Special PCB substrate of small-size sensor
By integrating the flow guide column and conductive gasket in the PCB substrate of the small-size sensor, and combining the heat transfer plate and heat dissipation fins, the problem of increasing the area of the PCB circuit board is solved, and the substrate design suitable for small-size sensors is realized. And ensure the normal operation of the substrate through effective heat dissipation.
Patent Information
- Application Number
- CN202420739926.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-11
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-04-11
AI Technical Summary
Due to the increase in area, existing PCB circuit boards cannot be used for small-sized sensors.
A special PCB substrate with a small size sensor was designed. By integrating the flow guide column and conductive gasket in the substrate body, the signal connector is set on the surface of the substrate, combined with the heat transfer plate and the heat dissipation fins, heat dissipation is used to dissipate heat. Reduce the substrate size and achieve effective heat dissipation.
The substrate size is reduced, suitable for small-size sensors, and the normal operation of the substrate is ensured through effective heat dissipation measures.
Smart Images
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Abstract
Description
Technical Field
[0001] The utility model relates to the field of electronic technology, in particular to a special PCB substrate for a small-size sensor. Background Art
[0002] Most of the current substrates are constructed with two substrates, with the guide column installed on one of the PCB circuit boards and the signal connector placed on the other substrate. The guide column is used to conduct the signal, which increases the area of the PCB circuit board and is not suitable for small-sized sensors. Utility Model Content
[0003] The utility model aims to provide a special PCB substrate for a small-sized sensor, which solves the technical problem that the PCB circuit board area is increased and cannot be applied to the small-sized sensor.
[0004] To achieve the above object, the utility model provides a special PCB substrate for a small-sized sensor, including a substrate body and a positioning assembly, wherein the substrate body has a mounting cavity.
[0005] Also included is a conductive component;
[0006] The conductive component includes a signal connector, a guide column, a conductive gasket and a heat dissipation component. The signal connector is fixedly connected to the substrate body and is located on one side of the substrate body. The guide column is fixedly connected to the signal connector and is located in the mounting cavity. The conductive gasket is fixedly connected to the substrate body and to the guide column and is located on one side of the substrate body close to the guide column. The heat dissipation component is arranged on the substrate body.
[0007] Among them, the heat dissipation assembly includes a heat transfer plate and heat dissipation fins, the heat transfer plate is fixedly connected to the substrate body and is located on a side of the substrate body close to the guide column; the heat dissipation fins are fixedly connected to the heat transfer plate and are located on a side of the heat transfer plate close to the substrate body.
[0008] Wherein, the substrate body has a heat dissipation hole, and the heat dissipation hole is located on a side of the substrate body close to the heat dissipation fin and passes through the substrate body.
[0009] Wherein, the positioning assembly includes a positioning plate and a positioning block, the positioning plate is fixedly connected to the substrate body and located at the bottom end of the substrate body; the positioning block is fixedly connected to the positioning plate and located on a side of the positioning plate close to the substrate body.
[0010] Wherein, the positioning block has a positioning hole, and the positioning hole is located on a side of the positioning block close to the positioning plate and passes through the positioning block.
[0011] The utility model provides a special PCB substrate for a small-sized sensor, wherein the signal connector is arranged on the surface of the substrate body, and the guide column and the conductive gasket are integrated in the mounting cavity of the substrate body, thereby reducing the size of the substrate and being suitable for small-sized sensors. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.
[0013] Figure 1 It is a cross-sectional view of a special PCB substrate of a small-size sensor according to the first embodiment of the utility model.
[0014] Figure 2 It is a front view of a special PCB substrate of a small-size sensor of the first embodiment of the utility model.
[0015] Figure 3 It is a cross-sectional view of a special PCB substrate of a small-size sensor according to the second embodiment of the utility model.
[0016] Figure 4 It is a front view of a special PCB substrate of a small-size sensor of the second embodiment of the utility model.
