Wafer film coating device for integrated circuit manufacturing

Abstract

The utility model relates to the technical field of wafer film coating, in particular to a wafer film coating device for integrated circuit manufacturing, which comprises a working table, a control panel is arranged on the front surface of the working table, a first side plate is fixedly connected to the top surface of the working table, and a film roller is arranged on the back surface of the first side plate; and the second side plate is installed on the top face of the workbench, a stabilizing ring is arranged on the front surface of the second side plate, a rotating shaft is arranged on the front surface of the stabilizing ring, and an attaching pad is arranged on the outer surface of the rotating shaft. According to the utility model, the electric push rod drives the connecting ring and the annular blade to rise in the cutting groove, so that the annular blade can integrally cut a film on the outer surface of the placing cylinder, the integral cutting is relatively complete, the operation effect is relatively good, after the operation is completed, a wafer is taken out, and then the operation is cycled; and then the waste millstone can be wound on the outer surface of the rotating shaft, so that the thin film can be conveniently recycled.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer coating, in particular to a wafer coating device for integrated circuit manufacturing. Background Art

[0002] Wafers are the basic raw materials for making semiconductor electrical components. One side of the wafer is used to process the circuit component structure. During the processing, one side of the wafer needs to be diced to obtain grains of a predetermined size. Before dicing, a layer of film needs to be attached to the other side of the wafer to protect the wafer.

[0003] In this regard, China applied for patent number: CN220895463U, which discloses a wafer coating device, including a workbench, a wafer placing part is provided on the top, guide seats are provided on both sides of the workbench, guide blocks are slidably provided in the guide seats, a spring is provided at one end of the guide block, and one end of the spring is connected to the guide seat, a roller is provided in the workbench, and rectangular blocks are connected at both ends of the roller, a cylindrical rod is provided on one side of the rectangular block, one end of the cylindrical rod extends into the guide block and is rotatably connected to the guide block, and the outer wall of the roller is connected to one end of the film; a pushing part, including a first air cylinder, a U-shaped block is provided at the output end of the first air cylinder, the opening of the U-shaped block faces one end of the rectangular block, and the U-shaped block is used to push the rectangular block to move. The cutting part is hinged at one end of the workbench and includes a cutter assembly, which is used to cut off excess film. One end of the film roll is connected to the roller, and the roller does not rotate when the film is pulled out to perform the wafer coating operation. When the excess film is cut, it is automatically retracted through the rotation of the roller, which reduces the labor intensity of the workers and is highly efficient.

[0004] However, during actual lamination, the film cannot be evenly recycled after transportation and cutting. At the same time, the efficiency of cutting the film is low, and the film is easily torn as a whole, resulting in a lot of waste of resources after the overall lamination. Therefore, it has become an urgent problem to be solved to improve and perfect the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer coating device for integrated circuit manufacturing, so as to solve the problem proposed in the above background technology that the film cannot be evenly recycled after transportation and cutting, and the efficiency of cutting the film is low and the film is easily torn as a whole, thereby wasting a lot of resources after the overall coating.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: A wafer coating device for integrated circuit manufacturing, comprising a workbench, a control panel is provided on the front surface of the workbench, a first side plate is fixedly connected to the top surface of the workbench, and a film roller is provided on the back surface of the first side plate;

[0007] The second side plate is installed on the top surface of the workbench, the front surface of the second side plate is provided with a stabilizing ring, the front surface of the stabilizing ring is provided with a rotating shaft, the outer surface of the rotating shaft is provided with a fitting pad, the interior of the workbench is provided with a placing tube, and a cutting groove is opened between the workbench and the placing tube.

[0008] Preferably, a connecting ring is provided inside the cutting groove, and an annular blade is fixedly connected to the top surface of the connecting ring.

[0009] Preferably, an electric push rod is provided on the lower surface of the connecting ring, and four groups of the electric push rods are provided and all are installed on the lower surface of the connecting ring.

[0010] Preferably, a support frame is fixedly connected to the left side surface of the workbench, and a connecting plate is fixedly connected to the right side surface of the support frame.

[0011] Preferably, a telescopic rod is fixedly connected to the lower surface of the connecting plate, and a fitting ring is provided on the lower surface of the telescopic rod.

