Light path adjusting mechanism for die bonding flip-chip device
By designing an optical path adjustment mechanism for solid crystal flip-up equipment, including adjustment base, intermediate adjustment frame and optical rack cylinder module, the assembly deviation and insufficient accuracy in optical path adjustment of solid crystal equipment is solved, and the accuracy of the optical path is achieved Adjust and real-time adjustment.
Patent Information
- Application Number
- CN202421020217.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-11
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-05-11
AI Technical Summary
The existing solid crystal equipment has problems of assembly deviation and insufficient accuracy in optical path adjustment, which leads to deviation of the optical path propagation path, affects imaging performance, and cannot make real-time adjustments without disassembling the optical path.
An optical path adjustment mechanism including an adjustment base, an intermediate adjustment frame and an optical path cylinder module is designed. Through the adjustment of the adjustment parts in different directions, the position adjustment of the optical path cylinder module is realized to meet the optical path positioning requirements.
It realizes accurate adjustment of the optical path, improves the control accuracy of the optical path propagation path, facilitates the optical path adjustment process, and avoids the necessity of optical path disassembly.
Smart Images
Figure CN222506630U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical path adjustment, and more specifically to an optical path adjustment mechanism for a die-bonding flip-chip device. Background Art
[0002] With the advancement of science and technology, the transmission rate of chips is constantly increasing, and the requirements for optical device technology are getting higher and higher, especially the requirements for die bonding accuracy. If the accuracy deviates, it will seriously affect the use of the client and cause problems such as poor coupling on the client. At present, die bonding is controlled by mechanical positioning to control concentricity. The control accuracy is limited and can no longer meet the requirements of high-end products for die bonding accuracy. In this context, a method of fine-tuning the optical path for die bonding has been developed.
[0003] When designing the optical path of the system, the lenses in the optical path of the system need to be strictly positioned and fixed. In the optical path design, if one of the many lenses is assembled with deviations, it will cause deviations in the optical propagation path, affecting the final imaging performance. The optical path design in the projection system is relatively complex, and the control of the optical propagation path is usually guaranteed by assembly accuracy. However, for the assembly of key lenses, once the positioning reference processing of the components to which they are assembled is inaccurate, the lenses will not be assembled in place. If the module cannot be adjusted from the outside after assembly, the optical path must be completely disassembled before adjustment can be made, and the assembly effect cannot be seen in real time, which brings inconvenience to the optical path adjustment. Utility Model Content
[0004] The purpose of the utility model is to provide an optical path adjustment mechanism for a die-bonding flip-chip device, so as to solve the technical problems existing in the above-mentioned background technology.
[0005] The utility model provides an optical path adjustment mechanism for a die-bonding flip-chip device, comprising an adjustment base, an intermediate adjustment frame, and an optical frame barrel module provided with a reflector, which are arranged in sequence from bottom to top, wherein the intermediate adjustment frame is slidably connected to the adjustment base, and the optical frame barrel module is slidably connected to the intermediate adjustment frame;
[0006] A mounting frame 1 is provided on the adjustment base, a mounting frame 2 is provided on the middle adjustment frame, an adjusting member 1 is provided on the mounting frame 1, and an adjusting member 2 is provided on the mounting frame 2. The adjusting member 1 passes through the mounting frame 1 and is connected to the mounting frame 2. The adjusting member 2 passes through the mounting frame 2 and is connected to the optical frame tube module. The adjustment directions of the adjusting member 1 and the adjusting member 2 are perpendicular to each other.
[0007] In a preferred embodiment, the adjusting member 1 includes a threaded barrel 1, a threaded rod 1 passing through the threaded barrel 1, and a limiting ring 1 connected to the threaded rod 1, and the limiting ring 1 is clamped with the mounting frame 2.
[0008] In a preferred embodiment, a card interface 1 is provided on the mounting frame 1, and an annular groove 1 is provided on the limiting ring 1, and the annular groove 1 is card-engaged with the card interface 1.
[0009] In a preferred embodiment, a limiting slide groove is provided at the bottom of the intermediate adjustment frame, and a limiting strip is provided on the mounting frame, and the limiting strip extends into the limiting slide groove.