[0017] In the figure: 101 - substrate body, 102 - mounting cavity, 103 - signal connector, 104 - guide column, 105 - conductive gasket, 106 - heat transfer plate, 107 - heat dissipation fins, 108 - heat dissipation holes, 201 - positioning plate, 202 - positioning block, 203 - positioning hole. DETAILED DESCRIPTION
[0018] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.
[0019] The first embodiment of the present application is:
[0020] See also Figure 1 and Figure 2 ,in Figure 1 is a cross-sectional view of a special PCB substrate of a small-size sensor of the first embodiment of the utility model, Figure 2It is a front view of a special PCB substrate for a small-sized sensor of the first embodiment of the utility model. The utility model provides a special PCB substrate for a small-sized sensor: comprising a substrate body 101, a positioning component and a conductive component, the substrate body 101 having a mounting cavity 102, the conductive component comprising a signal connector 103, a guide column 104, a conductive gasket 105 and a heat dissipation component, the heat dissipation component comprising a heat transfer plate 106 and a heat dissipation fin 107, and the substrate body 101 having a heat dissipation hole 108. The above-mentioned solution solves the problem of large PCB circuit board area. It can be understood that the above-mentioned solution can be used in the case of small-sized sensors, and can also be used to solve the problem of inaccurate positioning when installing the substrate.
[0021] According to this specific embodiment, the substrate body 101 is a rectangular body, the installation cavity 102 is a rectangular cavity, and the installation cavity 102 is located inside the substrate body 101 .
[0022] Among them, the signal connector 103 is fixedly connected to the substrate body 101 and is located on one side of the substrate body 101, the guide column 104 is fixedly connected to the signal connector 103 and is located in the installation cavity 102, the conductive gasket 105 is fixedly connected to the substrate body 101 and fixedly connected to the guide column 104, and is located on one side of the substrate body 101 close to the guide column 104, and the heat dissipation component is arranged on the substrate body 101. The signal connector 103 is fixedly arranged on the outer surface of the substrate body 101 and performs signal connection. The top of the guide column 104 is fixedly connected to the signal connector 103 and performs current diversion, and is arranged in the installation cavity 102. The conductive gasket 105 is a circular gasket. The conductive gasket 105 is respectively fixedly connected to the substrate body 101 and the guide column 104 and performs conduction, and is located in the installation cavity 102. The signal connector 103 is arranged on the surface of the substrate body 101, and the guide column 104 and the conductive gasket 105 are integrated in the installation cavity 102 of the substrate body 101, thereby reducing the size of the substrate and making it suitable for small-size sensors.
[0023] Secondly, the heat transfer plate 106 is fixedly connected to the substrate body 101 and is located on a side of the substrate body 101 close to the guide column 104; the heat dissipation fin 107 is fixedly connected to the heat transfer plate 106 and is located on a side of the heat transfer plate 106 close to the substrate body 101. The heat transfer plate 106 is fixedly arranged inside the substrate body 101, and the heat dissipation fin 107 is a rectangular fin. The heat dissipation fin 107 is fixedly arranged on the right side of the heat transfer plate 106. The heat on the surface of the substrate body 101 is transferred through the heat transfer effect of the heat transfer plate 106, and the heat is dissipated through the heat dissipation effect of the heat dissipation fin 107, thereby ensuring the normal operation of the substrate body 101.
[0024] At the same time, the heat dissipation hole 108 is located on a side of the substrate body 101 close to the heat dissipation fins 107 and penetrates the substrate body 101. There are multiple heat dissipation holes 108, which are evenly arranged on the right side of the substrate body 101 and penetrate the substrate body 101. Through the penetration of the heat dissipation holes 108, the heat in the substrate body 101 is easily discharged along the heat dissipation holes 108.
