Wafer heating device based on resistance wire multi-state temperature control

Abstract

The utility model relates to the technical field of wafer heating equipment, in particular to a wafer heating device based on resistance wire multi-state temperature control. According to the technical scheme, the device comprises a bottom plate and a set of supporting legs fixedly arranged on the bottom plate, and a supporting round frame is fixedly arranged at the upper ends of the supporting legs; the vacuum chuck assembly is arranged on the inner ring surface of the supporting circular frame in a sleeving manner and used for positioning a wafer, the vacuum chuck assembly comprises a chuck main body, a heat conduction base plate is fixedly arranged on the bottom surface of the chuck main body, and a plurality of clamping grooves are formed in the bottom of the heat conduction base plate; the heating assembly is arranged under the vacuum chuck assembly and used for heating the wafer; and the heating assembly comprises a heating disc. According to the utility model, the heating is more uniform, the heating speed is improved, and the temperature distribution is more uniform, so that the production efficiency of wafers is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer heating equipment, in particular to a wafer heating device based on multi-state temperature control of a resistance wire. Background Art

[0002] Wafer heating device is a device used to heat wafers. It is usually used in processes such as lithography, etching, and diffusion in the manufacturing process to control the temperature of the wafer to ensure the quality and performance of the device. Wafer heating devices usually use electric heating or laser heating, and have the advantages of high precision, high efficiency, and high stability.

[0003] The existing wafer heating device uses a resistance heating plate for heating. The resistance wire inside the resistance heating plate is usually arranged in a flat spiral. This causes uneven heating of the internal heating resistance wire and slow heating speed, resulting in uneven temperature distribution, thereby reducing the production efficiency of the wafer.

[0004] Therefore, a wafer heating device based on multi-state temperature control of resistance wire is proposed. Utility Model Content

[0005] The utility model aims to solve the problems existing in the background technology and proposes a wafer heating device based on multi-state temperature control of resistance wires.

[0006] The technical solution of the utility model: a wafer heating device based on multi-state temperature control of resistance wire, comprising a bottom plate, a group of legs fixedly arranged on the bottom plate, a supporting circular frame fixedly arranged on the upper ends of the legs; a vacuum suction cup assembly sleeved on the inner ring surface of the supporting circular frame for positioning the wafer, the vacuum suction cup assembly comprising a suction cup body, a heat-conducting bottom plate fixedly arranged on the bottom surface of the suction cup body, a plurality of card slots provided on the bottom of the heat-conducting bottom plate, the vacuum suction cup assembly also comprising an annular air groove and a linear air groove provided on the upper surface of the suction cup body, and the annular air groove and the linear air groove are connected to each other, a central air pipe is provided at the center of the suction cup body, and annular air pipes are respectively provided at the connecting points of the annular air groove and the linear air groove. , a plurality of heat-conducting grooves are provided at the bottom of the heat-conducting chassis; a heating assembly for heating the wafer is arranged directly below the vacuum suction cup assembly, the heating assembly includes a heating plate, a plurality of card blocks corresponding to the card slots are fixedly arranged on the upper surface of the heating plate, and the card blocks and the card slots are engaged with each other, the heating assembly also includes a plurality of heat-conducting blocks fixedly arranged on the upper surface of the heating plate, and the heat-conducting blocks correspond to the heat-conducting grooves, a heating resistor is fixedly arranged inside the heating plate, a plurality of heating resistor blocks are fixedly arranged on the upper side of the heating resistor, the heating resistor block is located inside the heat-conducting block, a power connection port is fixedly arranged on one side of the heating plate, and the power connection port is connected to the input end of the heating resistor.

[0007] Optionally, an air pipe connection port is installed on the outer wall of the heat-conducting chassis, and the air pipe connection port is connected to the annular air groove and the linear air groove.

[0008] Optionally, a support frame is fixedly provided on the upper surface of the support circular frame, a slide groove is opened on the upper surface of the support frame, a slider is slidably provided inside the slide groove, a bracket is fixedly provided on the upper end of the slider, an adjustment bolt is threadedly provided on the bracket, and a cover is fixedly provided on the lower end of the adjustment bolt.