[0010] In a preferred embodiment, the second adjusting member includes a second threaded barrel, a second threaded rod passing through the second threaded barrel, and a second limiting ring connected to the second threaded rod.
[0011] In a preferred embodiment, a second card interface is provided on the optical frame tube module, and a second annular groove is provided on the second limiting ring, and the second annular groove is engaged with the second card interface.
[0012] In a preferred embodiment, the optical frame tube module is limited by limiting plates on both sides, and the limiting plates are located on both sides of the middle adjustment frame.
[0013] The beneficial effects of the technical solution of the utility model are:
[0014] Through the layered adjustment base, the middle adjustment frame and the optical frame tube module, and the adjustment member 1 and the adjustment member 2 matched therewith, the adjustment member 1 and the adjustment member 2 are adjusted in different directions respectively, thereby realizing the position adjustment of the optical frame tube module loaded with the reflector to meet the optical path positioning requirements. At the same time, the optical path adjustment mechanism of the scheme is compact in structure and easy to install. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of the overall structure of the utility model.
[0016] Figure 2 This is a schematic diagram of the overall structure of the utility model from another perspective.
[0017] Figure 3 This is a schematic diagram of the structure of the first and second adjusting parts of the utility model.
[0018] Figure 4 This is a partial structural disassembly diagram of the utility model.
[0019] Figure 5 This is a disassembled diagram of the overall structure of the utility model from an upward viewing angle.
[0020] Explanation of the reference numerals: 1 adjusting base, 2 intermediate adjusting frame, 3 light frame tube module, 4 reflecting mirror, 5 mounting frame one, 6 adjusting piece one, 7 threaded tube one, 8 threaded rod one, 9 limiting ring one, 10 annular groove one, 11 card interface one, 12 limiting slide groove, 13 limiting strip, 14 mounting frame two, 15 adjusting piece two, 16 threaded tube two, 17 threaded rod two, 18 limiting ring two, 19 annular groove two, 20 card interface two, 21 limiting plate. DETAILED DESCRIPTION
[0021] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the sake of illustration and convenience of description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific purposes.
[0022] like Figure 1-5 As shown, the technical solution of the utility model provides an optical path adjustment mechanism for a solid crystal flip-chip device, including an adjustment base 1, an intermediate adjustment frame 2 and an optical frame barrel module 3 provided with a reflector 4, which are arranged in sequence from bottom to top, and the intermediate adjustment frame 2 is slidably connected to the adjustment base 1, and the optical frame barrel module 3 is slidably connected to the intermediate adjustment frame 2. The light source is injected from the light source inlet, passes through the optical frame barrel module 3, and the light source obtains a change in angular position in the internal structure of the optical frame barrel module 3. When emitted, the light source is projected onto the required material structure under the reflection of the reflector 4. The reflector 4 is fixed on the optical frame barrel and remains in a fixed state. When the position of the injected light source does not reach the ideal direction angle, the positions of the intermediate adjustment frame 2 and the optical frame barrel module 3 are adjusted to make the projection position of the light source accurate.
[0023] The adjustment base 1 is provided with a mounting frame 15, the intermediate adjustment frame 2 is provided with a mounting frame 2 14, the mounting frame 15 is provided with an adjusting member 16, the mounting frame 2 14 is provided with an adjusting member 2 15, the adjusting member 16 passes through the mounting frame 15 and is connected to the mounting frame 2 14, the adjusting member 2 15 passes through the mounting frame 2 14 and is connected to the optical frame barrel module 3, and the adjusting directions of the adjusting member 16 and the adjusting member 2 15 are perpendicular to each other. The adjusting member 16 and the adjusting member 2 15 are adjusted in different directions respectively to meet the adjustment requirements.
[0024] The adjusting member 6 includes a threaded barrel 7 and a threaded rod 8 passing through the threaded barrel 7, and a limiting ring 9 connected to the threaded rod 8, and the limiting ring 9 is engaged with the mounting frame 14. The mounting frame 5 is provided with a clamping interface 11, and the limiting ring 9 is provided with an annular groove 10, and the annular groove 10 is engaged with the clamping interface 11. The bottom of the intermediate adjusting frame 2 is provided with a limiting slide groove 12, and the mounting frame 5 is provided with a limiting strip 13, and the limiting strip 13 extends into the limiting slide groove 12.
