Finishing device and chemical mechanical polishing equipment applying same

Abstract

The utility model relates to the technical field of semiconductor processing, and provides a trimming device and chemical mechanical polishing equipment applying the trimming device, the trimming device comprises a trimmer and a humidor, the trimmer comprises a cantilever assembly of an ellipsoidal structure, the cantilever assembly comprises a cantilever main body part and a cantilever covering part, the cantilever covering part can cover a first opening of the cantilever main body part, and the cantilever main body part can cover a second opening of the cantilever main body part; the moisturizer comprises a moisturizing spray head and a moisturizing pipeline, the moisturizing spray head is of an oval funnel structure, and the diameter of a working medium passage of the moisturizing pipeline meets a first relational expression and a second relational expression, so that the moisturizing liquid can form laminar flow on the surface of the cantilever assembly and cover the surface of the whole cantilever assembly, and the moisturizing effect and the cleaning effect on the cantilever assembly are guaranteed; the sputtering of the moisturizing liquid is avoided. The utility model further provides chemical mechanical polishing equipment which comprises the trimming device.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a trimming device and a chemical mechanical polishing device using the same. Background Art

[0002] With the rapid development of the electronics industry, the demand for semiconductor products is also increasing day by day. In the process of semiconductor preparation, chemical mechanical polishing is one of the commonly used wafer flattening methods. Wafers are often polished using chemical mechanical polishing equipment, and its polishing accuracy can reach ultra-high atomic-level flatness. During the polishing process, the polishing liquid often sputters onto the dressing device, thereby forming crystals on the dressing device and affecting the polishing quality. Therefore, the dressing device needs to be cleaned and moisturized in real time.

[0003] In existing dressing devices, a moisturizer is often provided to moisturize and clean the dresser of the dressing device. When the moisturizer is used for cleaning, the moisturizing liquid often splashes onto the grinding pad under the grinding head to dilute the grinding liquid, thereby affecting the wafer grinding. In order to ensure the moisturizing and cleaning effects, the moisturizer is respectively provided above, below and on one side of the dresser, which easily causes a waste of the moisturizing liquid. Utility Model Content

[0004] The purpose of the present application is to provide a dressing device and a chemical mechanical polishing device using the same, which can effectively prevent the moisturizing liquid from splashing when cleaning the dresser, improve the utilization rate of the moisturizing liquid, and reduce the waste of the moisturizing liquid.

[0005] In order to achieve the above-mentioned purpose and other related purposes, the present application provides a dressing device applied to a chemical mechanical polishing device, comprising:

[0006] A dresser, comprising a dresser head assembly and a cantilever assembly, wherein the dresser head assembly is connected to one end of the cantilever assembly, and the dresser head assembly is used to dress the polishing pad of the chemical mechanical polishing device, wherein the cantilever assembly is an ellipsoidal structure;

[0007] The moisturizer is suspended above the cantilever assembly and is used for spraying moisturizing liquid onto the surface of the cantilever assembly.

[0008] Optionally, the ellipsoidal structure of the cantilever assembly has a first diameter, a second diameter and a third diameter that are perpendicular to each other, the first diameter and the second diameter are parallel to a first plane, and the third diameter is perpendicular to the first plane;

[0009] Wherein, the first plane is the plane where the contact surface between the dressing head assembly and the polishing pad is located.

[0010] Optionally, a ratio of the length of the second diameter to the length of the first diameter is between 10% and 25%, and a ratio of the length of the third diameter to the length of the first diameter is between 10% and 25%.

[0011] Optionally, the length of the second diameter is equal to the length of the third diameter.

[0012] Optionally, the cantilever assembly includes a cantilever main body and a cantilever covering part, and a first cavity is arranged in the cantilever assembly, wherein the first cavity forms a first opening of the cantilever main body on a side close to the cantilever covering part, and the cantilever covering part covers the first opening to seal the first cavity.

[0013] Optionally, the trimmer further comprises a driving assembly connected to an end of the cantilever assembly away from the trimming head assembly.