[0009] Optionally, a plurality of temperature sensors are arranged inside the heating plate.

[0010] Optionally, a plurality of threaded through holes are provided on the upper surface of the base plate.

[0011] Compared with the prior art, the utility model has the following beneficial technical effects:

[0012] The utility model arranges a plurality of heat-conducting blocks on the upper surface of the heating plate, and arranges a plurality of heating resistance blocks corresponding to the heat-conducting blocks on the upper side of the heating resistance wire inside the heating plate, and the heat-conducting blocks and the heat-conducting grooves are mutually clamped, so that the heating can be made more uniform, the heating speed can be increased, and the temperature distribution can be made more uniform, thereby improving the production efficiency of the wafer;

[0013] Furthermore, the utility model manually rotates the adjustment bolt to drive the cover to rotate vertically downward, so that the cover covers the upper surface of the vacuum suction cup assembly, sealing the wafer when heating it to avoid rapid heat loss, thereby improving the heating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the structure of a wafer heating device based on multi-state temperature control of a resistance wire is given;

[0015] Figure 2 Provide the utility model Figure 1 A schematic diagram of the structure of the vacuum suction cup assembly from a top view;

[0016] Figure 3 Provide the utility model Figure 1 A schematic diagram of the structure of the vacuum suction cup assembly when viewed from above;

[0017] Figure 4 Provide the utility model Figure 1 A schematic diagram of the structure of the heating component;

[0018] Figure 5 Provide the utility model Figure 4 Schematic diagram of the structure of the heating resistance wire inside the heating component.

[0019] Reference numerals:

[0020] 1. Bottom plate; 2. Legs; 3. Supporting round frame;

[0021] 4. Vacuum suction cup assembly; 41. Suction cup body; 42. Heat-conducting chassis; 43. Card slot; 44. Annular air slot; 45. Linear air slot; 46. Central air pipe; 47. Annular air pipe; 48. Heat-conducting slot; 49. Air pipe connection port;

[0022] 5. Heating assembly; 51. Heating plate; 52. Card block; 53. Heat conducting block; 54. Heating resistor wire; 55. Heating resistor block; 56. Power connection port;

[0023] 6. Support frame; 7. Slide groove; 8. Slider; 9. Bracket; 10. Adjustment bolt; 11. Cover; 12. Temperature sensor; 13. Threaded through hole. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0025] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0028] Example

[0029] As Figures 1 to 4 shown, the wafer heating device based on multi-state temperature control of resistance wire proposed by the present utility model includes a bottom plate 1, a set of legs 2 fixedly arranged on the bottom plate 1, and the legs 2 are arranged in a "C" shape structure, having stable support. An upper end of the legs 2 is fixedly provided with a support circular frame 3, and a heat insulation pad is arranged at a connection part between the support circular frame 3 and the legs 2 to avoid scalding operators caused by heat conduction; a vacuum chuck assembly 4 sleeved on an inner ring surface of the support circular frame 3 for positioning a wafer, the vacuum chuck assembly 4 includes a chuck body 41, and the chuck body 41 is made of silicone rubber material, which can withstand high-temperature environment, has good corrosion resistance, can prevent chemical substances from eroding its surface, and has good sealing performance, which can ensure the vacuum degree inside the heating device. A heat conduction chassis 42 is fixedly arranged on a bottom surface of the chuck body 41, and a plurality of card slots 43 are formed at a bottom of the heat conduction chassis 42; a heating assembly 5 arranged directly below the vacuum chuck assembly 4 for heating the wafer, the heating assembly 5 includes a heating plate 51, and a plurality of blocks 52 corresponding to the card slots 43 are fixedly arranged on an upper surface of the heating plate 51, and the blocks 52 and the card slots 43 are clamped with each other, which is convenient for conducting heat to the vacuum chuck assembly 4, making its heating faster and more uniform, improving the heating efficiency, and thus improving the production efficiency.

