LED packaging shell capable of improving high temperature resistance

Abstract

The utility model discloses an LED packaging shell capable of improving high temperature resistance, comprising a packaging shell, a lamp groove arranged in the packaging shell and used for accommodating an LED wafer, and an electrode layer arranged at the bottom of the lamp groove, the packaging shell is internally provided with a cavity, the cavity is filled with a heat-resistant medium, and the heat-resistant medium is used for improving the heat-resistant coefficient of the packaging shell. According to the utility model, the heat-resistant medium is filled in the cavity of the packaging shell, so that the whole packaging shell has stronger high-temperature resistance, the influence of heat accumulation of the LED wafers on the packaging shell can be effectively avoided, the risk that the packaging shell is broken due to heating is reduced, the service life of the LED assembly is obviously prolonged, and the service life of the LED assembly is prolonged. And the stable and reliable working state is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an LED packaging shell capable of improving high temperature resistance. Background Art

[0002] LED is mainly composed of LED chip, LED package shell and electrode layer. Compared with energy-saving lighting fixtures used with general photovoltaic power sources, LED has the advantages of energy saving, high efficiency, fast response time, long life cycle, mercury-free and environmental protection. Among them, the LED chip is sealed in the LED package shell by packaging glue to ensure its stable and reliable operation inside.

[0003] However, existing LED chips will generate higher temperatures during operation, which causes heat to easily accumulate inside the LED package. If the LED package is not resistant to high temperatures, it may be at risk of deformation or even cracking under high temperature conditions. This change will not only have an adverse effect on the overall stability of the LED, but may also directly damage the performance of the LED chip, thereby reducing its service life and effectiveness. Summary of the invention

[0004] The utility model provides an LED packaging shell capable of improving high temperature resistance, and its main purpose is to solve the problems existing in the prior art.

[0005] The utility model adopts the following technical solutions:

[0006] An LED package shell capable of improving high temperature resistance comprises a package shell, a lamp trough arranged in the package shell for accommodating an LED chip, and an electrode layer arranged at the bottom of the lamp trough, wherein a cavity is arranged inside the package shell and filled with a heat-resistant medium for improving the heat resistance coefficient of the package shell.

[0007] Furthermore, an opening communicating with the cavity is provided on the inner side of the packaging shell, and the heat-resistant medium is filled into the cavity through the opening.

[0008] Furthermore, the opening is a gradually expanding trumpet-shaped structure from the inside of the cavity to the outside of the cavity.

[0009] Furthermore, the cavity has a trumpet-shaped structure, and its volume gradually increases from top to bottom.

[0010] Furthermore, the opening and the lamp groove are both filled with packaging colloid.

[0011] Furthermore, a plurality of heat dissipation bumps are provided on the outer edge of the packaging shell.

[0012] Furthermore, the side wall of the lamp trough is in a trumpet shape that gradually expands from bottom to top.

[0013] Furthermore, the heat-resistant medium is aluminum nitride powder.

[0014] Furthermore, the packaging shell is formed by injection molding.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. The utility model can significantly improve the heat resistance of the LED package shell by setting a cavity inside the package shell and filling it with a heat-resistant medium, reduce the accumulation of heat inside the package shell, thereby greatly reducing the risk of deformation or cracking of the package shell in a high temperature environment, improving the reliability of the LED package shell, ensuring the stable operation of the LED chip, and also extending the service life of the LED.

[0017] 2. In the utility model, a plurality of heat dissipation bumps are arranged on the outer edge of the package shell. This design increases the heat dissipation area, reduces the thermal resistance, enables the heat to be rapidly dissipated to the external environment, and effectively prevents the LED component from being damaged due to overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the packaging shell structure in the utility model.

[0019] In the figure: 1-package shell; 2-LED chip; 3-lamp trough; 4-electrode layer; 5-cavity; 6-heat-resistant medium; 7-opening; 8-heat dissipation bump. DETAILED DESCRIPTION

[0020] The specific implementation of the present invention is described below with reference to the accompanying drawings. In order to fully understand the present invention, many details are described below, but for those skilled in the art, the present invention can be implemented without these details.

[0021] Reference Figure 1 , an LED package shell 1 with improved high temperature resistance performance, comprising a package shell 1, a lamp trough 3 arranged in the package shell 1 for accommodating an LED chip 2, and an electrode layer 4 arranged at the bottom of the lamp trough 3, a cavity 5 is arranged inside the package shell 1, and the cavity 5 is filled with a heat-resistant medium 6 for improving the heat resistance coefficient of the package shell 1. In this embodiment, by filling the cavity 5 of the package shell 1 with the heat-resistant medium 6, the package shell 1 as a whole has a stronger high temperature resistance, thereby effectively avoiding the influence of heat accumulation of the LED chip 2 on the package shell 1, and reducing the risk of heat cracking of the package shell 1.

