Cooling device of circuit substrate
By designing a circuit board cooling device including a vehicle body, top partition bar, side partition bar and cooling fan, the problem of high substrate temperature and inconvenient cooling in circuit board production is solved, and efficient cooling and independent placement are achieved.
Patent Information
- Application Number
- CN202420855804.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-04-23
AI Technical Summary
During the production process of circuit boards, the substrate temperature is high, and cooling is required. At the same time, it is necessary to ensure that there is no contact during the cooling process of the substrate, and there is a lack of independent cooling devices.
A cooling device for circuit substrates is designed, including a vehicle body, a top partition bar, a side partition bar and a cooling fan. Through the positioning grooves formed by the top partition bar and the side partition bar, the circuit board can be inserted vertically and separated independently, and the bottom heat dissipation fan can speed up the heat dissipation efficiency.
It realizes efficient cooling and independent placement of the circuit substrate, avoids contact damage and improves heat dissipation efficiency.
Smart Images
Figure CN222485002U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of circuit board cooling devices, and in particular relates to a cooling device for a circuit substrate. Background Art
[0002] There are multiple production processes in the production of rigid substrates for circuit boards. The substrate temperature will be high in some processes. Usually, cooling is required after the previous process, and it is necessary to ensure that the substrates do not come into contact during the cooling process. Therefore, a device that can place the circuit substrates separately is needed to help cool them down. Utility Model Content
[0003] The purpose of the present utility model is to provide a cooling device for a circuit substrate to solve the problems raised in the above background technology.
[0004] In view of this, the present invention provides a cooling device for a circuit substrate, comprising:
[0005] vehicle body;
[0006] A plurality of top spacers are provided and fixed on the top of the vehicle body, with the plurality of top spacers being arranged horizontally at intervals;
[0007] Side partitions, the number of which corresponds to the top partitions, are vertical and spaced apart on both sides of the vehicle body;
[0008] Corresponding positioning grooves are formed between adjacent top spacers and adjacent side spacers. The positioning grooves are used to position the circuit substrate and to separate the circuit substrate independently so that the circuit substrate can be vertically inserted into the vehicle body.
[0009] In a further embodiment of the present invention, a limiting strip is fixed to the inner bottom of the side partition strip for supporting the bottom of the circuit substrate.
[0010] In a further embodiment of the present invention, protective plates are provided on the front and rear sides of the vehicle body, and heat dissipation holes are provided on the protective plates.
[0011] In a further embodiment of the present invention, a support frame is further provided at the bottom of the vehicle body, and a cooling fan is provided at the bottom of the support frame.
[0012] In a further embodiment of the present invention, handles are provided above both sides of the vehicle body.
[0013] In a further embodiment of the present invention, wheels are provided around the bottom of the vehicle body.
[0014] The beneficial effects of the utility model are:
[0015] A top partition bar is provided on the top of the vehicle body, a side partition bar is provided on the side, and a limit bar is provided on the inner bottom of the side partition bar. Positioning grooves are formed between the top partition bars and the side partition bars, so that the circuit substrate can be inserted into the positioning grooves and supported on the limit bars, so that the circuit substrate can be separated and placed vertically. The cooling fan at the bottom of the vehicle body accelerates the heat dissipation efficiency of the circuit substrate and helps to dissipate heat and cool the circuit substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the structure of the utility model Figure 1 ;
[0017] Figure 2 This is a schematic diagram of the structure of the utility model Figure 2 ;
[0018] Figure 3 yes Figure 2 Enlarged schematic diagram of area A in the middle. DETAILED DESCRIPTION
[0019] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.
[0020] In the description of this application, it should be noted that the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn according to the actual proportional relationship. Technologies, methods and equipment known to ordinary technicians in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further discussed in subsequent figures.
[0021] It should be noted that the terms "first," "second," etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than those illustrated or described herein, and that the objects distinguished by "first," "second," etc. are generally of the same type, and do not limit the number of objects. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.
[0022] It should be noted that, in the description of this application, the directions or positional relationships indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise specified, these directional terms do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of this application; the directional terms "inside and outside" refer to the inside and outside relative to the outline of each component itself.
[0023] It should be noted that, in the present application, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.
[0024] like Figure 1 and Figure 2 This embodiment provides a cooling device for a circuit substrate, comprising: a vehicle body 1 , a top spacer 2 , and side spacers 3 .
[0025] Handles 4 are provided on the upper sides of the vehicle body 1, and wheels 5 are provided around the bottom of the vehicle body 1 to facilitate the movement of the device.
[0026] In detail, a plurality of top partition bars 2 are provided and fixed on the top of the vehicle body 1 , and the plurality of top partition bars 2 are horizontally spaced apart from each other.
[0027] The number of side partition bars 3 corresponds to that of top partition bars 2 . The side partition bars 3 are vertical and spaced apart on both sides of the vehicle body 1 . A limiting bar 6 is fixed to the inner bottom of the side partition bars 3 to support the bottom of the circuit substrate 7 .
[0028] And, as Figure 3 As shown, corresponding positioning grooves 8 are formed between adjacent top partitions 2 and adjacent side partitions 3. The width of the positioning grooves 8 is slightly larger than the thickness of the circuit substrate 7. The positioning grooves 8 are used to position the circuit substrate 7 and separate the circuit substrate 7 independently, so that the circuit substrate 7 can be vertically inserted into the vehicle body 1, and the circuit substrates 7 can be separated without contact.
[0029] Furthermore, a support frame 9 is provided at the bottom of the vehicle body 1 , and a cooling fan (not shown in the figure) is provided at the bottom of the support frame 9 . The cooling fan blows air upwards, thereby accelerating the heat dissipation efficiency.
[0030] In addition, in order to prevent the circuit substrate 7 from being touched from the side, protective plates 10 are provided on the front and rear sides of the vehicle body 1 . Heat dissipation holes 100 are provided on the protective plates 10 , thereby playing a certain protective role.
[0031] The embodiments of the present application are described above in conjunction with the accompanying drawings. Unless there is a conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.
Claims
1. A cooling device for a circuit substrate, characterized in that: include: Vehicle body; A plurality of top spacers are provided and fixed on the top of the vehicle body, and the plurality of top spacers are arranged horizontally at intervals; Side partition bars, the number of which corresponds to the top partition bars, and the side partition bars are vertically and spaced apart on both sides of the vehicle body; Corresponding positioning grooves are formed between adjacent top partition bars and adjacent side partition bars, and the positioning grooves are used to position the circuit substrate and to separate the circuit substrate independently, so that the circuit substrate can be vertically inserted into the vehicle body.
2. A circuit substrate cooling device according to claim 1, characterized in that: A limiting strip is also fixed to the inner bottom of the side partition strip for supporting the bottom of the circuit substrate.
3. The circuit substrate cooling device according to claim 1, characterized in that: The front and rear sides of the vehicle body are also provided with protective plates, and heat dissipation holes are opened on the protective plates.
4. The circuit substrate cooling device according to claim 1, characterized in that: A support frame is also provided at the bottom of the vehicle body, and a cooling fan is provided at the bottom of the support frame.
5. The circuit substrate cooling device according to claim 1, characterized in that: Handles are also provided above both sides of the vehicle body.
6. The circuit substrate cooling device according to claim 1, characterized in that: Wheels are arranged around the bottom of the vehicle body.