[0030] As Figures 1 to 3 shown, the vacuum chuck assembly 4 further includes an annular air groove 44 and a linear air groove 45 formed on an upper surface of the chuck body 41, and the annular air groove 44 and the linear air groove 45 are communicated with each other, which is convenient for the communication of air flow, making the adsorption of the wafer more stable. A central air pipe 46 is arranged at a center of the chuck body 41, and annular air pipes 47 are respectively arranged at communication parts between the annular air groove 44 and the linear air groove 45. The annular air pipes 47 and the central air pipe 46 are communicated, which can generate suction at multiple positions simultaneously, making the adsorption of the wafer more stable. A plurality of heat conduction grooves 48 are formed at a bottom of the heat conduction chassis 42, and an air pipe connection port 49 is installed on an outer wall of the heat conduction chassis 42, and the air pipe connection port 49 is communicated with the annular air groove 44 and the linear air groove 45, which is convenient for connecting with an air compressor.

[0031] As Figure 4 and Figure 5As shown, the heating assembly 5 further includes a plurality of heat conduction blocks 53 fixedly arranged on the upper surface of the heating plate 51, and the heat conduction blocks 53 correspond to the heat conduction grooves 48, facilitating rapid and uniform heating of the vacuum chuck assembly 4. Inside the heating plate 51, a heating resistance wire 54 is fixedly arranged. Above the heating resistance wire 54, a plurality of heating resistance blocks 55 are fixedly arranged. The heating resistance blocks 55 are located inside the heat conduction blocks 53, capable of rapidly heating the heat conduction blocks 53 to make the heating more uniform, thereby improving the efficiency of wafer heating. On one side of the heating plate 51, a power connection port 56 is fixedly arranged. The power connection port 56 is connected to the input end of the heating resistance wire 54, facilitating connection to the power supply to energize the heating resistance wire 54 and the heating resistance blocks 55, converting electrical energy into heat energy.

[0032] As Figure 1 shown, a support frame 6 is fixedly arranged on the upper surface of the support circular frame 3, and the support frame 6 is arranged in a "冂"-shaped structure, having good support stability. A chute 7 is opened on the upper surface of the support frame 6. Inside the chute 7, a slider 8 is slidably arranged. The upper end of the slider 8 is fixedly provided with a bracket 9, facilitating the movement of the bracket 9 and guiding it. A regulating bolt 10 is threadedly sleeved on the bracket 9. The upper end of the regulating bolt 10 is fixedly provided with a knob, facilitating manual rotation. The lower end of the regulating bolt 10 is fixedly provided with a cover 11, and a sealing gasket is arranged at the bottom of the cover 11, making it more sealed when covering the wafer.

[0033] Furthermore, a plurality of temperature sensors 12 are arranged inside the heating plate 51, and the temperature sensors 12 are traditional temperature sensors, which will not be described here. They can monitor the temperature at multiple positions during wafer heating to make the heating more uniform.

[0034] Even further, a plurality of threaded through holes 13 are opened on the upper surface of the bottom plate 1, facilitating the disassembly, assembly, and positioning of the bottom plate 1.

[0035] The working principle of this embodiment is as follows: When heating the wafer, first, the bottom plate 1 is fixedly installed through the threaded through holes 13. Subsequently, the wafer to be heated is placed on the upper surface of the vacuum chuck assembly 4. The air compressor is connected to the air pipe connection port 49, and the air compressor is started. The air pipe connection port 49 generates suction in the annular air groove 44 and the linear air groove 45 through the central air pipe 46 and the annular air pipe 47 to position the wafer placed on the upper surface of the vacuum chuck assembly 4.

[0036] Furthermore, manually push the bracket 9. The bracket 9 drives the slider 8 to slide horizontally in the chute 7, moving the cover 11 to directly above the wafer. Subsequently, manually rotate the regulating bolt 10. The regulating bolt 10 drives the cover 11 to move vertically downward, covering the cover 11 on the wafer.