[0012] Preferably, the fitting ring has the same size as the placement tube, and the annular blade is fitted on the outer surface of the placement tube.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The wafer coating device for integrated circuit manufacturing is provided with a workbench, a control panel, a first side plate, a film roller, a second side plate, a stabilizing ring, a rotating shaft, a bonding pad, a placing cylinder, a cutting groove, an electric push rod, a connecting ring and an annular blade. When in use, the film is first installed on the outer surface of the film roller as a whole, and then the wafer is placed inside the placing cylinder, and then the film is installed on the outer surface of the rotating shaft through the top surface of the wafer, so that the film is bonded to the surface of the bonding pad, and the overall installation is relatively stable, so that the Harima is bonded to the top surface of the wafer to perform a coating operation on the wafer, and when the coating is completed, the electric push rod is started, and the connecting ring and the annular blade are driven to rise inside the cutting groove by the electric push rod, so that the annular blade can cut the film on the outer surface of the placing cylinder as a whole, so that the overall cutting is relatively complete and the operation effect is better, and after the operation is completed, the wafer is taken out, and then the operation is cyclically operated, and then the waste Harima is wound around the outer surface of the rotating shaft, which is convenient for recycling the film, reflecting the practicality of the design.

[0015] 2. The wafer coating device for integrated circuit manufacturing is provided with a support frame, a connecting plate, a telescopic rod, a bonding ring and a placement tube. When in use, after the wafer inside the placement tube is coated as a whole, the telescopic rod is started, which will drive the bonding ring downward, so that the bonding ring will be bonded to the top surface of the placement tube, so that the wafer already coated inside the placement tube can be bonded, thereby limiting the position of the film, facilitating the subsequent cutting operation of the film, and fixing the position of the wafer and the film as a whole, reflecting the functionality of the design. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0017] Figure 2 It is a three-dimensional schematic diagram of the second side plate and the rotating shaft structure of the utility model;

[0018] Figure 3 It is a three-dimensional schematic diagram of the connecting ring and the annular blade structure of the utility model;

[0019] Figure 4 It is a three-dimensional schematic diagram of the connecting plate and the fitting ring structure of the utility model.

[0020] In the figure: 1. workbench; 2. control panel; 3. first side panel; 4. film roller; 5. second side panel; 6. stabilizing ring; 7. rotating shaft; 8. bonding pad; 9. placing cylinder; 10. cutting groove; 11. electric push rod; 12. connecting ring; 13. annular blade; 14. supporting frame; 15. connecting plate; 16. telescopic rod; 17. bonding ring. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 , an embodiment provided by the utility model:

[0023] A wafer coating device for integrated circuit manufacturing, the control panel 2, film roller 4, electric push rod 11, annular blade 13 and telescopic rod 16 used in this application are all products that can be directly purchased on the market, and their principles and connection methods are all prior arts well known to those skilled in the art, so they will not be repeated here, including a workbench 1, the front surface of the workbench 1 is provided with a control panel 2, the top surface of the workbench 1 is fixedly connected to a first side plate 3, the back surface of the first side plate 3 is provided with a film roller 4, the left surface of the workbench 1 is fixedly connected to a support frame 14, the right surface of the support frame 14 is fixedly connected to a connecting plate 15, the connecting plate 16 is fixedly connected to the supporting frame 14, and the connecting plate 16 is fixedly connected to the supporting frame 14. The lower surface of the plate 15 is fixedly connected with a telescopic rod 16, and the lower surface of the telescopic rod 16 is provided with a fitting ring 17, which has the same size as the placement tube 9, and the annular blade 13 is fitted on the outer surface of the placement tube 9. When the wafer inside the placement tube 9 is coated as a whole, the telescopic rod 16 is started, and the telescopic rod 16 drives the fitting ring 17 downward, so that the fitting ring 17 is fitted to the top surface of the placement tube 9, so that the wafer coated inside the placement tube 9 can be fitted, so that the position of the film can be limited, which is convenient for the subsequent cutting operation of the film, and the position of the wafer and the film can be fixed as a whole;