[0014] Optionally, the moisturizer comprises:

[0015] A moisturizing pipeline, wherein a working fluid passage is provided in the moisturizing pipeline for providing a flow passage for the moisturizing liquid;

[0016] A moisturizing nozzle is located above the cantilever assembly, and the moisturizing nozzle is connected to the moisturizing pipeline and communicated with the working fluid passage to spray the moisturizing liquid onto the surface of the cantilever assembly.

[0017] Optionally, the diameter of the working fluid passage is recorded as d, and the working fluid passage diameter d satisfies the first relationship Re=ρνd / μ and the second relationship Sλ≤πd 2 ν / 4;

[0018] Wherein, Re is the Reynolds number, ρ is the density of the moisturizing liquid, ν is the flow rate of the moisturizing liquid in the working fluid passage, μ is the viscosity coefficient of the moisturizing liquid, S is the surface area of ​​the ellipsoidal structure of the cantilever component, λ is the capillary length of the moisturizing liquid, and Re≤2000.

[0019] Optionally, the moisturizing nozzle is an elliptical funnel structure, the cantilever assembly is located in the spraying area of ​​the moisturizing nozzle, and the spraying area is the area surrounded by the extension line of the side wall of the elliptical funnel structure of the moisturizing nozzle.

[0020] The present application also provides a chemical mechanical polishing device, comprising a polishing device, a machine device, and any one of the dressing devices described in the aforementioned embodiments;

[0021] Wherein, the platform device comprises a grinding pad, the grinding device is located above the grinding pad and is used for grinding the wafer, and the trimming device is located above the grinding pad and is used for trimming the grinding pad.

[0022] The dressing device and the chemical mechanical polishing equipment using the same provided by the present application have at least the following beneficial effects:

[0023] The dressing device of the present application comprises a dresser and a moisturizer, the dresser comprises a cantilever assembly with an ellipsoidal structure, the ellipsoidal structure of the cantilever assembly has a first diameter, a second diameter and a third diameter, by controlling the ratio of the second diameter to the first diameter and the ratio of the third diameter to the first diameter, a first cavity that meets the installation requirements can be formed in the cantilever assembly, and at the same time, the ellipsoidal structure of the cantilever assembly is ensured to have a flat surface, so that the moisturizing liquid sprayed by the moisturizer can form a laminar flow on the surface of the cantilever assembly, avoiding the splashing of the moisturizing liquid, and ensuring the moisturizing effect and cleaning effect of the cantilever assembly; The cantilever assembly includes a cantilever body and a cantilever cover part, the cantilever cover part can detachably cover the first opening of the cantilever body, and can facilitate the disassembly and installation of the cantilever assembly and other auxiliary parts; the moisturizer includes a moisturizing nozzle and a moisturizing pipeline, the moisturizing nozzle is an elliptical funnel structure, so that the moisturizing liquid can be completely sprayed on the surface of the cantilever assembly, reducing the waste of moisturizing liquid; the diameter of the working fluid passage of the moisturizing pipeline satisfies the first relationship and the second relationship, so as to ensure that the moisturizing liquid can form a laminar flow on the surface of the cantilever assembly, and at the same time ensure the moisturizing effect and cleaning effect on the cantilever assembly. Therefore, the finishing device of this embodiment can ensure the moisturizing effect and cleaning effect on the surface of the entire cantilever assembly, effectively reduce the risk of residual grinding liquid crystallization on the grinding pad, and is easy to disassemble and install, which facilitates the maintenance of the chemical mechanical grinding equipment. The chemical mechanical grinding equipment provided by the present application includes any one of the finishing devices in the aforementioned embodiments, and therefore also has the beneficial effects of the aforementioned embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 Shown is a schematic diagram of the structure of the trimming device provided in Example 1 of the present application.

[0026] Figure 2a Display as Figure 1 A front view of a cantilever assembly in a trimmer apparatus is shown.

[0027] Figure 2b Display as Figure 1 A top view of a cantilever assembly in a trimmer apparatus is shown.

[0028] Figure 3Display as Figure 1 A schematic structural diagram of the cantilever assembly in the trimming device shown.

[0029] Figure 4 Display as Figure 3 A top view of the cantilever body portion of the cantilever assembly is shown.