[0037] Furthermore, the power supply is connected to the power connection port 56, and the power supply is started to quickly heat the heating resistor wire 54 and the heating resistor block 55. The heating resistor wire 54 and the heating resistor block 55 conduct heat to the heating plate 51 and the heat-conducting block 53. The heat-conducting block 53 is located inside the heat-conducting groove 48, so that the suction cup body 41 and the heat-conducting base plate 42 can be evenly conducted to quickly heat the wafer. During the heating process, the temperature of each position is monitored by multiple temperature sensors 12 to check whether the heating temperature is uniform, which can make the heating more uniform, increase the heating speed, and make the temperature distribution more uniform, thereby improving the production efficiency of the wafer.

[0038] The above-mentioned specific embodiments are only several optional embodiments of the present invention. Based on the technical solution of the present invention and the relevant inspiration of the above-mentioned embodiments, those skilled in the art can make various alternative improvements and combinations to the above-mentioned specific embodiments.

Claims

1. A wafer heating device based on multi-state temperature control of a resistance wire, comprising a base plate (1), characterized in that: A group of supporting legs (2) fixedly arranged on the bottom plate (1), wherein a supporting circular frame (3) is fixedly arranged on the upper end of the supporting legs (2); A vacuum suction cup assembly (4) sleeved on the inner annular surface of a supporting circular frame (3) for positioning a wafer, the vacuum suction cup assembly (4) comprising a suction cup body (41), a heat-conducting base plate (42) being fixedly arranged on the bottom surface of the suction cup body (41), a plurality of slots (43) being provided at the bottom of the heat-conducting base plate (42), the vacuum suction cup assembly (4) further comprising an annular air groove (44) and a linear air groove (45) provided on the upper surface of the suction cup body (41), the annular air groove (44) and the linear air groove (45) being interconnected, a central air pipe (46) being provided at the center of the suction cup body (41), annular air pipes (47) being provided at the connecting points of the annular air groove (44) and the linear air groove (45), and a plurality of heat-conducting grooves (48) being provided at the bottom of the heat-conducting base plate (42); A heating component (5) is arranged directly below the vacuum suction cup component (4) for heating the wafer, the heating component (5) comprising a heating disk (51), a plurality of clamping blocks (52) corresponding to the clamping slots (43) being fixedly arranged on the upper surface of the heating disk (51), and the clamping blocks (52) and the clamping slots (43) being mutually clamped, the heating component (5) further comprising a plurality of heat conducting blocks (53) fixedly arranged on the upper surface of the heating disk (51), and the heat conducting blocks (53) corresponding to the heat conducting slots (48), a heating resistor wire (54) being fixedly arranged inside the heating disk (51), a plurality of heating resistor blocks (55) being fixedly arranged on the upper side of the heating resistor wire (54), the heating resistor blocks (55) being located inside the heat conducting blocks (53), and a power connection port (56) being fixedly arranged on one side of the heating disk (51), the power connection port (56) being connected to the input end of the heating resistor wire (54).

2. The wafer heating device based on multi-state temperature control of resistance wire according to claim 1 is characterized in that: An air pipe connection port (49) is installed on the outer wall of the heat-conducting chassis (42), and the air pipe connection port (49) is in communication with the annular air groove (44) and the linear air groove (45).

3. The wafer heating device based on multi-state temperature control of resistance wire according to claim 1 is characterized in that: A support frame (6) is fixedly arranged on the upper surface of the support circular frame (3), a slide groove (7) is provided on the upper surface of the support frame (6), a slider (8) is slidably arranged inside the slide groove (7), a bracket (9) is fixedly arranged on the upper end of the slider (8), an adjustment bolt (10) is threadedly sleeved on the bracket (9), and a cover (11) is fixedly arranged on the lower end of the adjustment bolt (10).

4. The wafer heating device based on multi-state temperature control of resistance wire according to claim 1 is characterized in that: A plurality of temperature sensors (12) are arranged inside the heating plate (51).

5. The wafer heating device based on multi-state temperature control of resistance wire according to claim 1 is characterized in that: The upper surface of the bottom plate (1) is provided with a plurality of threaded through holes (13).

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