[0025] The mounting frame 5 is fixed on the adjustment base 1. By twisting the threaded rod 8, the threaded rod 8 moves relative to the threaded tube 7, thereby driving the limit ring 9 to move, because the limit ring 9 is engaged with the mounting frame 2 14, and the limit ring 9 rotates relative to the mounting frame 5. During the movement of the limit ring 9, the limit slide groove 12 cooperates with the limit bar 13, and the middle adjustment frame 2 slides along a straight line relative to the adjustment base 1, thereby realizing the position adjustment of the light frame tube assembly.
[0026] The adjusting member 2 15 includes a threaded barrel 2 16, a threaded rod 2 17 passing through the threaded barrel 2 16, and a limiting ring 2 18 connected to the threaded rod 2 17. The optical frame barrel module 3 is provided with a card interface 20, and the limiting ring 2 18 is provided with an annular groove 2 19, and the annular groove 2 19 is engaged with the card interface 20. The optical frame barrel module 3 is limited by limiting plates 21 on both sides, and the limiting plates 21 are located on both sides of the middle adjustment frame 2.
[0027] The adjustment method of the adjustment member 15 is the same as that of the adjustment member 16. By twisting the threaded rod 17, the threaded rod 17 moves relative to the threaded tube 16, thereby driving the limit ring 18 to move, because the limit ring 18 is engaged with the optical frame tube module 3, and the limit ring 18 rotates relative to the mounting frame. During the movement of the limit ring 18, the limit plate 21 limits the optical frame tube assembly, and the optical frame tube module 3 slides along a straight line relative to the intermediate adjustment frame 2, thereby realizing the position adjustment of the optical frame tube assembly.
[0028] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. Structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to conventional means in the field unless otherwise specified and limited.
Claims
1. An optical path adjustment mechanism for a die-bonding flip-chip device, characterized in that: It includes an adjustment base, an intermediate adjustment frame and a light frame tube module provided with a reflector, which are arranged in sequence from bottom to top, wherein the intermediate adjustment frame is slidably connected to the adjustment base, and the light frame tube module is slidably connected to the intermediate adjustment frame; A mounting frame 1 is arranged on the adjustment base, a mounting frame 2 is arranged on the middle adjustment frame, an adjusting member 1 is arranged on the mounting frame 1, and an adjusting member 2 is arranged on the mounting frame 2. The adjusting member 1 passes through the mounting frame 1 and is connected to the mounting frame 2. The adjusting member 2 passes through the mounting frame 2 and is connected to the optical frame tube module. The adjustment directions of the adjusting member 1 and the adjusting member 2 are perpendicular to each other.
2. The optical path adjustment mechanism for a die-bonding flip-chip device according to claim 1, characterized in that: The adjusting member 1 includes a threaded barrel 1, a threaded rod 1 passing through the threaded barrel 1, and a limiting ring 1 connected to the threaded rod 1, and the limiting ring 1 is clamped with the mounting frame 2.
3. The optical path adjustment mechanism for a die-bonding flip-chip device according to claim 2, characterized in that: The mounting frame is provided with a card interface 1, and the limiting ring is provided with an annular groove 1, and the annular groove 1 is card-connected with the card interface 1.
4. The optical path adjustment mechanism for a die-bonding flip-chip device according to claim 1, characterized in that: A limiting slide groove is arranged at the bottom of the intermediate adjustment frame, and a limiting strip is arranged on the first mounting frame, and the limiting strip extends into the limiting slide groove.
5. The optical path adjustment mechanism for a die-bonding flip-chip device according to claim 1, characterized in that: The second adjusting member comprises a second threaded barrel, a second threaded rod passing through the second threaded barrel, and a second limiting ring connected to the second threaded rod.
6. The optical path adjustment mechanism for a die-bonding flip-chip device according to claim 5, characterized in that: The optical frame tube module is provided with a second card interface, and the second limiting ring is provided with a second annular groove, and the second annular groove is card-connected with the second card interface.
7. The optical path adjustment mechanism for a die-bonding flip-chip device according to claim 1, characterized in that: The optical frame tube module is limited on both sides by limiting plates, and the limiting plates are located on both sides of the middle adjustment frame.