[0030] Figure 5 Display as Figure 1 A front view of a moisturizing nozzle in a finishing device is shown.

[0031] Figure 6 Display as Figure 5 A bottom view of the moisturizing spray head is shown.

[0032] Figure 7 Shown is a schematic diagram of the structure of the chemical mechanical polishing equipment provided in Example 2 of the present application.

[0033] Reference numerals:

[0034] 1. Dressing device; 11. Dresser; 111. Dressing head assembly; 112. Cantilever assembly; 1121. Cantilever body; 1122. Cantilever cover; 1123. First cavity; 1124. First opening; 1125. Sealing ring; 113. Driving assembly; 12. Moisturizer; 121. Moisturizing nozzle; 122. Moisturizing nozzle; 1221. Working fluid passage; 2. Machine device; 21. Grinding platform; 211. Grinding pad; 22. Transmission unit; 23. Driving unit; 3. Grinding device; 31. Grinding unit; 32. Grinding liquid transmission unit. DETAILED DESCRIPTION

[0035] In order to make the technical purpose, technical solution and technical effect of the present application clearer, the technical solution in the present application will be clearly and completely described in conjunction with the embodiments below. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the present application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0037] In the description of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. In addition, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the implementation or example are included in at least one implementation or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same implementation or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more implementations or examples in a suitable scheme.

[0039] Among the existing semiconductor process equipment for grinding wafers, chemical mechanical grinding equipment is a commonly used grinding equipment. A dressing device is provided in the chemical mechanical grinding equipment to dress the grinding pad of the chemical mechanical grinding equipment. In the dressing device, the dresser is used to dress the grinding pad, and the moisturizer is used to moisturize and clean the dresser. In the existing dressing device, when moisturizing and cleaning the dresser, the moisturizing liquid often sputters, causing the grinding liquid located below the grinding head to be diluted, which affects the wafer grinding. In addition, in order to ensure the moisturizing and cleaning effect of the dresser, the moisturizer is respectively arranged above, below and on one side of the dresser, which is easy to cause the waste of moisturizing liquid. The moisturizing liquid sprayed by the moisturizer cannot completely cover the entire cantilever component surface, increasing the risk of residual crystallization of the grinding liquid on the cantilever component surface. The grinding liquid crystals on the cantilever component surface may be sputtered onto the grinding pad along with the moisturizing liquid, increasing the risk of residual crystallization of the grinding liquid on the grinding pad; at the same time, when the chemical mechanical grinding equipment is maintained, the moisturizer needs to be disassembled, which hinders the maintenance of the equipment.

[0040] In view of the above defects in the prior art, the present application provides a finishing device and a chemical mechanical polishing device using the same to solve the above defects. The present application is now described in detail through specific embodiments and in conjunction with the accompanying drawings.

[0041] Embodiment 1

[0042] This embodiment provides a finishing device 1, which is applied to chemical mechanical polishing equipment. Figure 1 , including a trimmer 11 and a moisturizer 12.

[0043] In the dressing device 1 of the present embodiment, the dresser 11 includes a dressing head assembly 111 and a cantilever assembly 112, the dressing head assembly 111 is connected to one end of the cantilever assembly 112, the dressing head assembly 111 is located above the grinding pad 211 of the chemical mechanical grinding device, when in use, the dressing head assembly 111 contacts the grinding pad 211 to dress the grinding pad 211, the cantilever assembly 112 is suspended above the grinding pad 211, and is used to support and adjust the position of the dressing head assembly 111, and optionally, the cantilever assembly 112 is an ellipsoidal structure as a whole. The moisturizer 12 is arranged above the dresser 11, and moisturizing liquid flows in the moisturizer 12, and can spray the moisturizing liquid to the surface of the cantilever assembly 112. The moisturizing liquid sprayed by the moisturizer 12 can form a laminar flow on the surface of the cantilever assembly 112 of the dresser 11, thereby covering the surface of the entire cantilever assembly 112, and realizing moisturizing and cleaning of the cantilever assembly 112 of the dresser 11.

