can integrate a large number of micro-transistors into a small chip, which is a huge improvement.
[0003] After semiconductors are packaged, they are formed into chips. When soldered to circuit boards, hot air guns are usually used for soldering. The hot air gun directly heats the surface of the chip, and then transfers it to the bottom pins to melt the solder for soldering. In this process, a large amount of heat is transferred to the chip, and the high temperature can easily burn the chip. The high temperature of the chip during operation will also accumulate at the pins, which is not convenient for heat dissipation through the heat-conducting structure on the surface of the chip, which can easily cause the solder to melt and affect the welding strength. Therefore, we propose a semiconductor integrated device structure. Utility Model Content
[0004] The utility model aims to provide a semiconductor integrated device structure, in which an insulating heat-conducting plate is embedded and fixed in the lower inner part of the packaging ceramic, pins pass through the through holes of the insulating heat-conducting plate, and the insulating heat-conducting plate is extended to the outside to contact the copper plate above the chip, the heat during welding is directly transferred from the top to the pins, the heating of the wafer is reduced to avoid its burning, and at the same time, when the chip is working, the heat at the pins is directly transferred to the copper plate for heat dissipation, so as to avoid the pins from being too hot and causing desoldering, thereby solving the problems raised in the background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor integrated device structure, including a packaging ceramic and a wafer, the wafer is embedded and fixed in an upper position inside the packaging ceramic, and an insulating heat-conducting plate is laterally embedded and fixed inside the lower part of the packaging ceramic; a plurality of through holes are evenly opened on the surface of the insulating heat-conducting plate, and pins are inserted through the through holes, and the bottoms of the pins are exposed to the outside of the packaging ceramic, and the pins are connected to the wafer through leads; a copper plate is fixed to the upper outer ring cover of the packaging ceramic, and both sides of the copper plate are bent downward, and both sides of the insulating heat-conducting plate are bent upward and in contact with the inner surface of the copper plate, and both sides of the inner surface of the copper plate are provided with card slots, and the outer edge of the insulating heat-conducting plate is provided with a card block that abuts against the card slot.
[0006] By adopting the above technical solution, when using a hot air gun for welding, the heat can be transferred to the pins through the insulating heat conductive plate, which is conducive to the rapid melting of the solder and reduces the heating of the wafer, avoiding the burning of the chip due to high temperature. When the chip is working, the heat at the pins can also be transferred to the copper plate through the insulating heat conductive plate, which is conducive to the dissipation of heat and avoids the high temperature causing the solder to melt and desoldering.
[0007] Optionally, the surface of the packaged ceramic is evenly coated with thermal grease, and the thermal grease contacts the inner surface of the copper plate.
[0008] By adopting the above technical solution, the heat transferred from the wafer to the packaging ceramic during operation can be transferred to the copper plate through the thermal grease.
[0009] Optionally, the outer circle of the pin is pressed against the inner surface of the through hole, and the bottom of the pin is flush with the bottom of the package ceramic.
[0010] By adopting the above technical solution, when the pin is pressed against the inner surface of the through hole, it can be ensured that the heat is smoothly transferred to the insulating heat conducting plate.
[0011] Optionally, the card block is connected to the insulating heat-conducting plate to form an integral structure.
[0012] By adopting the above technical solution, the heat transfer between the card block and the insulating heat conducting plate is smoother.
[0013] Compared with the prior art, the technical solution of this application has the following beneficial effects:
[0014] 1. The technical solution of the present application is to embed and fix an insulating heat-conducting plate in the lower inner part of the packaging ceramic, and the pins pass through the through holes of the insulating heat-conducting plate, and the insulating heat-conducting plate is extended to the outside to contact the copper plate above the chip. The heat during welding is directly transferred from the top to the pins, reducing the heat of the wafer to avoid burning. At the same time, when the chip is working, the heat at the pins is directly transferred to the copper plate for heat dissipation, avoiding excessive heat at the pins and causing desoldering.
[0015] 2. The technical solution of the present application facilitates heat transfer and ensures a firm connection between the copper plate and the insulating heat-conducting plate by means of a card slot and a card block. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:
[0017] Figure 1 It is a schematic diagram of the overall structure of the semiconductor integrated device structure of the utility model;
[0018] Figure 2 It is a schematic diagram of the detailed structure of the corners of the semiconductor integrated device structure of the utility model.
[0019] In the figure: 1. packaging ceramic; 11. thermal grease; 2. wafer; 21. lead; 22. pin; 3. insulating thermal conductive plate; 31. card block; 32. through hole; 4. copper plate; 41. card slot. DETAILED DESCRIPTION
[0020] See also Figure 1-2 The utility model provides a technical solution: a semiconductor integrated device structure, including a packaging ceramic 1 and a wafer 2, wherein the wafer 2 is packaged, embedded and fixed in an upper position inside the packaging ceramic 1 to achieve protection of the wafer 2 and heat transfer.