[0022] Reference Figure 1, an opening 7 connected to the cavity 5 is provided on the inner side of the packaging shell 1, and the heat-resistant medium 6 is filled into the cavity 5 through the opening 7. Preferably, the opening 7 is a trumpet-shaped structure that gradually expands from the inside of the cavity 5 to the outside of the cavity 5. The design of the opening 7 makes the filling process of the heat-resistant medium 6 simple and efficient, which is conducive to reducing the difficulty of filling the heat-resistant medium 6, ensuring that the heat-resistant medium 6 is quickly and evenly filled into the cavity 5, so that the heat-resistant medium 6 can fully cover the entire cavity 5, greatly reducing the complexity and time cost of the production process.

[0023] Reference Figure 1 The volume of the cavity 5 gradually decreases from the bottom to the top and is roughly in a trumpet-shaped structure. Since the heat of the LED chip 2 in the lamp trough 3 is distributed in a gradually decreasing trend from the inside to the outside and from the bottom to the top, the volume of the cavity 5 is designed to be gradually reduced from the bottom to the top, which helps to match the distribution of the heat-resistant medium 6 with the heat distribution trend of the LED chip 2, thereby improving the design rationality and reliability of the packaging shell 1.

[0024] Reference Figure 1 , the opening 7 and the lamp trough 3 are filled with encapsulating colloid. The encapsulating colloid in the opening 7 can not only seal the opening 7, but also grasp and fix the heat-resistant medium 6, ensuring that the heat-resistant medium 6 in the cavity 5 is filled and compacted, so as to stably exert its heat-resistant performance. In actual operation, the encapsulating colloid is not limited to being filled in the opening 7. In order to further improve the compaction effect of the heat-resistant medium 6, part of the encapsulating colloid can also be filled in the top of the cavity 5.

[0025] Reference Figure 1 A plurality of heat dissipation bumps 8 are provided on the outer edge of the package shell 1. By enlarging the heat dissipation area of ​​the package shell 1, the heat dissipation efficiency is significantly improved, thereby more effectively reducing the operating temperature of the LED component.

[0026] Reference Figure 1 The side wall of the lamp slot 3 is in a trumpet shape that gradually expands from bottom to top. The trumpet-shaped design can not only ensure that the encapsulation colloid can fully fill the entire lamp slot 3 without leaving any gaps, but also guide the light to gradually diffuse, achieving a more uniform and wider light distribution.

[0027] Reference Figure 1 , refer to Figure 1 The heat-resistant medium 6 is aluminum nitride powder. Aluminum nitride powder has high thermal conductivity and excellent thermal stability, and can effectively and quickly conduct the heat generated by the LED chip 2 to the outside of the packaging shell 1 on the basis of improving the heat resistance of the packaging shell 1.

[0028] Reference Figure 1 The packaging shell 1 is formed by injection molding. The use of injection molding technology can achieve rapid and large-scale production, greatly improving the production efficiency of the packaging shell 1.

[0029] The above is only a specific implementation method of the utility model, but the design concept of the utility model is not limited to this. Any non-substantial changes to the utility model using this concept shall be deemed as an infringement of the protection scope of the utility model.

Claims

1. An LED package shell capable of improving high temperature resistance, comprising a package shell, a lamp trough disposed in the package shell for accommodating an LED chip, and an electrode layer disposed at the bottom of the lamp trough, characterized in that: A cavity is provided inside the packaging shell, and the cavity is filled with a heat-resistant medium to improve the heat resistance coefficient of the packaging shell.

2. The LED package shell capable of improving high temperature resistance according to claim 1, characterized in that: An opening communicating with the cavity is disposed on the inner side of the packaging shell, and the heat-resistant medium is filled into the cavity through the opening.

3. The LED package shell capable of improving high temperature resistance according to claim 2, characterized in that: The opening is a gradually expanding trumpet-shaped structure from the inside of the cavity to the outside of the cavity.

4. The LED package shell capable of improving high temperature resistance according to claim 1, characterized in that: The volume of the cavity gradually decreases from the bottom to the top.

5. The LED package shell capable of improving high temperature resistance according to claim 2, characterized in that: The opening and the lamp groove are both filled with packaging colloid.

6. The LED package shell capable of improving high temperature resistance according to claim 1, characterized in that: The outer edge of the packaging shell is provided with a plurality of heat dissipation bumps.

7. The LED package shell capable of improving high temperature resistance according to claim 1, characterized in that: The side wall of the lamp trough is in a trumpet shape that gradually expands from bottom to top.

8. The LED package shell capable of improving high temperature resistance according to claim 1, characterized in that: The heat-resistant medium is aluminum nitride powder.

9. The LED package shell capable of improving high temperature resistance according to claim 1, characterized in that: The packaging shell is formed by injection molding.

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