[0044] Reference Figure 2a and Figure 2b In this embodiment, the ellipsoidal structure of the cantilever assembly 112 has a first diameter, a second diameter and a third diameter that are perpendicular to each other, and the first diameter, the second diameter and the third diameter correspond to the major axis, the middle axis and the minor axis of the ellipsoidal structure, respectively (see the attached Figure 2a and Figure 2b The dotted line in the figure). The contact surface between the trimming head assembly 111 and the grinding pad 211 is recorded as the first plane, the first diameter and the second diameter are both parallel to the first plane, the extension direction of the first diameter is the longitudinal extension direction of the ellipsoidal structure of the cantilever assembly 112, the third diameter is perpendicular to the first plane, and the extension direction of the third diameter is the direction from the trimming head assembly 111 to the grinding pad 211. By adjusting the size of the first diameter, the size of the cantilever assembly 112 can be matched with the size of the grinding pad 211, so that the trimming head can trim different positions of the grinding pad 211 through the cantilever assembly 112.

[0045] In an optional embodiment, the ratio of the length of the second diameter to the length of the first diameter is between 10% and 25%, the ratio of the length of the third diameter to the length of the first diameter is between 10% and 25%, and the size of the second diameter can be larger than the size of the third diameter, or smaller than the size of the third diameter. By adjusting the sizes of the second diameter and the third diameter, a cavity that meets the installation requirements can be formed in the cantilever assembly 112 to install auxiliary parts, while ensuring that the ellipsoidal structure of the cantilever assembly 112 has a relatively flat surface to reduce the splashing of the moisturizing liquid and allow the moisturizing liquid to fully cover the surface of the cantilever assembly 112. Further, the second diameter is equal to the third diameter. For example, in some specific embodiments, the first diameter is 60 cm, and the second diameter and the third diameter are both 10 cm. It should be noted that the sizes of the first diameter, the second diameter and the third diameter can be adaptively set according to actual needs without violating the technical concept of the present application, and the present embodiment is not limited to this.

[0046] Reference Figure 3 and Figure 4 In this embodiment, a first cavity 1123 is provided in the cantilever assembly 112 for installing auxiliary parts of the chemical mechanical polishing equipment. Optionally, the auxiliary parts may include wires and transmission belts. The cantilever assembly 112 includes a cantilever body 1121 and a cantilever cover 1122. The cantilever cover 1122 is located above the cantilever body 1121. Optionally, the first cavity 1123 may be located in the cantilever body 1121, or part of the first cavity 1123 may be located in the cantilever body 1121 and the other part may be located in the cantilever cover 1122. The first cavity 1123 forms a first opening 1124 on the cantilever body 1121 at one side close to the cantilever covering portion 1122. The first opening 1124 is in communication with the first cavity 1123. The cantilever covering portion 1122 can cover the first opening 1124 to seal the first cavity 1123. Optionally, the cantilever covering portion 1122 can be snapped onto the cantilever body 1121 to cover the first opening 1124. By making the cantilever covering portion 1122 detachably connected to the cantilever body 1121, the cantilever assembly 112 can be easily disassembled and installed, and the installation and disassembly of the auxiliary parts of the chemical mechanical polishing can be facilitated.

[0047] In an optional embodiment, the cantilever assembly 112 also includes a sealing ring 1125, which is an elliptical ring structure and is arranged around the first opening 1124 above the cantilever main body 1121. When the cantilever covering portion 1122 covers the first opening 1124, the sealing ring 1125 is located between the cantilever covering portion 1122 and the cantilever main body 1121, thereby improving the sealing effect of the first cavity 1123.

[0048] The dressing head assembly 111 includes a dressing body and a dressing head, one end of the dressing body is connected to the cantilever assembly 112, and the other end away from the cantilever assembly 112 is connected to the dressing head. Optionally, the dressing head includes a dressing layer, which is located on a side of the dressing head away from the dressing body. Further, the dressing layer is a diamond disk layer. When in use, the dressing layer contacts the grinding pad 211 to dress the grinding pad 211.