[0025] When using a special PCB substrate of a small-sized sensor of the present embodiment, the signal connector 103 is arranged on the surface of the substrate body 101, and the guide column 104 and the conductive gasket 105 are integrated in the mounting cavity 102 of the substrate body 101, thereby reducing the size of the substrate and making it suitable for small-sized sensors. The heat on the surface of the substrate body 101 is transferred through the heat transfer effect of the heat transfer plate 106, and the heat is dissipated through the heat dissipation effect of the heat dissipation fins 107, so that the heat is discharged from the substrate body 101 along the heat dissipation holes 108, thereby ensuring the normal operation of the substrate body 101.
[0026] The second embodiment of the present application is:
[0027] See also Figure 3 and Figure 4 ,in Figure 3 is a cross-sectional view of a special PCB substrate of a small-size sensor of the second embodiment of the utility model, Figure 4 It is a front view of a special PCB substrate of a small-size sensor of the second embodiment of the utility model. Based on the first embodiment, the positioning assembly comprises a positioning plate 201 and a positioning block 202 , and the positioning block 202 has a positioning hole 203 .
[0028] The positioning plate 201 is fixedly connected to the substrate body 101 and is located at the bottom of the substrate body 101; the positioning block 202 is fixedly connected to the positioning plate 201 and is located on a side of the positioning plate 201 close to the substrate body 101. The positioning plate 201 is a rectangular plate, which is fixedly arranged below the substrate body 101. The positioning block 202 is a rectangular block, which is fixedly arranged below the positioning plate 201. The positioning block 202 and the positioning plate 201 are used to position the installation of the substrate body 101.
[0029] Secondly, the positioning hole 203 is located on one side of the positioning block 202 close to the positioning plate 201 and penetrates the positioning block 202. The positioning hole 203 is a circular hole, which is arranged on both sides of the positioning block 202 and penetrates the positioning block 202. Through the positioning function of the positioning hole 203, the positioning of the positioning block 202 is more accurate.
[0030] When using a special PCB substrate of a small-size sensor of this embodiment, the installation of the substrate body 101 is positioned through the positioning function of the positioning block 202 and the positioning plate 201, and the positioning function of the positioning hole 203 makes the positioning of the positioning block 202 more accurate, thereby making the installation of the substrate body 101 more accurate.
[0031] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.
Claims
1. A special PCB substrate for a small-size sensor, comprising a substrate body and a positioning assembly, wherein the substrate body has a mounting cavity, characterized in that: Also included is a conductive component; The conductive component includes a signal connector, a guide column, a conductive gasket and a heat dissipation component. The signal connector is fixedly connected to the substrate body and is located on one side of the substrate body. The guide column is fixedly connected to the signal connector and is located in the mounting cavity. The conductive gasket is fixedly connected to the substrate body and to the guide column and is located on one side of the substrate body close to the guide column. The heat dissipation component is arranged on the substrate body.
2. The special PCB substrate for a small-size sensor as claimed in claim 1, characterized in that: The heat dissipation assembly includes a heat transfer plate and heat dissipation fins. The heat transfer plate is fixedly connected to the substrate body and located on a side of the substrate body close to the guide column; the heat dissipation fins are fixedly connected to the heat transfer plate and located on a side of the heat transfer plate close to the substrate body.
3. The special PCB substrate for small-size sensors as claimed in claim 2, characterized in that: The substrate body has a heat dissipation hole, which is located on a side of the substrate body close to the heat dissipation fins and penetrates the substrate body.
4. The special PCB substrate for a small-size sensor as claimed in claim 1, characterized in that: The positioning assembly includes a positioning plate and a positioning block. The positioning plate is fixedly connected to the substrate body and located at the bottom end of the substrate body; the positioning block is fixedly connected to the positioning plate and located at a side of the positioning plate close to the substrate body.
5. The special PCB substrate for small-size sensors as claimed in claim 4, characterized in that: The positioning block has a positioning hole, which is located on a side of the positioning block close to the positioning plate and passes through the positioning block.