[0021] An insulating heat-conducting plate 3 is laterally embedded and fixed at the lower part of the packaging ceramic 1, and a plurality of through holes 32 are evenly opened on the surface of the insulating heat-conducting plate 3. The pins 22 of the chip are inserted into the through holes 32 of the insulating heat-conducting plate 3, and the bottom of the pins 22 pass through to the other side of the insulating heat-conducting plate 3, and then leak out of the packaging ceramic 1 and remain flush with the bottom of the packaging ceramic 1. The outer circle of the pins 22 is pressed against the inner surface of the through holes 32, and the pins 22 are connected to the wafer 2 through the leads 21.
[0022] A copper plate 4 is fixed on the upper outer ring cover of the packaged ceramic 1, and a thermal conductive silicone grease 11 is evenly applied on the surface of the packaged ceramic 1, and the thermal conductive silicone grease 11 abuts against the inner surface of the copper plate 4. The heat of the chip when working can be transferred to the copper plate 4, and then dissipated through the heat dissipation structure. The two sides of the copper plate 4 are bent downward, and the two sides of the insulating heat conductive plate 3 are bent upward and abut against the inner surface of the copper plate 4. The inner surfaces of both sides of the copper plate 4 are provided with card grooves 41, and the outer edge of the insulating heat conductive plate 3 is provided with a card block 31 that is connected to the insulating heat conductive plate 3 as a whole and abuts against the card groove 41, so that the copper plate 4 and the insulating heat conductive plate 3 are in a state of thermal connection. The heat of the hot air gun during welding can be transferred to the insulating heat conductive plate 3 through the copper plate 4, and then transferred to the pin 22 to melt the solder, thereby reducing the heating of the wafer 2 during welding. When the chip is working, the heat at the pin 22 can be transferred to the copper plate 4 through the insulating heat conductive plate 3, which is convenient for heat dissipation at the pin 22 to avoid desoldering.
[0023] When in use, when soldering the chip, first tin the pins 22 leaking out from the bottom of the package ceramic 1, apply flux on the surface of the circuit board, and then place the chip on the surface of the circuit board so that the pins 22 are aligned with the contacts on the surface of the circuit board, and then use a hot air gun to heat the copper plate 4 above the package ceramic 1. The heat can be transferred downward through the copper plate 4 and transmitted to the insulating heat conductive plate 3, so that the heat can be transferred to the pins 22 more quickly to melt the solder, and less heat will be transferred to the wafer 2 to avoid it from being burned. After the solder cools down, the chip will be soldered to the circuit board. When in use, the heat of the chip is directly transferred to the copper plate 4 through the thermal grease 11, and the heat at the pins 22 can also be transferred to the copper plate 4 through the insulating heat conductive plate 3, and then dissipated by the heat dissipation structure in contact with the copper plate 4. When the chip is working, it can avoid excessive heat at the pins 22 to melt the solder and cause desoldering.
Claims
1. A semiconductor integrated device structure, comprising a packaging ceramic (1) and a wafer (2), characterized in that: The wafer (2) is embedded and fixed in an upper position inside the packaging ceramic (1), and an insulating heat-conducting plate (3) is laterally embedded and fixed at the lower part inside the packaging ceramic (1); The surface of the insulating heat-conducting plate (3) is evenly provided with a plurality of through holes (32), the through holes (32) are penetrated by pins (22), the bottoms of the pins (22) are exposed outside the package ceramic (1), and the pins (22) are connected to the wafer (2) via leads (21); A copper plate (4) is fixedly mounted on the upper outer ring of the packaged ceramic (1), the two sides of the copper plate (4) are bent downward, the two sides of the insulating heat-conducting plate (3) are bent upward and in contact with the inner surface of the copper plate (4), the inner surfaces of both sides of the copper plate (4) are provided with card slots (41), and the outer side surface of the insulating heat-conducting plate (3) is provided with a card block (31) that abuts against the card slot (41).
2. A semiconductor integrated device structure according to claim 1, characterized in that: The surface of the packaged ceramic (1) is evenly coated with thermal conductive silicone grease (11), and the thermal conductive silicone grease (11) contacts the inner surface of the copper plate (4).
3. A semiconductor integrated device structure according to claim 1, characterized in that: The outer ring of the pin (22) is pressed against the inner surface of the through hole (32), and the bottom of the pin (22) is flush with the bottom of the packaged ceramic (1).
4. A semiconductor integrated device structure according to claim 3, characterized in that: The clamping block (31) and the insulating heat-conducting plate (3) are connected to form an integral structure.