[0049] Reference Figure 1 In this embodiment, the dresser 11 also includes a driving assembly 113 for providing driving force for the dresser 11 to work. The driving assembly 113 is connected to one end of the cantilever assembly 112 away from the dressing head assembly 111. Optionally, the driving assembly 113 includes a swing motor and a rotating motor. The swing motor is used to provide driving force for the cantilever assembly 112 to swing. The cantilever assembly 112 can be driven to swing by the swing motor to adjust the position of the dresser 11. The rotating motor is used to provide driving force for the dresser 11 to dress the grinding pad 211. Furthermore, a transmission belt is provided in the cantilever assembly 112, and the rotating motor drives the dressing head to rotate through the transmission belt to dress the grinding pad 211.

[0050] The moisturizer 12 includes a moisturizing nozzle 121 and a moisturizing pipeline 122. The moisturizing nozzle 121 is arranged above the cantilever assembly 112, and the moisturizing nozzle 121 is connected to the moisturizing pipeline 122. The moisturizing pipeline 122 is used to transmit moisturizing liquid, and the moisturizing liquid can be sprayed onto the surface of the cantilever assembly 112 through the moisturizing nozzle 121. Optionally, a working fluid passage 1221 for transmitting moisturizing liquid is provided in the moisturizing pipeline 122, and the working fluid passage 1221 is connected to the moisturizing nozzle 121; further, the moisturizing liquid is deionized water.

[0051] In an optional embodiment, the diameter of the working fluid passage 1221 is recorded as d, the first diameter, the second diameter, and the third diameter are recorded as d1, d2, and d3, respectively, the major axis radius of the ellipsoidal structure of the cantilever assembly 112 is recorded as a, the middle axis radius is recorded as b, and the minor axis radius is recorded as c, then a = 0.5d1, b = 0.5d2, c = 0.5d3, and the diameter d of the working fluid passage 1221 satisfies the first relationship and the second relationship, the first relationship is Re = ρνd / μ, and the second relationship is Sλ≤πd 2ν / 4, wherein ρ is the density of the moisturizing liquid flowing in the moisturizing pipeline 122, ν is the flow rate of the moisturizing liquid in the working fluid passage 1221, μ is the viscosity coefficient of the moisturizing liquid, S is the surface area of ​​the ellipsoidal structure of the cantilever assembly 112, the surface area of ​​the ellipsoidal structure of the cantilever assembly 112 S=(4 / 3)π(ab+ac+bc), λ is the capillary length of the moisturizing liquid, the capillary length is the characteristic length of the fluid when the surface tension and gravity of the fluid are equal, Re is the Reynolds number, the Reynolds number is a dimensionless quantity that characterizes the flow of the fluid, and optionally, Re≤2000. When the Reynolds number is less than or equal to 2000, the moisturizing liquid sprayed by the moisturizing nozzle 121 can form a laminar flow on the surface of the cantilever assembly 112 and cover the entire surface of the ellipsoidal structure of the cantilever assembly 112, which can effectively prevent the moisturizing liquid from splashing during the cleaning process and reduce the risk of residual crystallization of the grinding liquid on the surface of the cantilever assembly 112.

[0052] Reference Figure 5 and Figure 6 In an optional embodiment, the moisturizing nozzle 121 is an elliptical funnel structure, and the area enclosed by the side wall extension line of the elliptical funnel structure of the moisturizing nozzle 121 is the spraying area of ​​the moisturizing nozzle 121. Optionally, the cantilever assembly 112 is located in the spraying area of ​​the moisturizing nozzle 121. Further, the side wall extension line of the elliptical funnel structure of the moisturizing nozzle 121 is tangent to the surface of the cantilever assembly 112. By setting the moisturizing nozzle 121 as an elliptical funnel structure and making the side wall extension line of the elliptical funnel structure of the moisturizing nozzle 121 tangent to the surface of the cantilever component 112, the moisturizing liquid sprayed by the moisturizing nozzle 121 can be completely sprayed on the surface of the cantilever component 112 and cover the upper surface of the cantilever component 112, so as to facilitate the moisturizing liquid to form a laminar flow on the surface of the cantilever component 112, and then the moisturizing liquid flows from the upper surface of the cantilever component 112 to the lower surface of the cantilever component 112 until the lower surface of the cantilever component 112 is completely covered, and the excess moisturizing liquid flows out from the surface of the cantilever component 112 at the bottom of the ellipsoidal structure of the cantilever component 112, which effectively prevents the moisturizing liquid from splashing onto the polishing pad 211, and at the same time can ensure the moisturizing and cleaning effects of the cantilever component 112, reduce the risk of residual polishing liquid crystallization on the polishing pad 211, save the use of moisturizing liquid, and avoid waste of resources.