[0024] The second side plate 5 is installed on the top surface of the workbench 1. The front surface of the second side plate 5 is provided with a stabilizing ring 6. The front surface of the stabilizing ring 6 is provided with a rotating shaft 7. The back of the rotating shaft 7 is provided with a motor body. The motor body drives the rotating shaft 7 to rotate to roll up the waste film. The outer surface of the rotating shaft 7 is provided with a fitting pad 8. The inside of the workbench 1 is provided with a placing cylinder 9. A cutting groove 10 is opened between the workbench 1 and the placing cylinder 9. A connecting ring 12 is provided inside the cutting groove 10. The top surface of the connecting ring 12 is fixedly connected with a ring blade 13. The lower surface of the connecting ring 12 is provided with an electric push rod 11. The electric push rod 11 is provided with four groups, all of which are installed on the lower surface of the connecting ring 12. First, the entire film will be installed on the film roller 4 The outer surface of the wafer is then placed inside the placement cylinder 9, and then the film is installed on the outer surface of the rotating shaft 7 through the top surface of the wafer, so that the film will be fitted to the surface of the fitting pad 8, and the overall installation is relatively stable, so that the Harima will be fitted to the top surface of the wafer to perform a film coating operation on the wafer. When the coating is completed, the electric push rod 11 is started, and the connecting ring 12 and the annular blade 13 are driven to rise inside the cutting groove 10 by the electric push rod 11, so that the annular blade 13 can cut the film on the outer surface of the placement cylinder 9 as a whole, so that the overall cutting is relatively complete, and the operation effect is better. After the operation is completed, the wafer is taken out, and then the operation is cyclically operated, and then the waste Harima will be wound around the outer surface of the rotating shaft 7, which is convenient for recycling the film.

[0025] Working principle: When the staff uses the device, first connect the device to an external power source to provide power support for the device. First, the film will be installed on the outer surface of the film roller 4 as a whole, and then the wafer will be placed inside the placement cylinder 9. Then, the film will be installed on the outer surface of the rotating shaft 7 through the top surface of the wafer, so that the film will be fitted to the surface of the fitting pad 8. The overall installation is relatively stable, so that the mat will be fitted to the top surface of the wafer to perform the film coating operation on the wafer. When the coating is completed, the electric push rod 11 is started, and the connecting ring 12 and the annular blade 13 are driven by the electric push rod 11 to move on the inside of the cutting groove 10. Lift, so that the annular blade 13 can cut the film on the outer surface of the placement tube 9 as a whole, so that the overall cutting is relatively complete, and the operation effect is better. After the operation is completed, the wafer is taken out, and then the operation is cyclically operated. When the wafer inside the placement tube 9 is coated as a whole, by starting the telescopic rod 16, the telescopic rod 16 will drive the bonding ring 17 downward, so that the bonding ring 17 will be bonded to the top surface of the placement tube 9, so that the wafer that has been coated inside the placement tube 9 can be bonded, so that the position of the film can be limited, which is convenient for the subsequent cutting operation of the film. The above is all the working principles of the utility model.

[0026] The above description is only a preferred embodiment of the utility model and does not limit the utility model in any form. Any ordinary technician in the industry can smoothly implement the utility model as shown in the drawings of the specification and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the utility model using the technical content disclosed above are all equivalent embodiments of the utility model. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the utility model are still within the protection scope of the technical solution of the utility model.

Claims

1. A wafer coating device for integrated circuit manufacturing, comprising a workbench (1), a control panel (2) being arranged on the front surface of the workbench (1), a first side plate (3) being fixedly connected to the top surface of the workbench (1), characterized in that: A film roller (4) is provided on the back side of the first side plate (3); A second side plate (5), the second side plate (5) is mounted on the top surface of the workbench (1), a stabilizing ring (6) is arranged on the front surface of the second side plate (5), a rotating shaft (7) is arranged on the front surface of the stabilizing ring (6), a fitting pad (8) is arranged on the outer surface of the rotating shaft (7), a placing tube (9) is arranged inside the workbench (1), and a cutting groove (10) is provided between the workbench (1) and the placing tube (9).

2. The wafer coating device for integrated circuit manufacturing according to claim 1, characterized in that: A connecting ring (12) is provided inside the cutting groove (10), and an annular blade (13) is fixedly connected to the top surface of the connecting ring (12).

3. The wafer coating device for integrated circuit manufacturing according to claim 2, characterized in that: The lower surface of the connecting ring (12) is provided with an electric push rod (11), and four groups of the electric push rods (11) are provided and are all installed on the lower surface of the connecting ring (12).

4. The wafer coating device for integrated circuit manufacturing according to claim 1, characterized in that: A support frame (14) is fixedly connected to the left surface of the workbench (1), and a connecting plate (15) is fixedly connected to the right surface of the support frame (14).

5. The wafer coating device for integrated circuit manufacturing according to claim 4, characterized in that: A telescopic rod (16) is fixedly connected to the lower surface of the connecting plate (15), and a fitting ring (17) is provided on the lower surface of the telescopic rod (16).

6. The wafer coating device for integrated circuit manufacturing according to claim 5, characterized in that: The fitting ring (17) has the same size as the placement tube (9), and the annular blade (13) is fitted on the outer surface of the placement tube (9).

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