[0053] The dressing device 1 provided in this embodiment includes a dresser 11 and a moisturizer 12. The dresser 11 includes a cantilever component 112 with an ellipsoidal structure. The ellipsoidal structure of the cantilever component 112 has a first diameter, a second diameter and a third diameter. By controlling the ratio of the second diameter to the first diameter and the ratio of the third diameter to the first diameter, a first cavity 1123 that meets the installation requirements can be formed in the cantilever component 112, and at the same time, the ellipsoidal structure of the cantilever component 112 has a flat surface, so that the moisturizing liquid sprayed by the moisturizer 12 can form a laminar flow on the surface of the cantilever component 112, avoiding the splashing of the moisturizing liquid, and ensuring the moisturizing effect and cleaning effect of the cantilever component 112; the cantilever component 112 includes a cantilever main body 1121 and a cantilever cover 112 2. The cantilever cover portion 1122 can detachably cover the first opening 1124 of the cantilever main body 1121, which can facilitate the disassembly and installation of the cantilever assembly 112 and other auxiliary parts; the moisturizer 12 includes a moisturizing nozzle 121 and a moisturizing pipeline 122, the moisturizing nozzle 121 is an elliptical funnel structure, and the side wall extension line of the elliptical funnel structure of the moisturizing nozzle 121 is tangent to the surface of the cantilever assembly 112, so that the moisturizing liquid can be completely sprayed on the surface of the cantilever assembly 112, reducing the waste of the moisturizing liquid; the diameter of the working fluid passage 1221 of the moisturizing pipeline 122 satisfies the first relationship and the second relationship, thereby ensuring that the moisturizing liquid can form a laminar flow on the surface of the cantilever assembly 112, and at the same time ensure the moisturizing effect and cleaning effect on the cantilever assembly 112. Therefore, the finishing device 1 of this embodiment can ensure the moisturizing effect and cleaning effect on the surface of the entire cantilever assembly 112, effectively reduce the risk of residual grinding liquid crystallization on the grinding pad 211, and is easy to disassemble and install, which facilitates the maintenance of the chemical mechanical grinding equipment.

[0054] Embodiment 2

[0055] The present embodiment provides a chemical mechanical polishing device, which is applied to a wafer polishing process, and includes a polishing device 3 , a table device 2 , and any one of the trimming devices 1 in the aforementioned embodiments.

[0056] parameter Figure 7 The machine device 2 includes a grinding platform 21, a transmission part 22 and a driving part 23 which are arranged in sequence from top to bottom. One end of the transmission part 22 is connected to the grinding platform 21 and can drive the grinding platform 21 to rotate. One end of the transmission part 22 away from the grinding platform 21 is connected to the driving part 23. The driving part 23 can drive the transmission part 22 to rotate, thereby driving the grinding platform 21 to rotate. Optionally, a grinding pad 211 for grinding wafers is provided on the grinding platform 21. The grinding pad 211 is arranged on a side of the grinding platform 21 away from the transmission part 22. When in use, the grinding pad 211 can rotate with the grinding platform 21 to grind the wafer.

[0057] The grinding device 3 includes a grinding part 31 for wafer grinding and a grinding liquid transmission part 32 for transmitting grinding liquid. The grinding liquid transmission part 32 can spray the grinding liquid onto the grinding pad 211. The grinding part 31 includes a grinding head, which is located above the grinding platform 21. The side of the grinding head close to the grinding platform 21 is adsorbed with a wafer. When in use, the grinding liquid is distributed on the surface of the grinding pad 211, and the grinding head moves toward the grinding pad 211 to make the wafer contact with the grinding pad 211, thereby grinding the wafer.

[0058] The dressing device 1 is arranged above the grinding pad 211, and can dress the grinding pad 211 during or before wafer grinding. The moisturizer 12 of the dressing device 1 can moisturize the dressing device 11. When the grinding liquid splashes onto the cantilever assembly 112 of the dressing device 1, the moisturizer 12 rinses the grinding liquid on the surface of the cantilever assembly 112 by spraying moisturizing liquid, preventing the grinding liquid from crystallizing on the surface of the cantilever assembly 112 and falling on the grinding pad 211, thereby reducing the risk of residual grinding liquid crystallization on the grinding pad 211.

[0059] The chemical mechanical polishing equipment provided in this embodiment includes any one of the dressing devices 1 in the aforementioned embodiments, and thus also has the beneficial effects of the aforementioned embodiments.

[0060] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify, change or combine the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A dressing device, applied to chemical mechanical polishing equipment, characterized in that: include: A dresser, comprising a dresser head assembly and a cantilever assembly, wherein the dresser head assembly is connected to one end of the cantilever assembly, and the dresser head assembly is used to dress the polishing pad of the chemical mechanical polishing device, wherein the cantilever assembly is an ellipsoidal structure; The moisturizer is suspended above the cantilever assembly and is used for spraying moisturizing liquid onto the surface of the cantilever assembly.

2. The trimming device according to claim 1, characterized in that: The ellipsoidal structure of the cantilever assembly has a first diameter, a second diameter and a third diameter that are perpendicular to each other, the first diameter and the second diameter are parallel to a first plane, and the third diameter is perpendicular to the first plane; Wherein, the first plane is the plane where the contact surface between the dressing head assembly and the polishing pad is located.

3. The trimming device according to claim 2, characterized in that: The ratio of the length of the second diameter to the length of the first diameter is between 10% and 25%, and the ratio of the length of the third diameter to the length of the first diameter is between 10% and 25%.

4. The trimming device according to claim 2, characterized in that: The length of the second diameter is equal to the length of the third diameter.

5. The trimming device according to claim 1, characterized in that: The cantilever assembly includes a cantilever main body and a cantilever covering part, and a first cavity is arranged in the cantilever assembly. The first cavity forms a first opening on the side of the cantilever main body close to the cantilever covering part, and the cantilever covering part covers the first opening to seal the first cavity.

6. The trimming device according to claim 1, characterized in that: The trimmer further includes a drive assembly connected to an end of the boom assembly away from the trimming head assembly.

7. The trimming device according to claim 1, characterized in that: The moisturizer comprises: A moisturizing pipeline, wherein a working fluid passage is provided in the moisturizing pipeline for providing a flow passage for the moisturizing liquid; A moisturizing nozzle is located above the cantilever assembly, and the moisturizing nozzle is connected to the moisturizing pipeline and communicated with the working fluid passage to spray the moisturizing liquid onto the surface of the cantilever assembly.

8. The trimming device according to claim 7, characterized in that: The diameter of the working fluid passage is denoted as d. The working fluid passage diameter d satisfies the first relation Re=ρνd / μ and the second relation Sλ≤πd 2 ν / 4; Wherein, Re is the Reynolds number, ρ is the density of the moisturizing liquid, ν is the flow rate of the moisturizing liquid in the working fluid passage, μ is the viscosity coefficient of the moisturizing liquid, S is the surface area of ​​the ellipsoidal structure of the cantilever component, λ is the capillary length of the moisturizing liquid, and Re≤2000.

9. The trimming device according to claim 7, characterized in that: The moisturizing nozzle is an elliptical funnel structure, the cantilever assembly is located in the spraying area of ​​the moisturizing nozzle, and the spraying area is the area surrounded by the extension line of the side wall of the elliptical funnel structure of the moisturizing nozzle.

10. A chemical mechanical polishing device, characterized in that: It comprises a grinding device, a machine table device and a dressing device as claimed in any one of claims 1 to 9; Wherein, the platform device comprises a grinding pad, the grinding device is located above the grinding pad and is used for grinding the wafer, and the trimming device is located above the grinding pad and is used for trimming the grinding pad.

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